CN111921976A - Method for improving cleaning quality of wedge welding cleaver - Google Patents
Method for improving cleaning quality of wedge welding cleaver Download PDFInfo
- Publication number
- CN111921976A CN111921976A CN202010678917.2A CN202010678917A CN111921976A CN 111921976 A CN111921976 A CN 111921976A CN 202010678917 A CN202010678917 A CN 202010678917A CN 111921976 A CN111921976 A CN 111921976A
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- CN
- China
- Prior art keywords
- cleaning
- cleaver
- wedge
- improving
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/14—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects using gases or vapours other than air or steam, e.g. inert gases
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
- F26B25/001—Handling, e.g. loading or unloading arrangements
- F26B25/003—Handling, e.g. loading or unloading arrangements for articles
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B9/00—Machines or apparatus for drying solid materials or objects at rest or with only local agitation; Domestic airing cupboards
- F26B9/06—Machines or apparatus for drying solid materials or objects at rest or with only local agitation; Domestic airing cupboards in stationary drums or chambers
Abstract
The invention discloses a method for improving the cleaning quality of a wedge welding cleaver, which comprises the following steps of 1) ultrasonic cleaning. Putting the cleaver into a special clamp, and ultrasonically cleaning the cleaver in NaOH solution; 2) washing with deionized water; 3) blowing with nitrogen; 4) performing microscopic examination; 5) plasma cleaning; 6) washing with deionized water; 7) dehydrating the ethanol; 8) blowing with nitrogen; 9) and baking in an oven. The invention can realize the simultaneous cleaning of a plurality of cleavers and can avoid the damage caused by the collision of the cleavers; meanwhile, the steps of plasma cleaning, ethanol dehydration, baking and the like are utilized to thoroughly remove the excess and residual bonding materials in the chopper channel, so that the cleaning quality is improved.
Description
Technical Field
The invention relates to the field of semiconductor device packaging, in particular to a method for improving the cleaning quality of a wedge welding cleaver.
Background
In the process of manufacturing a hybrid circuit, a wedge bonding process is often used to connect a chip to a substrate or a package by wire bonding. The wedge welding bonding process is to form welding bonding between two metal interfaces pressed together by using heating temperature and ultrasonic energy under the action of a chopper. In the bonding process, the section of the chopper is stressed, and after multiple welding, the section and the channel of the chopper are contaminated with bonding materials, so that the welding spot is seriously deformed, and therefore, the residual bonding materials and impurities on the chopper need to be removed; when an existing chopper is cleaned, most of the existing chopper is directly placed in a cleaning pool for cleaning, due to long-term friction between a bonding wire and a chopper channel, redundant bonding materials are tightly combined with the chopper channel, the surplus bonding materials cannot be thoroughly cleaned, normal use of the chopper is affected, and like a plurality of chopper are cleaned simultaneously, the chopper is damaged due to mutual contact of the chopper.
Disclosure of Invention
The invention aims to solve the technical problem of providing a method for improving the cleaning quality of a wedge-welded cleaver, which is convenient to operate and can thoroughly clean the cleaver.
The technical scheme of the invention is as follows:
a method for improving the cleaning quality of a wedge welding cleaver comprises the following steps:
1) and carrying out ultrasonic cleaning. Putting the cleaver into a special clamp, and ultrasonically cleaning the cleaver in NaOH solution;
2) washing with deionized water;
3) blowing with nitrogen;
4) performing microscopic examination;
5) plasma cleaning;
6) washing with deionized water;
7) dehydrating the ethanol;
8) blowing with nitrogen;
9) and baking in an oven.
Further, in the step 1), the special fixture comprises a placing table, at least two placing through holes are uniformly arranged on the placing table along the circumferential direction, and the hole openings of the placing through holes are of a conical structure with a large top and a small bottom; a support column is arranged at the bottom of the object placing table; when the ultrasonic cleaning device is used, a 20% NaOH solution is configured in the beaker, after cooling, the placing table is placed in the beaker, the supporting columns are in contact with the bottom of the cup, it is guaranteed that a cleaning solution flows through the bottom of the placing table to fully soak the cleaver, and then the beaker is placed in an ultrasonic cleaning machine to be subjected to ultrasonic cleaning for 5-8 minutes.
Further, in the step 2, the placing table is washed with deionized water for 5-10 minutes.
Further, in the step 3, the time for blowing with nitrogen gas is 30 to 60 seconds.
Further, in the step 4, the tip of the wedge-shaped tool is inspected under a microscope with a magnification of 60 to 100 times.
Further, in the step 5, the parameters of the plasma cleaning are as follows: the power is 150-300 w, the time is 120-200 s, and the argon flow is 100-200 ml/min.
Further, in the step 6, the cleaning is carried out for 3-5 minutes by using deionized water.
Further, in the step 7, the cleaver is placed in ethanol for soaking for 2 minutes.
Further, in the step 8, the chopper is blown by nitrogen gas for 30 to 60 seconds.
Further, in the step 9, the chopper is placed in an oven for baking at the temperature of 150 ℃ for 10-20 minutes.
Has the advantages that: the invention is provided with a placing table placed in a beaker, and a support column is arranged at the bottom of the placing table, so that cleaning solution flows into a round hole and fully infiltrates a cleaver; the plasma cleaning step can further remove residual contamination on the surface of the riving knife, and further improve the cleaning quality; the steps of ethanol dehydration and baking can thoroughly remove the water vapor on the surface of the cleaver. Therefore, the invention can realize the simultaneous cleaning of a plurality of cleavers and can avoid the damage caused by the collision of the cleavers; meanwhile, the steps of plasma cleaning, ethanol dehydration, baking and the like are utilized to thoroughly remove the excess and residual bonding materials in the chopper channel, so that the cleaning quality is improved, the operation is convenient and fast, and the cost is low.
Drawings
Fig. 1 is a schematic structural view of a shelf.
Fig. 2 is a top view of fig. 1.
Detailed Description
The using method of the invention is as follows:
as shown in fig. 1 and 2, an inner circle and an outer circle of placing through holes 11 are formed in the object placing table 1 along the circumferential direction, four placing through holes 11 are uniformly formed in the inner circle, eight placing through holes 11 are uniformly formed in the outer circle, and the hole openings of the placing through holes 11 are of a tapered structure with a large top and a small bottom; the used cleavers (not marked) are respectively inserted into the corresponding placing through holes 11 from top to bottom, the support columns 12 are arranged at the bottoms of the placing platforms 1, when the cleavers are used, 20% NaOH solution is configured in beakers (not marked), after cooling, the placing platforms 1 are placed into the beakers, the support columns 12 contact the bottoms of the beakers to ensure that the NaOH solution flows through the bottoms of the placing platforms 1 and fully infiltrates the cleavers along with the liquid level, the height of the liquid level in the placing through holes 11 is consistent with the height of the liquid level in the beakers, then the beakers are placed into an ultrasonic cleaning machine, and ultrasonic cleaning is carried out for 5-8 minutes.
After ultrasonic cleaning, the object placing table 1 is washed by deionized water for 5-10 minutes.
After the deionized water is cleaned, nitrogen is used for blowing for 30-60 s.
After nitrogen blowing, the top end of the wedge-shaped tool is inspected by a magnification factor of 60-100 times under a microscope so as to inspect whether the cleaver is clean and whether the cleaver is worn.
If the foreign matters are still found by microscopic examination, repeating the steps 2) to 4); if no obvious foreign matter exists in microscopic examination, cleaning with plasma water, wherein the parameters of the plasma cleaning are as follows: the power is 150-300 w, preferably 240 w; the time is 120s to 200s, preferably 180 s; the flow rate of argon gas is 100-200 ml/min, preferably 170 ml/min.
And after the plasma water is cleaned, cleaning the cleaver for 3-5 minutes by using deionized water.
After the deionized water is washed again, the cleaver is placed in ethanol for soaking for 2 minutes.
Blowing the soaked riving knife by nitrogen for 30-60 s.
And after nitrogen is blown again, putting the cleaver into an oven for baking at the temperature of 150 ℃ for 10-20 minutes so as to remove impurities such as redundant water and the like.
The undescribed parts of the present invention are consistent with the prior art, and are not described herein.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent structures made by using the contents of the present specification and the drawings can be directly or indirectly applied to other related technical fields, and are within the scope of the present invention.
Claims (10)
1. A method for improving the cleaning quality of a wedge welding cleaver is characterized by comprising the following steps:
the method comprises the following steps:
1) and carrying out ultrasonic cleaning. Putting the cleaver into a special clamp, and ultrasonically cleaning the cleaver in NaOH solution;
2) washing with deionized water;
3) blowing with nitrogen;
4) performing microscopic examination;
5) plasma cleaning;
6) washing with deionized water;
7) dehydrating the ethanol;
8) blowing with nitrogen;
9) and baking in an oven.
2. The method for improving the cleaning quality of the wedge-welding cleaver according to claim 1, which is characterized in that: in the step 1), the special fixture comprises an object placing table (1), at least two placing through holes (11) are uniformly arranged on the object placing table (1) along the circumferential direction, and the orifices of the placing through holes (11) are of a conical structure with a large top and a small bottom; a support column (12) is arranged at the bottom of the object placing table (1); when the ultrasonic cleaning device is used, a 20% NaOH solution is configured in a beaker, after cooling, the placing table (1) is placed in the beaker, the supporting columns (12) are in contact with the bottom of the cup, it is guaranteed that a cleaning solution flows through the bottom of the placing table (1), the chopper is fully soaked, then the beaker is placed in an ultrasonic cleaning machine, and ultrasonic cleaning is carried out for 5-8 minutes.
