CN202763240U - LED (light-emitting diode) wafer eutectic soldering equipment - Google Patents
LED (light-emitting diode) wafer eutectic soldering equipment Download PDFInfo
- Publication number
- CN202763240U CN202763240U CN 201220254943 CN201220254943U CN202763240U CN 202763240 U CN202763240 U CN 202763240U CN 201220254943 CN201220254943 CN 201220254943 CN 201220254943 U CN201220254943 U CN 201220254943U CN 202763240 U CN202763240 U CN 202763240U
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- eutectic
- wafer
- jig
- welding
- led wafer
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Abstract
The utility model discloses LED wafer eutectic soldering equipment which comprises a heating device, a driving control system, a power configuration case, a soldering bench, an eutectic soldering platform in the middle of the front part of the soldering bench, a holder supply device, a wafer supply device, a soldering flux supply device arranged above the eutectic soldering platform, a nitrogen cooling device arranged on the eutectic soldering platform, a pulse current heating device arranged on one side of the eutectic soldering platform, and a thermostatic current heating device arranged inside the eutectic soldering platform, wherein the holder supply device and the wafer supply device are arranged in a manner of surrounding the two sides and the rear part of the eutectic soldering platform. The LED wafer eutectic soldering equipment is fast in heating speed and high in soldering precision, and the soldered LED wafer by the device has better heat conduction effect.
Description
Technical field
The utility model relates to the LED wafer fabrication, relates in particular to a kind of LED wafer eutectic welding equipment.
Background technology
The eutectic solder technology has widely in the Electronic Packaging industry to be used, such as bonding, shell sealing cap of bonding, the substrate of wafer and substrate and shell etc.Compare with traditional epoxy conducting is bonding, eutectic welding has advantages of that thermal conductivity is high, thermal resistance is low, heat transfer is fast, reliability is strong, bonding rear intensity is large, is applicable to the interconnected of wafer and substrate, substrate and shell in high frequency, the high power device.
High speed development along with the LED technology, LED wafer and encapsulation are more and more to high-power and integrated future development, traditional elargol technique for sticking has been difficult to satisfy the welding process requirement of LED wafer, thereby, increasing LED encapsulation producer begins to attempt other more advanced welding procedures and realizes the bonding of LED wafer and support, wherein, the eutectic solder technology is thought to have good application prospect by common.
Yet, because the eutectic melting point of LED wafer is greatly about more than 300 ℃, and the LED wafer eutectic welding equipment of prior art generally adopts the hot air reflux stove as heater, and this heater firing rate maximum temperature slow and that heating can reach is lower.In addition, adopt in addition the scheme of infrared bonding connection technology in the prior art, although this scheme has thermal source control conveniently, easily to control the advantage of the heating-up temperature rate of climb, but also have a lot of shortcomings, as more sensitivity speck can crested, the different heating effects, the temperature difference of can affecting of less unified heating, element and PCB quality are larger etc.
The utility model content
Technical problem to be solved in the utility model is: a kind of LED wafer eutectic welding equipment is provided, and this equipment firing rate is fast, welding precision is high, and can make the LED wafer after the welding have better heat-conducting effect.
For solving the problems of the technologies described above, the utility model adopts following technical scheme:
A kind of LED wafer eutectic welding equipment includes heater, power configuration casing and driving control system, also includes:
Welding bench;
Be arranged on described welding bench anteriomedial position, be used for placing the eutectic jig of wafer to be welded and support;
Arrange around described eutectic jig both sides and rear respectively, be used for that support to be welded is transported to the support feedway on the described eutectic jig and be used for carrying wafers to be welded wafer feedway to the support to be welded that is positioned at described eutectic jig;
Be arranged on described eutectic jig top, be used for the welding compound feedway at the rack surface point seal welding compound to be welded that is positioned at described eutectic jig;
Be arranged on the described eutectic jig, be used for the nitrogen cooling device that product cool is finished in the wafer welding after the described heater heating welding;
Described heater includes:
Be arranged on a side of described eutectic jig, be used for by producing pulse current described wafer to be welded being heated from top to bottom, make the Current Heating device of the rear fixed bonding of described wafer and support eutectic dissolving;
Be arranged on described eutectic jig inner, be used for simultaneously support to be welded being carried out heated at constant temperature heat from the bottom up, make the constant temperature heating device of the rear fixed bonding of described wafer and support eutectic dissolving.
