CN202797082U - SMD (surface mount device) LED (light-emitting diode) of combined type wire frame - Google Patents
SMD (surface mount device) LED (light-emitting diode) of combined type wire frame Download PDFInfo
- Publication number
- CN202797082U CN202797082U CN2012200738996U CN201220073899U CN202797082U CN 202797082 U CN202797082 U CN 202797082U CN 2012200738996 U CN2012200738996 U CN 2012200738996U CN 201220073899 U CN201220073899 U CN 201220073899U CN 202797082 U CN202797082 U CN 202797082U
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- CN
- China
- Prior art keywords
- led
- conductive metal
- metal frames
- bowl cup
- metal lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Led Device Packages (AREA)
Abstract
The utility model discloses an SMD (surface mount device) LED (light-emitting diode) of a combined type wire frame. The SMD LED comprises bowl cups, a plurality of metal lead frames, a transparent filler and an LED wafer fixed on the metal lead frames, wherein the metal lead frames which are coated in the transparent filler are bent without curves on the vertical center lines of the metal lead frames, and the vertical center lines of the plurality of metal lead frames are not positioned on the same straight line; the bowl cups are plastic bowl cups, the plurality of metal lead frames are inlaid in the plastic bowl cups, and the transparent filler is filled in a gap between the metal lead frames and the plastic bowl cups and packages the LED wafer and wires; and the bowl cups are spotlight bowl cups and are arranged on the metal lead frames, the spotlight bowl cups are internally provided with the LED wafer, and the transparent filler directly packages the metal lead frames, the spotlight bowl cups, the wires and the LED wafer. According to the utility model, the combined method of the combined type lead frame is flexible, various in shape, and firm and reliable, and an LED can display in multiple colors.
Description
Technical field
The utility model relates to the LED technical field, particularly a kind of paster LED of Combined guide coil holder.
Background technology
LED has energy-efficient characteristics and is widely used, existing LED mainly contains following a few class: great power LED, direct insertion LED, dot matrix LED and paster LED, existing patch type LED resistance to elevated temperatures is poor, because injection moulding plastic and transparent filler are the bondings of face and face, and they belong to the cold and hot shrinkage ratio difference of inhomogeneity material, used injection moulding plastic under the adverse circumstances out of doors of a specified duration, transparent filler, conductive silver glue, binding site cracking segregation phenomenon will appear in the binding site stress difference of gold solder point and conductive metal frames, causes the inner led circuit broken string of paster apparatus, the problems such as water inlet.
The utility model content
The defective that exists in order to overcome above-mentioned prior art, the utility model provides a kind of paster LED of Combined guide coil holder, and the lead frame compound mode is flexible, and shape is various, and is solid and reliable, and a LED can show multiple color.
To achieve these goals, the technical solution of the utility model is as follows:
A kind of paster LED of Combined guide coil holder, comprise bowl cup, a plurality of conductive metal frames, coated metal lead frame and LED wafer and fill bowl transparent filler of cup internal pore, be fixed on the LED wafer above the conductive metal frames, be characterized in, the conductive metal frames of parcel is crooked without bending on its vertical center line in the described transparent filling object, and the vertical center line of described a plurality of conductive metal frames is not on the same straight line.
The vertical center line of above-mentioned a plurality of conductive metal frames is not on the same straight line, so that it is various to be fixed on the LED wafer arrangement mode of described conductive metal frames top planes, thereby reaches the effect that a paster LED can show multiple color.
As a kind of preferred version, described bowl cup is the plastic bowl cup, a plurality of conductive metal frames are embedded in the described plastic bowl cup, the plane that described conductive metal frames is used for fixed L ED wafer is higher than plastic bowl cup bottom, be lower than the plastic bowl rim of a cup, described transparent filler is filled in the space between conductive metal frames and the plastic bowl cup and wraps up LED wafer and wire.
Described wire is used for connecting the electrode points on LED wafer electric limit and the conductive metal frames.
The distance that the plane that described conductive metal frames is used for fixed L ED wafer is higher than plastic bowl cup bottom is 0.2-100mm, the height of every conductive metal frames in the plastic bowl cup is identical, and the conductive metal frames bent reshaping beyond the outstanding plastic bowl cup is wrapped in the surface of plastic bowl cup.
Described conductive metal frames is notch cuttype, T font etc., and its compound mode is various.
As another kind of preferred version, comprise a plurality of conductive metal frames, transparent filler, convergent bowl cup and LED wafer, described plain conductor top of the trellis arranges 1-10 convergent bowl cup, described LED wafer is positioned in the described convergent bowl cup, and described transparent filler is direct coated metal lead frame, convergent bowl cup, LED wafer and wire.
