CN202522250U - Assembly module and ultrasonic sensing device - Google Patents
Assembly module and ultrasonic sensing device Download PDFInfo
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- CN202522250U CN202522250U CN2012200907424U CN201220090742U CN202522250U CN 202522250 U CN202522250 U CN 202522250U CN 2012200907424 U CN2012200907424 U CN 2012200907424U CN 201220090742 U CN201220090742 U CN 201220090742U CN 202522250 U CN202522250 U CN 202522250U
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- 239000000758 substrate Substances 0.000 claims abstract description 40
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 20
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
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Abstract
An ultrasonic sensing device is electrically connected with an external circuit and comprises a shell, a sensing unit and an assembling module. The shell comprises a bottom wall and a surrounding wall, and the bottom wall and the surrounding wall define a containing groove. The sensing unit is arranged on the bottom wall and can receive the sound wave to vibrate and send out a sensing signal. The assembly module is arranged in the containing groove and spaced from the sensing unit, and comprises a flexible base, wherein the base is provided with a substrate, and the substrate is sunken downwards from the top surface to form a groove; the circuit unit is arranged in the groove and receives the sensing signal and transmits the sensing signal to the external circuit; and a buffer unit capable of absorbing the shock wave, which is arranged on the bottom surface of the substrate and close to the sensing unit. The arrangement of the assembly module can reduce the difficulty degree of the ultrasonic sensing device in manufacturing.
Description
Technical field
The utility model relates to a kind of sensing apparatus, particularly relates to a kind of ultrasonic sensing device.
Background technology
Ultrasonic sensing device is hyperacoustic emission of utilization and acceptance, to measure the sensing apparatus of physical quantitys such as object distance, translational speed.Common ultrasonic sensing device is divided into open and closed, and open ultrasonic sensing device comprises a untight metal shell and usually and is placed in the sensing sheet (piezoelectric patches of for example processing with piezoelectric) in this metal shell; The design of closed then is installed in the sensing sheet and closes in the close metal shell.The former has higher sensitivity, and the latter is applicable to open outdoor environment.
No. 5987992 patent of U.S.'s notification number discloses a kind of closed ultrasound sensors that can be applicable to automobile-used radar for backing car, and this closed ultrasound sensors comprises the members such as sound-absorbing sheet and a packing colloid that piezoelectric patches, that a hollow housing, is installed in the inner bottom surface of this housing is positioned at this piezoelectric patches top.
But each micro parts sticked together, be provided with to this kind enclosure-type ultrasound sensors must in the narrow space in housing one by one when assembling, and increase the degree of difficulty in the assembling.
Summary of the invention
The purpose of the utility model is to provide a kind of assembling module of simplifying the manufacture process of ultrasonic sensing device.
The assembling module of the utility model ultrasonic sensing device is placed in the hollow housing of a ultrasonic sensing device, and is electrically connected on one and can receives sound wave and vibrate and send the sensing cell of a sensing signal.This assembling module comprises a flexible pedestal, a circuit unit and a buffer cell.This pedestal comprises a substrate, and this substrate is recessed to form a groove downwards from end face, and said sensing cell is positioned at this pedestal below.This circuit unit is arranged in this groove, and is electrically connected on this sensing cell and receives this sensing signal.This buffer cell can absorb seismic wave, is arranged at contiguous this sensing cell place, bottom surface of this substrate.
Preferably, this pedestal also comprises at least one locating piece that is outwards protruded out by this substrate top surface, and the internal face of this housing is recessed to form a locating slot, and is ccontaining for this locating piece.
Preferably, this substrate forms the breach of a depression from outer peripheral edges, and this buffer cell forms the groove that at least one pair of should breach.
Preferably; This pedestal also comprises respectively from these substrate two opposition sides to the two side that extends below; Said sidewall respectively forms at least one limiting section away from this substrate place, and this substrate, said sidewall and said limiting section cooperatively interact and define a room, and this room supplies this buffer cell ccontaining.
Another purpose of the utility model is providing a kind of ultrasonic sensing device that uses aforementioned assembling module.
So the utility model ultrasound wave sensing module is electrically connected on an external circuit, and comprise a housing, a sensing cell and an assembling module.
This housing comprises a diapire and from the upwardly extending surrounding wall of these diapire outer peripheral edges, and this diapire and this surrounding wall cooperatively interact and define a storage tank.This sensing cell is arranged at the end face of this diapire, and can receive sound wave and vibrate and send a sensing signal.This assembling module is arranged at this storage tank and is interval in this sensing cell, and comprises a flexible pedestal, a circuit unit and a buffer cell.This pedestal has a substrate, and this substrate is recessed to form a groove downwards from end face.This circuit unit is arranged in this groove, and is electrically connected on this sensing cell and receives this sensing signal, and is electrically connected on this external circuit and this sensing signal is transferred to this external circuit.This buffer cell can absorb seismic wave, and is arranged at contiguous this sensing cell place, bottom surface of this substrate.
Preferably, this pedestal also has at least one locating piece that is outwards protruded out by this substrate top surface, and this storage tank comprises the locating slot that the internal face by this surrounding wall is recessed to form, and is ccontaining for this locating piece.
Preferably; This ultrasonic sensors also comprises one first lead; This pedestal forms the breach of a depression from outer peripheral edges; This buffer cell forms the groove that at least one pair of should breach, and this first lead is arranged in this breach and this groove, and is electrically connected this circuit unit and this sensing cell to transmit this sensing signal.
Preferably, this ultrasonic sensors also comprises one second lead and a connecting line, and this second lead is electrically connected this circuit unit and this housing, and this connecting line is electrically connected this circuit unit and this external circuit.
Preferably, this ultrasonic sensors also comprises a seal, and the sealing body is filled in this storage tank and coats this sensing cell and this assembling module.
Preferably; This pedestal also has respectively from these substrate two opposition sides to the two side that extends below; Said sidewall respectively forms at least one limiting section away from this substrate place, and this substrate, said sidewall and said limiting section cooperatively interact and define a room, and this room supplies this buffer cell ccontaining.
The beneficial effect of the utility model is: assembling this assembling module in advance, can reduce follow-up in this narrow housing the step of parts, and the degree of difficulty of reduction manufacture process.
Description of drawings
Fig. 1 is a three-dimensional exploded view, and the preferred embodiment of the utility model ultrasonic sensing device is described;
Fig. 2 is the three-dimensional combination figure of the preferred embodiment;
Fig. 3 is the top view of the preferred embodiment;
Fig. 4 is the sectional view along the IV-IV direction of Fig. 3;
Fig. 5 is a three-dimensional combination figure, and the form of implementation of an assembling module is described;
Fig. 6 is the three-dimensional exploded view of this assembling module;
Fig. 7 is the sectional view along the VII-VII direction of Fig. 5;
Fig. 8 is the manufacturing flow chart of this ultrasonic sensing device;
Fig. 9 is a synoptic diagram, explains a sensing cell, one first lead and one second lead are assembled in a housing;
Figure 10 is a synoptic diagram, and explanation should be assembled module and is installed in this housing; And
Figure 11 is a synoptic diagram, explains a connecting line is connected in a circuit unit.
Embodiment
Below in conjunction with accompanying drawing and embodiment the utility model is elaborated, the explanation of the following example is graphic with reference to what add, is used for the specific embodiment that illustration the utility model can be used for implementing.The direction term that the utility model is mentioned, for example " on ", D score, " preceding ", " back ", " left side ", " right side " etc., only be direction with reference to annexed drawings.Therefore, the direction term of use is to be used for explanation, but not is used for limiting the content of the utility model.
Consult Fig. 1, Fig. 2 and Fig. 3 preferred embodiment, can be used for the equidistant measurement system of radar for backing car of vehicle for the utility model ultrasonic sensing device.Ultrasonic sensing device is electrically connected on one and is used for the external circuit (figure does not draw) of processing signals, and comprises a hollow housing 1, a sensing cell 2, an assembling module 3, one first lead 4, one second lead 5, a connecting line 6 and a seal 7.