Preferably, this equipment also includes:
Vision positioning system is used for treating welding support and carries out the vision localization process, confirms the position of support to be welded, and judges support outward appearance to be welded, rejects the inaccurate defective products in location.
Preferably, described visual identifying system specifically includes:
The optical dimensions checkout gear is arranged on the top of described eutectic jig, is used for by the detection and location camera that the top arranges rack surface size to be welded being carried out the vision detection and localization, and takes positioning image;
Graphics processing unit, link to each other with described optical dimensions checkout gear, be used for that the positioning image that described optical dimensions checkout gear is taken is carried out image and process, compare by utilizing default many-valuedization standard picture and the positioning image of shooting, calculate the locating accuracy of support to be welded;
The identifying processing unit links to each other with described graphics processing unit, is used for judging whether described locating accuracy reaches default standard, if, then send enabling signal to described heater, otherwise, described wafer to be welded and/or support are processed as defective products.
Preferably, described Current Heating device specifically includes:
The welding suction nozzle;
Be connected with described welding suction nozzle, be used for making described welding suction nozzle immediately be warmed up to the temperature required pulse current generation unit of welding by producing pulse current;
Link to each other with constant temperature current flow heats device with described pulse current generation unit, it is carried out the thermostatically controlled heating and temperature control of staged pulse unit;
Preferably, described wafer feedway specifically includes:
Be arranged on a side of described eutectic jig, the wafer with chip carrier locating hole is supplied with platform;
Section is got on the wafer top that is arranged on described chip carrier locating hole below;
Be arranged on the wafer material identification part of described chip carrier locating hole top;
Be arranged on the wafer angle correct device between described wafer supply platform and the eutectic jig;
Be arranged on described wafer and supply with the platform top, the end has the carrying wafers mechanical arm of suction nozzle, and the carrying wafers that is used for this suction nozzle is drawn to is to described wafer angle correct device or eutectic jig.
Preferably, described wafer angle correct device specifically includes:
Be arranged on the correction station between described wafer supply table and the eutectic jig, have three positive stop strips that are T-shaped setting on the described correction station, the intersection point place of these three positive stop strips reserves wafer and places the position;
Described carrying wafers mechanical arm specifically includes:
A carrying wafers arm is used for that the wafer that described suction nozzle is drawn to is transported to correction station from the chip carrier position and waits for angle correct;
Secondary carrying wafers arm is arranged side by side with a described carrying wafers arm, is used for the wafer after the angle correct is carried to the eutectic jig from correction station.
Preferably, described support feedway specifically includes:
Be arranged on the opposite side of described eutectic jig, the support that is used for the placing rack pallet is supplied with platform;
Be arranged on described support and supply with the platform top, the end has the support convey mechanical arm of support claw hook, is used for the support in the bracket tray is carried to described eutectic jig.
Preferably, described welding compound feedway specifically includes:
Be arranged on the some packing element of described eutectic jig top;
The point gum machine tool arm that is connected with described some packing element.
Preferably, described Current Heating device is arranged on the described secondary carrying wafers arm, and described secondary carrying wafers arm bottom arranges described welding suction nozzle.
Preferably, described wafer supply platform and eutectic jig all are arranged on the described welding bench by XY worktable.
