CN202829922U - Base-material-free high-thermal-conductive double sticky tape - Google Patents
Base-material-free high-thermal-conductive double sticky tape Download PDFInfo
- Publication number
- CN202829922U CN202829922U CN 201220300409 CN201220300409U CN202829922U CN 202829922 U CN202829922 U CN 202829922U CN 201220300409 CN201220300409 CN 201220300409 CN 201220300409 U CN201220300409 U CN 201220300409U CN 202829922 U CN202829922 U CN 202829922U
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- base material
- thermal
- heat conduction
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Abstract
The utility model discloses a double sticky tape, in particular to a base-material-free high-thermal-conductive double sticky tape which is composed of a base-material-free thermal-conductive glue body and release paper, wherein the release paper is covered on one surface of the base-material-free thermal-conductive glue body. The base-material-free thermal-conductive glue body is formed by adding high-thermal-conductive material ceramic powder into crylic acid pressure-sensitive glue according to certain proportion. The side of the thermal-conductive glue body without the release paper is directly stuck on a fixing ring and then laminated and twisted sequentially to form double sticky tape products with concentric layers twisted in laminating mode. The base-material-free high-thermal-conductive double sticky tape aims at having the functions of high thermal conductive rate, high holding power, weather resistance, vibration reduction, bonding and pasting, solves the problem of heat conduction and pasting of normal adhesive tapes in the market in the field of light-emitting diodes (LED), television (TV) backlight sources, backlight modules, integrated circuits (IC), radiators, power sources and the like, and improves the technology.
Description
Technical field
The present invention relates to double sticky tape, particularly a kind of without the high heat-conducting double-sided adhesive tape of base material.
Background technology
At present, various adhesive tapes have become indispensable article in electronics, the electrical apparatus industry, be used for various electronic components stickup, be fixed on circuit card such as electronic devices and components, perhaps electronic devices and components fixing on the high density integrated circuit.The products such as LED high-power lamp bar, LED lamp, TV backlight, backlight source module bonding also needs to use various double sticky tapes.But in actual applications, many problems have but been run into.For example, in the work of electronic devices and components, can produce a large amount of heats, this thermotolerance to adhesive tape has proposed very high requirement, needs it also can keep very strong clinging power under the condition of high temperature.While has also proposed Secretary to the heat sinking function of adhesive tape, and the adhesive tape that requires to adopt has good heat conductivility.For example, led chip and aluminium base thermal value are high, adopt conventional adhesive tape, because poor thermal conductivity is difficult to overcome the problem that the LED illumination is generated heat; Again for example, the normal heat-conducting cream that adds between electrical fittings heating element and scatterer, be used for heat radiation, although these heat-conducting cream heat conductivilitys are outstanding, its clinging power is low, even the function of not adhering, therefore need to be fixed electrical fittings heating element and scatterer with screw, use very inconveniently, and these heat-conducting creams are difficult operates, smear the inhomogeneous excessive glue that tends to cause, cause the generation of defective products.For LED, TV industry, the heat conduction technology is always immature, and adhesive tape commonly used often contains volatile matter, owing to the erosion of volatile matter, therefore often has the light decay phenomenon of TV backlight, LED etc., affects the quality of product.
In order to address the above problem, inventor of the present utility model is through further investigation, invented a kind of without the high heat-conducting double-sided adhesive tape of base material, this double sticky tape has high thermal conductivity, high confining force, weathering resistance, damping, applying paste functionality, solve industry heat conduction, the stickup problems such as LED, TV backlight, backlight source module, IC, scatterer, power supply, and improved technique.At present, China there is no the like product without base material heat conduction adhesive tape.
The utility model content
The purpose of this utility model provide a kind of have high thermal conductivity, high confining force, weathering resistance, damping, applying paste functionality without the base material double sticky tape, solved and commonly used on the market adhesive tape in heat conduction, the stickup problem of the industries such as LED, TV backlight, backlight source module, IC, scatterer, power supply, and improved technique.
The utility model provides and a kind ofly, it is characterized in that by forming without base material heat conduction colloid and separate-type paper without the high heat-conducting double-sided adhesive tape of base material, is coated with separate-type paper in described one side without base material heat conduction colloid.Described is to add according to a certain percentage a kind of highly heat-conductive material ceramic powder in acrylic pressure sensitive glue without base material heat conduction colloid, by uviolizing and hot procedure, single sintering.Form without base material heat conduction colloid on enclose again white or blue separate-type paper (film), namely form described without the high heat-conducting double-sided adhesive tape of base material.Color without base material heat conduction colloid is white.Use the different of product and character according to the heat conduction colloid, its thickness can be 0.05mm-3.0mm, is preferably 0.13mm-0.5mm, and more preferably, described thickness without base material heat conduction colloid is 0.13mm, 0.25mm, 0.38mm or 0.5mm.Described without the high heat-conducting double-sided adhesive tape of base material thermal conductivity be not less than 0.9 watt/(rice open).The one side of described heat conduction colloid no-off paper directly is affixed on the set collar, then stacks gradually winding, forms the double sticky tape product with concentric stacked winding.Described set collar can be the cycle object of various materials, is preferably sebific duct, and its shape can be any close-shaped, such as circle, square, rectangle, ellipse, is preferably circle.
Compare with like product, because the utility model has good heat conductivility without the high heat-conducting double-sided adhesive tape of base material, be fit to different clients' requirement, bonding on the products such as LED high-power lamp bar, LED lamp, TV backlight, backlight source module, IC, scatterer, the heat radiation of PCB wiring board, be widely used in a plurality of industries and the fields such as computer, communication equipment, consumer electronics, power supply, automotive electronics, industrial electrical equipment.For example, as the heat dissipation interface material of plastic cement spare part; Be pasted on purposes between heat sink part and metal base plate, such as CPU, PCB wiring board etc.; Be used on the products such as LED high-power lamp bar, LED lamp, TV backlight, backlight source module bonding; The thermal conduction purposes of other electronics or electrical device; Be used for led chip and aluminium base heat conduction, solve a LED illumination heating difficult problem; Be used for led chip and be connected the plastic cement spare part with scatterer heat conduction connection, solved thermal grease, the difficult operation of heat-conducting cream is smeared inhomogeneously, and excessive glue causes the difficult problem of defective products; Two hang-ups that are used for LED, TV backlight: the decline of light and heat transfer, heat conduction and heat radiation; Be used for the power supply industry, need rivet, screw fixed power source related accessory, directly get final product with the heat conduction adhesive tape sticking, not only heat conduction, and can fix, replace screw, rivet.
Description of drawings
Fig. 1 is without the high heat-conducting double-sided adhesive tape of base material sectional view in the utility model.
Fig. 2 is without the high heat-conducting double-sided adhesive tape of base material schematic diagram in the utility model.
Explanation about the accompanying drawing major portion
| Numbering | Title |
| 1 | Separate-type paper |
| 2 | Acrylic pressure |
| 3 | |
| 4 | Without base material |
| 5 | Sebific duct |
Embodiment
Below in conjunction with drawings and Examples the utility model is further described, but these embodiment are of the present utility model giving an example, the utility model is not restricted to this.
Embodiment 1
As depicted in figs. 1 and 2, a kind of without the high heat-conducting double-sided adhesive tape of base material, by forming without base material heat conduction colloid 4 and separate-type paper 1, this is comprised of according to certain ratio acrylic pressure sensitive glue 2 and the ceramic powder 3 with heat conduction function without base material heat conduction colloid 4, ceramic powder 3 is distributed in the acrylic pressure sensitive glue 2 equably, and this thickness without base material heat conduction colloid is 0.13mm.As shown in Figure 2, this one side without base material heat conduction colloid 4 no-off paper directly is affixed on the sebific duct 5, then stacks gradually winding, forms the double sticky tape product with concentric stacked winding.
Embodiment 2
As depicted in figs. 1 and 2, a kind of without the high heat-conducting double-sided adhesive tape of base material, by forming without base material heat conduction colloid 4 and separate-type paper 1, this is comprised of according to certain ratio acrylic pressure sensitive glue 2 and the ceramic powder 3 with heat conduction function without base material heat conduction colloid 4, ceramic powder 3 is distributed in the acrylic pressure sensitive glue 2 equably, and this thickness without base material heat conduction colloid is 0.25mm.As shown in Figure 2, this one side without base material heat conduction colloid 4 no-off paper directly is affixed on the sebific duct 5, then stacks gradually winding, forms the double sticky tape product with concentric stacked winding.
As depicted in figs. 1 and 2, a kind of without the high heat-conducting double-sided adhesive tape of base material, by forming without base material heat conduction colloid 4 and separate-type paper 1, this is comprised of according to certain ratio acrylic pressure sensitive glue 2 and the ceramic powder 3 with heat conduction function without base material heat conduction colloid 4, ceramic powder 3 is distributed in the acrylic pressure sensitive glue 2 equably, and this thickness without base material heat conduction colloid is 0.38mm.As shown in Figure 2, this one side without base material heat conduction colloid 4 no-off paper directly is affixed on the sebific duct 5, then stacks gradually winding, forms the double sticky tape product with concentric stacked winding.
As depicted in figs. 1 and 2, a kind of without the high heat-conducting double-sided adhesive tape of base material, by forming without base material heat conduction colloid 4 and separate-type paper 1, this is comprised of according to certain ratio acrylic pressure sensitive glue 2 and the ceramic powder 3 with heat conduction function without base material heat conduction colloid 4, ceramic powder 3 is distributed in the acrylic pressure sensitive glue 2 equably, and this thickness without base material heat conduction colloid is 0.5mm.As shown in Figure 2, this one side without base material heat conduction colloid 4 no-off paper directly is affixed on the sebific duct 5, then stacks gradually winding, forms the double sticky tape product with concentric stacked winding.
