CN202773172U - Cover film used for printed circuit board having intensive openings - Google Patents
Cover film used for printed circuit board having intensive openings Download PDFInfo
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- CN202773172U CN202773172U CN201220428493.5U CN201220428493U CN202773172U CN 202773172 U CN202773172 U CN 202773172U CN 201220428493 U CN201220428493 U CN 201220428493U CN 202773172 U CN202773172 U CN 202773172U
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- printed circuit
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Abstract
The utility model discloses a cover film used for a printed circuit board having intensive openings. The cover film is composed of a polyimide film, an adhesion layer and a release paper. The release paper is composed of a release agent layer, a first PE layer, a base paper layer and a second PE layer successively. The thickness of the release agent layer is less than 1 micron, the thickness of the first PE layer is in the range of 10 microns to 20 microns, the thickness of the base paper layer is in the range of 40 microns to 60 microns, the thickness of the second PE layer is in the range of 10 microns to 30 microns, the thickness of the release paper is in the range of 90 microns to 100 microns, the basis weight of the release paper is in the range of 40g/m<2> to 60g/m<2>, and the release force of the release paper is in the range of 2g/5cm to 8g/5cm. Thus, the release paper adopted in the utility model is a release paper having advantages of low basis weight, low thickness and low release force, so the cover film has advantages of low basis weight, low moisture absorption function and excellent crimp-resistant performance, the cover film of the utility model is specially applicable in a half-cut printed circuit board with small holes in a high density, the environmental requirement is met, the environmental pollution is reduced, the paperless trend in the aspect of cover films in the industry is followed up, and the requirement of sustainable development is satisfied.
Description
Technical field
The utility model relates to a kind of coverlay that is applied to printed circuit board (PCB), especially a kind of coverlay for the intensive printed circuit board (PCB) of opening.
Background technology
Printed circuit board (PCB) is material indispensable in the electronic product, and along with the consumption electronic products demand is grown up, and also grows with each passing day for the demand of printed circuit board (PCB).Because but flexible printed wiring board has the characteristics such as flexibility and three-dimensional space distribution, emphasize that at the technicalization electronic product development compact, flexibility drives under the gesture, computer and ancillary equipment thereof, communication product and consumption electronic products etc. at present are widely used.
Generally speaking, flexible print wiring board is made of copper clad laminate (FCCL) and coverlay (CL), and normal operation polyimides diaphragm is made coverlay, perhaps utilizes screen printing technology to form one deck thin insulating printing ink as coverlay.These known coverlays exist ink lay be full of cracks or the problem such as come off.In addition, most coverlay is common opening polyimide film in the market, and separated type material also is the very large product of thickness, basic weight, and so use amount is to the harm of environment, cause waste to a lot of natural resourcess to the felling of trees.And for more environmental protection, the demand that satisfies sustainable development and the with no paper trend of electronic material class, make simultaneously the polyimides diaphragm have the requirement that the reply high density is opened aperture, half sanction, flatness, then need to research and develop the coverlay that makes new advances.
The utility model content
In order to overcome defects, the utility model provides a kind of opening intensive cover membrane for printed circuit board, the intensive cover membrane for printed circuit board of this opening has function and the excellent anti-crimp energy of low basic weight, agent of low hygroscopicity, be applicable to high density and open aperture and half printed circuit board (PCB) of cutting out, respond environmental requirement, reduce environmental pollution and the in the industry with no paper trend in coverlay aspect that follows up, meet the demand of sustainable development.
The utility model for the technical scheme that solves its technical problem and adopt is:
The intensive cover membrane for printed circuit board of a kind of opening, consisted of by polyimide film, adhesion layer and release liners, described release liners is made of parting agent layer, a PE layer, original paper layer and the 2nd PE layer successively, the thickness of described parting agent layer is less than 1 micron, the thickness of a described PE layer is 10～20 microns, and the thickness of described original paper layer is 40～60 microns, and the thickness of described the 2nd PE layer is 10～30 microns, the thickness of described release liners is 90～100 microns, and the basic weight of described release liners is 40～60g/m
2, the off-type force of described release liners is 2～8g/5cm.
The further technical scheme that the utility model adopts is:
The thickness of described polyimide film is 5～50 microns.
The thickness of described adhesion layer is 1～70 micron.
Described adhesion layer is mixed by resin, rubber and inorganic filler.
Described resin is epoxy resin.
Described inorganic filler is one or more the mixture in titanium dioxide, silicon dioxide, aluminium hydroxide, boron nitride and the barium sulfate.
