CN106303862B

CN106303862B - Module shell subassembly, speaker module and electronic equipment

Info

Publication number: CN106303862B
Application number: CN201610871340.0A
Authority: CN
Inventors: 刘岩涛; 王召鑫
Original assignee: Goertek Inc
Current assignee: Goertek Inc
Priority date: 2016-09-30
Filing date: 2016-09-30
Publication date: 2020-03-17
Anticipated expiration: 2036-09-30
Also published as: CN106303862A

Abstract

The invention discloses a module shell assembly, a loudspeaker module and electronic equipment, wherein the module comprises a shell assembly body and at least one expansion plate combined in the shell assembly body, and each expansion plate is exposed out of the inner surface of the shell assembly body, wherein the expansion plate is a hard plate and is made of a porous material. The module housing of the speaker module comprises the module housing assembly. The electronic equipment is provided with the loudspeaker module.

Description

Module shell subassembly, speaker module and electronic equipment

Technical Field

The invention relates to the technical field of electroacoustic products, in particular to a module shell assembly for a loudspeaker module, the loudspeaker module adopting the module shell assembly and electronic equipment provided with the loudspeaker module.

Background

The speaker module includes the module shell and installs the speaker monomer in the module shell, in order to guarantee that the speaker module has good acoustic performance, generally requires that the module shell has great back cavity.

The existing module shell basically adopts full plastics or injection molding steel sheet structure in plastics, and under the condition of certain size, the volume of the rear cavity can only be increased by further thinning the thickness of the module shell, but the thickness of the module shell cannot be too thin, otherwise, box body resonance can be caused, and further the tone quality is poor, so that the volume of the rear cavity which can be increased by the method is very limited, and the acoustic performance of the loudspeaker module can not be obviously improved.

Disclosure of Invention

An object of the embodiments of the present invention is to provide a new technical solution for a module housing assembly to increase the volume of the rear cavity of the module with a certain size.

According to a first aspect of the present invention, there is provided a module housing assembly for a speaker module, comprising a housing assembly body and at least one volume expansion plate incorporated in the housing assembly body, each volume expansion plate being exposed through an inner surface of the housing assembly body, wherein the volume expansion plate is a hard plate, and the volume expansion plate is made of a porous material.

Optionally, at least part of the flash plate is integrated with the housing assembly body by being injection molded as an insert in the housing assembly body.

Optionally, the housing assembly body is provided with a through embedded groove, and at least part of the expansion plate is embedded into the embedded groove and the edge of the expansion plate is fixed on the side wall of the embedded groove.

Optionally, the porous material is a metal foam.

Optionally, the porous material is foamed steel or foamed aluminum.

Optionally, the porous material is a porous ceramic.

Optionally, at least a portion of the flash board is further exposed through an outer surface of the housing assembly body, and the module housing assembly further includes a sealing layer covering the exposed flash board on one side of the outer surface of the housing assembly body.

According to a second aspect of the present invention, there is provided a speaker module including a module case and a speaker unit, the speaker unit being mounted in the module case, and a diaphragm of the speaker unit dividing an inner space of the module case into a rear cavity, the module case including the module case assembly according to the first aspect of the present invention, wherein the expansion plate is exposed via an inner surface of the case assembly body corresponding to the rear cavity.

Optionally, the housing assembly body comprises a bottom wall and a side wall extending from the bottom wall, the bottom wall and the side wall enclosing the rear cavity; the flash plate is coupled to the bottom wall and/or the flash plate is coupled to the side wall.

According to a third aspect of the present invention, there is provided an electronic apparatus provided with the speaker module according to the second aspect of the present invention.

The module shell assembly has the advantages that the expansion plate made of the porous material is combined in the shell assembly body, and the porous material is provided with a large number of holes inside, so that when the module shell assembly is used for assembling the module shell, the volume of the rear cavity of the module can be increased by directly using the expansion plate, the convenience and the effectiveness for changing the volume of the rear cavity of the module are improved, and the acoustic performance of the loudspeaker module is adjusted. And the dilatation board is the hard board and is regarded as a part of shell, forms the powerful support to the shell, avoids the shell to produce the deformation.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.

Fig. 1 is a schematic cross-sectional view of a first embodiment of a module case assembly according to the invention;

FIG. 2 is a schematic cross-sectional view of a second embodiment of a module case assembly according to the present invention;

FIG. 3 is a schematic cross-sectional view of a third embodiment of a module case assembly according to the invention;

fig. 4 is a schematic cross-sectional view of an embodiment of a speaker module according to the present invention.

Description of reference numerals:

100-module case assembly/module top case; 200-module case assembly/module lower case;

110. 210-a housing assembly body; 120. 220-flash plate;

111. 211-an inner surface of the housing assembly body; 112. 212-an outer surface of the housing assembly body;

113-a bottom wall; 114-a side wall;

115-a mounting groove; 116-a flange;

117-step portion; 118. 128-a pair of anti-disengagement active surfaces;

218. 228-a pair of anti-disengagement active surfaces; 300-a speaker cell;

200' -module lower case.

Detailed Description

Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.

In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

To facilitate understanding of the present invention, the structure of the speaker module and the module housing will be described first.

This speaker module includes module shell and speaker monomer, and the module shell has the mounting groove that matches with the speaker monomer. The loudspeaker unit is arranged in the mounting groove and is positioned in the accommodating cavity of the module shell, and the accommodating cavity is also the rear cavity of the module.

In order to be able to mount the loudspeaker unit in the module housing, the module housing should generally comprise at least two module housing assemblies, so that after the loudspeaker unit is mounted, the module housing assemblies are assembled together by means of fasteners and/or adhesive bonding, etc. to form the module housing. For example, the module housing includes two components, a module upper shell and a module lower shell, wherein the module upper shell is provided with a mounting groove for mounting the speaker unit.

In order to facilitate the assembly of the module upper shell and the module lower shell, any one of the upper shell and the lower shell can be designed into a flat plate shape, the other one of the upper shell and the lower shell is designed into an open container for providing the accommodating cavity, and the flat plate-shaped component is assembled at the opening of the open container to form the module shell.

The invention provides a new technical scheme which can increase the volume of a rear cavity of a loudspeaker module even under the condition that the size of a module shell is fixed.

Fig. 1 is a schematic cross-sectional view of a first embodiment of a module case assembly according to the invention.

The module case assembly 100 of fig. 1 includes a case assembly body 110 and at least one flash board 120 integrated in the case assembly body 110, wherein the flash board 120 is surrounded by the case assembly body 110, and each flash board 120 is exposed through an inner surface 111 of the case assembly body 110, wherein the flash board 120 is a hard board, and the flash board 120 is made of a porous material.

The expansion plate 120 is a hard plate, has certain strength and rigidity, is not easy to deform, and is used as a part of the shell to form a powerful support for the shell, so that the shell is prevented from deforming.

The porous material is a material with a network structure formed by interconnected or closed pores, and the boundaries or surfaces of the pores are formed by pillars or flat plates. A more typical porous structure is a two-dimensional structure formed by a large number of polygonal cells gathered on a plane, and is called a honeycomb material because of its shape similar to a hexagonal structure of a honeycomb; another typical cellular structure is a three-dimensional structure formed by a collection of numerous polyhedron-shaped cells in space, commonly referred to as a foam. In addition, the porous material in the invention specifically refers to a porous material with holes having an open-pore structure or a semi-open-pore and semi-closed-pore structure, so as to ensure the permeability of the airflow and further obtain the effect of increasing the space volume which can be reached by the airflow.

In one embodiment of the invention, the porous material may be a foam material to obtain a higher permeability, and may further be a metal foam. The foamed metal refers to a special metal material containing foamed air holes, such as foamed steel, foamed aluminum, etc., so that the sound-diffusing plate 120 not only has the function of volume expansion, but also can play a role of electromagnetic shielding.

In further embodiments of the invention, the porous material may also be a porous ceramic or the like.

Both the above metal foam and the porous ceramic can provide sufficient strength and rigidity to avoid deformation of the housing.

The housing assembly body 110 is plastic to ensure the hermeticity of the module housing assembled from the module housing assembly 100 by wrapping a flash plate 120 on one side of the outer surface 112.

Since the porous material allows the airflow to pass through, for the module case assembled by such a module case assembly 100, the internal space of the porous material will also become the back cavity of the module, and further obtain the effect of further effectively increasing the volume of the back cavity for a given size of the module case, so that the acoustic performance of the speaker module can be adjusted by setting the flash plate 120 in a suitable ratio.

The flash board 120 may be partially embedded in the housing assembly body 110 or may be completely embedded in the housing assembly body 110, with only a surface of the flash board 120 exposed through the interior surface 111. In this embodiment, the capacity expansion plate 120 is completely embedded in the housing assembly body 110, so as to completely avoid occupying the accommodating cavity of the module housing assembled by the corresponding module housing assembly 100, thereby realizing the maximized design of the accommodating cavity volume.

