CN108650799A - A kind of base material treatment method before PTFE planks welding resistance - Google Patents
A kind of base material treatment method before PTFE planks welding resistance Download PDFInfo
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- CN108650799A CN108650799A CN201810700540.9A CN201810700540A CN108650799A CN 108650799 A CN108650799 A CN 108650799A CN 201810700540 A CN201810700540 A CN 201810700540A CN 108650799 A CN108650799 A CN 108650799A
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- ptfe
- base material
- planks
- welding resistance
- treatment method
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
Abstract
Base material treatment method before a kind of PTFE planks welding resistance of present invention offer, which is characterized in that include the following steps：S1.PTFE planks carry out overlay film protection after pattern transfer etching to part copper face and base material；S2. by using the base material of radium-shine laser treatment PTFE planks, make to handle subtle pit on the base material of PTFE plates.The present invention overcomes PTFE planks can not be stored for a long time after plasma treatment with copper face be corroded oxidation the problem of, it is abnormal to solve the problems, such as that PTFE planks combination force difference of the ink and base material of substrate location when welding resistance produces causes solder mask to fall off.
Description
Technical field
The invention belongs to wiring board processing technique fields, and in particular to a kind of base material treatment method before PTFE planks welding resistance.
Background technology
PTFE is the english abbreviation of polytetrafluoroethylene (PTFE), also known as Teflon, because with good weatherability, high insulation, height
Lubricate, do not adhere to, the good characteristics such as nonhazardous, being used to substitute common FR4 planks and extensive use, but with common FR4
It compares, PTFE planks are surface tension minimum in solid material, do not adhere to any substance, its friction coefficient pole of mechanical property
Small, only the 1/5 of polyethylene, this is the important feature of perfluorocarbon surface.Again since fluoro- carbon chain molecules intermolecular forces are extremely low, institute
There is non-stick with polytetrafluoroethylene (PTFE), welding resistance green oil is not easy to be attached to substrate surface in PCB production processes.
In existing known technology, the pre-treatment of PTFE plank welding resistances is all to use plasma treatment, increases base material plate face
Activity, but after being more than 8H for the resting period after plasma treatment the shortcomings that this processing, base material plate face loses activity again, need to do again
Plasma treatment, in plasma treatment process, the copper face on PTFE planks is corroded oxidation, and chemical pre-treatment is difficult to remove,
It is heterochromatic to easily cause welding resistance.
Invention content
In view of this, base material treatment method before a kind of PTFE planks welding resistance of present invention offer, the present invention overcomes PTFE plates
Material can not be stored for a long time after plasma treatment with copper face be corroded oxidation the problem of, solve PTFE planks welding resistance give birth to
The combination force difference of the ink and base material of substrate location causes solder mask to fall off abnormal problem when production.
The technical scheme is that：A kind of base material treatment method before PTFE planks welding resistance, which is characterized in that including following
Step：
S1. PTFE planks carry out overlay film protection after pattern transfer etching to part copper face and base material；
S2. by using the base material of radium-shine laser treatment PTFE planks, make to handle subtle pit on the base material of PTFE plates.
Further, the radium-shine laser treatment is CO2Any one of laser treatment, femtosecond laser processing.
Further, the CO2The machined parameters of laser treatment are：Marking delay 60-90 μ s, original walk step-length 18-28
Mm, original walk to be delayed 10-25 μ s, set step-length as 1-4 mm, frequency be 7000-17000 Hz, power 35-55%.
Further, the CO2The machined parameters of laser treatment are：40 μ s of marking delay, original walks 22 mm of step-length, original is walked
Be delayed 18 μ s, set step-length as 2mm, frequency be 9000 Hz, power 40%.
Further, the machined parameters of the femtosecond laser processing are：Centre wavelength is 800-1100nm, repetitive rate is
0.8-1.2kHz, pulse width 100-150fs, single pulse energy 2.5-4.5mJ, line spacing be 35-55 μm, laser pulse
Power 300-600mW.
Further, the machined parameters of the femtosecond laser processing are：Centre wavelength is 900nm, repetitive rate 1.0kHz,
Pulse width is 120fs, single pulse energy 3mJ, line spacing are 40 μm, laser pulse power 550mW.
In the present invention, PCB technology needs printing welding resistance to protect part copper face and base material after pattern transfer etching,
In welding resistance manufacturing process, because PTFE planks do not adhere to and minimum surface tension characteristics, the base material combination of welding resistance and PTFE plates
Force difference, the Promethean base material by using radium-shine laser treatment PTFE planks make to handle on the base material of PTFE plates subtle recessed
Hole, to increase PTFE plates base material roughness；Copper face by the PTFE plates after radium-shine laser treatment is unchanged, can be effective
Solve the problems, such as the copper face corrosion oxidation after plasma treatment；By the base material of the PTFE plates after radium-shine laser treatment to the storage period
No requirement (NR) requires to be lower, can be effectively improved bad caused by manufacturing parameter management and control is improper for the management and control of production process.
The method of the present invention effectively improves the resistance of PTFE plates by the processing method of the base material of PTFE plates before change welding resistance
Weldering falls off and copper face corrosion oxidation is asked, and by using the base material of radium-shine laser treatment PTFE plates, increases PTFE plate bases
The roughness of material, this increases increases to be permanent, is not required to because at the repetition plasma that the resting period is long or production process is done over again
Reason.
The beneficial effects of the present invention are：
1, the method for the present invention solves the problems, such as the welding resistance of PTFE planks and the combination force difference of base material；
2, the method for the present invention efficiently solves the problems, such as PTFE planks in the copper face corrosion oxidation exception after plasma treatment；
3, be more than the roughness after plasma treatment using the method treated PTFE plank substrate roughness, solder mask and
The binding force right side of base material and the effect of plasma treatment improve the quality that PTFE plates are produced in welding resistance.
Specific implementation mode
Technical scheme of the present invention is clearly and completely described below in conjunction with embodiment, it is clear that described reality
It is only a part of the embodiment of the present invention to apply example, instead of all the embodiments.
Embodiment 1
A kind of base material treatment method before PTFE planks welding resistance, which is characterized in that include the following steps：
S1. PTFE planks carry out overlay film protection after pattern transfer etching to part copper face and base material；
S2. by using the base material of radium-shine laser treatment PTFE planks, make to handle subtle pit on the base material of PTFE plates.
Further, the radium-shine laser treatment is CO2Laser treatment.
Further, the CO2The machined parameters of laser treatment are：40 μ s of marking delay, original walks 22 mm of step-length, original is walked
Be delayed 18 μ s, set step-length as 2mm, frequency be 9000 Hz, power 40%.
In the present invention, PCB technology needs printing welding resistance to protect part copper face and base material after pattern transfer etching,
In welding resistance manufacturing process, because PTFE planks do not adhere to and minimum surface tension characteristics, the base material combination of welding resistance and PTFE plates
Force difference, the Promethean base material by using radium-shine laser treatment PTFE planks make to handle on the base material of PTFE plates subtle recessed
Hole, to increase PTFE plates base material roughness；Copper face by the PTFE plates after radium-shine laser treatment is unchanged, can be effective
Solve the problems, such as the copper face corrosion oxidation after plasma treatment；By the base material of the PTFE plates after radium-shine laser treatment to the storage period
No requirement (NR) requires to be lower, can be effectively improved bad caused by manufacturing parameter management and control is improper for the management and control of production process.
Embodiment 2
A kind of base material treatment method before PTFE planks welding resistance, which is characterized in that include the following steps：
S1. PTFE planks carry out overlay film protection after pattern transfer etching to part copper face and base material；
S2. by using the base material of radium-shine laser treatment PTFE planks, make to handle subtle pit on the base material of PTFE plates.