Place a plurality of LED wafers in the described convergent bowl cup, described LED wafer connects the electrode points that is arranged on the conductive metal frames by wire.The convergent bowl cup is placed a plurality of LED wafers, can show more colors, changes various.
Conductive metal frames in the such scheme is the LED lead frame of at least two kinds of regular shapes.
Further, the transparent filler in the described two schemes is transparent epoxy resin or transparent silica gel.
The beneficial effects of the utility model are, the textural association mode is flexible, and combination of shapes is various, and is solid and reliable, and a LED can show multiple color, has satisfied the diversified demand of people to the led color conversion.
Description of drawings
Fig. 1 is the cutaway view of the paster LED structure of the utility model embodiment one.
Fig. 2 is the vertical view of the paster LED structure of the utility model embodiment one
Fig. 3 is the cutaway view of the paster LED structure of the utility model embodiment two.
Fig. 4 is the vertical view of the paster LED structure of the utility model embodiment two.
Embodiment:
Be easy to understand understanding in order to make creation characteristic of the present utility model, technological means and to reach purpose, further set forth the utility model below in conjunction with specific embodiment.
Embodiment one:
Referring to Fig. 1 and Fig. 2, a kind of paster LED of Combined guide coil holder, comprise six conductive metal frames 01, plastic bowl cup 02, transparent filler 03 and LED wafer 04, be inlaid with six conductive metal frames 01 in the plastic bowl cup 02, vertical center line a, the b of these six conductive metal frames 01 be not on the same straight line, and the conductive metal frames 01 in the plastic bowl cup 02 is the T font, and the conductive metal frames 01 of parcel is all crooked without bending on its vertical center line a, b in transparent filler 03 body.
Six conductive metal frames 01 are lined up three row, two conductive metal frames 01 of every row.The intrinsic LED wafer 04 of upper end that three conductive metal frames 01 are wherein arranged, then with the electrode points of each LED wafer 04 by wire respectively with the corresponding connection of electrode points of the upper end of other three conductive metal frames 01.
The height of above-mentioned six conductive metal frames 01 in plastic bowl cup 02 is identical, and conductive metal frames 01 bent reshaping beyond the outstanding plastic bowl cup 02 is wrapped in the surface of plastic bowl cup 02.
Vertical center line a, the b of above-mentioned conductive metal frames 01 be not on the same straight line, so that it is various to be fixed on LED wafer 04 arrangement mode of described conductive metal frames 01 top end face, makes a paster LED can show multiple color.
Above-mentioned Fig. 1 and paster LED shown in Figure 2 combination method for making are:
(1) the sheet metal band is struck out the conductive metal frames 01 that part-structure is the T word shape.
(2) will cut off reservation T font part after conductive metal frames 01 electroplating processes after the moulding and be encased in the plastic bowl cup 02.
(3) semi-finished product that conductive metal frames 01 and plastic bowl cup 02 assembled are put into mould and are flattened shaping, guarantee that the conductive metal frames 01 in the plastic bowl cup 02 is highly identical, again the paster LED bracket that protrudes after plastic bowl cup 02 conductive metal frames 01 bent reshaping in addition obtains shaping.
(4) paster LED bracket after the shaping is carried out obtain after a glue, die bond, bonding wire, the sealing paster LED of the Combined guide coil holder of finished product.
Embodiment two:
Referring to Fig. 3 and Fig. 4, a kind of paster LED of Combined guide coil holder, the disjunctor conductive metal frames 11 and disjunctor conductive metal frames 12 that comprise two kinds of regular shapes, transparent filler 3 and the convergent bowl cup 2 that is arranged on conductive metal frames 12 top elliptical shapes and three LED wafers 4 that are positioned in the convergent bowl cup 2, the electrode points of described three LED wafers 4 respectively with other conductive metal frames on electrode points be connected by wire.Transparent filler 3 is direct coated metal lead frame 11, conductive metal frames 12, convergent bowl cup 2 and LED wafer 4.
Elliptical shape convergent bowl cup 2 on the conductive metal frames 12 of the paster LED inside of this kind structure plays the optically focused effect, makes that its light is more concentrated, brightness is higher.
Equally, conductive metal frames 11 is crooked without bending on its vertical center line c in transparent filler 3 inclusion enclaves, and conductive metal frames 12 is crooked without bending on its vertical center line d in transparent filler 3 inclusion enclaves, and two kinds of vertical center line c, d are not on the same straight line.
Wherein, 1-10 convergent bowl cup of plain conductor top of the trellis operated by rotary motion, conductive metal frames 11 can arrange convergent bowl cup 2 with conductive metal frames 12, at least one LED wafer 4 of convergent bowl cup 2 interior placements, when placing a plurality of LED wafers, just can show more colors, change variously, specifically select according to actual needs.