As depicted in figs. 1 and 2, a kind of without the high heat-conducting double-sided adhesive tape of base material, by forming without base material heat conduction colloid 4 and separate-type paper 1, this is comprised of according to certain ratio acrylic pressure sensitive glue 2 and the ceramic powder 3 with heat conduction function without base material heat conduction colloid 4, ceramic powder 3 is distributed in the acrylic pressure sensitive glue 2 equably, and this thickness without base material heat conduction colloid is 0.05mm.As shown in Figure 2, this one side without base material heat conduction colloid 4 no-off paper directly is affixed on the sebific duct 5, then stacks gradually winding, forms the double sticky tape product with concentric stacked winding.
Embodiment 6
As depicted in figs. 1 and 2, a kind of without the high heat-conducting double-sided adhesive tape of base material, by forming without base material heat conduction colloid 4 and separate-type paper 1, this is comprised of according to certain ratio acrylic pressure sensitive glue 2 and the ceramic powder 3 with heat conduction function without base material heat conduction colloid 4, ceramic powder 3 is distributed in the acrylic pressure sensitive glue 2 equably, and this thickness without base material heat conduction colloid is 3.0mm.Shown in Fig. 2, this one side without base material heat conduction colloid 4 no-off paper directly is affixed on the sebific duct 5, then stacks gradually winding, forms the double sticky tape product with concentric stacked winding.
It should be noted, can revise arbitrarily for various details of the present utility model, but undoubtedly, these modifications all will fall within the protection domain of the present utility model.
Claims (7)
1. one kind without the high heat-conducting double-sided adhesive tape of base material, by forming without base material heat conduction colloid and separate-type paper, it is characterized in that, is coated with separate-type paper in described one side without base material heat conduction colloid.
2. according to claim 1ly it is characterized in that without the high heat-conducting double-sided adhesive tape of base material, described being uniformly distributed in the acrylic pressure sensitive glue by ceramic powder without base material heat conduction colloid consists of.
3. according to claim 1 and 2ly it is characterized in that without the high heat-conducting double-sided adhesive tape of base material, described one side without base material heat conduction colloid no-off paper directly is affixed on the set collar, then stacks gradually winding.
4. according to claim 3ly it is characterized in that without the high heat-conducting double-sided adhesive tape of base material, is a circular sebific duct on the described set collar.
5. arbitrary claim is described according to claim 1-2 is characterized in that without the high heat-conducting double-sided adhesive tape of base material, and described double sticky tape thickness is 0.05mm-3.0mm.
6. according to claim 5ly it is characterized in that without the high heat-conducting double-sided adhesive tape of base material, described double sticky tape thickness is 0.13mm-0.5mm.
7. according to claim 6ly it is characterized in that without the high heat-conducting double-sided adhesive tape of base material, described double sticky tape thickness is 0.13mm, 0.25mm, 0.38mm or 0.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220300409 CN202829922U (en) | 2012-06-25 | 2012-06-25 | Base-material-free high-thermal-conductive double sticky tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220300409 CN202829922U (en) | 2012-06-25 | 2012-06-25 | Base-material-free high-thermal-conductive double sticky tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202829922U true CN202829922U (en) | 2013-03-27 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220300409 Expired - Lifetime CN202829922U (en) | 2012-06-25 | 2012-06-25 | Base-material-free high-thermal-conductive double sticky tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202829922U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104143951A (en) * | 2013-05-08 | 2014-11-12 | Lg电子株式会社 | Solar cell module and edge tape usable with the same |
| TWI553798B (en) * | 2015-04-15 | 2016-10-11 | 力成科技股份有限公司 | Semiconductor package and manufacturing method thereof |
| CN106752999A (en) * | 2016-12-30 | 2017-05-31 | 芜湖研高粘胶新材料有限公司 | One kind is without base material high heat conduction two-sided tape |
-
2012
- 2012-06-25 CN CN 201220300409 patent/CN202829922U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104143951A (en) * | 2013-05-08 | 2014-11-12 | Lg电子株式会社 | Solar cell module and edge tape usable with the same |
| TWI553798B (en) * | 2015-04-15 | 2016-10-11 | 力成科技股份有限公司 | Semiconductor package and manufacturing method thereof |
| CN106752999A (en) * | 2016-12-30 | 2017-05-31 | 芜湖研高粘胶新材料有限公司 | One kind is without base material high heat conduction two-sided tape |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20191204 Address after: 246000 south of Longshan East Road and west of Gaoqiao Road, Taihu Economic Development Zone, Anqing City, Anhui Province Patentee after: Anhui Fuyin New Material Co.,Ltd. Address before: 523000 Guangdong province Dongguan City Qiaotou Agrocybe Jiao Cun Fu Sheng Lu Patentee before: DONGGUAN FUYIN ADHESIVE TECHNOLOGY Co.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130327 |