CN1358606A - Metal granule reinforced tin-lead base composite soldering flux and making method - Google Patents
Metal granule reinforced tin-lead base composite soldering flux and making method Download PDFInfo
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- CN1358606A CN1358606A CN 01144487 CN01144487A CN1358606A CN 1358606 A CN1358606 A CN 1358606A CN 01144487 CN01144487 CN 01144487 CN 01144487 A CN01144487 A CN 01144487A CN 1358606 A CN1358606 A CN 1358606A
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- solder
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- metallic particles
- lead base
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- 239000002131 composite material Substances 0.000 title claims abstract description 41
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 title claims abstract description 21
- 238000005476 soldering Methods 0.000 title claims abstract description 21
- 230000004907 flux Effects 0.000 title claims abstract description 9
- 239000002184 metal Substances 0.000 title abstract description 4
- 229910052751 metal Inorganic materials 0.000 title abstract description 4
- 239000008187 granular material Substances 0.000 title abstract 3
- 238000000034 method Methods 0.000 title description 7
- 229910000679 solder Inorganic materials 0.000 claims abstract description 62
- 238000002360 preparation method Methods 0.000 claims abstract description 14
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000013528 metallic particle Substances 0.000 claims description 34
- 238000005219 brazing Methods 0.000 claims description 32
- 229910045601 alloy Inorganic materials 0.000 claims description 30
- 239000000956 alloy Substances 0.000 claims description 30
- 229910020816 Sn Pb Inorganic materials 0.000 claims description 28
- 229910020922 Sn-Pb Inorganic materials 0.000 claims description 28
- 229910008783 Sn—Pb Inorganic materials 0.000 claims description 28
- 230000002708 enhancing effect Effects 0.000 claims description 12
- 239000000320 mechanical mixture Substances 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 2
- 238000003756 stirring Methods 0.000 claims description 2
- 238000005728 strengthening Methods 0.000 abstract description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 2
- 238000002844 melting Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 238000009736 wetting Methods 0.000 abstract 1
- 238000012360 testing method Methods 0.000 description 12
- 230000014509 gene expression Effects 0.000 description 10
- 238000003466 welding Methods 0.000 description 8
- 238000013019 agitation Methods 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000006071 cream Substances 0.000 description 5
- 238000005303 weighing Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052787 antimony Inorganic materials 0.000 description 4
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 230000005496 eutectics Effects 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 3
- 229910000765 intermetallic Inorganic materials 0.000 description 3
- 238000001556 precipitation Methods 0.000 description 3
- 229910001074 Lay pewter Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 240000006409 Acacia auriculiformis Species 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Abstract
The present invention relates to a metal granule strengthened tin-lead base composite solder and its preparation method, including granular tin-lead base body and granular strengthening body. It is characterized by that the described granular tin-lead base body size is 35-74 micrometer, in which weight ratio of tin is 5-95%, the rest is lead, and the granular strengthening body size is as follows: size of Ag is 0.5-5 micrometer, size of nickel is 0.5-5 micrometer and size of Cu is 0.5-35 micrometer, and the volume ratio of said strengthening body in the composite solder is 1-15%. The above-mentioned tin-lead solder, strengthening body granules and paste soldering flux are uniformly mechanically mixed, and stirred for above 15 min. so as to obtain the invented solder with strong creep resistance, low melting temp. and good wetting property, etc.
Description
One, technical field
Sn-Pb based composite brazing alloy that metallic particles strengthens and preparation method thereof belongs to Metal Substrate composite soldering technical field.
