CN202786423U

CN202786423U - Novel aluminum wafer heating plate

Info

Publication number: CN202786423U
Application number: CN201220445614.7U
Authority: CN
Inventors: 凌复华; 吴凤丽; 国建花
Original assignee: Piotech Shenyang Co Ltd
Current assignee: Piotech Inc
Priority date: 2012-09-03
Filing date: 2012-09-03
Publication date: 2013-03-13
Anticipated expiration: 2022-09-03

Abstract

The utility model discloses a novel aluminum wafer heating plate for semiconductor coating equipment, and mainly solves the problems of influence on equipment productivity and increment of use cost due to high possibility of sparking in the conventional aluminum heating plate. The novel aluminum wafer heating plate is formed in a way that a boss is arranged in the center of an aluminum heating plate and a ceramic ring with a concave step on the inner side is embedded on the boss. A connecting base at the lower part of the aluminum heating plate extends out of a cavity body through a connecting rod, so that the whole heating plate is mounted and fixed outside the cavity body. A heating wire is embedded in the heating plate, and an external heating cable and an alarm and temperature measurement thermoelectric couple are arranged in the center of the aluminum heating plate and both extend out of the connecting base through the hollow connecting rod. The diameter of the boss on the aluminum heating plate and the diameter of the concave step of the ceramic ring are changed with the diameter of a wafer. According to the novel aluminum wafer heating plate, the original pure aluminum heating plate is improved, the sparking phenomenon caused by exposure of the aluminum plate can be also avoided on the premise that the basic function is achieved, meanwhile, the ceramic ring of the wafer heating plate and the aluminum heating plate can be both recycled, and the novel aluminum wafer heating plate is superior to the pure aluminum heating plate.

Description

A kind of novel aluminium wafer heating plate

Technical field

The utility model relates to a kind of semiconductor coated film equipment wafer heating plate, exactly is a kind of aluminum wafer heating plate of ceramic embedded ring, belongs to semiconductor film deposition applications and manufacturing technology field.

Background technology

The wafer heating plate material that semiconductor coated film equipment adopts has aluminium, stainless steel, pottery etc.Ceramic heat dish performance is good, but the process-cycle is long, and cost is too high.The aluminum heating plate has the advantages such as thermo-efficiency height, cost be low, so the aluminum heating plate is still taken on the leading role in current semiconductor coated film equipment.Although single aluminum heating plate can satisfy the demand of wafer carrying and heating, but owing to there is the voltage difference that varies in size on the equipment between the each several part, sparking (Arcing) phenomenon appears easily, can produce different sizes, difform rainbow film at wafer, cause whole process results failure.Also can leave the sparking vestige in the corresponding position on the aluminium heating plate during because of sparking, heavy then heating plate is scrapped, and gently then needs the equipment cooling, begins to speak, and the cleaning heating plate could come into operation behind the surface again, thereby affects the aggregated capacity of equipment.

Summary of the invention

The utility model to be to address the above problem as purpose, mainly solves existing aluminum heating plate and occurs easily striking sparks and affect equipment capacity and increase the problem of use cost.

For achieving the above object, the utility model adopts following technical proposals: a kind of novel aluminium wafer heating plate is to improve each other in various degree spark phenomenon of aluminum heating plate, wafer and shower plate in the technological process by inlay a ceramic ring in aluminum heating plate outer rim.Its concrete structure is: be provided with a boss at aluminum heating plate center, be inlaid with an inboard on the boss and have ceramic ring with the concave station rank, jointly form novel aluminum wafer heating plate.Boss diameter on the heating plate and ceramic ring concave station rank diameter become with diameter wafer.The connection pedestal of above-mentioned aluminum heating plate bottom stretches out cavity by one section union lever, and whole heating plate is installed and fixed in the cavity outside.Heating plate inside studs with heater strip, and aluminum heating plate center is provided with external heating cables and warning, thermocouple for measuring temperature, and the two all stretches out by hollow union lever and connects outside the pedestal.Connect pedestal and be provided with the dovetail-indent that the installation O-ring seal is used, in addition positioning pin hole and the fixedly threaded hole of usefulness, threaded hole is uniform on same circumference.The bottom external diameter that connects pedestal is larger than union lever diameter.On the boss upper surface of aluminum heating plate, be positioned at different circumference and be provided with uniform jewel ball hole and pin-and-hole.Jewel ball hole is blind hole, and pin-and-hole is through hole.Pin-and-hole is that the cylindrical surface forms by the top cyclotomy conical surface and lower part.

