CN203405669U - Film capable of achieving black wafer direct alignment - Google Patents
Film capable of achieving black wafer direct alignment Download PDFInfo
- Publication number
- CN203405669U CN203405669U CN201320562810.7U CN201320562810U CN203405669U CN 203405669 U CN203405669 U CN 203405669U CN 201320562810 U CN201320562810 U CN 201320562810U CN 203405669 U CN203405669 U CN 203405669U
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- China
- Prior art keywords
- film
- circuit
- black
- alignment
- welding resistance
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- Expired - Fee Related
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- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The utility model discloses a film capable of achieving black wafer direct alignment. The film comprises a circuit black wafer film, a plurality of sets of light-transmission circuit alignment points, circuit detection points, solder resist alignment targets and solder resist detection targets are added on the periphery of the circuit black wafer film, the circuit alignment points and the circuit detection points are round, and the solder resist alignment targets are square. According to the film capable of achieving the black wafer direct alignment, the production operation can be simplified, the material consumption cost per unit can be reduced, the existing palm film alignment mode in the circuit and solder resist working procedure can be removed, the black wafer alignment can be directly adopted, and therefore a yellow film is not required to be copied.
Description
Technical field
The utility model relates to printed circuit board and makes field, is specifically related to a kind of film of realizing the direct contraposition of black-film.
Background technology
PCB model manufacturing enterprise is because of various a small amount of feature, in exposure operation, be difficult to use completely the comprehensive instead of manual contraposition of CCD contraposition exposure machine, the brown sheet film aligning of existing employing, copy brown sheet film process and easily produce the bad problems of quality such as the red point of the film, the more difficult to govern control of man efficiency and material consumption, cancel the brown sheet film and directly adopt black-film film aligning, difficult point is that the black-film film is light tight, affected by viewpoint and cannot guarantee its contraposition precision when circuit and welding resistance contraposition.
Utility model content
The problem that the utility model need solve be to provide a kind of contraposition convenient, accurately, directly adopt black-film film aligning, do not need to copy again the film of pornographic movie film flow process.
To achieve these goals, the utility model is designed a kind of film of realizing the direct contraposition of black-film, it comprises the circuit black-film film, and the circuit black-film film increases circuit loci and circuit check point, welding resistance alignment target and the welding resistance check target of many group printing opacities in surrounding.
The large 0.1mm of registration holes that described circuit loci is more corresponding than wiring board.
Described circuit loci and circuit check point are circular.
Described welding resistance alignment target is square.
The large 0.125mm in welding resistance hole that described welding resistance alignment target is more corresponding than wiring board.
The high precision printing opacity loci that the film that the utility model can be realized the direct contraposition of black-film increases particular design on the black-film film can realize the black-film film and can be used in artificial contraposition, can meet aligning accuracy requirement, can realize energy-conserving and environment-protective, reduce supplies consumption.
accompanying drawing explanation:
Fig. 1 is the structural representation that the utility model can be realized the film of the direct contraposition of black-film;
Fig. 2 is the structure for amplifying schematic diagram of A portion in Fig. 1.
Embodiment
For the ease of those skilled in the art's understanding, below in conjunction with specific embodiment and accompanying drawing, structural principle of the present utility model is described in further detail.
As shown in Figure 1 and Figure 2, a kind of film of realizing the direct contraposition of black-film, it comprises the circuit black-film film 1, the circuit black-film film 1 increases circuit loci 2 and circuit check point 3, welding resistance alignment target 4 and the welding resistance check target 5 of many group printing opacities in surrounding.
As shown in Figure 2, the described circuit loci 2 registration holes large 0.1mm more corresponding than wiring board.
As shown in Figure 2, described circuit loci 2 and circuit check point 3 are round dot.
As shown in Figure 2, described welding resistance alignment target 4 is square.
As shown in Figure 2, the described welding resistance alignment target 4 welding resistance hole large 0.125mm more corresponding than wiring board.
Application the utility model can be realized the case of the film of the direct contraposition of black-film: centre and surrounding at circuit board edge increase 10-12 group registration holes, every group is bored four pitchs of holes is 1.5mm, aperture reaches the 1.0mm circuit black-film film after requiring to electroplate and draws out 2 than (negative film) circuit loci 2 of the monolateral large 0.1mm in 1.0mm hole in corresponding drill hole, two other is circuit check point 3, one of them designs the gear point than the 1.0 monolateral little 0.05mm in hole, the gear point of the ratio 1.0 monolateral large 0.125mm in hole in hole.In corresponding drill hole, draw out 2 than (negative film) diaphanous spot of the monolateral large 0.1mm in 1.0mm hole, other 2 is inspection hole, wherein 1 is designed the gear point than the 1.0 monolateral little 0.05mm in hole in hole, the gear point of the ratio 1.0 monolateral large 0.1mm in hole, on the basis of the circuit black-film film, first form welding resistance alignment target, the welding resistance alignment target side of being target, on the basis of the circuit black-film film, becoming in advance two square target diameters is that 0.15mm spacing is 0.15mm, in the middle of two square targets, a round target diameter of design is 0.15mm, on the welding resistance black-film film, draw out than (negative film) diaphanous spot (adopting during welding resistance contraposition) of a square target of correspondence and the large 0.125mm of round target, (negative film) diaphanous spot that another side's target place draws out than its large 0.05mm (adopts during welding resistance check.
Above-mentioned embodiment is preferred embodiment of the present utility model; can not limit with the utility model; other any change that does not deviate from the technical solution of the utility model and make or other equivalent substitute modes, within being all included in protection domain of the present utility model.
Claims (5)
1. the film that can realize the direct contraposition of black-film, comprise the circuit black-film film (1), it is characterized in that: the circuit black-film film (1) increases circuit loci (2) and circuit check point (3), welding resistance alignment target (4) and the welding resistance check target (5) of many group printing opacities in surrounding.
2. the film of realizing the direct contraposition of black-film according to claim 1, is characterized in that: the large 0.1mm of registration holes that described circuit loci (2) is more corresponding than wiring board.
3. the film of realizing the direct contraposition of black-film according to claim 2, is characterized in that: described circuit loci (2) and circuit check point (3) are round dot.
4. the film of realizing the direct contraposition of black-film according to claim 3, is characterized in that: described welding resistance alignment target (4) is for square.
5. the film of realizing the direct contraposition of black-film according to claim 4, is characterized in that: the large 0.125mm in welding resistance hole that described welding resistance alignment target (4) is more corresponding than wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320562810.7U CN203405669U (en) | 2013-09-11 | 2013-09-11 | Film capable of achieving black wafer direct alignment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320562810.7U CN203405669U (en) | 2013-09-11 | 2013-09-11 | Film capable of achieving black wafer direct alignment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203405669U true CN203405669U (en) | 2014-01-22 |
Family
ID=49941599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320562810.7U Expired - Fee Related CN203405669U (en) | 2013-09-11 | 2013-09-11 | Film capable of achieving black wafer direct alignment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203405669U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109104822A (en) * | 2018-11-15 | 2018-12-28 | 梅州市志浩电子科技有限公司 | The alignment method of the film and exposure machine |
| CN110113885A (en) * | 2019-06-05 | 2019-08-09 | 景旺电子科技(龙川)有限公司 | A kind of FPC method for manufacturing circuit board |
-
2013
- 2013-09-11 CN CN201320562810.7U patent/CN203405669U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109104822A (en) * | 2018-11-15 | 2018-12-28 | 梅州市志浩电子科技有限公司 | The alignment method of the film and exposure machine |
| CN110113885A (en) * | 2019-06-05 | 2019-08-09 | 景旺电子科技(龙川)有限公司 | A kind of FPC method for manufacturing circuit board |
| CN110113885B (en) * | 2019-06-05 | 2021-09-07 | 景旺电子科技(龙川)有限公司 | FPC circuit board manufacturing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140122 Termination date: 20180911 |