CN207537387U - A kind of hot melt adhesive film with attenuating - Google Patents
A kind of hot melt adhesive film with attenuating Download PDFInfo
- Publication number
- CN207537387U CN207537387U CN201721104689.8U CN201721104689U CN207537387U CN 207537387 U CN207537387 U CN 207537387U CN 201721104689 U CN201721104689 U CN 201721104689U CN 207537387 U CN207537387 U CN 207537387U
- Authority
- CN
- China
- Prior art keywords
- hot melt
- film layer
- layer
- melt adhesive
- attenuating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
The utility model discloses a kind of hot melt adhesive films with attenuating, including release layer, PET film layer and hot melt film layer, PET film layer is covered in hot melt film layer, release layer is covered on PET film layer, the thickness for heating film layer is 10 50 μm, and the thickness of PET film layer is 12 50 μm, and the thickness of release layer is 59 μm, adhesive is additionally provided between PET film layer and hot melt film layer, the thickness of adhesive is 36 μm.The hot melt adhesive film of the utility model direct combination, the hot melt adhesive film can significantly reduce the attenuation of signal transmission under high frequency condition on FFC wire rods, reduce the fissipation factor of the hot melt film of FFC wire rods.
Description
Technical field
The utility model is related to a kind of hot melt film more particularly to a kind of hot melt adhesive films with attenuating.
Background technology
FFC lines (Flexible Flat Cable flexible flat cables) are a kind of with PET insulating materials and very thin tin plating
There is soft, random bending to roll over for flat copper wire, the new types of data cable formed by high-tech automation equipment production pressing
It is folded, thickness is thin, small, connection is simple, convenient disassembly, easily solves the advantages that electromagnetic shielding (EMI).FFC can be selected arbitrarily
Wire count and spacing, are more convenient on line, greatly reduce the volume of electronic product, reduce production cost, improve production efficiency,
Be best suited between moving parts and mainboard, pcb board between pcb board, miniaturization electrical equipment in make data transmission cable it
With.FFC is widely used in the connection between various printer port of printer and mainboard, plotter, scanner, duplicator, sound equipment, liquid
Signal transmission and plate the plate connection of the products such as brilliant electric appliance, facsimile machine, various video disc players.In modern electrical equipment, almost nowhere
Do not exist.At present, existing FFC wire rods are needed after laminating in the compound one layer of hot melt adhesive of wire rod appearance.
But there are following defects for existing hot melt adhesive:
Existing FFC hot melt adhesive films fissipation factor is higher, signal transmission process, attenuation it is excessive, it is difficult to meet height and keep pouring in
Defeated requirement.
Utility model content
For overcome the deficiencies in the prior art, the purpose of this utility model is to provide a kind of hot melts with attenuating
Glued membrane, the hot melt adhesive film include release layer, PET film layer, adhesive and hot melt film layer successively from top to bottom, can be in FFC lines
Direct combination hot melt adhesive film on material, the hot melt adhesive film can significantly reduce the attenuation of signal transmission under high frequency condition, reduce FFC lines
The fissipation factor of the hot melt film of material.
The purpose of this utility model adopts the following technical scheme that realization:
A kind of hot melt adhesive film with attenuating is covered including release layer, PET film layer and hot melt film layer, the PET film layer
It covers in hot melt film layer, the release layer is covered on PET film layer, and the thickness of the hot melt film layer is 10-50 μm, the PET
The thickness of film layer is 12-50 μm, and the thickness of the release layer is 5-9 μm, is additionally provided between the PET film layer and hot melt film layer
Adhesive, the thickness of the adhesive is 3-6 μm.
Further, the hot melt film layer, adhesive are identical with PET film layer length, and the length of the release layer is more than
The length of PET film layer.
Further, the thickness of the PET film layer is 16-32 μm.
Further, it is described hot melt film layer for polyolefin film layer, improved polyalkene film layer, SBS and its hydride film layer,
One kind in SIS and its hydride film layer, butadiene-styrene rubber film layer.
Further, the hot melt adhesive layer is single layer structure layer or is covered for two layers or more than two layers of hot melt adhesive
Composite construction layer.
Further, the adhesive is layer of polyurethane.