Two, background technology
Tin-lead solder is widely used in electronics industry, and realize in the components and parts and components and parts and printed circuit board (PCB) between be electrically connected and mechanical connection.Along with the miniaturization of components and parts and the development of surface installation technique, more and more higher to the requirement of microstructure stability, the mechanical property, particularly creep-resistant property of solder.Particularly in the photoelectron assembling, being positioned in the whole service life-span between the element must keep accurately.For example, taking on the project at laser instrument, Light-Emitting Diode and light connects, and any displacement that causes because of creep all may influence the transmission quality of optical signal, even the transmission signal is completely lost.At present, in the photoelectron assembling, extensively adopt the auri solder, as the 80Au-30Sn eutectic solder, though this solder creep resistance is higher, but solder fusing point higher (273 ℃), too high brazing temperature may cause damage to optical fiber or opto-electronic device, and costs an arm and a leg.In addition, automotive electronics and Military Electronic Equipment also have very high requirement to the creep-resistant property of solder.
Plumbous eutectic of tin or nearly eutectic solder fusing point lower (183 ℃), cheap, the soldering processes performance is good, but creep-resistant property is poor.For improving the mechanical property of tin-lead solder, often adopt two kinds of methods: precipitation strength and dispersion-strengtherning.The composition that precipitation strength requires to be added must adapt with metallic matrix, and the adding of alloying element can not too destroy the physical property of solder and the processing performance of soldering.In addition, the microscopic structure instability of precipitation strength solder joint, precipitated phase is alligatoring easily in time, and the mechanical property of the precipitated phase butt welded seam of alligatoring may be harmful to.And dispersion-strengtherning, dispersoid adds, and has bigger choice, and can control microscopic structure preferably.
It is the antimony of 0.3-1.0% that Japan Patent JP11333590 proposes to add weight ratio in tin-lead solder, the calcium of 0.001-0.15%, and the silver of 0.5-3.0%, the copper of 0.1-0.8% and the indium of 0.3-2.0% form a kind of seven yuan of solder alloies.In addition, Japan proposes at Chinese patents CN1110203A, contains the lead that weight ratio is 15-80% in the leypewter solder, the silver of 0.1-5%, and the antimony of 0.1-10%, the phosphorus of 0.0005-0.3%, all the other are tin, form a kind of quinary alloy solder.Above-mentioned two kinds of solders all are that interpolation silver, copper, antimony, indium etc. are element alloyed on the basis of tin-lead solder, realize strengthening by the intermetallic compound that is settled out elements such as silver, copper, antimony, indium in the postwelding tissue.But because postwelding microscopic structure instability, the precipitated phase alligatoring causes the mechanical property of brazing metal to reduce.In addition, these two kinds of solders have also changed the good physical property of tin-lead solder largely in the creep-resistant property that improves tin-lead solder.Holland Phillippe light modulation manufacturing company proposes at Chinese patents CN1059372A, adds the intermetallic compound that ranges up to 5% (volume), for example Ni in the leypewter solder
3Sn
4And CuNiSn
3Particulate, the alloy of formation dispersion-strengtherning.This patent of invention explanation: 100 ℃ of postweldings, be incubated 29 hours, crystal grain there is no obvious alligatoring and grows up, and infers that thus possibility tired and fracture occurring can reduce, but does not provide performance data.
Three, summary of the invention
The object of the present invention is to provide Sn-Pb based composite brazing alloy that a kind of creep-resistant property height, the preparation method is simple, cost is low metallic particles strengthen and preparation method thereof.
The Sn-Pb based composite brazing alloy that metallic particles provided by the present invention strengthens, comprise granular tin lead base body and granular enhancing body, it is characterized in that: described granular tin lead base body size is between 35-74 μ m, and wherein the weight ratio of tin is 5-95%, and all the other are plumbous; Described granular enhancing body be size the Ag between the 0.5-5 μ m, size at Ni between the 0.5-5 μ m or size the Cu between 0.5-38 μ m, the volume ratio of this enhancing body in composite soldering is 1-15%.
The preparation method of the Sn-Pb based composite brazing alloy that metallic particles provided by the present invention strengthens, it is characterized in that: tin-lead solder, enhancing body particle and paste brazing flux mechanical mixture is even, stir more than the 15min, the disperse of enhancing body is distributed in the tin lead base body, obtains the Sn-Pb based composite brazing alloy that the paste metallic particles strengthens.
The Sn-Pb based composite brazing alloy that metallic particles provided by the invention strengthens, composition is simple relatively, strengthens body and adopts pure metal particles.In the reflow welding process, strengthen body and basal body interface generation metallurgical reaction, form the skim intermetallic compound, creep-resistant property increases substantially, and fusion temperature, wetability and soldering processes performance etc. are suitable with corresponding existing tin-lead solder, keep advantages such as the tin-lead solder fusion temperature is low, wetability good, the soldering processes performance is good, and the solder preparation is simple.
Four, description of drawings
Fig. 1: composite soldering average creep life of the statistical chart that the metallic particles of 67Sn-37Pb solder and example of the present invention 1 strengthens;
Fig. 2: composite soldering average creep life of the statistical chart that the metallic particles of 67Sn-37Pb solder and example of the present invention 2 strengthens;
Fig. 3: composite soldering average creep life of the statistical chart that the metallic particles of 67Sn-37Pb solder and example of the present invention 3 strengthens;
Fig. 4: composite soldering average creep life of the statistical chart that the metallic particles of 67Sn-37Pb solder and example of the present invention 4 strengthens;
Fig. 5: composite soldering average creep life of the statistical chart that the metallic particles of 67Sn-37Pb solder and example of the present invention 5 strengthens.，
Illustrate that below by accompanying drawing and corresponding specific embodiment the croop property of five kinds of solders of the present invention has greatly improved.For the size and the cooling condition of simulating the actual printed circuit boards soldered fitting, what adopt in creep test is miniature single lap joint, and the overlap joint area of welding point is 1mm
2, brazed seam thickness is 0.15mm.Creep loading is 11-17MPa, and temperature is 10-40 ℃.The connection material is a red copper foil, and thickness is 0.1mm.230-240 ℃ of reflow welding temperature.The Sn-Pb based composite brazing alloy sample that five kinds of metallic particles strengthen among the embodiment and 67Sn-37Pb solder sample all are preparations and testing under above-mentioned identical condition.
Fig. 1: miniature single statistical chart creep life that overlaps sample that Sn-Pb based composite brazing alloy that the metallic particles of example 1 of the present invention strengthens and 67Sn-37Pb solder form with reflow welding.The preparation of creep test specimen and the experimental condition of creep life such as above-mentioned.Equal 12 of two kinds of solder creep test specimens.Abscissa 1 expression 67Sn-37Pb solder, the composite soldering that the metallic particles of abscissa 2 expressions example 1 of the present invention strengthens; Ordinate is represented assembly average creep life of miniature single overlap joint sample.As seen from Figure 1: assembly average creep life of example 1 composite soldering of the present invention is 10 times of 67Sn-37Pb solder.
Fig. 2: miniature single statistical chart creep life that overlaps sample that Sn-Pb based composite brazing alloy that the metallic particles of example 2 of the present invention strengthens and 67Sn-37Pb solder form with reflow welding.The creep test material preparation and creep life experimental condition such as above-mentioned.Equal 12 of two kinds of solder creep test specimens.Abscissa 1 expression 67Sn-37Pb solder, the Sn-Pb based composite brazing alloy that the metallic particles of abscissa 2 expressions example 2 of the present invention strengthens; Ordinate is represented assembly average creep life of miniature single overlap joint sample.As seen from Figure 2: assembly average creep life of example 2 of the present invention is 9 times of 67Sn-37Pb solder.
Fig. 3: miniature single statistical chart creep life that overlaps sample that Sn-Pb based composite brazing alloy that the metallic particles of example 3 of the present invention strengthens and 67Sn-37Pb solder form with reflow welding.The preparation of creep test specimen and the experimental condition of creep life such as above-mentioned.The creep test specimen of the Sn-Pb based composite brazing alloy that the metallic particles of 67Sn-37Pb solder and example of the present invention 3 strengthens is respectively 12 and 6.Abscissa 1 expression 67Sn-37Pb solder, the Sn-Pb based composite brazing alloy that the metallic particles of abscissa 2 expressions example 3 of the present invention strengthens; Ordinate is represented assembly average creep life of miniature single overlap joint sample.As seen from Figure 3: assembly average creep life of example 3 of the present invention is more than 21 times of 67Sn-37Pb solder.
Fig. 4: miniature single statistical chart creep life that overlaps sample that Sn-Pb based composite brazing alloy that the metallic particles of example 4 of the present invention strengthens and 67Sn-37Pb solder form with reflow welding.The preparation of creep test specimen and the experimental condition of creep life such as above-mentioned.The creep test specimen of the Sn-Pb based composite brazing alloy that the metallic particles of 67Sn-37Pb solder and example of the present invention 4 strengthens is respectively 12 and 6.Abscissa 1 expression 67Sn-37Pb solder, the Sn-Pb based composite brazing alloy that the metallic particles of abscissa 2 expressions example 4 of the present invention strengthens; Ordinate is represented assembly average creep life of miniature single overlap joint sample.As seen from Figure 4: assembly average creep life of example 4 of the present invention is more than 21 times of 67Sn-37Pb solder.
Fig. 5: miniature single statistical chart creep life that overlaps sample that Sn-Pb based composite brazing alloy that the metallic particles of example 5 of the present invention strengthens and 67Sn-37Pb solder form with reflow welding.The preparation of creep test specimen and the experimental condition of creep life such as above-mentioned.The creep test specimen of the Sn-Pb based composite brazing alloy that the metallic particles of 67Sn-37Pb solder and example of the present invention 5 strengthens is respectively 12 and 6.Abscissa 1 expression 67Sn-37Pb solder, the Sn-Pb based composite brazing alloy that the metallic particles of abscissa 2 expressions example 5 of the present invention strengthens; Ordinate is represented assembly average creep life of miniature single overlap joint sample.As seen from Figure 5: assembly average creep life of example 5 of the present invention is 12 times of 67Sn-37Pb solder.
Five, the specific embodiment
Embodiment:
Example 1: soldering flux is cleaned in the Ag (being of a size of 1 μ m) and commercially available the exempting from of 1.36g that take by weighing 0.66g, put into more than the crucible mechanical mixture 10min, to be mixed evenly after, the 67Sn-37Pb solder (being of a size of 46 μ m) that adds 10g again, more than the mechanical agitation 15min, the Sn-Pb based composite brazing alloy cream that metallic particles strengthens is made, and requires low temperature to preserve simultaneously.
Example 2: soldering flux is cleaned in the Ag (being of a size of 1 μ m) and commercially available the exempting from of 1.5g that take by weighing 1.40g, put into more than the crucible mechanical mixture 10min, to be mixed evenly after, the 67Sn-37Pb solder (being of a size of 46 μ m) that adds 10g again, more than the mechanical agitation 15min, the Sn-Pb based composite brazing alloy cream that metallic particles strengthens is made, and requires low temperature to preserve simultaneously.
Example 3: soldering flux is cleaned in the Ni (being of a size of 1 μ m) and commercially available the exempting from of 1.36g that take by weighing 0.56g, put into more than the crucible mechanical mixture 10min, to be mixed evenly after, the 67Sn-37Pb solder (being of a size of 46 μ m) that adds 10g again, more than the mechanical agitation 15min, the Sn-Pb based composite brazing alloy cream that metallic particles strengthens is made, and requires low temperature to preserve simultaneously.
Example 4: soldering flux is cleaned in the Ni (being of a size of 1 μ m) and commercially available the exempting from of 1.5g that take by weighing 1.18g, put into more than the crucible mechanical mixture 10min, to be mixed evenly after, the 67Sn-37Pb solder (being of a size of 46 μ m) that adds 10g again, more than the mechanical agitation 15min, the Sn-Pb based composite brazing alloy cream that metallic particles strengthens is made, and requires low temperature to preserve simultaneously.
Example 5: soldering flux is cleaned in the Cu (being of a size of 38 μ m) and commercially available the exempting from of 1.36g that take by weighing 0.56g, put into more than the crucible mechanical mixture 10min, to be mixed evenly after, the 67Sn-37Pb solder (being of a size of 46 μ m) that adds 10g again, more than the mechanical agitation 15min, the Sn-Pb based composite brazing alloy cream that metallic particles strengthens is made, and requires low temperature to preserve simultaneously.
Claims (2)
1, a kind of Sn-Pb based composite brazing alloy of metallic particles enhancing comprises granular tin lead base body and granular enhancing body, and it is characterized in that: described granular tin lead base body size is between 35-74 μ m, and wherein the weight ratio of tin is 5-95%, and all the other are plumbous; Described granular enhancing body be size the Ag between the 0.5-5 μ m, size at Ni between the 0.5-5 μ m or size the Cu between 0.5-38 μ m, the volume ratio of this enhancing body in composite soldering is 1-15%.
2, the preparation method of the Sn-Pb based composite brazing alloy of metallic particles enhancing according to claim 1, it is characterized in that: tin-lead solder, enhancing body particle and paste brazing flux mechanical mixture is even, stir more than the 15min, the disperse of enhancing body is distributed in the tin lead base body, obtains the Sn-Pb based composite brazing alloy that the paste metallic particles strengthens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01144487 CN1358606A (en) | 2001-12-19 | 2001-12-19 | Metal granule reinforced tin-lead base composite soldering flux and making method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01144487 CN1358606A (en) | 2001-12-19 | 2001-12-19 | Metal granule reinforced tin-lead base composite soldering flux and making method |
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| Publication Number | Publication Date |
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| CN1358606A true CN1358606A (en) | 2002-07-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01144487 Pending CN1358606A (en) | 2001-12-19 | 2001-12-19 | Metal granule reinforced tin-lead base composite soldering flux and making method |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101920405A (en) * | 2010-08-23 | 2010-12-22 | 中国电力科学研究院 | Tin-lead-based composite solder for galvanized steel ground grid and preparation method thereof |
| CN102581505A (en) * | 2012-03-27 | 2012-07-18 | 郑州机械研究所 | Seam particle filling composite welding rod applicable to large-gap brazing |
| CN101641176B (en) * | 2007-01-22 | 2013-05-22 | 马里兰大学 | High temperature solder materials |
| CN104588903A (en) * | 2014-12-08 | 2015-05-06 | 北京康普锡威科技有限公司 | Ag2O-particle-reinforced tin-lead-based composite solder and preparation method thereof |
| CN112372174A (en) * | 2020-09-24 | 2021-02-19 | 南昌航空大学 | High-temperature-resistant composite solder, soldering paste, soldering method of soldering paste and electronic substrate |
-
2001
- 2001-12-19 CN CN 01144487 patent/CN1358606A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101641176B (en) * | 2007-01-22 | 2013-05-22 | 马里兰大学 | High temperature solder materials |
| CN101920405A (en) * | 2010-08-23 | 2010-12-22 | 中国电力科学研究院 | Tin-lead-based composite solder for galvanized steel ground grid and preparation method thereof |
| CN101920405B (en) * | 2010-08-23 | 2013-07-31 | 中国电力科学研究院 | Tin-lead-based composite solder for galvanized steel ground grid and preparation method thereof |
| CN102581505A (en) * | 2012-03-27 | 2012-07-18 | 郑州机械研究所 | Seam particle filling composite welding rod applicable to large-gap brazing |
| CN104588903A (en) * | 2014-12-08 | 2015-05-06 | 北京康普锡威科技有限公司 | Ag2O-particle-reinforced tin-lead-based composite solder and preparation method thereof |
| CN104588903B (en) * | 2014-12-08 | 2017-01-18 | 北京康普锡威科技有限公司 | Ag2O-particle-reinforced tin-lead-based composite solder and preparation method thereof |
| CN112372174A (en) * | 2020-09-24 | 2021-02-19 | 南昌航空大学 | High-temperature-resistant composite solder, soldering paste, soldering method of soldering paste and electronic substrate |
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