CN216349191U

CN216349191U - PCB integrated fast reaction temperature measurement touch probe

Info

Publication number: CN216349191U
Application number: CN202122413731.7U
Authority: CN
Inventors: 聂德政; 廖洪亮; 陈彦东
Original assignee: Shenzhen Mass Production Electronic Technology Co ltd
Current assignee: Shenzhen Mass Production Electronic Technology Co ltd
Priority date: 2021-10-08
Filing date: 2021-10-08
Publication date: 2022-04-19
Anticipated expiration: 2031-10-08

Abstract

The utility model discloses a PCB integrated rapid reaction temperature measurement touch probe, which comprises a probe main body, wherein the probe main body comprises a PCB and a temperature sensing element welded on the PCB, the PCB conducts heat to the temperature sensing element rapidly to realize temperature acquisition, and the PCB is used as a touch medium to actively signal to wake up a peripheral unit. The utility model can solve the problem that the existing temperature sensor on the market has slow reaction speed, improves the use value of related products, and simultaneously increases the function of the touch sensor on the basis of the temperature sensor, and improves the convenience and diversity of related product application.

Description

PCB integrated fast reaction temperature measurement touch probe

Technical Field

The utility model relates to a sensor, in particular to a PCB integrated rapid reaction temperature measurement touch probe.

Background

With the advent of the internet of things era, the demand of various sensors is increasing. The temperature sensor has a wide range of applications, such as daily body temperature measurement, object temperature measurement, and the like. Among the temperature sensors, temperature sensing element sensors are the most commonly used.

The conventional temperature sensor of temperature sensing element in the market is usually to weld wires on two poles of the temperature sensing element, and then seal and cure the temperature sensing element by using epoxy resin or similar glue. In order to adapt to certain specific use scenes, a metal shell is additionally arranged outside some of the devices.

In the prior art, wires are directly welded on two poles of a temperature sensing element, then epoxy resin is used for sealing, the epoxy resin becomes a part of a temperature sensing medium, the temperature firstly passes through the epoxy resin and then reaches the temperature sensing element, and due to the material characteristics, the specified reaction speed is slow.

The prior art has the following defects:

1. the reaction speed is slow, and the method is not suitable for use scenes needing rapid temperature measurement;

2. only pure temperature sensing is needed, and the sensor can only be used as a passive device in application.

SUMMERY OF THE UTILITY MODEL

The PCB is used as a temperature and touch control conducting medium, the advantage of rapid conduction of a metal material on the PCB is utilized, user experience is greatly improved, the use field of a temperature sensor is widened, a touch control sensing function is added on the basis of temperature sensing, and peripheral units can be awakened by active signaling.

The utility model is realized by the following technical scheme: the utility model provides an integrative quick reaction temperature measurement of PCB touches probe, includes the probe main part, and this probe main part includes a PCB to and the temperature-sensing element of welding on PCB, heat conduction to temperature-sensing element realization temperature acquisition fast through PCB (1), and act as touch-control medium initiative signaling and awaken up peripheral unit.

As a preferred technical solution, the temperature sensing element is disposed in the PCB and sealed and fixed by epoxy resin.

Preferably, the temperature sensing element has two temperature signal conducting wires, and the two temperature signal conducting wires are connected to both poles of the temperature sensing element.

As a preferred technical scheme, the touch control medium comprises a sensing contact layer arranged on one side surface of the PCB (1), a circuit layer arranged on the other side surface of the PCB, and a touch control signal conducting wire connected with the circuit layer.

As a preferred technical scheme, the temperature sensing element is attached in the PCB through an SMT process.

A method for manufacturing a PCB integrated rapid reaction temperature measurement touch probe specifically comprises the following steps:

step one, selecting a PCB;

step two, the front side of the PCB is used as a sensing contact layer, the back side of the PCB is used as a circuit layer, and a temperature sensing element is mounted on the PCB through an SMT process and three electronic wires are welded on the PCB;

thirdly, sealing the adhesive by using epoxy resin to achieve reinforcement and sealing;

and step four, two of the three electronic wires are communicated with two poles of the temperature sensing element to serve as temperature signal conducting wires, and the third electronic wire serves as a touch signal conducting wire.

The utility model has the beneficial effects that: firstly, the PCB is used as a temperature and touch control conducting medium, and the advantage of rapid conduction of a metal material on the PCB is utilized, so that the whole sensing reaction speed is high;

secondly, the touch sensing function is added on the basis of temperature sensing, the peripheral unit can be awakened by active signaling, the function of the touch sensor is added on the basis of the temperature sensor, and the convenience and the diversity of related product application are improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is an exploded view of the present invention;

FIG. 2 is a schematic view of the overall structure of the present invention

Detailed Description

All of the features disclosed in this specification, or all of the steps in any method or process so disclosed, may be combined in any combination, except combinations of features and/or steps that are mutually exclusive.

