CN102593114A - SMD (surface mount device) LED (light-emitting diode) of combined type wire frame - Google Patents
SMD (surface mount device) LED (light-emitting diode) of combined type wire frame Download PDFInfo
- Publication number
- CN102593114A CN102593114A CN2012100517644A CN201210051764A CN102593114A CN 102593114 A CN102593114 A CN 102593114A CN 2012100517644 A CN2012100517644 A CN 2012100517644A CN 201210051764 A CN201210051764 A CN 201210051764A CN 102593114 A CN102593114 A CN 102593114A
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- China
- Prior art keywords
- led
- conductive metal
- metal frames
- bowl cup
- led wafer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Led Device Packages (AREA)
Abstract
The invention discloses an SMD (surface mount device) LED (light-emitting diode) of a combined type wire frame. The SMD LED comprises bowl cups, a plurality of metal lead frames, a transparent filler and an LED wafer fixed on the metal lead frames, wherein the metal lead frames which are coated in the transparent filler are bent without curves on the vertical center lines of the metal lead frames, and the vertical center lines of the plurality of metal lead frames are not positioned on the same straight line; the bowl cups are plastic bowl cups, the plurality of metal lead frames are inlaid in the plastic bowl cups, and the transparent filler is filled in a gap between the metal lead frames and the plastic bowl cups and packages the LED wafer and wires; and the bowl cups are spotlight bowl cups and are arranged on the metal lead frames, the spotlight bowl cups are internally provided with the LED wafer, and the transparent filler directly packages the metal lead frames, the spotlight bowl cups, the wires and the LED wafer. According to the invention, the combined method of the combined type lead frame is flexible, various in shape, and firm and reliable, and an LED can display in multiple colors.
Description
Technical field
The present invention relates to the LED technical field, particularly a kind of paster LED of composite type lead frame.
Background technology
LED has energy-efficient characteristics and is widely used; Existing LED mainly contains following several types: great power LED, direct insertion LED, dot matrix LED and paster LED; Existing paster class LED resistance to elevated temperatures is poor; Because of injection moulding plastic cement and transparent filler are the bondings of face and face; And that they belong to the cold and hot shrinkage ratio of inhomogeneity material is different, and binding site cracking segregation phenomenon will appear in the binding site stress difference of using under the adverse circumstances out of doors injection moulding plastic cement, transparent filler, conductive silver glue, gold solder point and conductive metal frames of a specified duration, causes problems such as paster apparatus inside led circuit broken string, water inlet.
Summary of the invention
In order to overcome the defective that above-mentioned prior art exists, the present invention provides a kind of paster LED of composite type lead frame, and the lead frame compound mode is flexible, and shape is various, and is solid and reliable, and a LED can show multiple color.
To achieve these goals, technical scheme of the present invention is following:
A kind of paster LED of composite type lead frame; Comprise bowl cup, a plurality of conductive metal frames, coated metal lead frame and LED wafer and fill bowl transparent filler of cup internal pore; Be fixed on the LED wafer above the conductive metal frames; Be characterized in, the conductive metal frames of parcel no bending bending on its vertical center line in the said transparent filling object, the vertical center line of said a plurality of conductive metal frames is not on same straight line.
The vertical center line of above-mentioned a plurality of conductive metal frames makes that the LED wafer arrangement mode that is fixed on said conductive metal frames top plan is various, thereby reaches the effect that a paster LED can show multiple color not on same straight line.
As a kind of preferred version; Said bowl cup is a plastic cement bowl cup; A plurality of conductive metal frames are embedded in the said plastic cement bowl cup; The plane that said conductive metal frames is used for fixing the LED wafer is higher than plastic cement bowl cup bottom, is lower than plastic cement bowl rim of a cup, and said transparent filler is filled in the space between conductive metal frames and the plastic cement bowl cup and wraps up LED wafer and lead.
Said lead is used to connect the electrode points on LED chip electrode point and the conductive metal frames.
The distance that the plane that said conductive metal frames is used for fixing the LED wafer is higher than plastic cement bowl cup bottom is 0.2-100mm; The height of every conductive metal frames in plastic cement bowl cup is identical, and the conductive metal frames bent reshaping beyond the outstanding plastic cement bowl cup is wrapped in the surface of plastic cement bowl cup.
Said conductive metal frames is notch cuttype, T font etc., and its compound mode is various.
As another kind of preferred version; Comprise a plurality of conductive metal frames, transparent filler, convergent bowl cup and LED wafer; Said plain conductor top of the trellis is provided with 1-10 convergent bowl cup; Said LED wafer is positioned in the said convergent bowl cup, and said transparent filler is direct coated metal lead frame, convergent bowl cup, LED wafer and lead.
Place a plurality of LED wafers in the said convergent bowl cup, said LED wafer is arranged on the electrode points on the conductive metal frames through the lead connection.The convergent bowl cup is placed a plurality of LED wafers, makes it can show more colors, changes various.
Conductive metal frames in the such scheme is the LED lead frame of at least two kinds of regular shapes.
Further, the transparent filler in said two kinds of schemes is transparent epoxy resin or transparent silica gel.