3. The method for improving the cleaning quality of the wedge-welding cleaver according to claim 1, which is characterized in that: in the step 2, the placing table (1) is washed by deionized water for 5-10 minutes.
4. The method for improving the cleaning quality of the wedge-welding cleaver according to claim 1, which is characterized in that: in the step 3, the time for blowing with nitrogen gas is 30 to 60 seconds.
5. The method for improving the cleaning quality of the wedge-welding cleaver according to claim 1, which is characterized in that: in the step 4, the top end of the wedge-shaped tool is inspected under a microscope with a magnification of 60 to 100 times.
6. The method for improving the cleaning quality of the wedge-welding cleaver according to claim 1, which is characterized in that: in step 5, the parameters of plasma cleaning are as follows: the power is 150-300 w, the time is 120-200 s, and the argon flow is 100-200 ml/min.
7. The method for improving the cleaning quality of the wedge-welding cleaver according to claim 1, which is characterized in that: and in the step 6, cleaning the substrate for 3-5 minutes by using deionized water.
8. The method for improving the cleaning quality of the wedge-welding cleaver according to claim 1, which is characterized in that: in step 7, the cleaver is immersed in ethanol for 2 minutes.
9. The method for improving the cleaning quality of the wedge-welding cleaver according to claim 1, which is characterized in that: in the step 8, the cleaver is blown by nitrogen for 30-60 s.
10. The method for improving the cleaning quality of the wedge-welding cleaver according to claim 1, which is characterized in that: in the step 9, the cleaver is placed into an oven for baking at the temperature of 150 ℃ for 10-20 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010678917.2A CN111921976B (en) | 2020-07-15 | 2020-07-15 | Method for improving cleaning quality of wedge welding cleaver |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010678917.2A CN111921976B (en) | 2020-07-15 | 2020-07-15 | Method for improving cleaning quality of wedge welding cleaver |
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| Publication Number | Publication Date |
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| CN111921976A true CN111921976A (en) | 2020-11-13 |
| CN111921976B CN111921976B (en) | 2022-02-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010678917.2A Active CN111921976B (en) | 2020-07-15 | 2020-07-15 | Method for improving cleaning quality of wedge welding cleaver |
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| CN (1) | CN111921976B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114178244A (en) * | 2021-12-07 | 2022-03-15 | 富芯微电子有限公司 | Method for solving damage in Wedge cleaning process |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6036785A (en) * | 1997-05-02 | 2000-03-14 | Ferrell; Gary W. | Method for removing chemical residues from a surface |
| CN103295881A (en) * | 2013-06-04 | 2013-09-11 | 上海华力微电子有限公司 | Method for removing low-k dielectric materials on surfaces of silicon wafers |
| CN103990612A (en) * | 2014-05-30 | 2014-08-20 | 贵州雅光电子科技股份有限公司 | Diode part cleaning and drying device and operating method thereof |
| CN105327875A (en) * | 2015-09-25 | 2016-02-17 | 长治清华机械厂 | Normal-temperature metal abstergent type water-based cleaning fluid flushing method |
| CN205762698U (en) * | 2016-06-23 | 2016-12-07 | 浙江钱江摩托股份有限公司 | A kind of knife rest for chopper ultrasonic cleaning |
| CN108176640A (en) * | 2017-11-17 | 2018-06-19 | 天津津航技术物理研究所 | A kind of drying means for improving laser gyro cavity cleaning degree |
-
2020
- 2020-07-15 CN CN202010678917.2A patent/CN111921976B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6036785A (en) * | 1997-05-02 | 2000-03-14 | Ferrell; Gary W. | Method for removing chemical residues from a surface |
| CN103295881A (en) * | 2013-06-04 | 2013-09-11 | 上海华力微电子有限公司 | Method for removing low-k dielectric materials on surfaces of silicon wafers |
| CN103990612A (en) * | 2014-05-30 | 2014-08-20 | 贵州雅光电子科技股份有限公司 | Diode part cleaning and drying device and operating method thereof |
| CN105327875A (en) * | 2015-09-25 | 2016-02-17 | 长治清华机械厂 | Normal-temperature metal abstergent type water-based cleaning fluid flushing method |
| CN205762698U (en) * | 2016-06-23 | 2016-12-07 | 浙江钱江摩托股份有限公司 | A kind of knife rest for chopper ultrasonic cleaning |
| CN108176640A (en) * | 2017-11-17 | 2018-06-19 | 天津津航技术物理研究所 | A kind of drying means for improving laser gyro cavity cleaning degree |
Non-Patent Citations (1)
| Title |
|---|
| 沙帕拉•K•普拉萨德: "《复杂的引线键合互连工艺》", 30 September 2015, 中国宇航出版社 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114178244A (en) * | 2021-12-07 | 2022-03-15 | 富芯微电子有限公司 | Method for solving damage in Wedge cleaning process |
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| CN111921976B (en) | 2022-02-01 |
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