CN202662577U

CN202662577U - Wafer chip mounter

Info

Publication number: CN202662577U
Application number: CN 201220269074
Authority: CN
Inventors: 廖明俊; 赵亮; 孙俊杰; 蒋秦苏
Original assignee: Siliconware Technology SuZhou Co Ltd
Current assignee: Siliconware Technology SuZhou Co Ltd
Priority date: 2012-06-08
Filing date: 2012-06-08
Publication date: 2013-01-09
Anticipated expiration: 2022-06-08

Abstract

The utility model provides a wafer chip mounter, which comprises a wafer storage mechanism, a wafer transferring mechanism, a wafer chip mounting mechanism and a wafer conveying mechanism, wherein the wafer storage mechanism comprises a wafer box, the wafer transferring mechanism comprises a metal basket, the wafer chip mounting mechanism comprises a machine table, an iron ring conveying device, an iron ring and a film pasting rolling wheel, the iron ring conveying device is arranged on the machine table, and an ion gun is arranged above the metal basket. The wafer chip mounter has the main beneficial effect that the generation of the risk of wafer scrap caused by wafer chip circuit breakdown through static electricity generated when a wafer leaves away from the wafer box to ascend and a protecting film arranged at the front side of the wafer is uncovered is avoided.

Description

The wafer chip mounter

Technical field

The utility model relates to a kind of wafer chip mounter, especially a kind of wafer chip mounter that is applicable to the wafer manufacturing in the semiconductor packaging process process.

Background technology

Semiconductor package process is generally: cutting crystal wafer, and wafer is cut into little wafer by behind the scribing process; Sticking brilliant, the wafer of well cutting is mounted on corresponding substrate (lead frame) frame with glue; Bonding wire or plant ball, bonding wire is to utilize ultra-fine metal, such as gold, silver, copper, aluminum conductor or electroconductive resin the bond pad of wafer is connected to the respective pins of substrate, planting ball is that soldered ball is realized being connected by high-temperature soldering with the substrate weld pad; Zinc-plated, with the ball surface coverage scolding tin of pin or implantation; Lettering is stamped the information such as model, date of manufacture, lot number at device surface; Detect the electrical property of test products.Wherein, when the wafer finished product dispatched from the factory, one deck protection glued membrane can be posted in its front, is convenient at storing wafer.And cutting crystal wafer needs with blue film or UV film before and wafer rear is pasted together and be fixed into one with framework, is convenient to the cutting of wafer.Present prior art typically uses chip mounter wafer is carried out pad pasting; in the technical process; when wafer is taken out wish to its pad pasting from wafer cassette; wafer leaves the wafer cassette building up transient can produce stronger static; equally also can produce static when the diaphragm of opening wafer frontside enters next processing procedure, said process has electrostatic breakdown chip wafer circuit to cause the risk of wafer loss to occur.

The utility model content

The purpose of this utility model provides a kind of wafer chip mounter that addresses the above problem.

The purpose of this utility model is achieved through the following technical solutions:

A kind of wafer chip mounter, comprise wafer holding structure, wafer transfer mechanism, wafer plaster mechanism and wafer connecting gear, described wafer holding structure comprises a wafer cassette, described wafer transfer mechanism comprises a metal hand basket, described wafer plaster mechanism comprises board, is arranged on iron ring conveyer, iron ring and pad pasting roller on the described board, is provided with ion gun above described metal hand basket.

Preferably, described ion gun is the seven apertures in the human head ion wind gun.

Preferably, described ion gun is along with corresponding movement is done in the movement of described metal hand basket.

Preferably, described metal hand basket is the annular metal vacuum cup.

Preferably, iron ring framework conveyer is the clamp device of a pair of symmetrical setting.

The beneficial effects of the utility model are mainly reflected in: the electrostatic breakdown chip wafer circuit of avoiding wafer to leave wafer cassette building up transient and the diaphragm moment generation of opening wafer frontside causes the risk of wafer loss to occur.

Description of drawings

Below in conjunction with accompanying drawing technical solutions of the utility model are described further:

Fig. 1 is the structural representation of the utility model wafer chip mounter.

Wherein

1	The metal hand basket	2	The iron ring framework	3	Board
						4	Iron ring framework conveyer	5	Ion gun	6	Wafer

Embodiment

See also Fig. 1, a kind of wafer chip mounter of the present utility model, comprise wafer cassette, metal hand basket 1, board 3, be arranged on iron ring framework conveyer 4, iron ring framework 2, coat peeling unit, pad pasting roller and film cutter sweep on the described board, the top of metal hand basket 1 is provided with ion gun 5.The ion gun 5 that present embodiment adopts is the seven apertures in the human head ion wind gun, and employed metal hand basket 1 is the annular metal vacuum cup.

During use procedure, at first iron ring framework conveyer 4 is sent to destination locations place on the board 3 with iron ring framework 2, then metal hand basket 1 moves to the wafer cassette top, and the suction by its vacuum cup sucks the back side of wafer to be processed 6 and move upward, wafer 6 is taken out from wafer cassette.Ion gun 5 is also in running order and move along with the movement of metal hand basket 1 during metal hand basket 1 work, ion gun 5 produces a large amount of air mass with positive and negative charge, the compressed gas of these air mass blows out at a high speed, with leave on the wafer wafer cassette building up transient with charging neutrality fall, eliminate the static on the wafer, the high speed compression gas that ion gun 5 produces also can blow away the obstinate laying dust above the object.When metal hand basket 1 wafer 6 is moved to destination locations be iron ring framework 2 directly over the time, wafer 6 is placed position in the circle of iron ring frameworks 2, the face down of glued membrane is posted up in wafer 6 back sides.Followed by the pad pasting roller blue film is tiled on wafer 6 and the iron ring framework 2, makes the back side of wafer 6 be attached on the blue film, blue film is fixed on the iron ring framework 2, the three namely is fixed together.Unnecessary blue membranectomy is torn according to the size of iron ring framework 2 with the caudacoria cutter sweep, wafer paster process is finished.Last coat peeling unit tears the glued membrane in wafer 6 fronts, and this moment, ion gun 5 was in running order, with glued membrane leave on the wafer 6 moment wafer 6 with charging neutrality fall, eliminate the static on the wafer, the wafer that paster is finished enters next processing procedure.

The utility model still has multiple concrete execution mode, and all employings are equal to replacement or equivalent transformation and all technical schemes of forming, all drop within the claimed scope of the utility model.

Claims

1. wafer chip mounter, comprise wafer (6), wafer holding structure, wafer transfer mechanism, wafer plaster mechanism and wafer connecting gear, described wafer holding structure comprises a wafer cassette, described wafer transfer mechanism comprises a metal hand basket (1), described wafer plaster mechanism comprises board (3), is arranged on iron ring framework conveyer (4), iron ring framework (2) and pad pasting roller on the described board (3), and it is characterized in that: the top at described metal hand basket (1) is provided with ion gun.

2. wafer chip mounter according to claim 1 is characterized in that: described ion gun (5) is the seven apertures in the human head ion wind gun.

3. wafer chip mounter according to claim 2, it is characterized in that: described ion gun (5) is along with corresponding movement is done in the movement of described metal hand basket (1).

4. wafer chip mounter according to claim 3, it is characterized in that: described metal hand basket (1) is the annular metal vacuum cup.

5. wafer chip mounter according to claim 4, it is characterized in that: described iron ring framework conveyer (4) is the clamp device of a pair of symmetrical setting.