CN202285459U - Bottom board structure for manufacturing right angle circuit board copper conductor - Google Patents
Bottom board structure for manufacturing right angle circuit board copper conductor Download PDFInfo
- Publication number
- CN202285459U CN202285459U CN2012200215654U CN201220021565U CN202285459U CN 202285459 U CN202285459 U CN 202285459U CN 2012200215654 U CN2012200215654 U CN 2012200215654U CN 201220021565 U CN201220021565 U CN 201220021565U CN 202285459 U CN202285459 U CN 202285459U
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- right angle
- etching
- copper conductor
- conductor
- pattern
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- Expired - Fee Related
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Abstract
The utility model discloses a bottom board structure for manufacturing a right angle circuit board copper conductor, which comprises a bottom plate body (1) and is characterized in that a right angle circuit conductor structure (2) is formed on the bottom plate body (1), a protruding point (3) is arranged on the outer side of a right angle of the right angle circuit conductor structure (2), and the right angle circuit conductor structure (2) can form a multi-compensation pattern by arranging the protruding point (3). Due to the fact that the protruding point is arranged on the outer side of the right angle of the right angle circuit conductor structure, the multi-compensation pattern is formed, the pattern is transferred onto a printed circuit board (PCB) through exposure, after etching, a conductor pattern with a circular or an R arc-shaped protruding point is etched to become the right angle by using lateral etching quantity of the etching. Compared with the prior art in which a traditional inner layer board bottom plate pattern is transferred through the exposure so as to conduct etching, the bottom board structure can turn a semi-circular R-angle of the traditional conductor patter after etching into a high order product with the right angle, and further improves processing capacity of a traditional etching machine and product quality.
Description
Technical field
The utility model relates to a kind of circuit board structure, particularly relates to a kind of base arrangement that is used to make perpendicular type wiring board copper conductor.Belong to the wiring board manufacture technology field.
Background technology
The wiring board exposure is internal layer important process instrument and the equipment of making in the multilayer board process with figure base plate, internal layer exposure machine and etching machine, utilizes exposure machine after on the copper base, to utilize etching machine that the etching of corresponding line conductor figure is displayed the line conductor figure transfer on the figure base plate.But; Present base arrangement; The line conductor of producing through internal layer tradition acid etching machine; Can carry out lateral erosion because of the characteristic of liquid medicine when the etching, like Fig. 4 and shown in Figure 5, can be after etching because liquid medicine cause actual line conductor should become semicircle R angle (5) for the part at right angle to the line conductor lateral erosion.Therefore, can't satisfy the particular requirement of people to the right angle conductor.
Summary of the invention
The purpose of the utility model is the problem that becomes semicircle R angle for the base plate right angle of copper conductor after etching that solves above-mentioned prior art, and a kind of base arrangement that is used to make perpendicular type wiring board copper conductor is provided.This base arrangement keeps the rectangular shape of copper conductor after etching.
The purpose of the utility model can reach through following technical scheme:
Be used to make the base arrangement of perpendicular type wiring board copper conductor; Comprise the egative film body; Its design feature is: on the egative film body, form right angle circuit conductor structure; The right angle arranged outside salient point of circuit conductor structure at said right angle makes right angle circuit conductor structure form many compensation patterns through said salient point is set.
The purpose of the utility model can also reach through following technical scheme:
Further Technological improvement plan is: said salient point can rounded shape or R arcuation.
Further Technological improvement plan is: the radius of said salient point can be 0.25mil～1.0mil.
Further Technological improvement plan is: said egative film body can square-shaped or oblong-shaped.
Further Technological improvement plan is: on said egative film body, can be provided with registration holes.
The utlity model has following outstanding beneficial effect:
The utility model is owing to the right angle arranged outside salient point of the circuit conductor structure at the right angle; Become more than one compensation patterns; Transfer to pcb board through exposure pattern; Through etching, utilize the etching side etching quantity will add that the conductor pattern etching of circle or R arcuation salient point becomes the right angle, carry out pattern transfer and carry out etching thereby compare traditional inner plating egative film pattern utilization exposure; Can the high-order product that become the right angle after the etching of conventional conductor pattern by semicircle R angle further be improved the processing procedure ability and the product quality of traditional etching machine.
Embodiment
Specific embodiment 1:
Fig. 1, Fig. 2 and Fig. 3 constitute the specific embodiment 1 of the utility model.