The beneficial effects of the utility model are:
Embodiment of the present utility model reaches the moment intensification by utilizing the Current Heating device to produce pulse current, and by welding suction nozzle heat conduction to the LED wafer surface, simultaneously heated at constant temperature is adopted in the chip bottom, make welding compound and the dissolving of submount material eutectic of the golden tin composition of bottom of wafer reach fixed bonding, LED wafer and support welding are in the same place, realize the effect of LED wafer eutectic welding, thereby make the LED wafer of welding after finishing reach better heat-conducting effect, and greatly accelerated firing rate, weld interval, improved eutectic precision, production efficiency.
Below in conjunction with accompanying drawing the utility model is described in further detail.
Description of drawings
Fig. 1 is the schematic appearance of an embodiment of LED wafer eutectic welding equipment of the present utility model.
Fig. 2 is the modular construction figure that is arranged among embodiment of LED wafer eutectic welding equipment of the present utility model on the welding bench.
Fig. 3 is the three-dimensional structure diagram of wafer feedway among embodiment of LED wafer eutectic welding equipment of the present utility model.
Fig. 4 is the three-dimensional structure diagram of an embodiment medium-height trestle of LED wafer eutectic welding equipment of the present utility model feedway.
Fig. 5 is the three-dimensional structure diagram of vision positioning system among embodiment of LED wafer eutectic welding equipment of the present utility model.
Fig. 6 is the three-dimensional structure diagram of soldering flux feeding device among embodiment of LED wafer eutectic welding equipment of the present utility model.
Fig. 7 is the three-dimensional structure diagram of heater among embodiment of LED wafer eutectic welding equipment of the present utility model.
The specific embodiment
Describe an embodiment of LED wafer eutectic welding equipment of the present utility model in detail below with reference to Fig. 1-Fig. 7; As shown in Figure 1, the present embodiment mainly includes fuselage 1000, fuselage 1000 mainly comprises bottom casing 101, upper box body 102, the bottom is provided with power configuration casing (not shown) in the casing 102, bottom casing 102 is provided with welding bench 100, is provided with radiator fan 103, alarm lamp 104 on upper box body 102 top boards.
In addition, please refer to Fig. 2, be provided with in the upper box body 102:
The eutectic jig 10 of frame;
Arrange around described eutectic jig 10 both sides and rear respectively, be used for that support to be welded is transported to the support feedway 2 on the described eutectic jig 10 and be used for carrying wafers to be welded wafer feedway 1 to the support to be welded that is positioned at eutectic jig 10;
Be arranged on described eutectic jig 10 tops, be used at the welding compound feedway 4 that is positioned at the rack surface point seal welding compound to be welded on the eutectic jig 10;
Heater 5;
Be arranged on the described eutectic jig 10, be used for the nitrogen cooling device (not shown) that product cool is finished in the wafer welding after the described heater 5 heating welding.
Please refer to Fig. 3, during specific implementation, described wafer feedway 1 specifically includes:
Be arranged on a side of described eutectic jig 10, the wafer with chip carrier locating hole 10 is supplied with platform 11;
Be arranged on the wafer material identification part 121 of described chip carrier locating hole 10 tops;
Be arranged on the wafer angle correct device 13 between described wafer supply platform 11 and the eutectic jig 10;
Be arranged on described wafer and supply with platform 11 tops, the end has the carrying wafers mechanical arm of suction nozzle, and the carrying wafers that is used for suction nozzle is drawn to is to described wafer angle correct device 13 or eutectic jig 10.
Further, described wafer angle correct device 13 specifically includes:
Be arranged on the correction station 131 between described wafer supply table 11 and the eutectic jig 10, have three positive stop strips 132 that are T-shaped setting on the correction station 31, the intersection point place of these three positive stop strips 132 reserves wafer and places the position;
Further, described carrying wafers mechanical arm specifically includes:
A carrying wafers arm 151 is used for that the wafer that suction nozzle is drawn to is transported to correction station 131 from the chip carrier position and waits for angle correct;
Secondary carrying wafers arm 152 is arranged side by side with a described carrying wafers arm 151, is used for the wafer after the angle correct is carried to eutectic jig 10 from correction station 131.
Please refer to Fig. 4, during specific implementation, described support feedway 2 specifically includes:
Wafer after degree is proofreaied and correct is carried on the eutectic jig 10 from correction station 131.
Please refer to Fig. 4, during specific implementation, described support feedway 2 specifically includes:
Be arranged on the opposite side of eutectic jig 10, the support that is used for the placing rack pallet is supplied with platform 21;
Be arranged on described support and supply with platform 21 tops, the end has the support convey mechanical arm 23 of support claw hook 22, is used for the support in the bracket tray 800 is carried to eutectic jig 10.
The support feedway 2 of the present embodiment except but positive action is finished the supply of support, also can be reverse action realize that welding finishes the function of taking in of product.
Please refer to Fig. 5, during specific implementation, described visual identifying system 3 specifically includes:
Optical dimensions checkout gear 31 is arranged on described eutectic jig 10 tops, is used for carrying out the vision detection and localization by 310 pairs of rack surface sizes to be welded of detection and location camera that the top arranges, and takes positioning image;
The graphics processing unit (not shown), link to each other with described optical dimensions checkout gear, being used for that the positioning image that described optical dimensions checkout gear is taken is carried out image processes, by utilizing default many-valuedization standard picture and the positioning image of shooting to compare, calculate the locating accuracy of support to be welded;
Identifying processing unit (not shown), link to each other with described graphics processing unit, be used for judging whether described locating accuracy reaches default standard, if, then send enabling signal to described heater, otherwise, described wafer to be welded and/or support are processed as defective products, wherein, described default standard can be more than 90%, take 98% as best.
Please refer to Fig. 6, during specific implementation, described welding compound feedway 4 specifically includes:
Be arranged on the some packing element 41 of described eutectic jig 10 tops;
The point gum machine tool arm 42 that is connected with described some packing element 41.
Please refer to Fig. 7, during specific implementation, described heater 5 specifically includes:
Be arranged on a side of described eutectic jig 10, be used for by producing pulse current described wafer to be welded being heated from top to bottom, make the Current Heating device 51 of the rear fixed bonding of described wafer and support eutectic dissolving;
Be arranged on described eutectic jig 10 inside, be used for simultaneously support to be welded being carried out heated at constant temperature heat from the bottom up, make the constant temperature heating device (not shown) of the rear fixed bonding of described wafer and support eutectic dissolving.
Further, described Current Heating device 51 specifically includes:
Welding suction nozzle 511, welding suction nozzle 511 can be tack suction nozzle, conical vacuum suction nozzle, geta formula vacuum slot, mechanical type suction nozzle or other special suction nozzle etc.;
Be connected with described welding suction nozzle 511, be used for making welding suction nozzle 511 immediately be warmed up to the temperature required pulse current generation unit (not shown) of welding by producing pulse current;
Link to each other with constant temperature current flow heats device with described pulse current generation unit, it is carried out the thermostatically controlled heating and temperature control of staged pulse unit (not shown).
Further, Current Heating device 51 can be arranged on the secondary carrying wafers arm 152 of described wafer feedway 1, and the suction nozzle of secondary carrying wafers arm 152 bottoms adopts described welding suction nozzle 511.
In addition, described nitrogen cooling device also is arranged on described Current Heating device 5 inside, links to each other with described welding suction nozzle 51.When described pulse current generation unit heating is finished, switch to described nitrogen cooling device work by magnetic valve, to wafer and support nitrogen-blow, can make it be cooled to rapidly normal temperature by welding suction nozzle 51.
As a preferred forms of the present utility model, described wafer is supplied with platform 11, eutectic jig 10 all is fixed on the welding bench 100 by XY worktable 1001, thereby realizes the function that can move along X, Y-axis.
In addition, the present embodiment also can include the system's detecting unit 105 that is arranged on upper box body 102 internal upper parts, for detection of the duty of display system, draw detection display unit, support gripping detection display unit, support detection and localization display unit, vacuum detecting display unit, preheat temperature detection display unit, heating-up temperature detection display unit, chilling temperature detection display unit, nitrogen flow detection display unit, air mass flow monitoring display unit etc. such as wafer.