The utility model improves on the basis of original fine aluminium heating plate processed, adopts simple and reliable embedded structure, so that the processing of ceramic ring and heating plate, install all easily, whole process operation is simple, quick.And under the prerequisite of its basic function demand of realization, that is: outside realizing the carrying of original fine aluminium dish to wafer, heating function fully, can also avoid the appearance because of the exposed spark phenomenon that causes of aluminium dish, thereby well guaranteed validity, the accuracy of process results, guaranteed the normal production capacity of equipment.Simultaneously, the ceramic ring of this wafer heating plate and aluminum heating plate all can reuse, and greatly provide cost savings, and reach the purpose that is better than simple aluminum heating plate technological effect.

Description of drawings

Fig. 1 is structural representation of the present utility model.

Fig. 2 is the vertical view of Fig. 1.

Fig. 3 is the sectional view of Fig. 1.

Fig. 4 is the local enlarged diagram at A place among Fig. 3.

Fig. 5 is the local enlarged diagram at B place among Fig. 3.

Fig. 6 is the local enlarged diagram at C place among Fig. 3.

Embodiment

With reference to Fig. 1-6, a kind of novel aluminium wafer heating plate is provided with a boss 8 at aluminum heating plate 2 centers, is inlaid with an inboard on the boss 8 with the ceramic ring 1 on concave station rank 3, jointly forms novel aluminum wafer heating plate.Above-mentioned ceramic ring 1 is concentric installation with aluminum heating plate 2, and is embedded in the edge of aluminum heating plate.The diameter on the diameter of heating plate convex platform 8 and ceramic ring concave station rank 3 is all changeable, changes with diameter wafer.

During use, whole heating plate is positioned at reaction chamber, and the connection pedestal 20 of aluminum heating plate bottom stretches out cavity by one section hollow union lever 19, and whole heating plate is installed and fixed in the cavity outside.The heating plate outer most edge diameter of aluminum heating plate 2 is greater than diameter wafer, but the diameter of boss 8 is less than the diameter of wafer.Because heating plate 14 inside stud with heater strip, so the aluminum heating plate has certain thickness.Aluminum heating plate center is provided with external heating cables 26 and warning, thermocouple for measuring temperature 23, the two all the hollow position by union lever 19 stretch out and connect outside the pedestal 20.Even after heating plate fixes, do not hinder the use of the two yet.Connect pedestal 20 and be provided with the dovetail-indent 25 that the installation O-ring seal is used, in addition positioning pin hole 24 and the fixedly threaded hole 21 of usefulness, threaded hole 21 is uniform on same circumference.The external diameter that connects pedestal 20 is larger than union lever 19 diameters, and is to guarantee to connect the contact area ratio of pedestal 20 and permanent seat, more firm after whole heating plate is installed.

Before the installation, be placed in the dovetail-indent 25 first with the sealing-ring of wiped clean, and guarantee that the working face of sealing-ring after compression still is higher than face 22, to meet the requirements of sealing effectiveness.Adjust aluminum heating plate 2, the pin-and-hole 24 above it is aimed at the pin on the permanent seat, slowly transfer, until the two contact entangles firm, whole aluminum heating plate 2 can't rotate, and finish aluminum heating plate 2 location.Install bolt, bullet pad, plain cushion additional, corresponding with the threaded hole 21 on the heating plate, and tighten.At this moment, the fixed installation of whole aluminum heating plate 2 has just all been finished.Simultaneously, to guarantee that also thermopair 23 and heating cables 26 in use arrange in order, can not mutually twine.