Any feature disclosed in this specification (including any accompanying claims, abstract and drawings), may be replaced by alternative features serving equivalent or similar purposes, unless expressly stated otherwise. That is, unless expressly stated otherwise, each feature is only an example of a generic series of equivalent or similar features.

In the description of the present invention, it is to be understood that the terms "one end", "the other end", "outside", "upper", "inside", "horizontal", "coaxial", "central", "end", "length", "outer end", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present invention.

Further, in the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

The use of terms such as "upper," "above," "lower," "below," and the like in describing relative spatial positions herein is for the purpose of facilitating description to describe one element or feature's relationship to another element or feature as illustrated in the figures. The spatially relative positional terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly

In the present invention, unless otherwise explicitly specified or limited, the terms "disposed," "sleeved," "connected," "penetrating," "plugged," and the like are to be construed broadly, e.g., as a fixed connection, a detachable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

As shown in fig. 1 and 2, the PCB integrated rapid reaction temperature measurement touch probe of the present invention comprises a probe body, the probe body comprises a PCB1, and a temperature sensing element soldered on a PCB1, the temperature is collected by rapidly conducting heat to the temperature sensing element through the PCB1, and the probe acts as a touch medium to actively signal to wake up a peripheral unit.

In this embodiment, the PCB1 may be a PCB made of various materials, including but not limited to copper-based, aluminum-based, FR4, etc., and may have any shape, such as circular, square, triangular, etc., and in this embodiment, it is circular. When the temperature sensing element is installed, the temperature sensing element is arranged in the PCB1 and is sealed and fixed through the epoxy resin 3.

The temperature sensing element can be any element with temperature detection capability, such as a thermistor, a temperature detection sensor and the like; the temperature sensing element 2 has two temperature signal conducting wires 5, the touch control medium comprises a sensing contact layer arranged on one side surface of the PCB1, a circuit layer arranged on the other side surface of the PCB1, and a touch control signal conducting wire 4, and the touch control signal conducting wire 4 is connected with the circuit layer. The two temperature signal conducting wires 5 are connected with two poles of the temperature sensing element 2, so that the two temperature signal conducting wires are used as temperature detection signals for conducting, the sensing contact layer and the touch signal conducting wires are used for touch detection, and the peripheral unit can be awakened by active signaling of a touch medium, so that the application range of the traditional temperature sensor is enlarged.

The specific method comprises the following steps: firstly, selecting a PCB, wherein the front side of the PCB is used as a sensing contact layer, the back side of the PCB is used as a circuit layer, and a temperature sensing element is pasted and welded with three electronic wires through an SMT (surface mount technology); then, sealing the epoxy resin to achieve reinforcement and sealing; and finally, two of the three electronic wires are communicated with two poles of the temperature sensing element to serve as temperature signal conducting wires, and the third electronic wire serves as a touch signal conducting wire.

The above description is only an embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that are not thought of through the inventive work should be included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope defined by the claims.

Claims

1. The utility model provides an integrative quick reaction temperature measurement touch probe of PCB which characterized in that: the probe comprises a probe body, wherein the probe body comprises a PCB (1) and a temperature sensing element welded on the PCB (1), the temperature sensing element is quickly conducted to the temperature sensing element through the PCB (1) to realize temperature acquisition, and the PCB is used as a touch medium to actively signal to wake up a peripheral unit.

2. The PCB integrated rapid response temperature measurement touch probe of claim 1, wherein: the temperature sensing element is arranged in the PCB (1) and is sealed and fixed by sealing glue through epoxy resin (3).

3. The PCB integrated rapid response temperature measurement touch probe of claim 1, wherein: the temperature sensing element (2) is provided with two temperature signal conducting wires (5), and the two temperature signal conducting wires (5) are connected with two poles of the temperature sensing element (2).

4. The PCB integrated rapid response temperature measurement touch probe of claim 3, wherein: the touch control medium comprises a sensing contact layer arranged on one side face of the PCB (1), a circuit layer arranged on the other side face and a touch control signal conducting wire (4), wherein the touch control signal conducting wire (4) is connected with the circuit layer.

5. The PCB integrated rapid response temperature measurement touch probe of claim 3, wherein: the temperature sensing element (2) is attached in the PCB (1) through an SMT process.