In this embodiment, the flash board 120 is combined with the housing assembly body 110 by being molded as an insert in the housing assembly body 110, that is, when the housing assembly body 110 is molded, the flash board 120 is placed as an insert in a corresponding position of a cavity of an injection mold and positioned, so that injection molding of the housing assembly body 110 can be performed on the flash board 120 when injecting an injection molding raw material into the injection mold, and the two are reliably combined together. The advantages of this kind of combination structure lie in: the binding force is strong, the fixing between the two is not needed by an additional means, an effective anti-disengagement limit structure can be easily formed between the two, the processing is convenient, the cost is low, and the like.

In another embodiment of the present invention, the flash plate 120 may also be combined in the housing assembly body 110 after the housing assembly body 110 is molded and assembled into the embedded groove formed in the housing assembly body 110, and the two may be fixedly combined together by interference fit, adhesion, ultrasonic welding, etc.

In order to further improve the coupling force between the shell assembly body 110 and the flash board 120, in this embodiment, a separation preventing limit structure is formed between each flash board 120 and the shell assembly body 110. The limiting structure can be any one or any combination of the following:

(1) with the case assembly body 100 of the present embodiment, since the mounting groove 115 for mounting the speaker unit is provided, the case assembly body 110 may be provided with a flange 116 forming the mounting groove 115 on the side of the inner surface 111 thereof, and the flash board 120 may extend into the flange 116, that is, an edge portion of the flash board 120 is covered by the flange 116, forming a corresponding limiting structure.

(2) With regard to the housing assembly body 100 of the present embodiment, since it is shaped like an open container, which includes the bottom wall 113 and the side wall 114 surrounding the bottom wall 113 to enclose the rear cavity 119 of the speaker module, in this embodiment, the module housing assembly 100 has at least one expansion board 120 integrated in the bottom wall 113, and the expansion board 120 integrated in the bottom wall 113 extends into the side wall 114, that is, the edge portion of the expansion board 120 is covered by the side wall 114 to form a corresponding limiting structure.

Alternatively, the module housing assembly 110 has at least one expansion plate integrated into the side wall 114, and each expansion plate integrated into the side wall 114 extends into the bottom wall 113 to form a corresponding limiting structure.

(3) At least one pair of anti-disengagement action surfaces are arranged between the expansion board 120 and the shell assembly body 110 to form corresponding limiting structures. The active surface may be a stepped surface, a sloped surface, or the like.

Figure 2 is a schematic cross-sectional view of a second embodiment of a modular housing assembly according to the present invention.

Referring to fig. 2, the main difference between this embodiment and the embodiment shown in fig. 1 is that the flash board 120 is also exposed through the outer surface 112 of the housing assembly body 110, so as to simplify the positioning structure of the flash board 120 in the injection mold. For such a structure, the module case assembly 100 should further include a sealing layer (not shown) covering the exposed portion of the expansion plate 120 on the outer surface 112 side to ensure the sealing performance of the module case assembly 100 on the outer surface side, and further ensure the sealing performance of the receiving cavity of the module case assembled by the module case assembly 100.

The sealant layer may be, for example, an electroplated coating, a sealant layer, or the like.

In addition, in the embodiment shown in fig. 2, in order to prevent the flash board 120 from being pulled out from the outer surface 112 side of the housing assembly body 110, a pair of acting

surfaces

118, 128 mentioned in (3) above are formed between the flash board 120 and the housing assembly body 110, and the pair of acting

surfaces

118, 128 are mutually fitting stepped surfaces.

The module case assembly 100 in the embodiment shown in fig. 1 and 2 is provided with a mounting groove 115, and thus, the module case assembly 100 may be the module upper case described above, but in the case where the module case assembly 100 does not have the mounting groove 115, it may also be the module lower case described above.

Fig. 3 is a schematic cross-sectional view of a third embodiment of a module case assembly according to the invention.

Referring to FIG. 3, the modular enclosure assembly 200 also includes an enclosure assembly body 210 and at least one flash board 220 integrated into the enclosure assembly body 210, wherein the flash board 220 is enclosed by the enclosure assembly body 210 and each flash board 220 is exposed through an inner surface 211 of the enclosure assembly body 210, and wherein the flash board 220 is made of a porous material.

In this embodiment, the housing assembly body 210 is flat, and the flash board 220 may have at least one pair of

anti-disengagement surfaces

218, 228 with the housing assembly body 210 to form corresponding limiting structures.