Consult Fig. 1, Fig. 2 and Fig. 4, housing 1 generally is short cylinder, and is processed by metal material (like aluminum metal).Housing 1 comprises that a diapire 11 and is from the upwardly extending surrounding wall 12 of diapire 11 outer peripheral edges.Diapire 11 and surrounding wall 12 cooperatively interact and define a storage tank 13, and storage tank 13 comprises the locating slot 121 that the front side internal face by surrounding wall 12 is recessed to form.
Sensing cell 2 generally is the disk shape, is arranged at the end face of diapire 11.Sensing cell 2 is processed by piezoelectric, can produce vibration and form ultrasound wave after receiving electric energy, also can receive acoustic vibration and sends a sensing signal.
Assembling module 3 is arranged at storage tank 13, and comprises pedestal 31, a circuit unit 32 and a buffer cell 33 of a flexible.
Consult Fig. 5, Fig. 6 and Fig. 7, pedestal 31 is processed by pliability material (like silica gel), and has a substrate 311, two sidewalls 312 and two locating pieces 313.Substrate 311 is recessed to form a groove 315 downwards from end face, and forms the breach 316 that caves inward from cephalolateral margin.Said sidewall 312 respectively from substrate 311 left and right sides to extending below, and the internal face of each sidewall 312 respectively protrudes out in the front and back end at contiguous root edge place and forms a limiting section 317.Substrate 311, said sidewall 312 and said limiting section 317 cooperatively interact and define a room 314.
Consult Fig. 4, Fig. 6 and Fig. 7, circuit unit 32 is a rectangular parallelepiped generally, is placed in the groove 315, and is recessed to form the depressed part 321 of a corresponding breach 316 from cephalolateral margin.Circuit unit 32 is electrically connected on sensing cell 2 and receives this sensing signal with first lead 4, and is electrically connected on external circuit with connecting line 6.
Consult Fig. 1, Fig. 2 and Fig. 4, first lead 4 is arranged in breach 316 and groove 331 to be electrically connected circuit unit 32 and sensing cell 2, makes the sensing signal that receives transfer to circuit unit 32.Second lead 5 is electrically connected the rear side internal face of the surrounding wall 12 of circuit unit 32 and housing 1, to form the ground connection effect.Connecting line 6 has two leads of twining of spiral (among the figure not label) each other, and the sensing signal that circuit unit 32 is received transfers to external circuit.Seal 7 is to be filled in the storage tank 13 with the material that can absorb seismic wave (like silicone rubber), and coats the bottom of the sensing cell 2 be installed in storage tank 13, assembling module 3, first lead 4, second lead 5 and said connecting line 6.
Under this design, external circuit sends a drive signal, and this drive signal transfers to sensing cell 2 through connecting line 6, circuit unit 32 and first lead 4 in regular turn.Sensing cell 2 receives this drive signal and bending vibration generation ultrasound wave.Ultrasound wave is incident to an exterior object and produces a reflection wave, and this reflection wave is back to sensing cell 2 and produces this sensing signal.This sensing signal is in regular turn via the transmission of first lead 4, circuit unit 32 and connecting line 6 and feed back to external circuit, to carry out follow-up signal Processing and judgement.
Consult Fig. 8 and be the manufacturing approach of the utility model ultrasonic sensing device, below cooperate graphic describing in each step:
S1: assembling assembling module 3.(with reference to Fig. 6)
Use solid that circuit unit 32 is bonding in the groove 315 of substrate 311 end faces, and buffer cell 33 is placed in the room 314 and is attached to the bottom surface of substrate 311.
S2: sensing cell 2, first lead 4 and second lead 5 are installed in the housing 1.(with reference to Fig. 9)
Sensing cell 2 is fitted in the end face of the diapire 11 of housing 1, and an end of first lead 4 is connected in sensing cell 2, and an end of second lead 5 is connected in the internal face of surrounding wall 12 rear sides of housing 1.
S3: will assemble module 3 and be installed in the housing 1.(with reference to Figure 10)
The assembling module 3 that step S1 assembling is accomplished is positioned in the storage tank 13 of housing 1, this moment said locating piece 313 for being placed in the locating slot 121, and buffer cell 33 is positioned at the top of sensing cell 2 for the compartment of terrain.
S4: first lead 4, second lead 5 and connecting line 6 are connected in circuit unit 32.(with reference to Figure 11)
Make the other end of first lead 4 pass groove 331 and breach 316, then be welded on the circuit unit 32; The other end of second lead 5 is welded in the position that circuit unit 32 is interval in first lead 4; One end of connecting line 6 is welded in the middle position of circuit unit 32.
S5: fill seal 7 in this housing (with reference to Fig. 2, Fig. 4)
As aforementioned, the assembling in step S1 accomplishes assembling module 3 earlier can decrease in the step of each member of installing in the housing 1, and reduce the degree of difficulty on making, so can reach the purpose of the utility model really.
The above; Be merely the preferred embodiment of the utility model; Can not limit the scope that the utility model is implemented with this, promptly all simple equivalent of being done according to the utility model claim and utility model description change and modify, and still belong in the scope that the utility model patent contains.
Claims (10)
1. the assembling module of a ultrasonic sensing device is placed in the hollow housing of a ultrasonic sensing device, and is electrically connected on one and can receives sound wave and vibrate and send the sensing cell of a sensing signal; It is characterized in that: said assembling module comprises:
The pedestal of one flexible comprises a substrate, and said substrate is recessed to form a groove downwards from end face, and said sensing cell is positioned at said pedestal below;
One circuit unit is arranged in the said groove, and is electrically connected on said sensing cell and receives said sensing signal; And
One buffer cell can absorb seismic wave and be arranged at the contiguous said sensing cell place, bottom surface of said substrate.
2. the assembling module of ultrasonic sensing device according to claim 1; It is characterized in that: said pedestal also comprises at least one locating piece that is outwards protruded out by said substrate top surface; And the internal face of said housing is recessed to form a locating slot, and is ccontaining for said locating piece.
3. the assembling module of ultrasonic sensing device according to claim 1 is characterized in that: said substrate forms the breach of a depression from outer peripheral edges, and said buffer cell forms groove that at least one pair of should said breach.
4. according to the assembling module of the described ultrasonic sensing device of arbitrary claim in the claim 1 to 3; It is characterized in that: said pedestal also comprises respectively from said substrate two opposition sides to the two side that extends below; Said sidewall respectively forms at least one limiting section away from said substrate place; Said substrate, said sidewall and said limiting section cooperatively interact and define a room, and said room supplies said buffer cell ccontaining.
5. a ultrasonic sensing device is electrically connected on an external circuit; It is characterized in that: said ultrasonic sensing device comprises:
One housing comprises a diapire and from the upwardly extending surrounding wall of said diapire outer peripheral edges, and said diapire and said surrounding wall cooperatively interact and define a storage tank;
One sensing cell is arranged at the end face of said diapire, and can receive sound wave and vibrate and send a sensing signal; And
One assembling module is arranged at said storage tank and is interval in said sensing cell, and said assembling module comprises
The pedestal of one flexible has a substrate, and said substrate is recessed to form a groove downwards from end face,
One circuit unit is arranged in the said groove, and is electrically connected on said sensing cell and receives said sensing signal, and is electrically connected on said external circuit and said sensing signal is transferred to said external circuit, and
One buffer cell can absorb seismic wave and be arranged at the contiguous said sensing cell place, bottom surface of said substrate.
6. ultrasonic sensing device according to claim 5; It is characterized in that: said pedestal also has at least one locating piece that is outwards protruded out by said substrate top surface; And said storage tank comprises the locating slot that the internal face by said surrounding wall is recessed to form, and is ccontaining for said locating piece.
7. ultrasonic sensing device according to claim 5 is characterized in that: said ultrasonic sensing device also comprises one first lead, and said pedestal is from the breach of outer peripheral edges formation one depression, and said buffer cell forms at least one pair of groove of answering said breach; Said first lead is arranged in said breach and said groove, and is electrically connected said circuit unit and said sensing cell to transmit said sensing signal.
8. ultrasonic sensing device according to claim 5; It is characterized in that: said ultrasonic sensing device also comprises one second lead and a connecting line; Said second lead is electrically connected said circuit unit and said housing, and said connecting line is electrically connected said circuit unit and said external circuit.
9. ultrasonic sensing device according to claim 5 is characterized in that: said ultrasonic sensing device also comprises a seal, and said seal is filled in said storage tank and coats said sensing cell and said assembling module.
10. according to the described ultrasonic sensing device of arbitrary claim in the claim 5 to 9; It is characterized in that: said pedestal also has respectively from said substrate two opposition sides to the two side that extends below; Said sidewall respectively forms at least one limiting section away from said substrate place; Said substrate, said sidewall and said limiting section cooperatively interact and define a room, and said room supplies said buffer cell ccontaining.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101203114 | 2012-02-21 | ||
| TW101105663 | 2012-02-21 | ||
| TW101105663A TWI456168B (en) | 2012-02-21 | 2012-02-21 | Assembly module, ultrasonic sensing device and manufacturing method thereof |
| TW101203114U TWM433698U (en) | 2012-02-21 | 2012-02-21 | Assembling module and ultrasound sensing device |
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| Publication Number | Publication Date |
|---|---|
| CN202522250U true CN202522250U (en) | 2012-11-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100640282A Pending CN103256949A (en) | 2012-02-21 | 2012-03-07 | Assembly module, ultrasonic sensing device and manufacturing method thereof |
| CN2012200907424U Expired - Fee Related CN202522250U (en) | 2012-02-21 | 2012-03-07 | Assembly module and ultrasonic sensing device |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN2012100640282A Pending CN103256949A (en) | 2012-02-21 | 2012-03-07 | Assembly module, ultrasonic sensing device and manufacturing method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103256949A (en) * | 2012-02-21 | 2013-08-21 | 同致电子企业股份有限公司 | Assembly module, ultrasonic sensing device and manufacturing method thereof |
| CN103900629A (en) * | 2012-12-24 | 2014-07-02 | 同致电子企业股份有限公司 | Sensor shell |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7188045B2 (en) * | 2018-12-14 | 2022-12-13 | セイコーエプソン株式会社 | sensor unit and electronics |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3939387A1 (en) * | 1989-11-29 | 1991-06-06 | Swf Auto Electric Gmbh | Ultrasonic distance warning system esp. for motor vehicles - has aperture covering membrane carrying piezo-plate to eliminate group echos |
| JP3975939B2 (en) * | 2003-02-18 | 2007-09-12 | 松下電工株式会社 | Ultrasonic sensor |
| JP4581545B2 (en) * | 2004-08-02 | 2010-11-17 | 株式会社デンソー | Ultrasonic sensor mounting structure |
| TWM275407U (en) * | 2004-12-20 | 2005-09-11 | Ju-Lin Lee | Ultrasonic sensor having audio beam tube |
| JP4438667B2 (en) * | 2005-03-29 | 2010-03-24 | 株式会社デンソー | Ultrasonic sensor and ultrasonic transducer |
| JP2007114182A (en) * | 2005-09-22 | 2007-05-10 | Denso Corp | Mounting structure of ultrasonic sensor |
| JP2008191007A (en) * | 2007-02-05 | 2008-08-21 | Denso Corp | Structure for mounting sensor device |
| CN201980154U (en) * | 2011-01-28 | 2011-09-21 | 广东铁将军防盗设备有限公司 | Reverse radar sensor module |
| CN103256949A (en) * | 2012-02-21 | 2013-08-21 | 同致电子企业股份有限公司 | Assembly module, ultrasonic sensing device and manufacturing method thereof |
-
2012
- 2012-03-07 CN CN2012100640282A patent/CN103256949A/en active Pending
- 2012-03-07 CN CN2012200907424U patent/CN202522250U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103256949A (en) * | 2012-02-21 | 2013-08-21 | 同致电子企业股份有限公司 | Assembly module, ultrasonic sensing device and manufacturing method thereof |
| CN103900629A (en) * | 2012-12-24 | 2014-07-02 | 同致电子企业股份有限公司 | Sensor shell |
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| Publication number | Publication date |
|---|---|
| CN103256949A (en) | 2013-08-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121107 Termination date: 20150307 |
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| EXPY | Termination of patent right or utility model |