The invention has the beneficial effects as follows that the textural association mode is flexible, combination of shapes is various, and is solid and reliable, and a LED can show multiple color, satisfied the diversified demand of people to the led color conversion.
Description of drawings
Fig. 1 is the cutaway view of the paster LED structure of the embodiment of the invention one.
Fig. 2 is the vertical view of the paster LED structure of the embodiment of the invention one
Fig. 3 is the cutaway view of the paster LED structure of the embodiment of the invention two.
Fig. 4 is the vertical view of the paster LED structure of the embodiment of the invention two.
Embodiment:
Be easy to understand understanding in order to make creation characteristic of the present invention, technological means and to reach purpose, further set forth the present invention below in conjunction with specific embodiment.
Embodiment one:
Referring to Fig. 1 and Fig. 2; A kind of paster LED of composite type lead frame comprises six conductive metal frames 01, plastic cement bowl cup 02, transparent filler 03 and LED wafer 04; Be inlaid with six conductive metal frames 01 in the plastic cement bowl cup 02; The vertical center line a of these six conductive metal frames 01, b be not on same straight line, and the conductive metal frames 01 in the plastic cement bowl cup 02 be the T font, and the conductive metal frames 01 of wrapping up in transparent filler 03 body does not all have a bending bending in that its vertical center line a, b are last.
Six conductive metal frames 01 are lined up triplex row, two conductive metal frames 01 of every row.The intrinsic LED wafer 04 of upper end that three conductive metal frames 01 are wherein arranged, then with the electrode points of each LED wafer 04 through lead respectively with the corresponding connection of electrode points of the upper end of other three conductive metal frames 01.
The height of above-mentioned six conductive metal frames 01 in plastic cement bowl cup 02 is identical, and conductive metal frames 01 bent reshaping beyond the outstanding plastic cement bowl cup 02 is wrapped in the surface of plastic cement bowl cup 02.
The vertical center line a of above-mentioned conductive metal frames 01, b make that LED wafer 04 arrangement mode that is fixed on said conductive metal frames 01 top end is various not on same straight line, make a paster LED can show multiple color.
Above-mentioned Fig. 1 and paster LED combination method for making shown in Figure 2 are:
(1) the sheet metal band is struck out the conductive metal frames 01 that part-structure is the T word shape.
(2) reserve T font part with cutting off after 01 electroplating processes of the conductive metal frames after the moulding
And be encased in the plastic cement bowl cup 02.
(3) semi-finished product that conductive metal frames 01 and plastic cement bowl cup 02 assembled are put into mould and are flattened shaping; Guarantee that the conductive metal frames 01 in the plastic cement bowl cup 02 is highly identical, again the paster LED support that protrudes after plastic cement bowl cup 02 conductive metal frames 01 bent reshaping in addition obtains shaping.
(4) the paster LED support after the shaping is carried out obtaining after a glue, solid crystalline substance, bonding wire, the sealing paster LED of the composite type lead frame of finished product.
Embodiment two:
Referring to Fig. 3 and Fig. 4; A kind of paster LED of composite type lead frame; The disjunctor conductive metal frames 11 and disjunctor conductive metal frames 12 that comprise two kinds of regular shapes; Transparent filler 3 and the convergent bowl cup that is arranged on conductive metal frames 12 top elliptical shapes 2 and three LED wafers 4 that are positioned in the convergent bowl cup 2, the electrode points of said three LED wafers 4 respectively with other conductive metal frames on electrode points be connected through lead.Transparent filler 3 is direct coated metal lead frame 11, conductive metal frames 12, convergent bowl cup 2 and LED wafer 4.
Elliptical shape convergent bowl cup 2 on the inner conductive metal frames 12 of the paster LED of this kind structure plays the optically focused effect, makes that its light is more concentrated, brightness is higher.
Equally, in transparent filler 3 inclusion enclaves conductive metal frames 11 no bending on its vertical center line c crooked, conductive metal frames 12 no bending bending on its vertical center line d in transparent filler 3 inclusion enclaves, two kinds of vertical center line c, d be not on same straight line.
Wherein, 1-10 convergent bowl cup of plain conductor top of the trellis operated by rotary motion, conductive metal frames 11 can be provided with convergent bowl cup 2 with conductive metal frames 12, places at least one LED wafer 4 in the convergent bowl cup 2; When placing a plurality of LED wafers; Just can show more colors, change variously, specifically select according to actual needs.
Fig. 3 and its combination method for making of paster LED shown in Figure 4 are:
(1) the sheet metal band is struck out the disjunctor conductive metal frames 11 and disjunctor conductive metal frames 12 of two kinds of regular shapes.
(2) disjunctor conductive metal frames after the moulding 11 and disjunctor conductive metal frames 12 are encased in the anchor clamps, form a brand-new led support.
(3) the new led support after will making up carries out obtaining after a glue, solid crystalline substance, bonding wire, the sealing semi-finished product LED of a plurality of disjunctors.
(4) the semi-finished product LED with disjunctor puts into the tool shaping, and the lead frame that obtains after the shaping beyond the transparent filler inclusion enclave has the crooked shape of bending.
(5) there is the crooked disjunctor LED of bending to put in the die cutting die lead frame beyond the transparent filler inclusion enclave; Obtain the paster LED of the composite type lead frame of finished product one by one after die-cut, the lead frame end beyond the transparent filler inclusion enclave of paster LED has bending to be convenient to the paster welding processing of rear end operation LED.
Transparent filler among above-mentioned two kinds of embodiment is transparent epoxy resin or transparent silica gel.
Textural association mode of the present invention is flexible, and combination of shapes is various, and is solid and reliable, and a LED can show multiple color, has satisfied the diversified demand of people to the led color conversion.
More than show and described basic principle of the present invention, principal character and advantage of the present invention.The technical staff of the industry should understand; The present invention is not restricted to the described embodiments; That describes in the foregoing description and the specification just explains principle of the present invention; The present invention also has various changes and modifications under the prerequisite that does not break away from spirit and scope of the invention, and these variations and improvement all fall in the scope of the invention that requires protection.The present invention requires protection range to be defined by appending claims and equivalent thereof.
Claims (6)
1. the paster LED of a composite type lead frame; Comprise bowl cup, a plurality of conductive metal frames, coated metal lead frame and LED wafer and fill bowl transparent filler of cup internal pore; It is characterized in that; The LED wafer be fixed on conductive metal frames above, the conductive metal frames of parcel no bending bending on vertical center line in the said transparent filling object, the vertical center line of said a plurality of conductive metal frames is not on same straight line.
2. the paster LED of a kind of composite type lead frame according to claim 1; It is characterized in that; Said bowl cup is a plastic cement bowl cup, and a plurality of conductive metal frames are embedded in the said plastic cement bowl cup, and the plane that said conductive metal frames is used for fixing the LED wafer is higher than plastic cement bowl cup bottom; Be lower than a bowl rim of a cup, said transparent filler is filled in the space between conductive metal frames and the plastic cement bowl cup and wraps up LED wafer and lead.
3. the paster LED of a kind of composite type lead frame according to claim 2; It is characterized in that; The distance that the plane that said conductive metal frames is used for fixing the LED wafer is higher than plastic cement bowl cup bottom is 0.2-100mm, and the height of every conductive metal frames in plastic cement bowl cup is identical.
4. the paster LED of a kind of composite type lead frame according to claim 1; It is characterized in that; Comprise a plurality of conductive metal frames, transparent filler, convergent bowl cup, LED wafer and lead; Said plain conductor top of the trellis is provided with 1-10 convergent bowl cup, and said LED wafer is positioned in the said convergent bowl cup, and said transparent filler is direct coated metal lead frame, convergent bowl cup, LED wafer and lead.
5. according to the paster LED of claim 1 or 2 or 4 described a kind of composite type lead frames, it is characterized in that place a plurality of LED wafers in the said bowl cup, said LED wafer is arranged on the electrode points on the conductive metal frames through the lead connection.
6. according to the paster LED of claim 1 or 2 or 4 described a kind of composite type lead frames, it is characterized in that said transparent filler is transparent epoxy resin or transparent silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100517644A CN102593114A (en) | 2012-03-01 | 2012-03-01 | SMD (surface mount device) LED (light-emitting diode) of combined type wire frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100517644A CN102593114A (en) | 2012-03-01 | 2012-03-01 | SMD (surface mount device) LED (light-emitting diode) of combined type wire frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102593114A true CN102593114A (en) | 2012-07-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100517644A Pending CN102593114A (en) | 2012-03-01 | 2012-03-01 | SMD (surface mount device) LED (light-emitting diode) of combined type wire frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102593114A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08335720A (en) * | 1995-06-08 | 1996-12-17 | Nichia Chem Ind Ltd | Nitrate semiconductor light emitting diode |
| CN2650336Y (en) * | 2003-09-10 | 2004-10-20 | 三得电子股份有限公司 | High-luminance light-emitting diode with good radiating effect |
| CN201007997Y (en) * | 2007-02-02 | 2008-01-16 | 张守仁 | Direct heat conduction light-emitting diode device |
| CN202797082U (en) * | 2012-03-01 | 2013-03-13 | 李海涛 | SMD (surface mount device) LED (light-emitting diode) of combined type wire frame |
-
2012
- 2012-03-01 CN CN2012100517644A patent/CN102593114A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08335720A (en) * | 1995-06-08 | 1996-12-17 | Nichia Chem Ind Ltd | Nitrate semiconductor light emitting diode |
| CN2650336Y (en) * | 2003-09-10 | 2004-10-20 | 三得电子股份有限公司 | High-luminance light-emitting diode with good radiating effect |
| CN201007997Y (en) * | 2007-02-02 | 2008-01-16 | 张守仁 | Direct heat conduction light-emitting diode device |
| CN202797082U (en) * | 2012-03-01 | 2013-03-13 | 李海涛 | SMD (surface mount device) LED (light-emitting diode) of combined type wire frame |
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Application publication date: 20120718 |