The module case assembly 200 in the embodiment shown in fig. 3 is not provided with a mounting groove, and thus, the module case assembly 200 may be the above-described module case down, but it may also be the above-described module case down by providing a mounting groove on the case assembly body 210 of the module case assembly 200.

In further embodiments, the flash panel 220 may also be exposed through the exterior surface 212 of the enclosure assembly body 210, and the module enclosure assembly 200 further includes a sealing layer overlying the exposed portion of the flash panel 220 on the side of the exterior surface 212.

According to the

module case assembly

100, 200 of the present invention, a speaker module is also provided, and fig. 4 is a schematic cross-sectional view of an embodiment of the speaker module.

According to fig. 4, the speaker module includes a module case including the above module case assembly 100 and a speaker unit 300, the speaker unit 300 is installed at a mounting groove of the module case assembly 100 such that the speaker unit 300 is installed in the module case, and a diaphragm of the speaker unit divides an inner space of the module case into a rear cavity, wherein a flash board is exposed via an inner surface of a case assembly body corresponding to the rear cavity.

In this embodiment, the module case assembly 100 is a module upper case, and thus, the module case further includes a module lower case 200' that is fittingly installed at an opening of the module case assembly 100 to form a closed module case.

The housing assembly body of the module housing assembly 100 comprises a bottom wall 113 and side walls 114 extending from the bottom wall 113, the bottom wall 113 and the side walls 114 enclosing the rear cavity; the flash plate may be joined to the bottom wall 113 and/or to the side wall 114.

In order to improve the aesthetic appearance of the module housing, in this embodiment, referring to fig. 1, the module housing assembly 100 forms a stepped portion 117 at the opening to embed the module lower case 200' into the stepped portion 117 for connection and fixation, for example, by means of coating adhesive on the surface of the stepped portion 117.

In other embodiments, the module case of the speaker module may also include the module case assembly 200, and may also include both the module case assembly 100 and the module case assembly 200.

The invention also provides electronic equipment provided with the loudspeaker module, wherein the electronic equipment is a mobile phone, a tablet personal computer, wearable equipment and the like.

The above embodiments mainly focus on differences from other embodiments, but it should be clear to those skilled in the art that the above embodiments can be used alone or in combination with each other as needed.

Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims

1. A module housing assembly (100, 200) for a speaker module, comprising a housing assembly body (110, 210) and at least one flash board (120, 220) incorporated in the housing assembly body (110, 210), wherein each flash board (120, 220) is exposed through an inner surface (111, 211) of the housing assembly body (110, 210), the flash board (120, 220) is completely embedded in the housing assembly body (110, 210), wherein the flash board is a rigid board, and the flash board (120, 220) is made of a porous material.

2. A modular enclosure assembly (100, 200) according to claim 1, wherein at least part of the flash board (120, 220) is integrated with the enclosure assembly body (110, 210) by being injection molded as an insert in the enclosure assembly body (110, 210).

3. A modular housing assembly (100, 200) according to claim 1, wherein the housing assembly body is provided with a through-going insertion slot, into which at least part of the flash plate (120, 220) is inserted and the edge of which is fixed to the side wall of the insertion slot.

4. The modular housing assembly (100, 200) of any of claims 1 to 3, wherein the porous material is a metal foam.

5. The modular housing assembly (100, 200) of claim 4, wherein the porous material is a foamed steel or a foamed aluminum.

6. The modular housing assembly (100, 200) of any of claims 1 to 3, wherein the porous material is a porous ceramic.

7. A modular enclosure assembly (100, 200) according to any of claims 1 to 3, wherein at least part of the flash panel (120, 220) is further exposed via an outer surface (112, 212) of the enclosure assembly body (110, 210), and the modular enclosure assembly (100, 200) further comprises a sealing layer overlaying the exposed flash panel (120, 220) on the side of the outer surface (112, 212) of the enclosure assembly body (110, 210).

8. A loudspeaker module comprising a module housing and a loudspeaker unit (300), the loudspeaker unit (300) being mounted in the module housing and a diaphragm of the loudspeaker unit dividing an inner space of the module housing into a rear cavity, characterized in that the module housing comprises a module housing assembly (100, 200) according to any one of claims 1 to 7, wherein the flash plate is exposed via an inner surface of the housing assembly body corresponding to the rear cavity.

9. The speaker module of claim 8, wherein the housing assembly body includes a bottom wall and side walls extending from the bottom wall, the bottom wall and the side walls enclosing the back volume;

the flash plate is coupled to the bottom wall and/or the flash plate is coupled to the side wall.

10. An electronic device characterized in that the speaker module according to claim 8 is provided.