Its combination method for making of Fig. 3 and paster LED shown in Figure 4 is:
(1) the sheet metal band is struck out the disjunctor conductive metal frames 11 and disjunctor conductive metal frames 12 of two kinds of regular shapes.
(2) the disjunctor conductive metal frames 11 after the moulding is encased in the anchor clamps with disjunctor conductive metal frames 12, forms a brand-new led support.
(3) the new led support after will making up carries out obtaining after a glue, die bond, bonding wire, the sealing semi-finished product LED of a plurality of disjunctors.
(4) the semi-finished product LED with disjunctor puts into the tool shaping, obtains the shape that transparent filler inclusion enclave lead frame in addition has the bending bending after the shaping.
(5) there is the disjunctor LED of bending bending to put in the die cutting die lead frame beyond the transparent filler inclusion enclave, obtain the one by one paster LED of the Combined guide coil holder of finished product after die-cut, the lead frame end beyond the transparent filler inclusion enclave of paster LED has bending to be convenient to the paster welding processing of rear end operation LED.
Transparent filler among above-mentioned two kinds of embodiment is transparent epoxy resin or transparent silica gel.
The utility model textural association mode is flexible, and combination of shapes is various, and is solid and reliable, and a LED can show multiple color, satisfied the diversified demand of people to the led color conversion.
More than show and described basic principle of the present utility model, principal character and advantage of the present utility model.The technical staff of the industry should understand; the utility model is not restricted to the described embodiments; that describes in above-described embodiment and the specification just illustrates principle of the present utility model; the utility model also has various changes and modifications under the prerequisite that does not break away from the utility model spirit and scope, and these changes and improvements all fall in claimed the utility model scope.The claimed scope of the utility model is defined by appending claims and equivalent thereof.
Claims (5)
1. the paster LED of a Combined guide coil holder, comprise bowl cup, a plurality of conductive metal frames, coated metal lead frame and LED wafer and fill bowl transparent filler of cup internal pore, it is characterized in that, the LED wafer be fixed on conductive metal frames above, the conductive metal frames of parcel is crooked without bending on vertical center line in the described transparent filling object, and the vertical center line of described a plurality of conductive metal frames is not on the same straight line.
2. the paster LED of a kind of Combined guide coil holder according to claim 1, it is characterized in that, described bowl cup is the plastic bowl cup, a plurality of conductive metal frames are embedded in the described plastic bowl cup, the plane that described conductive metal frames is used for fixed L ED wafer is higher than plastic bowl cup bottom, be lower than a bowl rim of a cup, described transparent filler is filled in the space between conductive metal frames and the plastic bowl cup and wraps up LED wafer and wire.
3. the paster LED of a kind of Combined guide coil holder according to claim 2, it is characterized in that, the distance that the plane that described conductive metal frames is used for fixed L ED wafer is higher than plastic bowl cup bottom is 0.2-100mm, and the height of every conductive metal frames in the plastic bowl cup is identical.
4. the paster LED of a kind of Combined guide coil holder according to claim 1, it is characterized in that, comprise a plurality of conductive metal frames, transparent filler, convergent bowl cup, LED wafer and wire, described plain conductor top of the trellis arranges 1-10 convergent bowl cup, described LED wafer is positioned in the described convergent bowl cup, and described transparent filler is direct coated metal lead frame, convergent bowl cup, LED wafer and wire.
5. according to claim 1 and 2 or the paster LED of 4 described a kind of Combined guide coil holders, it is characterized in that place a plurality of LED wafers in the described bowl cup, described LED wafer connects the electrode points that is arranged on the conductive metal frames by wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200738996U CN202797082U (en) | 2012-03-01 | 2012-03-01 | SMD (surface mount device) LED (light-emitting diode) of combined type wire frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200738996U CN202797082U (en) | 2012-03-01 | 2012-03-01 | SMD (surface mount device) LED (light-emitting diode) of combined type wire frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202797082U true CN202797082U (en) | 2013-03-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200738996U Expired - Fee Related CN202797082U (en) | 2012-03-01 | 2012-03-01 | SMD (surface mount device) LED (light-emitting diode) of combined type wire frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202797082U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102593114A (en) * | 2012-03-01 | 2012-07-18 | 李海涛 | SMD (surface mount device) LED (light-emitting diode) of combined type wire frame |
-
2012
- 2012-03-01 CN CN2012200738996U patent/CN202797082U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102593114A (en) * | 2012-03-01 | 2012-07-18 | 李海涛 | SMD (surface mount device) LED (light-emitting diode) of combined type wire frame |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130313 Termination date: 20160301 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |