CN202721120U - LED device in form of chip-on-board (COB) package - Google Patents

LED device in form of chip-on-board (COB) package Download PDF

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Publication number
CN202721120U
CN202721120U CN2012200299931U CN201220029993U CN202721120U CN 202721120 U CN202721120 U CN 202721120U CN 2012200299931 U CN2012200299931 U CN 2012200299931U CN 201220029993 U CN201220029993 U CN 201220029993U CN 202721120 U CN202721120 U CN 202721120U
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China
Prior art keywords
cob
substrate
colloid
light source
cone
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Expired - Lifetime
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CN2012200299931U
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Chinese (zh)
Inventor
丁宪治
周政泰
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POLAR-LIGHTS Co Ltd
POLAR LIGHTS OPTO CO Ltd
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POLAR-LIGHTS Co Ltd
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Priority to CN2012200299931U priority Critical patent/CN202721120U/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

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  • Led Device Packages (AREA)

Abstract

The utility model discloses an LED device in the form of a COB package, which comprises a substrate and at least one COB light source body formed on the substrate. Each COB light source body is formed by at least one LED chip bonded onto the substrate and coated with a colloid body. The colloid body comprises a platform part and a convex arc part combined onto the top surface of the platform part. The platform part is in the shape of a cylinder, a cone or the stacked combination of the cylinder and the cone. In this way, the COB light source body can emit light at a certain lighting angle to satisfy the requirement.

