CN202488882U - PCB plate - Google Patents

PCB plate Download PDF

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Publication number
CN202488882U
CN202488882U CN2011205269637U CN201120526963U CN202488882U CN 202488882 U CN202488882 U CN 202488882U CN 2011205269637 U CN2011205269637 U CN 2011205269637U CN 201120526963 U CN201120526963 U CN 201120526963U CN 202488882 U CN202488882 U CN 202488882U
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CN
China
Prior art keywords
plate
groove
convexity
pcb board
protruding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN2011205269637U
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Chinese (zh)
Inventor
华炎生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Peking University Founder Group Co Ltd
Zhuhai Founder Technology Multilayer PCB Co Ltd
Original Assignee
Peking University Founder Group Co Ltd
Zhuhai Founder Technology Multilayer PCB Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Peking University Founder Group Co Ltd, Zhuhai Founder Technology Multilayer PCB Co Ltd filed Critical Peking University Founder Group Co Ltd
Priority to CN2011205269637U priority Critical patent/CN202488882U/en
Application granted granted Critical
Publication of CN202488882U publication Critical patent/CN202488882U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The utility model discloses a PCB plate. The PCB comprises the components as following: a first plate, which is provided with N projections, wherein N is an integer more than 0; and a second plate, which is provided with N grooves, wherein each of the N projections is corresponding to each of the N grooves at positions and shapes one by one, and the size of each groove is larger than the corresponding projection by M mils. The first plate and the second plate are fixedly connected through the one-by-one corresponding clamping connection of the N projections and the N grooves.

Description

A kind of pcb board
Technical field
The utility model relates to the printed circuit board process technology, relates in particular to a kind of pcb board.
Background technology
High frequency development along with electronic equipment; Especially relate to the development of wireless network, satellite communication device, the development trend of voice, video and data normalization that information products move towards at a high speed to move towards with high frequencyization and communication products big, the fireballing wireless transmission of capacity is inevitable.The needed substrate of a new generation's communication products also need cooperate its development, and obviously traditional FR-4 material can not satisfy existing demand.In the traditional PCB manufacturing process if use high-frequency signal; All be that whole layer uses high frequency material to make in the design; If just local (most less than whole plate 1/3 zone) need to use the high frequency model; Adopt local (most) pressing high frequency material, can reduce the use amount of expensive high-frequency sheet material, reduce the PCB cost greatly less than whole plate 1/3 zone.But in the process of pressing high frequency material plate (daughter board), daughter board and whole plate (motherboard) contraposition deviation can occur, the adaptation of daughter board and motherboard junction is bad, and the exterior quality of product is bad.In the prior art, usual way has following two kinds:
Method one: directly implantation promptly is the high frequency daughter board directly to be put into us need imbed on the motherboard position of high frequency daughter board.In the process of pressing, resin solidification, cohere high frequency daughter board and motherboard as a whole, then through the via hole conducting.
Method two: stud registration.Promptly pass through pin, be fixed up high frequency daughter board and motherboard, can guarantee that in pressing plate the relative position between daughter board and the motherboard moves in the position of high frequency daughter board.
The inventor finds that prior art has following shortcoming at least in the process that realizes the utility model:
Method one: problems such as daughter board leans on the profile frame location of motherboard, is easy to generate displacement, daughter board and motherboard contraposition deviation occur, and the adaptation of daughter board and motherboard junction is bad, and the product appearance quality is bad, scrappage is higher.
Method two: problems such as the adaptation of daughter board and motherboard junction is bad, and the product appearance quality is bad, the higher problem of scrappage; Flow process is complicated, and all corresponding central layers, epoxy resin all will bore location hole, and cost is high.
The utility model content
In order to solve the high frequency partial mixed pressure in the process of pressing daughter board, daughter board and motherboard contraposition deviation appear, and the adaptation of daughter board and motherboard junction is bad, the bad and scrappage problem of higher of product appearance quality, the utility model provides a kind of pcb board.
In order to achieve the above object, the utility model provides a kind of pcb board, comprising: first plate, N convexity arranged on said first plate, and wherein N is the integer greater than zero.Second plate has N groove on said second plate, in the said N convexity in each protruding and said N groove each groove in position and corresponding one by one in shape, and the big M of the size Mill that the size of each groove compares the correspondence convexity in the said N groove.Wherein, engage one to one through each groove in each protruding and said N groove in the said N convexity, to fix the connection between said first plate and said second plate.
Preferably, said pcb board is local mixed pressure pcb board; Said first plate is the daughter board of said pcb board, and said second plate is the motherboard of said pcb board.
Preferably, when N was 1, limit, said groove place was first limit of said second plate, and the engaging of said convexity and said groove is used to stop said first plate after snapping in said second plate, to the direction motion away from said first limit.
Preferably, the internal layer of narrow position of said groove still has the part figure.
Preferably, said convexity is T word shape, π shape, cucurbit shape or the trapezoidal shape that falls.
Preferably, when a said N convexity laid respectively at least one opposite side of said first plate, said convexity was rectangle, triangle or trapezoidal.
Preferably, a said N convexity is evenly distributed on the periphery of said first plate.
Preferably, said M is smaller or equal to ten number greater than zero.
The utility model beneficial effect is following:
The utility model compared with prior art; Adopt daughter board and motherboard self-locating method; Can effectively solve daughter board and motherboard the moving of position when pressing; It is complicated to solve simultaneously when adopting the rivet location flow process, problem, can effectively solve the product appearance quality bad with the high problem of boring location cost.
Further, daughter board and motherboard engage through protruding and groove, and the convexity on the daughter board and daughter board are one-body molded, so daughter board and motherboard adaptation are good.
Description of drawings
Fig. 1 the utility model first embodiment PCB daughter board structure chart;
The structure chart of Fig. 2 the utility model first embodiment PCB motherboard;
Fig. 3 the utility model first embodiment PCB daughter board and the superimposed sketch map of PCB motherboard;
The structure chart of Fig. 4 the utility model second embodiment PCB motherboard;
The structure chart of Fig. 5 the utility model second embodiment PCB daughter board;
Fig. 6 the utility model second embodiment PCB daughter board and the superimposed sketch map of PCB motherboard;
The structure chart of Fig. 7 the utility model the 3rd embodiment PCB motherboard;
The structure chart of Fig. 8 the utility model the 3rd embodiment PCB daughter board;
Fig. 9 the utility model the 3rd embodiment PCB daughter board and the superimposed sketch map of PCB motherboard.
Embodiment
The utility model first embodiment provide a kind of pcb board, please refer to Fig. 1, Fig. 2 and Fig. 3.
As shown in Figure 1, pcb board comprises first plate 11, protruding 101.
As shown in Figure 2, pcb board also comprises second plate 12, groove 201.
As shown in Figure 3, first plate 11 of pcb board and second plate 12 are superimposed together with groove 201 through protruding 101.
Wherein, in the present embodiment, first plate 11 is the daughter board of pcb board, and second plate 12 is the motherboard of pcb board.Wherein protruding in the present embodiment 101 and first plate 11 is one-body molded, but those skilled in the art can adopt convexity 101 welding in practical application or cohere on first plate 11, and present embodiment does not limit.
Like Fig. 1, Fig. 2 and shown in Figure 3; Convexity 101 is the font into T with groove 201; And protruding 101 is all corresponding one by one with the quantity and the position of groove 201, and in Fig. 1, Fig. 2 and Fig. 3, the quantity of convexity 101 and groove 201 is respectively 4; But the quantity at practical application protrusions 101 and groove 201 can evenly or unevenly be distributed in the periphery of first plate 11 and second plate 12 respectively according to actual needs for a plurality of.
Or; Quantity protruding and groove respectively is one; This moment, protruding shape with groove needed to stop said first plate after snapping in said second plate, moved to the direction away from said first limit, and is common such as T word, ∏ (or π), Pear-Shaped or trapezoidal shape.The general character of this type Common Shape is that the inboard of the minimum widith position of groove (i.e. the narrowest position) still has the part figure; The outside of protruding minimum widith (the narrowest position) position still has the part figure.Because when first plate only is fastened in second plate through a convexity; Stoped first plate to move to direction perpendicular to first limit of second plate; Also stop its direction motion towards first limit of second plate; When the narrowest position forms bayonet socket, also can stop first plate to direction motion away from first limit of second plate.Certainly, other such as r, fall L shaped groove and convexity, also can stop first plate to direction motion away from first limit of second plate.
In addition; In N convexity; When having protruding at least one pair of opposite side that lays respectively at first plate; The convexity and the shape of groove that are positioned on the opposite side can be rectangle, triangle or trapezoidal, because the groove branch is located at and the plate of winning can't be done all around with respect to second plate move, so the groove of rectangle and protruding living of also can engaging.Again perhaps, when first plate had only three limits and second plate to join, protruding and groove can only be positioned at three limits that join, and it is protruding to need not design on the 4th limit of first plate.
Further, the size of groove 201 is than protruding 101 the big M of size Mill, and M be greater than zero smaller or equal to 10 number, and for example the normal value 4 of M or 8 makes groove 201 and convexity 101 well to engage, and makes first plate 11 and second plate, 12 adaptations better.
Please continue with reference to figure 3, in the present embodiment, first plate 11 and second plate 12 are to stick on second plate 12 with in protruding 101 corresponding groove 201 through the convexity 101 on first plate 11 to fix.The pcb board that adopts the mode of this engaging to process can reduce by first plate 11 and second plate 12 moves the influence that is caused in the position when pressing, and engages the back pcb board and have good exterior quality.
In a second embodiment, different with first embodiment is that the groove 202 on the convexity 102 on first plate 21 and second plate 22 is trapezoidal.Please refer to Fig. 4, Fig. 5 and Fig. 6, other versions please refer to aforementioned description to first embodiment, and succinct for specification is not described in detail in this.
In the 3rd embodiment, different with first, second embodiment is, protruding 103 with groove 203 be trapezoidal, protruding 113 and groove 213 be the T font.Wherein protruding in the present embodiment 103 is one-body molded with protruding 113 and first plate 31, but those skilled in the art can adopt in practical application convexity 103 and convexity 113 are welded or cohered on first plate 31, and present embodiment does not limit.Please refer to Fig. 7, Fig. 8 and Fig. 9.
Protruding 103 is all corresponding one by one with the quantity and the position of groove 203; In Fig. 7, Fig. 8 and Fig. 9; The quantity of convexity 103 and groove 203 is respectively 2; But in practical application, the quantity of convexity 103 and groove 203 can be a plurality of and the even respectively according to actual needs or uneven periphery that is distributed in first plate 31 and second plate 32.Further, the size of groove 203 is than protruding 103 the big M of size Mill, and M be greater than zero smaller or equal to ten number, and for example M can value 4 or 8, makes groove 203 and convexity 103 well to engage, and makes first plate 31 and second plate, 32 adaptations fine.
Protruding 113 is also corresponding one by one with the quantity and the position of groove 213; In Fig. 7, Fig. 8 and Fig. 9; The quantity of convexity 113 and groove 213 is respectively 2; But in practical application, the quantity of convexity 113 and groove 213 can be a plurality of and the even respectively according to actual needs or uneven periphery that is distributed in first plate 31 and second plate 32.Further, the size of groove 213 is than the big M of the size Mill of convexity 113, and smaller or equal to 10, for example the normal value 4 of M or 8 makes groove 213 can well engage with protruding 113 to M, makes first plate 31 and second plate, 32 adaptations fine greater than zero.
Please continue with reference to figure 9, in the present embodiment, to first plate 31 and second plate 32 be through the convexity on first plate 31 103 and protruding 113 stick into respectively on second plate 32 with protruding 103 with protruding 113 corresponding groove 203 and groove 213 in.The pcb board that adopts the mode of this engaging to process can reduce by first plate 31 and second plate 32 moves the influence that is caused in the position when pressing, and engages the back pcb board and have good exterior quality.
Convexity among first, second, third embodiment and groove can be T fonts among also trapezoidal or the 3rd embodiment among T font or second embodiment among first embodiment and trapezoidal; Also can be those skilled in the art adopted according to actual needs other be easy to other shape of realizing that first plate and second integrated circuit board close, in above-mentioned three embodiment, do not limit.
Above-mentioned pcb board adopts daughter board and motherboard self-locating method, can effectively solve daughter board and motherboard the moving of position when pressing, can solve flow process complicacy when adopting rivet to locate simultaneously, the problem that cost is high.
In this specification, the utility model is described with reference to its certain embodiments, and still, those skilled in the art can carry out various changes and modification to the utility model and not break away from the spirit and the scope of the utility model.Like this, belong within the scope of the utility model claim and equivalent technologies thereof if these of the utility model are revised with modification, then the utility model also is intended to comprise these changes and modification interior.

Claims (9)

1. a pcb board is characterized in that, comprising:
First plate has N convexity on said first plate, wherein N is the integer greater than zero;
Second plate has N groove on said second plate;
In the said N convexity in each protruding and said N groove each groove in position and corresponding one by one in shape, and the big M of the size Mill that the size of each groove compares the correspondence convexity in the said N groove; Wherein, engage one to one through each groove in each protruding and said N groove in the said N convexity, to fix the connection between said first plate and said second plate.
2. pcb board as claimed in claim 1 is characterized in that, said pcb board is local mixed pressure pcb board; Said first plate is the daughter board of said pcb board, and said second plate is the motherboard of said pcb board.
3. pcb board as claimed in claim 1 is characterized in that, said N protruding one-body molded with said first plate.
4. pcb board as claimed in claim 1; It is characterized in that when N was 1, limit, said groove place was first limit of said second plate; The engaging of said convexity and said groove is used to stop said first plate after snapping in said second plate, to the direction motion away from said first limit.
5. pcb board as claimed in claim 4 is characterized in that, the inboard of the minimum widith position of said groove has the part figure.
6. like each described pcb board of claim 1 ~ 5, it is characterized in that said convexity is T word shape, π shape, cucurbit shape or the trapezoidal shape that falls.
7. pcb board as claimed in claim 1 is characterized in that, in a said N convexity, when having protruding at least one pair of opposite side that lays respectively at said first plate, the convexity on the said opposite side is rectangle, triangle or trapezoidal.
8. pcb board as claimed in claim 1 is characterized in that, a said N convexity is evenly distributed on the periphery of said first plate.
9. like each described pcb board in the claim 1 ~ 5,7, it is characterized in that said M is smaller or equal to ten number greater than zero.
CN2011205269637U 2011-12-15 2011-12-15 PCB plate Expired - Lifetime CN202488882U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011205269637U CN202488882U (en) 2011-12-15 2011-12-15 PCB plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011205269637U CN202488882U (en) 2011-12-15 2011-12-15 PCB plate

Publications (1)

Publication Number Publication Date
CN202488882U true CN202488882U (en) 2012-10-10

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011205269637U Expired - Lifetime CN202488882U (en) 2011-12-15 2011-12-15 PCB plate

Country Status (1)

Country Link
CN (1) CN202488882U (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103974540A (en) * 2014-05-22 2014-08-06 深圳市格瑞普电池有限公司 Circuit board provided with battery in embedded mode
CN104254212A (en) * 2014-09-17 2014-12-31 广州杰赛科技股份有限公司 Manufacturing method of circuit board
CN104470204A (en) * 2013-09-13 2015-03-25 北京大明五洲科技有限公司 Plate electrode interconnecting structure and display type intelligent cipher key
CN104519674A (en) * 2013-09-27 2015-04-15 北大方正集团有限公司 Partial mixed lamination board dislocation prevention method
CN104780702A (en) * 2015-04-21 2015-07-15 深圳市博敏电子有限公司 High-frequency mixed-compression circuit board capable of quick heat dissipation and forming method thereof

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104470204A (en) * 2013-09-13 2015-03-25 北京大明五洲科技有限公司 Plate electrode interconnecting structure and display type intelligent cipher key
CN104519674A (en) * 2013-09-27 2015-04-15 北大方正集团有限公司 Partial mixed lamination board dislocation prevention method
CN104519674B (en) * 2013-09-27 2018-10-09 北大方正集团有限公司 One kind preventing partial hybrid plate dislocation method
CN103974540A (en) * 2014-05-22 2014-08-06 深圳市格瑞普电池有限公司 Circuit board provided with battery in embedded mode
CN103974540B (en) * 2014-05-22 2018-03-16 深圳市格瑞普电池有限公司 A kind of circuit board of embedded installation battery
CN104254212A (en) * 2014-09-17 2014-12-31 广州杰赛科技股份有限公司 Manufacturing method of circuit board
CN104780702A (en) * 2015-04-21 2015-07-15 深圳市博敏电子有限公司 High-frequency mixed-compression circuit board capable of quick heat dissipation and forming method thereof
CN104780702B (en) * 2015-04-21 2017-10-24 深圳市博敏电子有限公司 A kind of forming method of quick heat radiating high frequency mixed pressure wiring board

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GR01 Patent grant
CX01 Expiry of patent term
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Granted publication date: 20121010