Further, the radium-shine laser treatment is femtosecond laser processing.
Further, the machined parameters of the femtosecond laser processing are：Centre wavelength is 900nm, repetitive rate 1.0kHz,
Pulse width is 120fs, single pulse energy 3mJ, line spacing are 40 μm, laser pulse power 550mW.
In the present invention, PCB technology needs printing welding resistance to protect part copper face and base material after pattern transfer etching,
In welding resistance manufacturing process, because PTFE planks do not adhere to and minimum surface tension characteristics, the base material combination of welding resistance and PTFE plates
Force difference, the Promethean base material by using radium-shine laser treatment PTFE planks make to handle on the base material of PTFE plates subtle recessed
Hole, to increase PTFE plates base material roughness；Copper face by the PTFE plates after radium-shine laser treatment is unchanged, can be effective
Solve the problems, such as the copper face corrosion oxidation after plasma treatment；By the base material of the PTFE plates after radium-shine laser treatment to the storage period
No requirement (NR) requires to be lower, can be effectively improved bad caused by manufacturing parameter management and control is improper for the management and control of production process.
Embodiment 3
A kind of base material treatment method before PTFE planks welding resistance, which is characterized in that include the following steps：
S1. PTFE planks carry out overlay film protection after pattern transfer etching to part copper face and base material；
S2. by using the base material of radium-shine laser treatment PTFE planks, make to handle subtle pit on the base material of PTFE plates.
Further, the radium-shine laser treatment is CO2Laser treatment.
Further, the CO2The machined parameters of laser treatment are：60 μ s of marking delay, original walks 18 mm of step-length, original is walked
Be delayed 10 μ s, set step-length as 1mm, frequency be 7000 Hz, power 35%.
Embodiment 4
A kind of base material treatment method before PTFE planks welding resistance, which is characterized in that include the following steps：
S1. PTFE planks carry out overlay film protection after pattern transfer etching to part copper face and base material；
S2. by using the base material of radium-shine laser treatment PTFE planks, make to handle subtle pit on the base material of PTFE plates.
Further, the radium-shine laser treatment is CO2Laser treatment.
Further, the CO2The machined parameters of laser treatment are：90 μ s of marking delay, original walks 28 mm of step-length, original is walked
Be delayed 25 μ s, set step-length as 4 mm, frequency be 17000 Hz, power 55%.
Embodiment 5
A kind of base material treatment method before PTFE planks welding resistance, which is characterized in that include the following steps：
S1. PTFE planks carry out overlay film protection after pattern transfer etching to part copper face and base material；
S2. by using the base material of radium-shine laser treatment PTFE planks, make to handle subtle pit on the base material of PTFE plates.
Further, the radium-shine laser treatment is femtosecond laser processing.
Further, the machined parameters of the femtosecond laser processing are：Centre wavelength is 1100nm, repetitive rate is
1.2kHz, pulse width 150fs, single pulse energy 4.5mJ, line spacing be 55 μm, laser pulse power 600mW.
Embodiment 6
A kind of base material treatment method before PTFE planks welding resistance, which is characterized in that include the following steps：
S1. PTFE planks carry out overlay film protection after pattern transfer etching to part copper face and base material；
S2. by using the base material of radium-shine laser treatment PTFE planks, make to handle subtle pit on the base material of PTFE plates.
Further, the radium-shine laser treatment femtosecond laser processing.
Further, the machined parameters of the femtosecond laser processing are：Centre wavelength is 800nm, repetitive rate 0.8kHz,
Pulse width is 100fs, single pulse energy 2.5mJ, line spacing are 35 μm, laser pulse power 300mW.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case of without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Profit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent requirements of the claims
Variation is included within the present invention.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiment being appreciated that.It is noted that the technical characteristic not being described in detail in the present invention, can pass through this
Field any prior art is realized.
Claims (6)
1. a kind of base material treatment method before PTFE planks welding resistance, which is characterized in that include the following steps：
S1. PTFE planks carry out overlay film protection after pattern transfer etching to part copper face and base material；
S2. by using the base material of radium-shine laser treatment PTFE planks, make to handle subtle pit on the base material of PTFE plates.
2. base material treatment method before a kind of PTFE planks welding resistance according to claim 1, which is characterized in that described radium-shine sharp
Light processing is any one of CO2 laser treatments, femtosecond laser processing.
3. base material treatment method before a kind of PTFE planks welding resistance according to claim 2, which is characterized in that the CO2 swashs
The machined parameters of light processing are：Marking delay 60-90 μ s, original walk step-length 18-28 mm, original is walked to be delayed 10-25 μ s, setting step-length
It is 7000-17000 Hz for 1-4 mm, frequency, power 35-55%.
4. base material treatment method before a kind of PTFE planks welding resistance according to claim 3, the processing of the CO2 laser treatments
Parameter is：Marking be delayed 40 μ s, original walk 22 mm of step-length, original walks 18 μ s of delay, set step-length as 2mm, frequency be 9000 Hz,
Power is 40%.
5. base material treatment method before a kind of PTFE planks welding resistance according to claim 2, the femtosecond laser processing adds
Work parameter is：Centre wavelength is 800-1100nm, repetitive rate 0.8-1.2kHz, pulse width 100-150fs, single pulse energy
Amount is 2.5-4.5mJ, line spacing is 35-55 μm, laser pulse power 300-600mW.
6. base material treatment method before a kind of PTFE planks welding resistance according to claim 5, the femtosecond laser processing adds
Work parameter is：Centre wavelength is 900nm, between repetitive rate 1.0kHz, pulse width 120fs, single pulse energy 3mJ, line
Away from for 40 μm, laser pulse power 550mW.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810700540.9A CN108650799A (en) | 2018-06-29 | 2018-06-29 | A kind of base material treatment method before PTFE planks welding resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810700540.9A CN108650799A (en) | 2018-06-29 | 2018-06-29 | A kind of base material treatment method before PTFE planks welding resistance |
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| CN108650799A true CN108650799A (en) | 2018-10-12 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113441836A (en) * | 2021-06-25 | 2021-09-28 | 德中（天津）技术发展股份有限公司 | Base material with high surface binding force and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080006605A1 (en) * | 2004-08-23 | 2008-01-10 | Mayo Uenoyama | Method of Manufacturing a Porous Resin Substrate Having Perforations and Method of Making a Porous Resin Substrate Including Perforations Having Electrically Conductive Wall Faces |
| CN203618209U (en) * | 2013-09-23 | 2014-05-28 | 惠州市金百泽电路科技有限公司 | High frequency, high speed printing circuit board |
| CN104411095A (en) * | 2014-11-29 | 2015-03-11 | 惠州市金百泽电路科技有限公司 | Surface modification method used for improving binding force of polytef and solder resist ink |
-
2018
- 2018-06-29 CN CN201810700540.9A patent/CN108650799A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080006605A1 (en) * | 2004-08-23 | 2008-01-10 | Mayo Uenoyama | Method of Manufacturing a Porous Resin Substrate Having Perforations and Method of Making a Porous Resin Substrate Including Perforations Having Electrically Conductive Wall Faces |
| CN203618209U (en) * | 2013-09-23 | 2014-05-28 | 惠州市金百泽电路科技有限公司 | High frequency, high speed printing circuit board |
| CN104411095A (en) * | 2014-11-29 | 2015-03-11 | 惠州市金百泽电路科技有限公司 | Surface modification method used for improving binding force of polytef and solder resist ink |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113441836A (en) * | 2021-06-25 | 2021-09-28 | 德中（天津）技术发展股份有限公司 | Base material with high surface binding force and preparation method thereof |
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Application publication date: 20181012 |