Description

The LED matrix of COB encapsulation
Technical field
The utility model is the design about a kind of LED matrix, the LED matrix that particularly encapsulates about a kind of COB.
Background technology
In recent years, because light-emitting diode (light emitting diode, LED) but have that volume is little, reaction is fast, the life-span long, be difficult for decay, firm in appearance, vibration resistance full-color light-emitting (containing invisible light), point to design easily, low-voltage, low current, the advantages such as conversion loss is low, thermal radiation is little, volume production is easy, environmental protection, replace gradually general conventional illumination device.
In order to satisfy various application, LED structurally has to be become the lamp string with a plurality of LED serial connections or is laid on the circuit board setting as lamp plate, and various mode is also arranged on technique, and COB (chip on board) is an example.COB a kind ofly is transplanted to technique on the circuit board (PCB) with routing and solid glue operation, in other words, COB pastes chip (or claiming crystal grain, naked crystalline substance) on the circuit board, and its wire/bonding wire is welded to the weld pad of circuit board, then gluing covers chip and wire, becomes light source.COB can deduct many steps compared to the traditional IC packaging technology, therefore in price comparatively cheap advantage is arranged.
The utility model content
The technical problem that the utility model institute wish solves
Yet, known COB packaged LED is all the design of hemisphere or flat-top shape, the lighting angle of its light (full-shape) is though can reach wide-angle about 120 °, but often need light fixture is carried out the design of secondary optical lens, can meet the use of specific narrow angle light purposes, cause simultaneously extra expense.
Edge this, main purpose of the present utility model namely provides the LED matrix of a kind of COB encapsulation, to improve known COB packaged LED in structural design and to use existing shortcoming.
The technological means that the utility model is dealt with problems
The technological means that the utility model adopts for the problem that solves known technology provides a kind of LED matrix of COB encapsulation, and comprising: a substrate has one face is set; And at least one COB light source body, each COB light source body is formed at least one led chip of substrate now the face that arranges of substrate with the colloid coating, colloid comprises that a section and is incorporated into the convex arc section of the end face of platform section, platform section is the stacking combination of a cylinder, a cone or cylinder and cone, the COB light source body satisfies following equation
0.1 < H D < 3 ,
H is that whole height and the D of colloid are the bottom width of colloid herein.
In an embodiment of the present utility model, the COB light source body more satisfies following equation,
2 < D C ,
D is the bottom width of colloid herein, and C is the width of led chip.
In an embodiment of the present utility model, more be added with more than one fluorescent material in the COB light source body.
In an embodiment of the present utility model, platform section comprises a cylinder and a cone, and cylinder is stacked on the cone.
In an embodiment of the present utility model, platform section comprises a cylinder and a cone, and cone is stacked on the cylinder.
In an embodiment of the present utility model, the end face width of platform section is greater than the width of convex arc section.
In an embodiment of the present utility model, colloid is made with Silicon, PC, Epoxy, acryl or glass material.
In an embodiment of the present utility model, substrate is selected from ceramic substrate, aluminium base, copper base, glass fibre basal plate, silicon substrate, graphite substrate, silicon carbide substrate, reaches Diamonal substrate one or a combination set of.
The effect of the utility model contrast prior art
The technological means that adopts via the utility model is so that in the LED matrix of COB encapsulation of the present utility model, the lighting angle of its COB light source body (full-shape) can reach for example 5-90 ° narrow angle.And on technique, the COB light source body is that direct one-shot forming is specified configuration of the present utility model and ratio in the COB encapsulation process, therefore afterwards can not need carry out the design to the secondary optical lens of light fixture.Thereby, not only simplify the design procedure of secondary optical lens, also save the manufacturing cost of secondary optical lens and follow-up assembling man-hour thereof.On the other hand, because exempted the element setting of secondary optical lens, more so that integral member has the possibility of further microminiaturization, thereby reach known COB small size that packaged LED is beyond one's reach.
Description of drawings
The specific embodiment that the utility model adopts will be further described by following embodiment and accompanying drawing, wherein:
Fig. 1 is that demonstration is according to the schematic side view of the LED matrix of the COB encapsulation of the first embodiment of the present utility model;
Fig. 2 is that demonstration is according to the schematic side view of the LED matrix of the COB encapsulation of the second embodiment of the present utility model;
Fig. 3 is that demonstration is according to the schematic side view of the LED matrix of the COB encapsulation of the 3rd embodiment of the present utility model;
Fig. 4 is that demonstration is according to the schematic side view of the LED matrix of the COB encapsulation of the 4th embodiment of the present utility model;
Fig. 5 is that demonstration is according to the schematic side view of the LED matrix of the COB encapsulation of the 5th embodiment of the present utility model;
Fig. 6 is that demonstration is according to the schematic side view of the LED matrix of the COB encapsulation of the 6th embodiment of the present utility model.
Embodiment
Consult shown in Figure 1ly, it shows the schematic side view according to the LED matrix of the COB encapsulation of the first embodiment of the present utility model.The LED matrix 100 of the COB encapsulation of foundation the first embodiment of the present utility model comprises a substrate 1 and at least one COB light source body.
Substrate 1 is selected from ceramic substrate, aluminium base, copper base, glass fibre basal plate, silicon substrate, graphite substrate, silicon carbide substrate, reaches Diamonal substrate one or a combination set of.Substrate 1 has one face 11 is set, and the COB light source body is formed at the face of setting 11.
The COB light source body is and utilizes COB technique and be formed at light source on the substrate 1.Each COB light source body is the face that arranges 11 that now is formed at substrate 1 at least one led chip 2 of substrate 1 with colloid 3 coatings with COB technique.The light that led chip 2 sends can be any wavelength section, and for example the ultraviolet ray of 250-960nm is to infrared light wavelength section.Colloid 3 can be transparent colloid, translucent colloid or colored colloid according to circumstances, and it is mainly made with Silicon, PC, Epoxy, acryl, glass material or similar material, and has various refractive indexes.In addition, alternatively in the COB light source body add or add more than one fluorescent material 4, produce the light of desired spectrum with the combination by fluorescent material 4 and led chip 2, colloid 3.
In the utility model, for the lighting angle that makes the COB light source body reaches required angle, colloid 3 comprises that a section 31 and is engaged in the convex arc section 32 of the end face of platform section 31.Wherein, platform section 31 is the stacking combination of a cylinder, a cone or cylinder and cone.And in this embodiment, platform section 31 is a cylinder.Cylinder can be cylinder, cylindroid or prism, and its lateral margin in end view is straight line or oblique line parallel to each other.Convex arc section 32 can be the cambered surface of any curvature, naturally also can be the hemisphere cambered surface.Moreover the COB light source body satisfies following equation:
0.1 < H D < 3 , (equation one)
H is that whole height and the D of colloid 3 are the bottom width of colloid 3 herein.In addition, control more accurately for the lighting angle that makes the COB light source body, the COB light source body preferably also satisfies following equation:
2 < D C , (equation two)
D is the bottom width of colloid 3 herein, and C is the width of led chip 2.By configuration and the Proportionality design of this kind COB light source body, the light that led chip 2 sends can be subject to the impact of configuration and the ratio of colloid 3, and so that the lighting angle of whole COB light source body (full-shape) can reach for example 5-90 ° narrow angle.And on technique, the COB light source body is that direct one-shot forming is this kind configuration and ratio in the COB encapsulation process, therefore afterwards can not need carry out the design to the secondary optical lens of light fixture.Thereby, not only simplify the design procedure of secondary optical lens, also save the manufacturing cost of secondary optical lens and follow-up assembling man-hour thereof.On the other hand, because exempted the element setting of secondary optical lens, more so that integral member has the possibility of further microminiaturization, thereby reach known COB small size that packaged LED is beyond one's reach.
Consult Fig. 2, it shows the schematic side view according to the LED matrix of the COB encapsulation of the second embodiment of the present utility model.The element of the LED matrix 100a of the COB encapsulation of this embodiment is similar to aforementioned the first embodiment, therefore identical element is to indicate with identical element number.
This embodiment is characterised in that, the 31a of platform section of colloid 3a is a cone (frustum).Cone can be circular cone, elliptic cone or pyramid, and its lateral margin in end view is non-straight line parallel to each other or oblique line.Certainly, the COB light source body of this embodiment satisfies aforesaid equation one equally, and further can satisfy aforesaid equation two, and realizes the requirement to lighting angle.
Consult Fig. 3, it shows the schematic side view according to the LED matrix of the COB encapsulation of the 3rd embodiment of the present utility model.The element of the LED matrix 100b of the COB encapsulation of this embodiment is similar to aforementioned the first embodiment, therefore identical element is to indicate with identical element number.
This embodiment is characterised in that, the 31b of platform section of colloid 3b comprises a cylinder 311 and a cone 312, and cone 312 is stacked on the cylinder 311.Certainly, the COB light source body of this embodiment satisfies aforesaid equation one equally, and further can satisfy aforesaid equation two, and realizes the requirement to lighting angle.
Consult Fig. 4, it shows the schematic side view according to the LED matrix of the COB encapsulation of the 4th embodiment of the present utility model.The element of the LED matrix 100c of the COB encapsulation of this embodiment is similar to aforementioned the first embodiment, therefore identical element is to indicate with identical element number.
This embodiment is characterised in that, the 31c of platform section of colloid 3c comprises a cylinder 311 and a cone 312, and cylinder 311 is stacked on the cone 312.Certainly, the COB light source body of this embodiment satisfies aforesaid equation one equally, and further can satisfy aforesaid equation two, and realizes the requirement to lighting angle.
Consult Fig. 5, it shows the schematic side view according to the LED matrix of the COB encapsulation of the 5th embodiment of the present utility model.The element of the LED matrix 100d of the COB encapsulation of this embodiment is similar to aforementioned the first embodiment, therefore identical element is to indicate with identical element number.
This embodiment is characterised in that, the end face width of the 31d of platform section of colloid 3d greater than the width of convex arc section 32 (that is, and W1＞W2), therefore in the convex arc section 32 around as being formed with flange.Certainly, the COB light source body of this embodiment satisfies aforesaid equation one equally, and further can satisfy aforesaid equation two, and realizes the requirement to lighting angle.
Consult Fig. 6, it shows the schematic side view according to the LED matrix of the COB encapsulation of the 6th embodiment of the present utility model.The element of the LED matrix 100e of the COB encapsulation of this embodiment is similar to aforementioned the first embodiment, therefore identical element is to indicate with identical element number.
This embodiment is characterised in that, in single COB light source body, colloid 3e is coated with a plurality of led chips 2.These led chips 2 can have identical or different emission wavelength section, and mixed light sends the light of specific frequency spectrum.Certainly, even be a plurality of situations at led chip 2, the COB light source body of this embodiment satisfies aforesaid equation one equally, and further can satisfy aforesaid equation two, and realizes the requirement to lighting angle.
By above embodiment as can be known, the value on the true tool industry of LED matrix of COB encapsulation provided by the utility model was therefore the utility model had accorded with the condition of patent already.Only above narration only be preferred embodiment explanation of the present utility model, and all persons that is skillful in the technique be when doing according to above-mentioned explanation other all improvement, only these changes still belong to creation spirit of the present utility model and the claim scope that defines in.

Claims (7)

1. the LED matrix of a COB encapsulation is characterized in that, comprising:
One substrate has one face is set; And
At least one COB light source body, each this COB light source body is formed at least one led chip of this substrate now the face that arranges of this substrate with the colloid coating, this colloid comprises that a section and is incorporated into the convex arc section of the end face of this one, this one is the stacking combination for a cylinder, a cone or cylinder and cone, this COB light source body satisfies following equation
Figure DEST_PATH_FDA00002142828800011
H is that whole height and the D of this colloid are the bottom width of this colloid herein.
2. the LED matrix of COB encapsulation as claimed in claim 1 is characterized in that, wherein this COB light source body also satisfies following equation,
Figure DEST_PATH_FDA00002142828800012
D is the bottom width of this colloid herein, and C is the width of this led chip.
3. the LED matrix of COB encapsulation as claimed in claim 1 is characterized in that, wherein this one comprises a cylinder and a cone, and this cylinder is stacked on this cone.
4. the LED matrix of COB encapsulation as claimed in claim 1 is characterized in that, wherein this one comprises a cylinder and a cone, and this cone is stacked on this cylinder.
5. the LED matrix of COB encapsulation as claimed in claim 1 is characterized in that, wherein the end face width of this one is greater than the width of this convex arc section.
6. the LED matrix of COB encapsulation as claimed in claim 1 is characterized in that, wherein this colloid is made with Silicon, PC, Epoxy, acryl or glass material.
7. the LED matrix of COB encapsulation as claimed in claim 1 is characterized in that, wherein this substrate is selected from one of ceramic substrate, aluminium base, copper base, glass fibre basal plate, silicon substrate, graphite substrate, silicon carbide substrate and Diamonal substrate.
CN2012200299931U 2012-01-30 2012-01-30 LED device in form of chip-on-board (COB) package Expired - Lifetime CN202721120U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012200299931U CN202721120U (en) 2012-01-30 2012-01-30 LED device in form of chip-on-board (COB) package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012200299931U CN202721120U (en) 2012-01-30 2012-01-30 LED device in form of chip-on-board (COB) package

Publications (1)

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CN202721120U true CN202721120U (en) 2013-02-06

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112271172A (en) * 2020-07-29 2021-01-26 深圳市聚飞光电股份有限公司 LED (light-emitting diode) luminous piece and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112271172A (en) * 2020-07-29 2021-01-26 深圳市聚飞光电股份有限公司 LED (light-emitting diode) luminous piece and manufacturing method thereof

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Granted publication date: 20130206