Described rubber is acrylonitrile-butadiene rubber.
Described inorganic filler accounts for 3～25wt% of described resin solid content.
Identical or both the thickness summation of the thickness of described polyimide film and described adhesion layer equals 12 microns.
The beneficial effects of the utility model are: the intensive cover membrane for printed circuit board of opening of the present utility model is made of polyimide film, adhesion layer and release liners, and release liners is made of parting agent layer, a PE layer, original paper layer and the 2nd PE layer successively, the thickness of parting agent layer is less than 1 micron, the thickness of the one PE layer is 10～20 microns, the thickness of original paper layer is 40～60 microns, the thickness of the 2nd PE layer is 10～30 microns, the thickness of release liners is 90～100 microns, and the basic weight of release liners is 40～60g/m
2The off-type force of release liners is 2～8g/5cm, what therefore the utility model adopted is the release liners of a kind of low basic weight, low thickness and low off-type force, thereby make coverlay have function and the excellent anti-crimp energy of low basic weight, agent of low hygroscopicity, be specially adapted to high density and open aperture and half printed circuit board (PCB) of cutting out, respond environmental requirement, reduce environmental pollution and the in the industry with no paper trend in coverlay aspect that follows up, meet the demand of sustainable development.
Description of drawings
Fig. 1 is the intensive cover membrane for printed circuit board profile of the utility model opening;
Fig. 2 is the utility model release liners profile.
Embodiment
Embodiment: the intensive cover membrane for printed circuit board of a kind of opening, consisted of by polyimide film 1, adhesion layer 2 and release liners 3, described release liners is made of parting agent layer 31, a PE layer 32, original paper layer 33 and the 2nd PE layer 34 successively, the thickness of described parting agent layer 31 is less than 1 micron, the thickness of a described PE layer 32 is 10～20 microns, the thickness of described original paper layer 33 is 40～60 microns, the thickness of described the 2nd PE layer 34 is 10～30 microns, the thickness of described release liners 3 is 90～100 microns, and the basic weight of described release liners 3 is 40～60g/m
2, the off-type force of described release liners 3 is 2～8g/5cm.
The thickness of the utility model coverlay can satisfy following condition: identical or both the thickness summation of the thickness of described adhesion layer and described polyimide film equals 12 microns, can make like this coverlay of the present utility model have better folding quality.The thickness of coverlay of the present utility model also can satisfy following condition: the thickness of described polyimide film is 5～50 microns, and the thickness of described adhesion layer is 1～70 micron, and the thickness of described release liners is 90～100 microns.
Open aperture or half function of cutting out in order to make coverlay of the present utility model have high density, described adhesion layer is made of resin, rubber and inorganic filler mixing, wherein resin is epoxy resin, rubber is acrylonitrile-butadiene rubber, and inorganic filler is one or more the mixture that is selected from titanium dioxide, silicon dioxide, aluminium hydroxide, boron nitride and the barium sulfate.For folding resistance and the resistance to scraping of safeguarding coverlay, this adhesion layer is take epoxy resin as matrix, and the content of described inorganic filler accounts for 3～25 wt% of this epoxy resin solid content, preferably 3～8 wt%.
Coverlay of the present utility model can make by following method: use polyimide film as sandwich layer; At first, at the thick liquid that the polyimide layer surface-coated is comprised of epoxy resin, acrylonitrile-butadiene rubber and silicon dioxide, behind this thick liquid of baking and curing, form one deck adhesion layer; Fit and hang down the release liners of basic weight, low water absorbable, low thickness, can obtain coverlay of the present utility model.
The low basic weight of coverlay of the present utility model and the test of low water absorbable are as follows:
Low basic weight test: adopt the special liquid release liners that coverlay is used to soak, finally cause each layer separately, make it carry out thickness measuring with the spiral micrometer respectively, assay balance and accurate baking oven carry out the test of basic weight.
The test of low water absorbable: test piece is taken out from sealing bag, be cut into fast 100mm * 100mm square test piece, adopt assay balance weigh (W1), adopt accurate baking oven to toast 105 ℃ * 3HR, take out after the baking test piece and reuse assay balance weigh (W2), the water absorption rate of asking thus, computing formula is as follows:
Water absorption rate %=(W1-W2) * 100%/W1
As experimental group, the coverlay in the experimental group carries out the test of basic weight with coverlay of the present utility model, and the test data outcome record is in table 1.
Table 1
Coverlay of the present utility model can satisfy that flexible printed wiring board high density small-bore opening is complete to be cut out or partly cut out requirement, can avoid the haftplatte of waste material and causes coverlay outward appearance pressure wound and tear the problem such as small-bore edge of opening.
The low water absorbable test of coverlay of the present utility model is as follows:
The coverlay of getting control group 1 to 3 in the coverlay of experimental group in the table 1 and the upper table 1 carries out the water absorption test, and with outcome record in following table 2.
Table 2
| Test event | Experimental group | Control group 1 | Control group 2 | |
| ① | 0.85% | 1.52% | 1.85% | 2.12% |
| ② | 0.81% | 1.56% | 1.88% | 2.11% |
| ③ | 0.82% | 1.55% | 1.86% | 2.08% |
| Average | 0.83% | 1.54% | 1.86% | 2.10% |
The measuring mechanical property of coverlay of the present utility model is as follows:
The utility model coverlay can satisfy the specification requirement of curling height≤1.0cm under the environment of flexible printed wiring board normal temperature, high humility.
The coverlay of getting control group 1 to 3 in the coverlay of experimental group in the table 1 and the upper table 1 carries out A(800 ℃ of gamma transition attitude temperature) test, and with outcome record in following table 3.
Table 3
As above shown in the table 3, the release liners inorganic constituents that coverlay of the present utility model uses is far below control group 1 to 3.
Claims (5)
1. the intensive cover membrane for printed circuit board of an opening, consisted of by polyimide film, adhesion layer and release liners, it is characterized in that: described release liners is made of parting agent layer, a PE layer, original paper layer and the 2nd PE layer successively, the thickness of described parting agent layer is less than 1 micron, the thickness of a described PE layer is 10～20 microns, the thickness of described original paper layer is 40～60 microns, the thickness of described the 2nd PE layer is 10～30 microns, the thickness of described release liners is 90～100 microns, and the basic weight of described release liners is 40～60g/m
2, the off-type force of described release liners is 2～8g/5cm.
2. the intensive cover membrane for printed circuit board of opening as claimed in claim 1, it is characterized in that: the thickness of described polyimide film is 5～50 microns.
3. the intensive cover membrane for printed circuit board of opening as claimed in claim 1, it is characterized in that: the thickness of described adhesion layer is 1～70 micron.
4. the intensive cover membrane for printed circuit board of opening as claimed in claim 1, it is characterized in that: the thickness of described polyimide film and described adhesion layer is identical.
5. the intensive cover membrane for printed circuit board of opening as claimed in claim 1, it is characterized in that: the thickness summation of described polyimide film and described adhesion layer equals 12 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220428493.5U CN202773172U (en) | 2012-08-28 | 2012-08-28 | Cover film used for printed circuit board having intensive openings |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220428493.5U CN202773172U (en) | 2012-08-28 | 2012-08-28 | Cover film used for printed circuit board having intensive openings |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202773172U true CN202773172U (en) | 2013-03-06 |
Family
ID=47779708
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201220428493.5U Expired - Lifetime CN202773172U (en) | 2012-08-28 | 2012-08-28 | Cover film used for printed circuit board having intensive openings |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202773172U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103635008A (en) * | 2012-08-28 | 2014-03-12 | 昆山雅森电子材料科技有限公司 | Opening intensive type printed circuit board covering film |
| CN105188264A (en) * | 2015-07-02 | 2015-12-23 | 厦门弘信电子科技股份有限公司 | Method for making window on cover film of flexible circuit board |
| CN109041403A (en) * | 2017-06-09 | 2018-12-18 | 昆山雅森电子材料科技有限公司 | A kind of ultra-thin white covering film and the LED substrate using the white covering film |
-
2012
- 2012-08-28 CN CN201220428493.5U patent/CN202773172U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103635008A (en) * | 2012-08-28 | 2014-03-12 | 昆山雅森电子材料科技有限公司 | Opening intensive type printed circuit board covering film |
| CN105188264A (en) * | 2015-07-02 | 2015-12-23 | 厦门弘信电子科技股份有限公司 | Method for making window on cover film of flexible circuit board |
| CN109041403A (en) * | 2017-06-09 | 2018-12-18 | 昆山雅森电子材料科技有限公司 | A kind of ultra-thin white covering film and the LED substrate using the white covering film |
| CN109041403B (en) * | 2017-06-09 | 2020-09-01 | 昆山雅森电子材料科技有限公司 | Ultrathin white cover film and LED substrate using same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130306 |