In addition, on the boss upper surface 10 of aluminum heating plate 2, be positioned at different circumference and be provided with uniform jewel ball hole 18 and pin-and-hole 13.Jewel ball hole 18 is blind holes, and pin-and-hole 13 is through holes.Pin-and-hole 13 is comprised of the top cyclotomy conical surface 11 and minute cylindrical surface, bottom 12.During use, put into the jewel ball of corresponding size in jewel ball hole 18, jewel ball upper surface exceeds the identical size of heating plate boss upper surface 10.When wafer heats, wafer is not directly contacted with the heating plate card, wafer is played a supportive role, to guarantee technological effect.Equally, at pin-and-hole 13 interior placement pins.Pin is the part of wafer elevating system, and it plays the carrying effect to wafer in the transport process of wafer.When passing sheet, the pin in wafer elevating (Lift Pin) system can rise by pin-and-hole uniform on the heating plate 13, and exceeds boss upper surface 10 certain distances of aluminum heating plate, realizes the carrying to wafer.During the wafer heating, pin again can be along pin-and-hole 13 landing, until overlap with the pin-and-hole top cyclotomy conical surface 11 of heating plate.

Ceramic ring 1 is embedded in the outer rim place of aluminum heating plate 2, is concentric with the aluminum heating plate.Because of aluminium different from the thermal expansivity of pottery, so ceramic ring minimum diameter place is less than the diameter of wafer, but slightly larger than boss 8 diameters of aluminum heating plate.Ceramic ring lower surface 16 fits with the non-boss surface 6 of aluminum heating plate 2.During installation, the general method of range estimation that adopts is adjusted ceramic ring 1 centering, and more careful adjustment makes that the gap on whole circumference is consistent substantially between the minimum internal surface 5 of ceramic ring and the aluminum heating plate boss outside surface 7.No matter at normal temperature or under technological temperature, the two remains certain gap and is in concentric.The upper surface of ceramic ring is provided with concave station rank 3 in the inner part, and this concave station terrace 4 is highly basically identical with the boss upper surface 10 of heating plate, to guarantee the levelness of institute's placing wafer.The diameter on ceramic ring concave station rank 3 is slightly larger than the diameter of wafer, and the degree of depth is slightly larger than the thickness of wafer.No matter under what temperature condition, wafer sideslip can not occur or exceed the phenomenon of whole dish upper surface 9 all within the concave station of ceramic ring.The outside surface 17 of ceramic ring is larger than the outmost surface 15 of aluminum heating plate, being heated to 400 when spending, still can cover the aluminum heating plate comprehensively, can avoid the edge exposure of aluminum heating plate, prevents thin film aluminum, with protection aluminum heating plate.No matter in normal temperature state or the condition of high temperature, wafer outer rim below is pottery all the time, not have exposed aluminium dish, thereby has avoided sparking (Arcing) appearance.

Claims

1. a novel aluminium wafer heating plate comprises the aluminum heating plate, it is characterized in that: be provided with a boss at aluminum heating plate center, be inlaid with an inboard on the boss and have ceramic ring with the concave station rank.

2. novel aluminium wafer heating plate as claimed in claim 1, it is characterized in that: the connection pedestal of above-mentioned aluminum heating plate bottom stretches out cavity by one section union lever, whole heating plate is installed and fixed in the cavity outside, heating plate inside studs with heater strip, aluminum heating plate center is provided with external heating cables and warning, thermocouple for measuring temperature, the two all stretches out by hollow union lever and connects outside the pedestal, connect pedestal and be provided with the dovetail-indent that the installation O-ring seal is used, in addition positioning pin hole and the fixedly threaded hole of usefulness, threaded hole is uniform on same circumference, the bottom external diameter that connects pedestal is larger than union lever diameter, on the boss upper surface of aluminum heating plate, be positioned at different circumference and be provided with uniform jewel ball hole and pin-and-hole, jewel ball hole is blind hole, and pin-and-hole is through hole, and pin-and-hole is comprised of the top cyclotomy conical surface and bottom cyclotomy cylinder.

3. novel aluminium wafer heating plate as claimed in claim 1, it is characterized in that: the boss diameter on the above-mentioned aluminum heating plate and ceramic ring concave station rank diameter become with diameter wafer, the concave station terrace of ceramic ring is consistent with the boss upper surface of heating plate, the diameter on ceramic ring concave station rank is slightly larger than the diameter of wafer, the degree of depth is slightly larger than the thickness of wafer, ceramic ring minimum diameter place, diameter than wafer is little, but the boss diameter than aluminum heating plate is slightly large, and the external diameter of ceramic ring is larger than the external diameter of aluminum heating plate.