Compared with prior art, the beneficial effects of the utility model are:
The hot melt adhesive film with attenuating of the utility model, the hot melt adhesive film from top to bottom successively include release layer,
PET film layer, adhesive and hot melt film layer, direct combination hot melt adhesive film, the hot melt adhesive film can significantly drop on FFC wire rods
The attenuation of signal transmission under low high frequency condition reduces the fissipation factor of the hot melt film of FFC wire rods.
Description of the drawings
Fig. 1 is the structure diagram of the hot melt adhesive film with attenuating of embodiment 1;
Fig. 2 is the structure diagram of the hot melt adhesive film with attenuating of embodiment 2.
In figure:1st, release layer;2nd, PET film layer;3rd, adhesive;4th, film layer is heated.
Specific embodiment
In the following, with reference to attached drawing and specific embodiment, the utility model is described further, it should be noted that
Under the premise of not colliding, it can be formed in any combination between various embodiments described below or between each technical characteristic new
Embodiment.
Embodiment 1:
With reference to Fig. 1, a kind of hot melt adhesive film with attenuating including release layer 1, PET film layer 2 and heats film layer 4,
PET film layer 2 is covered in hot melt film layer 4, and release layer 1 is covered on PET film layer 2, is also set between PET film layer 2 and hot melt film layer 4
It is equipped with adhesive 3.
The thickness for heating film layer 4 is 10-50 μm, and the thickness of PET film layer 2 is 12-50 μm, and the thickness of release layer 1 is 5-9 μ
M, the thickness of adhesive 3 is 3-6 μm.
It is identical with 2 length of PET film layer to heat film layer 4, adhesive 3, setting is in order to which hot melt adhesive can securely glue in this way
It is attached on FFC wire rods;The length of release layer 1 is more than the length of PET film layer 2.1 side of release layer is flushed with PET film layer 2, another
Side is stretched out outside PET film layer 2, and setting is removed for the ease of release layer 1 in this way.
The thickness of PET film layer 2 is 16-32 μm.Fluoropolymer can be also added in PET film layer.
Hot melt film layer 4 is polyolefin film layer, improved polyalkene film layer, SBS and its hydride film layer, SIS and its hydride
One kind in film layer, butadiene-styrene rubber film layer.Hot melt adhesive layer is single layer structure layer.
Adhesive 3 is layer of polyurethane.
Embodiment 2:
With reference to Fig. 2, a kind of hot melt adhesive film with attenuating, the present embodiment difference from Example 1 is, heats
Glue-line is the composite construction layer that double-deck hot melt adhesive covers.
The hot melt adhesive film with attenuating of the utility model, the hot melt adhesive film from top to bottom successively include release layer 1,
PET film layer 2, adhesive 3 and hot melt film layer 4, direct combination hot melt adhesive film, the hot melt adhesive film can show on FFC wire rods
Writing reduces the attenuation of signal transmission under high frequency condition, reduces the fissipation factor of the hot melt film of FFC wire rods.
The above embodiment is only the preferred embodiment of the utility model, it is impossible to be protected with this to limit the utility model
Range, the variation of any unsubstantiality that those skilled in the art is done on the basis of the utility model and replacing belongs to
In the utility model range claimed.
Claims (6)
1. a kind of hot melt adhesive film with attenuating, which is characterized in that described including release layer, PET film layer and hot melt film layer
PET film layer is covered in hot melt film layer, and the release layer is covered on PET film layer, and the thickness of the hot melt film layer is 10-50 μ
M, the thickness of the PET film layer are 12-50 μm, and the thickness of the release layer is 5-9 μm, the PET film layer and hot melt film layer it
Between be additionally provided with adhesive, the thickness of the adhesive is 3-6 μm.
2. there is the hot melt adhesive film of attenuating as described in claim 1, which is characterized in that the hot melt film layer, glue
Layer is identical with PET film layer length, and the length of the release layer is more than the length of PET film layer.
3. there is the hot melt adhesive film of attenuating as described in claim 1, which is characterized in that the thickness of the PET film layer is
16-32μm。
4. there is the hot melt adhesive film of attenuating as described in claim 1, which is characterized in that the hot melt film layer is polyolefin
One kind in film layer, improved polyalkene film layer, SBS and its hydride film layer, SIS and its hydride film layer, butadiene-styrene rubber film layer.
