CN202479714U - Grain filling composite electrode suitable for wide-gap brazing - Google Patents
Grain filling composite electrode suitable for wide-gap brazing Download PDFInfo
- Publication number
- CN202479714U CN202479714U CN2012201186822U CN201220118682U CN202479714U CN 202479714 U CN202479714 U CN 202479714U CN 2012201186822 U CN2012201186822 U CN 2012201186822U CN 201220118682 U CN201220118682 U CN 201220118682U CN 202479714 U CN202479714 U CN 202479714U
- Authority
- CN
- China
- Prior art keywords
- solder
- brazing
- particle
- gap
- composite electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 22
- 238000005219 brazing Methods 0.000 title abstract description 27
- 239000002245 particle Substances 0.000 claims description 36
- 229910000679 solder Inorganic materials 0.000 claims description 36
- 238000005476 soldering Methods 0.000 claims description 27
- 239000013528 metallic particle Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 abstract description 19
- 229910052751 metal Inorganic materials 0.000 abstract description 18
- 239000002184 metal Substances 0.000 abstract description 18
- 230000008569 process Effects 0.000 abstract description 11
- 239000000945 filler Substances 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 abstract 2
- 239000002699 waste material Substances 0.000 abstract 1
- 239000000843 powder Substances 0.000 description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- 238000005266 casting Methods 0.000 description 7
- 230000004907 flux Effects 0.000 description 7
- 239000007788 liquid Substances 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 5
- 230000006698 induction Effects 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000000203 mixture Substances 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 229910017518 Cu Zn Inorganic materials 0.000 description 3
- 229910017752 Cu-Zn Inorganic materials 0.000 description 3
- 229910017943 Cu—Zn Inorganic materials 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 229910000570 Cupronickel Inorganic materials 0.000 description 2
- 229910017709 Ni Co Inorganic materials 0.000 description 2
- 229910003267 Ni-Co Inorganic materials 0.000 description 2
- 229910003262 Ni‐Co Inorganic materials 0.000 description 2
- 229910052793 cadmium Inorganic materials 0.000 description 2
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910017693 AgCuTi Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000635 Spelter Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- PDYXSJSAMVACOH-UHFFFAOYSA-N [Cu].[Zn].[Sn] Chemical compound [Cu].[Zn].[Sn] PDYXSJSAMVACOH-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000011204 carbon fibre-reinforced silicon carbide Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 239000008240 homogeneous mixture Substances 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000320 mechanical mixture Substances 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Images
Landscapes
- Powder Metallurgy (AREA)
Abstract
The utility model provides a grain filling composite electrode suitable for wide-gap brazing, which is characterized by comprising an adhesive inner core prepared by metal grains with grain size of 0.05mm to 0.3mm and an outer ring layer brazing filler metal coated on the adhesive inner core. With the adoption of the electrode, the problems of difficult wide-gap brazing process and loss and waste of brazing filler metal are solved, and the electrode is suitable for processes such as the flame brazing process and the sensitive brazing process, and the like at the wide gap of 0.8mm to 2.0mm.
Description
Technical field
The utility model relates to a kind of composite electrode, is particularly useful for the particle joint filling soldering in the big gap of 0.8 ~ 2.0mm.
Technical background
During soldering, guarantee that whole gaps that liquid solder fills up brazed seam are preconditions of guaranteeing the soldered fitting premium properties.Generally, the joint gap is less, and liquid solder relies on capillarity in the joint gap, to flow, and fills up brazed seam; When the joint gap big (＞0.5mm) time; Only rely on capillary force to be not enough to that liquid solder is sucked the gap and form superior in quality soldered fitting; Even can't form brazed seam, because the joint gap is bigger, cause the loss of liquid solder during soldering easily simultaneously; Reduce soldered fitting quality and soldering efficient, increase brazing cost.
The solder method by hand that big gap soldering processes will be enough to fill up the play movement usually is preset in joint and connects the surface, during soldering, reaches purpose of connecting thereby rely in the solder some element to produce atom diffusion; The mode of inserting also can adopt to mix packs method into or presets the method for handling metal powder.
Mix the method for packing into and be and metal powder and solder mixed by proper ratio to place place, joint gap, its advantage be that ratio is easy to.When the Lu Shou equality people of Beijing Inst. of Aeronautical Materials has studied the soldering of big gap, preset and handle the influence that metal powder (or alloyed powder) butt joint is shaped and organizes.Presetting facture is earlier the joint gap to be filled up with metal powder, loads solder again in brazed seam mouth place.During soldering, metal powder plays skeleton function, utilizes the capillarity between metal powder to make liquid solder fill up the joint gap, simultaneously between metal powder and solder counterdiffusion mutually and dissolving takes place also.Compare and mix the method for packing into, preset processing and be easy to obtain good weld seam, but this method can not accurately be controlled the ratio of solder and metal powder.Simultaneously the workload of manual preseting solder or metal powder joint filling is bigger, operates more loaded down with trivial detailsly, and solder runs off easily.
Disclose the paste composite soldering that a kind of Ag, Ni or Cu particle and tin-lead solder, paste brazing flux mechanical mixture form among the patent CN 1358606A, can significantly improve creep-resistant property.Disclose a kind of composite soldering that is mixed by particle diameter 1 ~ 10 μ m copper powder, powdery tin spelter solder and paste brazing flux among the patent CN 100488703C, this solder has high creep resistance and fatigue performance, and Joint Reliability is improved simultaneously.A kind of Ni particle strengthening tin and silver group leadless composite solder and preparation method thereof is disclosed among the patent CN 101224526A, Ni grain diameter 2 ~ 3 μ m, with matrix generation metallurgical binding, solder physical property and spreading property are good, improve shearing strength of joint simultaneously.Metal powder particle diameter in the above-mentioned several kinds of composite solderings is all less, is distributed in the matrix as enhanced granule, mainly plays dispersion-strengthened action, is used to improve the mechanical property of joint, is not suitable for big gap soldering processes, and is paste solder.
Patent CN 102173848A discloses a kind of paste solder that machinery mixes, method for welding in vacuum brazing thin-walled C/SiC composite and the big gap of TC4 titanium alloy of between test specimen, applying in advance.Paste solder is the mixture of AgCuTi and SiC powder, and brazed seam layer/joint gap is used for the interfacial stress of slowly-releasing low temperature-high-temperature temperature alternation environment.This solder also is a paste solder, and used SiC powder degree is less than 0.075mm.
Therefore; Provide a kind of soldering processes simple; The brazing filler metal erosion less wastage, solder and metallic particles adjustable ratio can guarantee that again big gap brazed seam well is shaped simultaneously; Being applicable to the novel joint filling composite soldering of kinds of processes such as gas brazing, induction brazing, is problem demanding prompt solution in the soldering tech of big gap.
Summary of the invention
The purpose of the utility model is to existing weak point in the soldering tech of existing big gap, and a kind of particle joint filling composite electrode that is applicable to the soldering of big gap is provided.
The purpose of the utility model can realize through following technique measures:
The particle joint filling composite electrode that is applicable to the soldering of big gap of the utility model is that the metallic particles of 0.05 ~ 0.3mm bonding inner core that is prepared from and the outer circular layer solder that is wrapped on the bonding inner core are formed by particle diameter.
The said bonding inner core of the utility model is mixed by raw materials by weight percent and forms, wherein: metallic particles 90% ~ 95%, brazing flux 4% ~ 10%, binding agent 0% ~ 3%.
The described outer circular layer solder of the utility model is any one in silver-bearing copper nickel solder, silver-bearing copper tin solder, Ag-Cu-Zn tin solder, the Ag-Cu-Zn cadmium solder.
The said metallic particles of the utility model is taken from any one in Cu particle, Ni particle, Ti particle, Mo particle, Cr particle or the Co particle that particle diameter is 0.05 ~ 0.3mm, or two kinds, and two or more mixture; The volume fraction of said metallic particles is 15% ~ 40%.
The composite electrode that the utility model provides adopts conventional preparation method to produce: the batching of outer circular layer silver solder is smelted into ingot casting through vacuum medium frequency induction furnace; Ingot casting carries out homogenizing annealing subsequently; Adopt the moving extrusion of Composite Double to produce composite electrode again, promptly keep the trip of ingot casting core motionless, utilize hollow pressure ram that ingot casting is exerted pressure; The head of the pressue device ingot casting of riving; The homogeneous mixture of metallic particles, brazing flux and binding agent is pressed into ingot casting inside, and ingot casting seam again finally is extruded into above-mentioned composite electrode in extrusion die cavity.
The welding rod of the utility model structure is applicable to particle joint filling soldering processes such as the gas brazing, induction brazing in the big gap of 0.8 ~ 2.0mm.
The beneficial effect of the utility model is following:
The particle joint filling composite electrode of the utility model utilizes the skeleton function of refractory metal particle in soldering, causes capillarity, and liquid solder is sucked in the big gap, forms brazed seam.Its soldering processes are simple; Exempt traditional big gap soldering processes and preset the workload of metal powder or mixed powder in earlier stage; Reduced the brazing filler metal erosion wasting phenomenon; Simultaneously can guarantee big gap soldered fitting quality, can be formed directly in superior in quality brazed seam, have higher production efficiency through gas brazing or induction brazing.
Description of drawings
Fig. 1 is a Ti particle joint filling silver-bearing copper nickel composite electrode cross-sectional view.
Fig. 2 is a Ni particle joint filling Ag-Cu-Zn cadmium composite electrode cross-sectional view.
Fig. 3 is a Ni-Co particle joint filling silver-bearing copper zinc-tin composite electrode cross-sectional view.
The specific embodiment
To combine embodiment (accompanying drawing) to further describe below the utility model:
Embodiment 1:
As shown in Figure 1, core diameter 4.0mm, circular layer outside structure is divided into (1) and bonding inner core (2), outer circular layer main component is BAg56CuNi; Bonding inner core diameter 2.4mm, bonding inner core are mixed by following weight percentages and form, wherein: metallic particles 91%, brazing flux 7%, binding agent 2%; Said metallic particles is the metal Ti particle (3) of particle diameter 0.16mm, and the metal Ti grain volume fraction is about 34%.Adopt gas brazing 1.4mm big gap butt weld, directly soldering is shaped, no solder cross flow, and the brazed seam form is full, reliable in quality.
Embodiment 2:
As shown in Figure 2, core diameter 5.0mm, circular layer outside structure is divided into (1) and bonding inner core (2), outer circular layer main component is BAg20CuZnCd; Bonding inner core diameter 2.2mm, bonding inner core are mixed by following weight percentages and form, wherein: metallic particles 92%, brazing flux 8%, binding agent 0%; Said metallic particles is by the Ni particle A of particle diameter 0.10mm
1(4) and the Ni particle A of particle diameter 0.20mm
2(5) two kinds of forms are formed (A
1%:A
2%=60:40, volume ratio), wherein Ni particle total volume fraction is about 17.0%.Adopt induction brazing 2.0mm big gap butt weld, directly soldering is shaped, no solder cross flow, and the brazed seam form is full, reliable in quality.
Embodiment 3:
As shown in Figure 3, core diameter 3.6mm, circular layer outside structure is divided into (1) and bonding inner core (2), outer circular layer main component is BAg45CuZnSn; Bonding inner core diameter 1.5mm, bonding inner core are mixed by following weight percentages and form, wherein: metallic particles 93%, brazing flux 4.5%, binding agent 2.5%; Said metallic particles is formed (A%:B%=88:12, volume ratio) for (7) two kinds by the Ni particle A (6) of particle diameter 0.08mm and the Co particle B of particle diameter 0.06mm, and wherein Ni-Co particle total volume fraction is about 15.0%.Adopt gas brazing 0.8mm big gap butt weld, directly soldering is shaped, no solder cross flow, and the brazed seam form is full, reliable in quality.
Claims (1)
1. particle joint filling composite electrode that is applicable to the soldering of big gap is characterized in that: said composite electrode is that metallic particles bonding inner core that is prepared from and the outer circular layer solder that is wrapped on the bonding inner core of 0.05 ~ 0.3mm formed by particle diameter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201186822U CN202479714U (en) | 2012-03-27 | 2012-03-27 | Grain filling composite electrode suitable for wide-gap brazing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201186822U CN202479714U (en) | 2012-03-27 | 2012-03-27 | Grain filling composite electrode suitable for wide-gap brazing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202479714U true CN202479714U (en) | 2012-10-10 |
Family
ID=46954174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012201186822U Expired - Fee Related CN202479714U (en) | 2012-03-27 | 2012-03-27 | Grain filling composite electrode suitable for wide-gap brazing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202479714U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107866617A (en) * | 2016-09-23 | 2018-04-03 | 中国航空工业集团公司北京航空制造工程研究所 | A kind of wide-gap brazing metal dust fill method |
-
2012
- 2012-03-27 CN CN2012201186822U patent/CN202479714U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107866617A (en) * | 2016-09-23 | 2018-04-03 | 中国航空工业集团公司北京航空制造工程研究所 | A kind of wide-gap brazing metal dust fill method |
| CN107866617B (en) * | 2016-09-23 | 2020-03-17 | 中国航空制造技术研究院 | Metal powder filling method for large-gap brazing |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102581505A (en) | Seam particle filling composite welding rod applicable to large-gap brazing | |
| TWI505899B (en) | A bonding method, a bonding structure, and a method for manufacturing the same | |
| EP2647467A3 (en) | Solder cream and method of soldering electronic parts | |
| CN105081599B (en) | Medicine core soldering bar with diaphragm and preparation method thereof | |
| JP2014180690A (en) | Sheet-like high-temperature solder joint material, and die bonding method using the same | |
| CN104526181A (en) | Electric vacuum silver base alloy solder for vacuum electronic device brazing sealing and preparation method thereof | |
| CN108127290B (en) | Brazing material for welding porous material and application thereof | |
| CN102172805B (en) | Low-cost anti-aging brazing filler material used for electronic packaging and preparation method thereof | |
| CN202479714U (en) | Grain filling composite electrode suitable for wide-gap brazing | |
| CN105252163A (en) | Lead-free tin-soldering wire applied to automatic soldering robot and preparation method thereof | |
| CN102626838B (en) | Silver-based cadmium-free medium temperature brazing filler metal and preparation method thereof | |
| CN102248323B (en) | Silver-based cadmium-free medium-temperature solder and preparation method thereof | |
| CN102513727B (en) | Self-fluxing silver solder containing neodymium, zirconium and gallium | |
| CN103084749B (en) | The lead-free brazing in a kind of high service life | |
| CN105834613B (en) | A kind of solder being exclusively used in four-way valve high frequency brazing | |
| CN102699567A (en) | Zirconium-containing copper silver titanium solder alloy | |
| CN204686295U (en) | Metal-cored composite silver solder | |
| CN103084760B (en) | For the welding wire of aluminium alloy/steel different-metal material welding | |
| CN106312369A (en) | Solder for connecting ceramics with kovar alloys | |
| CN106271183B (en) | MEMS device three-dimension packaging interconnection material | |
| CN106507723B (en) | A kind of titanium alloy low temperature brazing material, the preparation of solder and its using method | |
| CN106695160A (en) | Automatic tin soldering wire of robot | |
| CN106548880B (en) | A kind of Ag-based electrical contact that can be directly brazed and its manufacturing method | |
| CN100488703C (en) | Copper powder reinforced composite Sn-Zn brazing alloy and its preparation process | |
| CN102554504B (en) | Self-soldering silver solder containing praseodymium, zirconium and gallium |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Fengyang high tech Industrial Development Zone, Henan province Zhengzhou city 450001 Street No. 10 Patentee after: Zhengzhou Machinery Research Institute Co., Ltd. Address before: Fengyang high tech Industrial Development Zone, Henan province Zhengzhou city 450001 Street No. 10 Patentee before: Zhengzhou Research Institute of Mechanical Engineering |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121010 Termination date: 20190327 |