CN102581505A - Seam particle filling composite welding rod applicable to large-gap brazing - Google Patents

Seam particle filling composite welding rod applicable to large-gap brazing Download PDF

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Publication number
CN102581505A
CN102581505A CN2012100832780A CN201210083278A CN102581505A CN 102581505 A CN102581505 A CN 102581505A CN 2012100832780 A CN2012100832780 A CN 2012100832780A CN 201210083278 A CN201210083278 A CN 201210083278A CN 102581505 A CN102581505 A CN 102581505A
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China
Prior art keywords
particle
brazing
solder
soldering
applicable
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CN2012100832780A
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Chinese (zh)
Inventor
孙华为
龙伟民
鲍丽
袁宏高
齐剑钊
张冠星
薛行雁
张强
赵建昌
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Zhengzhou Research Institute of Mechanical Engineering Co Ltd
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Zhengzhou Research Institute of Mechanical Engineering Co Ltd
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Priority to CN2012100832780A priority Critical patent/CN102581505A/en
Publication of CN102581505A publication Critical patent/CN102581505A/en
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Abstract

A seam particle filling composite welding rod applicable to large-gap brazing is characterized by consisting of a binding inner core and an outer annular brazing filler layer, the binding inner core is formed by mixing the following raw materials: by weight percentage, 90-95% of metal particles, 4-10% of brazing flux, and 0-3% of binder. The seam particle filling composite welding rod solves the problems of complexity in brazing process and loss waste of brazing flux in existing large-gap brazing, is applicable to processes of torch brazing and sensing brazing and the like for large gaps of 0.8 mm to 2.0mm.

Description

A kind of particle joint filling composite electrode that is applicable to the soldering of big gap
Technical field
The present invention relates to a kind of composite electrode, be particularly useful for the particle joint filling soldering in the big gap of 0.8 ~ 2.0mm.
Technical background
During soldering, guarantee that whole gaps that liquid solder fills up brazed seam are preconditions of guaranteeing the soldered fitting premium properties.Generally, the joint gap is less, and liquid solder relies on capillarity in the joint gap, to flow, and fills up brazed seam; When the joint gap big (>0.5mm) time; Only rely on capillary force to be not enough to that liquid solder is sucked the gap and form superior in quality soldered fitting; Even can't form brazed seam, because the joint gap is bigger, cause the loss of liquid solder during soldering easily simultaneously; Reduce soldered fitting quality and soldering efficient, increase brazing cost.
The solder method by hand that big gap soldering processes will be enough to fill up the play movement usually is preset in joint and connects the surface, during soldering, reaches purpose of connecting thereby rely in the solder some element to produce atom diffusion; The mode of inserting also can adopt to mix packs method into or presets the method for handling metal powder.
Mix the method for packing into and be and metal powder and solder mixed by proper ratio to place place, joint gap, its advantage be that ratio is easy to.When the Lu Shou equality people of Beijing Inst. of Aeronautical Materials has studied the soldering of big gap, preset and handle the influence that metal powder (or alloyed powder) butt joint is shaped and organizes.Presetting facture is earlier the joint gap to be filled up with metal powder, loads solder again in brazed seam mouth place.During soldering, metal powder plays skeleton function, utilizes the capillarity between metal powder to make liquid solder fill up the joint gap, simultaneously between metal powder and solder counterdiffusion mutually and dissolving takes place also.Compare and mix the method for packing into, preset processing and be easy to obtain good weld seam, but this method can not accurately be controlled the ratio of solder and metal powder.Simultaneously the workload of manual preseting solder or metal powder joint filling is bigger, operates more loaded down with trivial detailsly, and solder runs off easily.
Disclose the paste composite soldering that a kind of Ag, Ni or Cu particle and tin-lead solder, paste brazing flux mechanical mixture form among the patent CN 1358606A, can significantly improve creep-resistant property.Disclose a kind of composite soldering that is mixed by particle diameter 1 ~ 10 μ m copper powder, powdery tin spelter solder and paste brazing flux among the patent CN 100488703C, this solder has high creep resistance and fatigue performance, and Joint Reliability is improved simultaneously.A kind of Ni particle strengthening tin and silver group leadless composite solder and preparation method thereof is disclosed among the patent CN 101224526A, Ni grain diameter 2 ~ 3 μ m, with matrix generation metallurgical binding, solder physical property and spreading property are good, improve shearing strength of joint simultaneously.Metal powder particle diameter in the above-mentioned several kinds of composite solderings is all less, is distributed in the matrix as enhanced granule, mainly plays dispersion-strengthened action, is used to improve the mechanical property of joint, is not suitable for big gap soldering processes, and is paste solder.
Patent CN 102173848A discloses a kind of paste solder that machinery mixes, method for welding in vacuum brazing thin-walled C/SiC composite and the big gap of TC4 titanium alloy of between test specimen, applying in advance.Paste solder is the mixture of AgCuTi and SiC powder, and brazed seam layer/joint gap is used for the interfacial stress of slowly-releasing low temperature-high-temperature temperature alternation environment.This solder also is a paste solder, and used SiC powder degree is less than 0.075mm.
Therefore; Provide a kind of soldering processes simple; The brazing filler metal erosion less wastage, solder and metallic particles adjustable ratio can guarantee that again big gap brazed seam well is shaped simultaneously; Being applicable to the novel joint filling composite soldering of kinds of processes such as gas brazing, induction brazing, is problem demanding prompt solution in the soldering tech of big gap.
Summary of the invention
The objective of the invention is provides a kind of particle joint filling composite electrode that is applicable to the soldering of big gap to existing weak point in the soldering tech of existing big gap.
The object of the invention can be realized through following technique measures:
The particle joint filling composite electrode that is applicable to the soldering of big gap of the present invention is characterized in that: said composite electrode is made up of bonding inner core and the outer circular layer solder that is wrapped on the bonding inner core; Said bonding inner core is mixed by raw materials by weight percent and forms, wherein: metallic particles 90% ~ 95%, brazing flux 4% ~ 10%, binding agent 0% ~ 3%.
Outer circular layer solder of the present invention is any one in silver-bearing copper nickel solder, silver-bearing copper tin solder, Ag-Cu-Zn tin solder, the Ag-Cu-Zn cadmium solder.
Metallic particles according to the invention is taken from any one in Cu particle, Ni particle, Ti particle, Mo particle, Cr particle or the Co particle that particle diameter is 0.05 ~ 0.3mm, or two kinds, and two or more mixture; The volume fraction of said metallic particles is 15% ~ 40%.
Composite electrode provided by the invention adopts conventional preparation method to produce: the batching of outer circular layer silver solder is smelted into ingot casting through vacuum medium frequency induction furnace; Ingot casting carries out homogenizing annealing subsequently; Adopt the moving extrusion of Composite Double to produce composite electrode again, promptly keep the trip of ingot casting core motionless, utilize hollow pressure ram that ingot casting is exerted pressure; The head of the pressue device ingot casting of riving; The homogeneous mixture of metallic particles, brazing flux and binding agent is pressed into ingot casting inside, and ingot casting seam again finally is extruded into above-mentioned composite electrode in extrusion die cavity.
The welding rod of structure of the present invention is applicable to particle joint filling soldering processes such as the gas brazing, induction brazing in the big gap of 0.8 ~ 2.0mm.
Beneficial effect of the present invention is following:
Particle joint filling composite electrode of the present invention utilizes the skeleton function of refractory metal particle in soldering, causes capillarity, and liquid solder is sucked in the big gap, forms brazed seam.Its soldering processes are simple; Exempt traditional big gap soldering processes and preset the workload of metal powder or mixed powder in earlier stage; Reduced the brazing filler metal erosion wasting phenomenon; Simultaneously can guarantee big gap soldered fitting quality, can be formed directly in superior in quality brazed seam, have higher production efficiency through gas brazing or induction brazing.
Description of drawings
Fig. 1 is a Ti particle joint filling silver-bearing copper nickel composite electrode cross-sectional view.
Fig. 2 is a Ni particle joint filling Ag-Cu-Zn cadmium composite electrode cross-sectional view.
Fig. 3 is a Ni-Co particle joint filling silver-bearing copper zinc-tin composite electrode cross-sectional view.
The specific embodiment
To combine embodiment (accompanying drawing) to further describe below the present invention:
Embodiment 1:
As shown in Figure 1, core diameter 4.0mm, circular layer outside structure is divided into (1) and bonding inner core (2), outer circular layer main component is BAg56CuNi; Bonding inner core diameter 2.4mm, bonding inner core are mixed by following weight percentages and form, wherein: metallic particles 91%, brazing flux 7%, binding agent 2%; Said metallic particles is the metal Ti particle (3) of particle diameter 0.16mm, and the metal Ti grain volume fraction is about 34%.Adopt gas brazing 1.4mm big gap butt weld, directly soldering is shaped, no solder cross flow, and the brazed seam form is full, reliable in quality.
Embodiment 2:
As shown in Figure 2, core diameter 5.0mm, circular layer outside structure is divided into (1) and bonding inner core (2), outer circular layer main component is BAg20CuZnCd; Bonding inner core diameter 2.2mm, bonding inner core are mixed by following weight percentages and form, wherein: metallic particles 92%, brazing flux 8%, binding agent 0%; Said metallic particles is by the Ni particle A of particle diameter 0.10mm 1(4) and the Ni particle A of particle diameter 0.20mm 2(5) two kinds of forms are formed (A 1%:A 2%=60:40, volume ratio), wherein Ni particle total volume fraction is about 17.0%.Adopt induction brazing 2.0mm big gap butt weld, directly soldering is shaped, no solder cross flow, and the brazed seam form is full, reliable in quality.
Embodiment 3:
As shown in Figure 3, core diameter 3.6mm, circular layer outside structure is divided into (1) and bonding inner core (2), outer circular layer main component is BAg45CuZnSn; Bonding inner core diameter 1.5mm, bonding inner core are mixed by following weight percentages and form, wherein: metallic particles 93%, brazing flux 4.5%, binding agent 2.5%; Said metallic particles is formed (A%:B%=88:12, volume ratio) for (7) two kinds by the Ni particle A (6) of particle diameter 0.08mm and the Co particle B of particle diameter 0.06mm, and wherein Ni-Co particle total volume fraction is about 15.0%.Adopt gas brazing 0.8mm big gap butt weld, directly soldering is shaped, no solder cross flow, and the brazed seam form is full, reliable in quality.

Claims (3)

1. particle joint filling composite electrode that is applicable to the soldering of big gap is characterized in that: said composite electrode is made up of bonding inner core and the outer circular layer solder that is wrapped on the bonding inner core; Said bonding inner core is mixed by following weight percentages and forms, wherein: metallic particles 90% ~ 95%, brazing flux 4% ~ 10%, binding agent 0% ~ 3%.
2. require the described particle joint filling composite electrode that is applicable to the soldering of big gap according to right 1, it is characterized in that: said outer circular layer solder is any one in silver-bearing copper nickel solder, silver-bearing copper tin solder, Ag-Cu-Zn tin solder, the Ag-Cu-Zn cadmium solder.
3. require the described particle joint filling composite electrode that is applicable to the soldering of big gap according to right 1; It is characterized in that: said metallic particles is taken from any one in Cu particle, Ni particle, Ti particle, Mo particle, Cr particle or the Co particle that particle diameter is 0.05 ~ 0.3mm, or two kinds, and two or more mixture.
CN2012100832780A 2012-03-27 2012-03-27 Seam particle filling composite welding rod applicable to large-gap brazing Pending CN102581505A (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102990241A (en) * 2012-08-24 2013-03-27 张�林 Metal powder welding material special for high-frequency welding machine
CN104907723A (en) * 2015-05-25 2015-09-16 郑州机械研究所 Flux-cored silver brazing filler metal with toughening alloy
CN105108378A (en) * 2015-09-08 2015-12-02 龙飞 Flux-cored welding bar for preventing soldering flux from loss
CN112091477A (en) * 2019-10-24 2020-12-18 浙江新锐焊接科技股份有限公司 High-performance composite brazing material with low brazing flux residue
CN113695783A (en) * 2021-06-30 2021-11-26 郑州机械研究所有限公司 Brazing material for shield cutter, preparation method thereof and brazing method
CN114310029A (en) * 2022-03-08 2022-04-12 中机智能装备创新研究院(宁波)有限公司 Variable-gap and large-gap composite brazing filler metal and preparation method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3163500A (en) * 1962-08-03 1964-12-29 Engelhard Ind Inc Sandwich composite brazing alloy
CN1358606A (en) * 2001-12-19 2002-07-17 北京工业大学 Metal granule reinforced tin-lead base composite soldering flux and making method
CN101537520A (en) * 2009-04-30 2009-09-23 顺特电气有限公司 Brazing method of aluminum electromagnetic wire and brass
CN101537546A (en) * 2009-04-17 2009-09-23 南京航空航天大学 Sn-Ag-Cu lead-free solder containing Pr, Ni and Ga
CN101537547A (en) * 2009-04-17 2009-09-23 南京航空航天大学 Sn-Ag-Cu lead-free solder containing Nd, Ni and Co

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3163500A (en) * 1962-08-03 1964-12-29 Engelhard Ind Inc Sandwich composite brazing alloy
CN1358606A (en) * 2001-12-19 2002-07-17 北京工业大学 Metal granule reinforced tin-lead base composite soldering flux and making method
CN101537546A (en) * 2009-04-17 2009-09-23 南京航空航天大学 Sn-Ag-Cu lead-free solder containing Pr, Ni and Ga
CN101537547A (en) * 2009-04-17 2009-09-23 南京航空航天大学 Sn-Ag-Cu lead-free solder containing Nd, Ni and Co
CN101537520A (en) * 2009-04-30 2009-09-23 顺特电气有限公司 Brazing method of aluminum electromagnetic wire and brass

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102990241A (en) * 2012-08-24 2013-03-27 张�林 Metal powder welding material special for high-frequency welding machine
CN102990241B (en) * 2012-08-24 2015-07-22 张�林 Metal powder welding material special for high-frequency welding machine
CN104907723A (en) * 2015-05-25 2015-09-16 郑州机械研究所 Flux-cored silver brazing filler metal with toughening alloy
CN104907723B (en) * 2015-05-25 2017-08-25 郑州机械研究所 Carry the medicine core silver solder of increasing tougheness alloy
CN105108378A (en) * 2015-09-08 2015-12-02 龙飞 Flux-cored welding bar for preventing soldering flux from loss
CN112091477A (en) * 2019-10-24 2020-12-18 浙江新锐焊接科技股份有限公司 High-performance composite brazing material with low brazing flux residue
CN113695783A (en) * 2021-06-30 2021-11-26 郑州机械研究所有限公司 Brazing material for shield cutter, preparation method thereof and brazing method
CN113695783B (en) * 2021-06-30 2023-04-28 郑州机械研究所有限公司 Brazing material for shield cutter, preparation method of brazing material and brazing method
CN114310029A (en) * 2022-03-08 2022-04-12 中机智能装备创新研究院(宁波)有限公司 Variable-gap and large-gap composite brazing filler metal and preparation method thereof

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Application publication date: 20120718