CN202736615U - Plate type thermistor - Google Patents
Plate type thermistor Download PDFInfo
- Publication number
- CN202736615U CN202736615U CN 201220365030 CN201220365030U CN202736615U CN 202736615 U CN202736615 U CN 202736615U CN 201220365030 CN201220365030 CN 201220365030 CN 201220365030 U CN201220365030 U CN 201220365030U CN 202736615 U CN202736615 U CN 202736615U
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- thermal resistor
- protective layer
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Abstract
The utility model relates to the technical field of a thermistor, in particular to a plate type thermistor, which comprises a substrate. The upper end face of the substrate is provided with a bottom electrode, the upper end face of the bottom electrode is provided with a heat-sensitive resistance layer, two ends of the upper end face of the heat-sensitive resistance layer are respectively provided with an upper electrode, the middle part of the upper end face of the heat-sensitive resistance layer is provided with a protective layer, and the protective layer is arranged between the upper electrodes on the two sides. The plate type thermistor has the advantages of simple structure and relative small number of electrode layers. Only one surface of the substrate is provided with electrodes, the size and the weight can be reduced effectively, and the cost is low. When the plate type thermistor is used, welding of the upper electrodes and a circuit board pad is equivalent to direct connection of the heat-sensitive resistance layer and the circuit board, and the rate of thermal response of the thermistor can be improved. Moreover, the plate type thermistor has high thermal sensitivity.
Description
Technical field
The utility model relates to the thermistor technical field, particularly a kind of chip type thermal resistor.
Background technology
At present; the design of existing multiple chip type thermal resistor; the chip type thermal resistor of tool representative; as shown in Figure 1, it comprises: resistive element 100, be positioned at the both sides, top and bottom side electrode 101, be positioned at left and right sides internal layer silver electrode 102, be positioned at the nickel electrode 103 in the middle of the left and right sides ectonexine, the protective layer 105 that is positioned at the outer field tin electrode 104 in the left and right sides and is used for sealing.The structure relative complex of this chip type thermal resistor, resistive element need the heat conduction of outside multi-layered electrode when experiencing thermal change, its temperature-sensitive response time is long, reacts slow.
Summary of the invention
The purpose of this utility model is to solve the deficiencies in the prior art, provides that a kind of volume is little, resistance accuracy is high, the simple slice heat sensitive resistor of technique and manufacture method thereof.
For achieving the above object, the technical solution adopted in the utility model is:
A kind of chip type thermal resistor; comprise substrate; the upper surface of substrate is provided with bottom electrode; the upper surface of bottom electrode is provided with thermal resistor layer; the both sides of the upper surface of thermal resistor layer are respectively equipped with upper electrode; the middle part of the upper surface of described thermal resistor layer is provided with protective layer, and protective layer is positioned at the centre of the upper electrode of both sides.
Further, the middle part of described thermal resistor layer is provided with the gap, and described protective layer offsets to the substrate extension and with bottom electrode.
Further, described substrate is ceramic substrate.
Further, described protective layer is insulating protective layer.
Wherein, substrate adopts insulating material to make, and such as pottery, forms the insulating ceramics substrate; The material of bottom electrode can be a kind of in gold, palladium, platinum, the silver or several alloy wherein, also can be a kind of metal or its alloy in nickel, the chromium.
The material of thermistor layer material can be one or more the alloy in manganese, cobalt, nickel, copper, iron, the silver.
The material of upper electrode can be one or more the alloy in gold, palladium, platinum, the silver.
The material of protective layer can be lead-boron-silex glass system, such as lead glass, Pyrex, borosilicate lead glass, can be the compound of silicon also, such as silicon dioxide; And other megohmite insulants.
The beneficial effects of the utility model are: the utility model is simple in structure, and electrode layer is relatively less, and only the one side at substrate arranges electrode, effectively reduces volume and weight, and cost is low; The utility model by upper electrode and board pads welding, is equivalent to thermal resistor layer and directly is connected with circuit board in use, improves the thermal response speed of thermistor, and thermal sensitivity of the present utility model is high.
Description of drawings
Fig. 1 is the schematic diagram of prior art.
Fig. 2 is the schematic diagram of the utility model product.
Fig. 3 is the another kind of schematic diagram of the utility model product.
Reference numeral is:
100---resistive element 101---side electrode
102---silver electrode 103---nickel electrode
104---tin electrode 105---protective layer
200---substrate 201---bottom electrode
202---thermal resistor layer 203---upper electrode
204---protective layer.
Embodiment
Below in conjunction with the drawings and specific embodiments the utility model is described further.
Embodiment 1: referring to accompanying drawing 2; A kind of chip type thermal resistor; comprise substrate 200; the upper surface of substrate 200 is provided with bottom electrode 201; the upper surface of bottom electrode 201 is provided with thermal resistor layer 202; the both sides of the upper surface of thermal resistor layer 202 are respectively equipped with upper electrode 203; the middle part of the upper surface of described thermal resistor layer 202 is provided with protective layer 204, and protective layer 204 is positioned at the centre of the upper electrode 203 of both sides.
Wherein, substrate 200 adopts insulating material to make, and such as pottery, forms insulating ceramics substrate 200; The material of bottom electrode 201 can be a kind of in gold, palladium, platinum, the silver or several alloy wherein, also can be a kind of metal or its alloy in nickel, the chromium.
The material of thermal resistor layer 202 materials can be a kind of in manganese (Mn), cobalt (Co), nickel (Ni) copper (Cu), iron (Fe), the silver (Ag) or several alloy wherein.
The material of upper electrode 203 can be a kind of in gold, palladium, platinum, the silver or several alloy wherein.
The material of protective layer 204 can be lead-boron-silex glass system, such as lead glass, Pyrex, borosilicate lead glass, can be the compound of silicon also, such as silicon dioxide; And other megohmite insulants.
The utility model in use, the upper electrode that will be positioned at both sides is welded on the circuit board, the heat on the circuit board is directly passed to thermal resistor layer by upper electrode, the heat pipeline is short, so that the thermal response speed of thermal resistor layer is fast.
Embodiment 2: referring to Fig. 3; comprise substrate 200; the upper surface of substrate 200 is provided with bottom electrode 201; the upper surface of bottom electrode 201 is provided with thermal resistor layer 202; the both sides of the upper surface of thermal resistor layer 202 are respectively equipped with upper electrode 203; the middle part of the upper surface of described thermal resistor layer 202 is provided with protective layer 204; and protective layer 204 is positioned at the centre of the upper electrode 203 of both sides; wherein the middle part of thermal resistor layer 202 is provided with the gap, and described protective layer 204 offsets to substrate 200 extensions and with bottom electrode 201.
Among this embodiment, thermal resistor layer 202 is divided into two parts, two parts are together in series by bottom electrode 201, during enforcement, these two parts are connected with circuit board by corresponding upper electrode 203, when the circuit board heat imports into, only need one of two parts to have thermosensitive response just can finish the temperature-sensitive response, improved temperature-sensitive sensitivity.
Below only be the application's preferred embodiment, equivalent technical solutions on this basis still falls into the application protection range.
Claims (4)
1. chip type thermal resistor; comprise substrate; it is characterized in that: the upper surface of substrate is provided with bottom electrode; the upper surface of bottom electrode is provided with thermal resistor layer; the both sides of the upper surface of thermal resistor layer are respectively equipped with upper electrode; the middle part of the upper surface of described thermal resistor layer is provided with protective layer, and protective layer is positioned at the centre of the upper electrode of both sides.
2. a kind of chip type thermal resistor according to claim 1, it is characterized in that: the middle part of described thermal resistor layer is provided with the gap, and described protective layer extends and offsets with bottom electrode to substrate.
3. a kind of chip type thermal resistor according to claim 1 and 2, it is characterized in that: described substrate is ceramic substrate.
4. a kind of chip type thermal resistor according to claim 3, it is characterized in that: described protective layer is insulating protective layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220365030 CN202736615U (en) | 2012-07-26 | 2012-07-26 | Plate type thermistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220365030 CN202736615U (en) | 2012-07-26 | 2012-07-26 | Plate type thermistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202736615U true CN202736615U (en) | 2013-02-13 |
Family
ID=47662290
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220365030 Expired - Lifetime CN202736615U (en) | 2012-07-26 | 2012-07-26 | Plate type thermistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202736615U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102800449A (en) * | 2012-07-26 | 2012-11-28 | 东莞市东思电子技术有限公司 | Chip thermistor and manufacturing method thereof |
-
2012
- 2012-07-26 CN CN 201220365030 patent/CN202736615U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102800449A (en) * | 2012-07-26 | 2012-11-28 | 东莞市东思电子技术有限公司 | Chip thermistor and manufacturing method thereof |
| CN102800449B (en) * | 2012-07-26 | 2016-07-06 | 东莞市东思电子技术有限公司 | A kind of chip type thermal resistor and manufacture method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130213 |