In addition, the present embodiment also includes the some man-machine dialog interfaces between the top board that is arranged on described system detecting unit 105 and upper box body 102.During specific implementation, described man-machine dialog interface can comprise: visual identity display interface 30, system arrange interface 20, system monitor unit 40 etc.
Compared with prior art, the utlity model has following advantage:
1, utilizes the Current Heating device to produce pulse current and reach the moment intensification, and by welding suction nozzle heat conduction to the LED wafer surface, make the welding compound of golden tin composition of bottom of wafer and submount material can reach fixed bonding after the eutectic dissolving moment, the LED wafer after this mode is welded can reach better heat-conducting effect and Current Heating and can reach moment (in the several seconds) and realize the temperature technique that adds from normal temperature to 500 ℃: can be controlled in 8.5 seconds/from material loading, blanking, welding, to the activity duration of finishing product; Can be at 3-4 in second, realize that temperature from 350 ℃ to 200 ℃ conversion, can be controlled in 2-3 heat time heating time in second (containing weld interval); Can be controlled in cool time within 1 second;
Can realize simultaneously in batches (perhaps module type) encapsulated wafer by heat-supplying mode up and down, and because high-temperature part is concentrating on the welding suction nozzle, can realize producing at modularity and can not have influence on LED wafer on every side when LED encapsulates.
2, adopt the high-precision vision correcting system, lens type up and down target localization, guarantee two object stack rates more than 98%, guarantee the identical precision of LED wafer and base, can drop into flip chip, the upside-down mounting of wafer bipolar electrode,, replacing needs gold thread to weld conducting LED that the mode of power supply is provided at present.
3, utilize wafer angle compensating device that the wafer of drawing from chip carrier (blue film) is carried out independently angle modification, guarantee that every wafer and the ceramics bracket rate of coincideing when welding reaches 100%.
The utility model is also applicable to technology such as traditional silver slurry die bond and tin slurry die bonds, can contain different die bond modes and eutectic alloy materials such as using silver slurry, tin slurry, tin copper, golden tin, only need simply window writing routine to be adjusted parameter or change the fraction accessory and can realize multipurpose.
The above is preferred embodiment of the present utility model; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the utility model principle; can also make some improvements and modifications, these improvements and modifications also are considered as protection domain of the present utility model.
Claims (10)
1. a LED wafer eutectic welding equipment includes heater, driving control system and power configuration casing, it is characterized in that, also includes:
Welding bench;
Be arranged on described welding bench anteriomedial position, be used for placing the eutectic jig of wafer to be welded and support;
Center on respectively the wafer feedway that described eutectic jig both sides and rear arrange;
Be arranged on the welding compound feedway of described eutectic jig top;
Be arranged on the nitrogen cooling device of described eutectic jig top;
Described heater includes:
Be arranged on the Current Heating device of a side of described eutectic jig;
Be arranged on the constant temperature heating device of described eutectic jig inside.
2. a LED wafer eutectic welding equipment is characterized in that, this LED wafer eutectic welding equipment also includes: vision positioning system.
3. LED wafer eutectic welding equipment as claimed in claim 2 is characterized in that, described visual identifying system specifically includes:
The optical dimensions position detecting device is arranged on the top of described eutectic jig;
Graphics processing unit links to each other with described optical dimensions checkout gear;
The identifying processing unit links to each other with described graphics processing unit.
4. such as each described LED wafer eutectic welding equipment among the claim 1-3, it is characterized in that, described Current Heating device specifically includes:
The welding suction nozzle;
The pulse current generation unit that is connected with described welding suction nozzle;
The heating and temperature control unit that links to each other with constant temperature heating device with described pulse current generation unit.
5. LED wafer eutectic welding equipment as claimed in claim 4 is characterized in that, described wafer feedway specifically includes:
Be arranged on a side of described eutectic jig, the wafer with chip carrier locating hole is supplied with platform;
Section is got on the wafer top that is arranged on described chip carrier locating hole below;
Be arranged on the wafer material identification part of described chip carrier locating hole top;
Be arranged on the wafer angle correct device between described wafer supply platform and the eutectic jig;
Be arranged on described wafer and supply with the platform top, the end has the carrying wafers mechanical arm of suction nozzle.
6. LED wafer eutectic welding equipment as claimed in claim 5 is characterized in that,
Described wafer angle correct device specifically includes:
Be arranged on the correction station between described wafer supply table and the eutectic jig, have three positive stop strips that are T-shaped setting on the described correction station, the intersection point place of these three positive stop strips reserves wafer and places the position;
Described carrying wafers mechanical arm specifically includes:
A carrying wafers arm;
Secondary carrying wafers arm is arranged side by side with a described carrying wafers arm.
7. LED wafer eutectic welding equipment as claimed in claim 6 is characterized in that, described support feedway specifically includes:
The support that is arranged on the opposite side of described eutectic jig is supplied with platform;
Be arranged on described support and supply with the platform top, the end has the support convey mechanical arm of support claw hook.
8. LED wafer eutectic welding equipment as claimed in claim 7 is characterized in that, described welding compound feedway specifically includes:
Be arranged on the some packing element of described eutectic jig top;
The point gum machine tool arm that is connected with described some packing element.
9. LED wafer eutectic welding equipment as claimed in claim 8, it is characterized in that: described Current Heating device is arranged on the described secondary carrying wafers arm, and described secondary carrying wafers arm bottom arranges described welding suction nozzle.
10. LED wafer eutectic welding equipment as claimed in claim 9 is characterized in that: described wafer is supplied with platform and the eutectic jig all is arranged on the described welding bench by XY worktable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220254943 CN202763240U (en) | 2012-05-30 | 2012-05-30 | LED (light-emitting diode) wafer eutectic soldering equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220254943 CN202763240U (en) | 2012-05-30 | 2012-05-30 | LED (light-emitting diode) wafer eutectic soldering equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202763240U true CN202763240U (en) | 2013-03-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220254943 Expired - Fee Related CN202763240U (en) | 2012-05-30 | 2012-05-30 | LED (light-emitting diode) wafer eutectic soldering equipment |
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| CN (1) | CN202763240U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105458439A (en) * | 2015-12-28 | 2016-04-06 | 深圳市顺尚自动化科技有限公司 | Full-automatic silicon wafer tin soldering robot |
| CN108581118A (en) * | 2017-03-17 | 2018-09-28 | 泰科电子(上海)有限公司 | The automatic supply system of soldering paste |
| CN112599432A (en) * | 2020-12-16 | 2021-04-02 | 无锡英诺赛思科技有限公司 | Chip eutectic welding equipment |
-
2012
- 2012-05-30 CN CN 201220254943 patent/CN202763240U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105458439A (en) * | 2015-12-28 | 2016-04-06 | 深圳市顺尚自动化科技有限公司 | Full-automatic silicon wafer tin soldering robot |
| CN105458439B (en) * | 2015-12-28 | 2018-06-08 | 深圳市顺尚自动化科技有限公司 | Full-automatic silicon wafer tin soldering robot |
| CN108581118A (en) * | 2017-03-17 | 2018-09-28 | 泰科电子(上海)有限公司 | The automatic supply system of soldering paste |
| CN112599432A (en) * | 2020-12-16 | 2021-04-02 | 无锡英诺赛思科技有限公司 | Chip eutectic welding equipment |
| CN112599432B (en) * | 2020-12-16 | 2022-04-01 | 无锡英诺赛思科技有限公司 | Eutectic welding equipment and eutectic welding method for chip |
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| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130306 Termination date: 20150530 |
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| EXPY | Termination of patent right or utility model |