See figures.1.and.2; Present embodiment comprises egative film body 1; On egative film body 1, form right angle circuit conductor structure 2, the right angle arranged outside salient point 3 of circuit conductor structure 2 at said right angle makes right angle circuit conductor structure 2 form many compensation patterns through said salient point 3 is set.Right angle circuit conductor structure 2 constitutes rectangle.
In the present embodiment, said salient point 3 can rounded shape, and the radius of said salient point 3 can be 1.0mil.Said egative film body 1 shape that is rectangle.On said egative film body 1, can be provided with registration holes 4.
With reference to Fig. 3; The egative film of present embodiment is transferred to pcb board through exposure pattern; Through etching; Utilize the etching side etching quantity will add that the conductor pattern etching of circular PAD becomes the right angle, can the high-order product that become the right angle after the etching of conventional conductor pattern by semicircle R angle further be improved the processing procedure ability and the product quality of traditional etching machine.
Comparison diagram 5 can know that the base plate of prior art is owing to be provided with arranged outside toroidal or the compensation of R arcuation salient point at the right angle, and therefore through after the etching, the right angle becomes the R arc angle, can not satisfy the wiring board requirement of right angle copper conductor.
Specific embodiment 2:
The characteristics of present embodiment 2 are:Said salient point 3 can rounded shape or R arcuation, and the radius of said salient point 3 can be 0.25mil, 0.5mil, 0.75mil or 1.0mil.All the other are with specific embodiment 1.
Other specific embodiments:
The main feature of other specific embodiments of the utility model is: right angle circuit conductor structure 2 can be square-shaped, the right angle is polygon-shaped.All the other are with specific embodiment 1 or specific embodiment 2.
The above; It only is the preferred embodiment of the utility model; Be not that the technical scope of the utility model is done any restriction; So every technical spirit according to the utility model to any trickle modification, equivalent variations and modification that above embodiment did, all still belongs in the scope of the utility model technology Fang An.
Claims (5)
1. be used to make the base arrangement of perpendicular type wiring board copper conductor; Comprise egative film body (1); It is characterized in that: go up at egative film body (1) and form right angle circuit conductor structure (2); At the right angle of said right angle circuit conductor structure (2) arranged outside salient point (3),, said salient point (3) make right angle circuit conductor structure (2) form many compensation patterns through being set.
2. the base arrangement that is used to make perpendicular type wiring board copper conductor according to claim 1 is characterized in that: rounded shape of salient point (3) or R arcuation.
3. the base arrangement that is used to make perpendicular type wiring board copper conductor according to claim 2 is characterized in that: the radius of said salient point (3) is 0.25mil～1.0mil.
4. the base arrangement that is used to make perpendicular type wiring board copper conductor according to claim 2 is characterized in that: the square-shaped or oblong-shaped of egative film body (1).
5. according to the described circuit board structure that is used to make perpendicular type base plate copper conductor of the arbitrary claim of claim 1 to 4, it is characterized in that: on said egative film body (1), be provided with registration holes (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200215654U CN202285459U (en) | 2012-01-16 | 2012-01-16 | Bottom board structure for manufacturing right angle circuit board copper conductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200215654U CN202285459U (en) | 2012-01-16 | 2012-01-16 | Bottom board structure for manufacturing right angle circuit board copper conductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202285459U true CN202285459U (en) | 2012-06-27 |
Family
ID=46296969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200215654U Expired - Fee Related CN202285459U (en) | 2012-01-16 | 2012-01-16 | Bottom board structure for manufacturing right angle circuit board copper conductor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202285459U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108012432A (en) * | 2017-11-27 | 2018-05-08 | 深南电路股份有限公司 | A kind of production method of millimetre-wave radar PCB |
| CN110557886A (en) * | 2019-09-03 | 2019-12-10 | 深圳市景旺电子股份有限公司 | Compensation method of Printed Circuit Board (PCB) cursor point, application of compensation method and PCB production process |
-
2012
- 2012-01-16 CN CN2012200215654U patent/CN202285459U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108012432A (en) * | 2017-11-27 | 2018-05-08 | 深南电路股份有限公司 | A kind of production method of millimetre-wave radar PCB |
| CN110557886A (en) * | 2019-09-03 | 2019-12-10 | 深圳市景旺电子股份有限公司 | Compensation method of Printed Circuit Board (PCB) cursor point, application of compensation method and PCB production process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120627 Termination date: 20130116 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |