CN202603030U

CN202603030U - Copper foil bubble improvement PCB (printed circuit board)

Info

Publication number: CN202603030U
Application number: CN 201220088719
Authority: CN
Inventors: 陈定红
Original assignee: CHANGZHOU HAIHONG ELECTRONICS CO LTD
Current assignee: CHANGZHOU HAIHONG ELECTRONICS CO LTD
Priority date: 2012-03-09
Filing date: 2012-03-09
Publication date: 2012-12-12
Anticipated expiration: 2022-03-09

Abstract

The utility model discloses a copper foil bubble improvement PCB (printed circuit board), which comprises a body, wherein the body is provided with a plurality of air holes, and the air holes are of a grid structure. As PCB lines are provided with a regular window or the grid structure, the copper foil bubble improvement PCB not only strengthens the radiating performance, but also can protect working parts, thereby improving the overall working performance and the safety performance in use.

Description

Improve the pcb board of Copper Foil bubble

Technical field

The utility model relates to pcb board commonly used on the electronic equipment, relates in particular to a kind of pcb board that improves the Copper Foil bubble.

Background technology

Along with the develop rapidly of electron trade, the trend of electronic product microminiaturization is obvious day by day, and a pcb board is except fixing various little electronic components, and its major function provides being electrically connected each other of various electronic components in addition.Along with the development of information technology, electronic equipment also becomes increasingly complex, and the part that needs is more and more, and circuit and part on the pcb board are also more and more intensive.In the pcb board manufacturing; Pcb board is heat insulation by insulation, also unbending material constitutes substrate, and the tiny line material that can see on the surface is a Copper Foil, and Copper Foil is to cover on the whole plate originally; Part is etched and disposes in manufacture process; The part that stays has just become netted tiny circuit, and these circuits are known as lead, and is used to provide the circuit of part on the pcb board to connect.

The part pcb board is behind the dress complete machine, and the heat that sends down in working order is bigger, and the complete machine service behaviour property this state under causes the quality of product to descend to relatively poor and fail safe is lower, keeps in repair morely, and pcb board itself also is prone to cause and hinders bad phenomenon such as welding foaming.

The utility model content

The purpose of the utility model is the problem that solves above-mentioned existence, provides a kind of thermal diffusivity good, can control the pcb board that improves the Copper Foil foaming that resistance solder paste China ink bubbles.

The purpose of the utility model realizes as follows: a kind of pcb board that improves the Copper Foil foaming, have body, and have some air-vents on the said body.

Saying further, said air-vent are fenestral fabric.

Saying further, said air-vent are the borehole structure that is equally spaced.

The advantage of the utility model: because the pcb board lines have had rule window or fenestral fabric, not only strengthened heat dispersion and can also protect working part, improved the service behaviour of complete machine and the security performance of use.

Description of drawings

For the content that makes the utility model is expressly understood more easily,, the utility model is done further detailed explanation, wherein below according to specific embodiment and combine accompanying drawing

Fig. 1 is the utility model structural representation;

Fig. 2 is the structural representation of embodiment 2;

Reference numeral: 1, body, 2, air-vent.

Embodiment:

Embodiment 1

See shown in Figure 1ly, a kind ofly improve the pcb board that Copper Foil bubbles, have on the body 1 said body (1) and have some air-vents 2, said air-vent 2 is a fenestral fabric.

Embodiment 2

See shown in Figure 2ly, a kind ofly improve the pcb board that Copper Foil bubbles, have on the body 1 said body (1) and have some air-vents 2, the borehole structure of said air-vent 2 for being equally spaced.The place detains system for the large tracts of land Copper Foil, is simultaneously with its etching in the invalid Copper Foil operation of etching, need not to increase operation like this.After the equipment operate as normal, can reduce temperature, can not take place to strengthen the performance of each element owing to the excessive bad phenomenon such as green oil foaming that cause of heat.

Above-described specific embodiment; Purpose, technical scheme and beneficial effect to the utility model have carried out further explain, it should be understood that the above is merely the specific embodiment of the utility model; Be not limited to the utility model; All within the spirit and principle of the utility model, any modification of being made, be equal to replacement, improvement etc., all should be included within the protection range of the utility model.

Claims

1. a pcb board that improves the Copper Foil bubble has body (1), it is characterized in that: have some air-vents (2) on the said body (1).

2. according to the said pcb board that improves the Copper Foil bubble of claim 1, it is characterized in that: said air-vent (2) is a fenestral fabric.

3. according to the said pcb board that improves the Copper Foil bubble of claim 1, it is characterized in that: the borehole structure of said air-vent (2) for being equally spaced.