CN203618209U - High frequency, high speed printing circuit board - Google Patents
High frequency, high speed printing circuit board Download PDFInfo
- Publication number
- CN203618209U CN203618209U CN201320585366.0U CN201320585366U CN203618209U CN 203618209 U CN203618209 U CN 203618209U CN 201320585366 U CN201320585366 U CN 201320585366U CN 203618209 U CN203618209 U CN 203618209U
- Authority
- CN
- China
- Prior art keywords
- wiring board
- printed wiring
- high frequency
- high speed
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Manufacturing Of Printed Wiring (AREA)
Abstract
The utility model discloses a high frequency, high speed printing circuit board, which comprises a printing circuit board; a polytetrafluoroethylene material layer is set at the printing circuit board where is exposed to the air; a set of or a sheet of laser boring drilling belt is set on the polytetrafluoroethylene material layer; the distance from the hole center of the drilling belt to the hole center is 0.2mm; and the size of the drilling belt aperture is 0.3mm. The high frequency, high speed printing circuit board provided by the utility model solves the problem of abnormal shedding of a solder mask layer of the high frequency, high speed printing circuit board made of polytetrafluoroethylene material, so that the reliability of the printing circuit board can be improved.
Description
Technical field
The utility model relates to printed wiring board, specifically refers to a kind of high frequency, high speed printed wiring board.
Background technology
The high frequency, the high speed printed wiring board that adopt polytetrafluoroethylmaterial material to make, due to properties of materials, material is exposed there will be welding resistance ink and material adhesive force not and solder mask easily comes off in air, occurs that product needed that solder mask comes off is done over again even to scrap.
Utility model content
The purpose of this utility model is to provide and a kind ofly solves exposed aerial polytetrafluoroethylmaterial material in printed wiring board and easily occur high high frequency, the high speed printed wiring board of problem, reliability that solder mask drops.
To achieve these goals, the utility model is designed a kind of high frequency, high speed printed wiring board, it comprises printed wiring board, is provided with polytetrafluoroethylmaterial material layer in the exposed aerial part of printed wiring board, is provided with drilling a set of or a slice laser drill on polytetrafluoroethylmaterial material layer.
Described drilling Kong center and hole center distance are 0.2mm.
Described drilling pore size is 0.3mm.
The utility model high frequency, high speed printed wiring board can solve the high frequency that adopts polytetrafluoroethylmaterial material to make, the solder mask of high speed printed wiring board comes off extremely, and the reliability that printed wiring board uses is improved.
accompanying drawing explanation:
Fig. 1 is the structural representation of the utility model high frequency, high speed printed wiring board.
Embodiment:
For the ease of those skilled in the art's understanding, below in conjunction with specific embodiment and accompanying drawing, structural principle of the present utility model is described in further detail.
As shown in Figure 1, a kind of high frequency, high speed printed wiring board, it comprises printed wiring board, is provided with polytetrafluoroethylmaterial material layer in the exposed aerial part of printed wiring board, is provided with the drilling 1 of a set of or a slice laser drill on polytetrafluoroethylmaterial material layer.Described drilling Kong center and hole center distance are 0.2mm.Described drilling pore size is 0.3mm.
The utility model high frequency, high speed printed wiring board adopt on the exposed aerial polytetrafluoroethylmaterial material of printed wiring board surface implements laser drill operation by certain drilling parameter, completes the printed wiring board rough surface of laser drill operation.
The operation principle of the utility model high frequency, high speed printed wiring board: the printed wiring board in existing high frequency, high speed increases a laser drill flow process, realize the physics alligatoring of exposed aerial polytetrafluoroethylmaterial material in printed wiring board, thereby reach prevent that solder mask from coming off abnormal.
The utility model high frequency, the concrete manufacturing process of high speed printed wiring board are as follows:
1, according to the design drawing of printed wiring panel products, at the exposed material area of printed wiring board, the drilling that completes a set of laser drill is made, and drilling is made and required to make according to 2.4-1;
2, according to normal laser drill operation, adopt suitable parameter, form at the exposed material surface of printed wiring board micro-hole that the degree of depth differs;
3, complete the making of whole printed wiring board by existing wiring board work flow.
Foregoing, is only preferred embodiment of the present utility model, and not for limiting embodiment of the present utility model, those skilled in the art are according to design of the present utility model, and the appropriate adaptation of having done or modification, all should be within protection range of the present utility model.
Claims (3)
1. a high frequency, high speed printed wiring board, comprise printed wiring board, be provided with polytetrafluoroethylmaterial material layer in the exposed aerial part of printed wiring board, it is characterized in that: on polytetrafluoroethylmaterial material layer, be provided with the drilling (1) of a set of or a slice laser drill.
2. high frequency according to claim 1, high speed printed wiring board, is characterized in that: described drilling Kong center and hole center distance are 0.2mm.
3. high frequency according to claim 2, high speed printed wiring board, is characterized in that: described drilling pore size is 0.3mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320585366.0U CN203618209U (en) | 2013-09-23 | 2013-09-23 | High frequency, high speed printing circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320585366.0U CN203618209U (en) | 2013-09-23 | 2013-09-23 | High frequency, high speed printing circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203618209U true CN203618209U (en) | 2014-05-28 |
Family
ID=50770823
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320585366.0U Expired - Fee Related CN203618209U (en) | 2013-09-23 | 2013-09-23 | High frequency, high speed printing circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203618209U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104411095A (en) * | 2014-11-29 | 2015-03-11 | 惠州市金百泽电路科技有限公司 | Surface modification method used for improving binding force of polytef and solder resist ink |
| CN108650799A (en) * | 2018-06-29 | 2018-10-12 | 惠州市金百泽电路科技有限公司 | A kind of base material treatment method before PTFE planks welding resistance |
| CN111970815A (en) * | 2020-08-17 | 2020-11-20 | Oppo广东移动通信有限公司 | Circuit board, manufacturing method thereof and electronic equipment |
-
2013
- 2013-09-23 CN CN201320585366.0U patent/CN203618209U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104411095A (en) * | 2014-11-29 | 2015-03-11 | 惠州市金百泽电路科技有限公司 | Surface modification method used for improving binding force of polytef and solder resist ink |
| CN108650799A (en) * | 2018-06-29 | 2018-10-12 | 惠州市金百泽电路科技有限公司 | A kind of base material treatment method before PTFE planks welding resistance |
| CN111970815A (en) * | 2020-08-17 | 2020-11-20 | Oppo广东移动通信有限公司 | Circuit board, manufacturing method thereof and electronic equipment |
| CN111970815B (en) * | 2020-08-17 | 2021-07-27 | Oppo广东移动通信有限公司 | Circuit board, manufacturing method thereof and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140528 |