5. there is the hot melt adhesive film of attenuating as claimed in claim 4, which is characterized in that the hot melt adhesive layer is individual layer knot
The composite construction layer that structure layer or the hot melt adhesive for being more than two layers cover.
6. there is the hot melt adhesive film of attenuating as described in claim 1, which is characterized in that the adhesive is polyurethane
Layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201721104689.8U CN207537387U (en) | 2017-08-30 | 2017-08-30 | A kind of hot melt adhesive film with attenuating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201721104689.8U CN207537387U (en) | 2017-08-30 | 2017-08-30 | A kind of hot melt adhesive film with attenuating |
Publications (1)
Publication Number | Publication Date |
---|---|
CN207537387U true CN207537387U (en) | 2018-06-26 |
Family
ID=62607889
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201721104689.8U Active CN207537387U (en) | 2017-08-30 | 2017-08-30 | A kind of hot melt adhesive film with attenuating |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN207537387U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109979670A (en) * | 2019-04-15 | 2019-07-05 | 嘉兴市航旗电器有限公司 | A kind of high-speed transfer cable and its processing technology suitable for HDMI interface |
-
2017
- 2017-08-30 CN CN201721104689.8U patent/CN207537387U/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109979670A (en) * | 2019-04-15 | 2019-07-05 | 嘉兴市航旗电器有限公司 | A kind of high-speed transfer cable and its processing technology suitable for HDMI interface |
CN109979670B (en) * | 2019-04-15 | 2020-09-25 | 嘉兴市航旗电器股份有限公司 | High-speed transmission cable suitable for HDMI interface and processing technology thereof |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101977486B (en) | Method for manufacturing via stubs of circuit board | |
CN101296562A (en) | Copper foil substrates and method for making flexible printed circuit board of the same | |
CN207537387U (en) | A kind of hot melt adhesive film with attenuating | |
CN104797081B (en) | A kind of electromagnetic shielding film and its manufacturing process suitable for Rigid Flex | |
CN207367636U (en) | A kind of hot melt adhesive film and FFC lines with shield effectiveness | |
CN101964224A (en) | Shielding material for flexible flat cable (FFC) high-frequency transmission line and high-frequency transmission line | |
CN203708621U (en) | Ultrathin single-sided flexible printed circuit board | |
CN201465619U (en) | Insulating hot melt adhesive polyimide Nylar structure of FFC wire | |
CN206332909U (en) | A kind of combined type folds structure mould release membrance | |
CN105491788B (en) | A kind of graphene heat radiating type screened film and preparation method thereof | |
CN201797648U (en) | PCB board favorable for improving impedance control of PCB | |
CN102186306A (en) | Metal base circuit board and manufacturing method thereof | |
CN107046766A (en) | Flexible print thin film circuit and system | |
CN201465622U (en) | Hot melt aluminium foil Nylar structure of FFC wire | |
CN110366330A (en) | FPC multi-layer board and technique based on high frequency FRCC Yu high frequency dual platen | |
CN203449672U (en) | High thermal conductivity copper-clad plate with good flexibility | |
CN103200771B (en) | There is glue-free single sided copper clad substrate and the manufacture method thereof of paste functionality | |
CN209144067U (en) | A kind of high-performance conductive cloth double-sided adhesive | |
CN208128661U (en) | FPC multi-layer board based on high frequency FRCC Yu high frequency dual platen | |
CN203406071U (en) | Shielding film used for frequency conversion transmission line | |
CN202782009U (en) | Composite double-sided copper clad laminate | |
CN207958236U (en) | A kind of hot melt adhesive film structure for eliminating glue-line hole | |
CN207367631U (en) | A kind of anti-flammability hot melt adhesive film structure of low-dielectric loss | |
CN201841717U (en) | Laminated structure for improving apparent mass of sandwich plate | |
CN205491428U (en) | Hot pressing laminating flexible circuit board |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address |
Address after: 528000 Guangdong province Foshan Shunde District Xing Tan Town, Bai An Road North water industry area. Patentee after: Guangdong Lyle new materials Polytron Technologies Inc Address before: 528325 Guangdong province Foshan Shunde District Xing Tan Town, Bai An Road North water industry area. Patentee before: Leary Electrical Equipment Co., Ltd. |
|
CP03 | Change of name, title or address |