CN202839752U - LED chip radiator having radial high-density flow guide duct structure - Google Patents
LED chip radiator having radial high-density flow guide duct structure Download PDFInfo
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- CN202839752U CN202839752U CN 201220429418 CN201220429418U CN202839752U CN 202839752 U CN202839752 U CN 202839752U CN 201220429418 CN201220429418 CN 201220429418 CN 201220429418 U CN201220429418 U CN 201220429418U CN 202839752 U CN202839752 U CN 202839752U
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- evaporator
- led chip
- honeycomb duct
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- highly dense
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Abstract
The utility model is an LED chip radiator having a radial high-density flow guide duct structure. The LED chip radiator comprises an evaporator of a negative pressure sealing body, and the evaporator is internally filled with a liquid working medium. The evaporator comprises a heating body having a relatively high heat conductivity coefficient metal material. The back of a heating surface of the heating body is processed to form a radial high-density flow guide duct having a certain capillary force. The outer wall surface of the evaporator is provided with a plurality of fins for increasing the heat exchange area. The LED chip radiator improves heat radiation efficiency, is small in size and light in weight, and solves a problem that the temperature of the chip center of an LED light source gets too high.
Description
Technical field
The utility model relates to a kind of led chip radiator of emanant highly dense honeycomb duct structure, is mainly used in concentrating the heat radiation of packaged high-power LED chip.
Background technology
Led chip in the LED lamp has 80% electric energy conversion to become heat in the course of the work approximately, if can not take effectively measure to reject heat in the environment, will cause junction temperature of chip to raise, and luminous efficiency reduces, the lost of life.Natural convection air cooling and air blast cooling heat radiation are mainly adopted in the at present heat radiation of led chip, increase along with led chip power, above-mentioned dual mode is because heat-obtaining and heat-sinking capability are limited, be difficult to the heater members heat-obtaining from high heat flux, and dispel the heat efficiently, seriously restrict LED and developed to high power, therefore needed the new cooling technology of exploitation badly.There are the problems such as heat-sinking capability is not enough, weight and volume is excessive in current led chip radiator.
Summary of the invention
For solving the problems of the technologies described above, the utility model provides a kind of led chip radiator of emanant highly dense honeycomb duct structure, improves the problem that radiating efficiency, volume are little, lightweight, solved concentrated led light source chip center excess Temperature.
The technical solution adopted in the utility model is:
The led chip radiator of a kind of emanant highly dense honeycomb duct structure of the present utility model, it is characterized in that: the evaporator that comprises the negative-pressure sealing body, be perfused with liquid working substance in the evaporator, evaporator comprises the heated body with high thermal conductivity metal material, the heated body back side is processed with the emanant highly dense honeycomb duct that forms certain capillary force, and the outside wall surface of evaporator is provided with a plurality of fins that increase heat exchange area.
The led chip radiator of described emanant highly dense honeycomb duct structure, it is characterized in that: the width of emanant highly dense honeycomb duct is in the 0.01-3mm scope, and the degree of depth is in the 0.01-3mm scope, and spacing is in the 0.1-5mm scope, the fin thickness of evaporator outside wall surface is 1-5mm, and spacing is 1-30mm.
The led chip radiator of described emanant highly dense honeycomb duct structure is characterized in that: the heating surface of evaporator heated body is by heat conductive silica gel and the adhesion of heater outer surface phase.
In the described led chip radiator evaporator a certain amount of liquid working substance is housed, working medium is in the effect current downflow of highly dense honeycomb duct capillary force, and working medium enters into emission center, both led chip central temperature peak position.Liquid working substance in the emanant highly dense honeycomb duct structure is in the operating mode of negative pressure, and the steam of the rear generation of being heated is evenly distributed in the inner surface of evaporator, release heat after the inner surface condensation, and the fin by outside wall surface discharges to air.
This programme has overcome the excessive defective of axial thermal resistance that adopts the simple metal material to cause effectively, the led chip radiator of described emanant highly dense honeycomb duct structure, solved the problem of concentrated led light source chip center excess Temperature, when having solved the irradiation of the LED radiator elevation angle, the problem of absorption that contacts of honeycomb duct and work phase-change liquid.
Description of drawings
The schematic diagram of the led chip radiator of the emanant highly dense honeycomb duct structure of Fig. 1.
Embodiment
Embodiment as shown in the figure, directly led chip is encapsulated into the metal material surface with high thermal conductivity, process emanant highly dense honeycomb duct at the back side of this metal material, the shape and size of described highly dense honeycomb duct can form certain REFRIGERATION SYSTEM DRIVEN BY CAPILLARY FORCE power, the width of above-mentioned highly dense honeycomb duct is in the 0.01-3mm scope, the degree of depth is in the 0.01-3mm scope, and spacing is in the 0.1-5mm scope.
Embodiment sees figure, the structural representation of the radiator of emanant highly dense honeycomb duct structure.Radiator comprises an evaporator 5, evaporator 5 is perfused with liquid working substance 3 in the seal of negative pressure and its, evaporator comprises the heated body 1 with high thermal conductivity metal material, the heated body back side is processed with the emanant highly dense honeycomb duct 2 that forms certain capillary force, described honeycomb duct shape and size can all form certain capillary force, the outer surface of evaporator be provided with fin 4 for increasing with the heat exchange area of air side.The be heated steam of rear generation of the liquid working substance of emanant highly dense honeycomb duct is evenly distributed in the inner surface of evaporator, release heat after the inner surface condensation, and the fin by outside wall surface discharges to air.
Above-mentioned highly dense honeycomb duct width is in the 0.01-3mm scope, and the degree of depth is in the 0.01-3mm scope, and spacing is in the 0.1-5mm scope.
The fin thickness of above-mentioned evaporator outside wall surface is 1-5mm, and spacing is 1-30mm.The heating surface of above-mentioned evaporator heated body is by heat conductive silica gel and the adhesion of heater outer surface phase.
The technical solution of the utility model is: directly led chip is encapsulated into the metal material surface with high thermal conductivity, be processed into emanant highly dense honeycomb duct at the back side of this metal material, described highly dense honeycomb duct shape and size can form certain capillary force, with the sealing backside of described metal material in a metal cavitg, form the enhanced heat exchange evaporator that minute yardstick heat exchange and phase transformation combine by special negative pressure cold seal dress technique, the outer surface of evaporator be provided with fin for increasing with the heat exchange area of air side.
A certain amount of liquid working substance is housed in the evaporator, and working medium is in the effect current downflow of highly dense honeycomb duct capillary force, and working medium enters into emission center, both led chip central temperature peak position.Liquid working substance in the emanant highly dense honeycomb duct structure is in the operating mode of negative pressure, and the steam of the rear generation of being heated is evenly distributed in the inner surface of evaporator, release heat after the inner surface condensation, and the fin by outside wall surface discharges to air.
This programme has overcome the axial thermal resistance excessive defective that adopts the simple metal material to cause effectively, has solved the problem of concentrated led light source chip center excess Temperature.When having solved the irradiation of the LED radiator elevation angle, the problem of absorption that contacts of honeycomb duct and work phase-change liquid.
Realize the special-purpose member of said method: have emanant highly dense honeycomb duct structure, the metallic plate of high thermal conductivity, the shape and size of described highly dense honeycomb duct can form certain capillary force, while is at the radiation point of honeycomb duct, institute holds a certain amount of liquid working substance, the rear rapid phase transformation gas that is heated, the radiation point of honeycomb duct has formed the capillary force drive point thus, has greatly promoted capillary pulling power.
Technique effect: form emanant highly dense honeycomb duct structure LED chip radiator by special negative pressure cold seal dress technique, have the enhanced heat exchange function that minute yardstick heat exchange and rapid phase transition combine.
Find that by research liquid working substance belongs to the micro-scale heat exchange in the emanant highly dense honeycomb duct structure, its heat-obtaining can the present high performance chips of force rate, and high heat flux is taller, can satisfy current LED heat radiation requirement fully; Reduce and control LED working temperature, guarantee and improve the service behaviour of device.
Any non-creativeness that those skilled in the art do around this spirit improves, and all belongs to protection range of the present utility model.
Claims (3)
1. the led chip radiator of emanant highly dense honeycomb duct structure, it is characterized in that: the evaporator (5) that comprises the negative-pressure sealing body, be perfused with liquid working substance (3) in the evaporator, evaporator comprises the heated body (1) with high thermal conductivity metal material, the heated body heating surface back side is processed with the emanant highly dense honeycomb duct (2) that forms certain capillary force, and the outside wall surface of evaporator is provided with a plurality of fins (4) that increase heat exchange area.
2. the led chip radiator of emanant highly dense honeycomb duct structure according to claim 1, it is characterized in that: the width of emanant highly dense honeycomb duct is in the 0.01-3mm scope, the degree of depth is in the 0.01-3mm scope, spacing is in the 0.1-5mm scope, the fin thickness of evaporator outside wall surface is 1-5mm, and spacing is 1-30mm.
3. the led chip radiator of emanant highly dense honeycomb duct structure according to claim 1, it is characterized in that: the heating surface of evaporator heated body is by heat conductive silica gel and the adhesion of heater outer surface phase.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220429418 CN202839752U (en) | 2012-08-28 | 2012-08-28 | LED chip radiator having radial high-density flow guide duct structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220429418 CN202839752U (en) | 2012-08-28 | 2012-08-28 | LED chip radiator having radial high-density flow guide duct structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202839752U true CN202839752U (en) | 2013-03-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220429418 Expired - Fee Related CN202839752U (en) | 2012-08-28 | 2012-08-28 | LED chip radiator having radial high-density flow guide duct structure |
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| CN (1) | CN202839752U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111275948A (en) * | 2020-03-19 | 2020-06-12 | 太原师范学院 | Electric fire fighting early warning system |
-
2012
- 2012-08-28 CN CN 201220429418 patent/CN202839752U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111275948A (en) * | 2020-03-19 | 2020-06-12 | 太原师范学院 | Electric fire fighting early warning system |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| DD01 | Delivery of document by public notice |
Addressee: Beijing Ruidesan Energy-Saving Technology Co., Ltd. Document name: Notification to Pay the Fees |
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| DD01 | Delivery of document by public notice | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130327 Termination date: 20180828 |
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| CF01 | Termination of patent right due to non-payment of annual fee |