CN202455643U - High density interconnected circuit board explosion-proof hole soldering-resistant film - Google Patents
High density interconnected circuit board explosion-proof hole soldering-resistant film Download PDFInfo
- Publication number
- CN202455643U CN202455643U CN 201120469895 CN201120469895U CN202455643U CN 202455643 U CN202455643 U CN 202455643U CN 201120469895 CN201120469895 CN 201120469895 CN 201120469895 U CN201120469895 U CN 201120469895U CN 202455643 U CN202455643 U CN 202455643U
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- China
- Prior art keywords
- circuit board
- high density
- soldering
- film
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a high density interconnected circuit board explosion-proof hole soldering-resistant film which includes a film substrate. A figure which is corresponding to the line of a circuit board except for a pad is arranged on the film substrate, and the film substrate is also provided with a plurality of black blocking points which are corresponding to through holes in the circuit board. For the soldering-resistant film, the uncured soldering-resistant printing ink in the through holes is washed off in the subsequent development process, and in the following surface process, because the through holes have no cured soldering-resistant printing ink, the printing ink in the through holes is expelled from openings in the heating expansion in a gaseous form, so the hole explosion never occurs, and consequently the product quality is guaranteed, and the yield is raised.
Description
Technical field
The utility model belongs to high density interconnected circuit plate manufacturing technology field, especially a kind of high density interconnected circuit plate explosionproof hole resistance weldering film.
Background technology
In the circuit board manufacturing process, can make the line pattern that constitutes by metallic copper, on substrate, also can make a plurality of vias at the upper surface of base plate of circuit board; The surface of circuit board hinders the coating of solder paste China ink, and these printing ink can be filled in the above-mentioned via, will be shaped on then with circuit board on remove beyond the pad circuit mutually the resistance weldering film of the pattern of contraposition cover the top of circuit board; Utilize irradiate light, the resistance solder paste China ink that circuit board is removed on the circuit beyond the pad carries out photopolymerization reaction, solidifies the back circuit board is carried out the surface treatment processing; But because the surface treatment treatment temperature is higher, the printing ink expanded by heating in the via can be with the resistance solder paste China ink jack-up that covers on it; This defective is called blast hole; And can be splashed everywhere by the resistance solder paste China ink of jack-up, not only influence the apparent of pad, and the effect of influence welding.
The utility model content
The purpose of the utility model is to overcome the deficiency of prior art, and a kind of high density interconnected circuit plate explosionproof hole rational in infrastructure, easy to use resistance weldering film is provided.
The technical scheme that the utility model is taked is:
A kind of high density interconnected circuit plate explosionproof hole resistance weldering film; Comprise the film base material; Make on the film base material with circuit board on remove the circuit figure of contraposition mutually beyond the pad, it is characterized in that: on the film base material, also be shaped on a plurality of and the via-hole of circuit board black chopping point of contraposition mutually.
And the external diameter of said black chopping point is smaller or equal to the internal diameter of via.
The advantage and the good effect of the utility model are:
In the utility model, on the resistance weldering film except make with circuit board on remove the circuit figure of contraposition mutually the pad, also be shaped on and the via-hole of circuit board black chopping point of contraposition mutually; The external diameter of these chopping points is smaller or equal to the internal diameter of via, and when irradiate light, the resistance solder paste China ink in the via scope receives blocking of black chopping point; Photopolymerization reaction does not take place in resistance solder paste China ink, and when follow-up development, resistance solder paste China ink uncured in the via scope is washed off; When surface treatment is subsequently handled; Owing to there is not the resistance solder paste China ink of curing on the via, in opening, gas is discharged behind the printing ink expanded by heating in the via, can not produce the phenomenon of blast hole; Guarantee the quality of product thus, improved rate of finished products.
Description of drawings
Fig. 1 is the structural representation of the utility model;
Fig. 2 is the structural representation after developing.
Embodiment
Below in conjunction with embodiment, the utility model is further specified, following embodiment is illustrative, is not determinate, can not limit the protection range of the utility model with following embodiment.
A kind of high density interconnected circuit plate explosionproof hole resistance weldering film; Shown in Fig. 1～2; Comprise film base material 2; Make on the film base material with circuit board 3 on remove circuit 7 figure 1 of contraposition mutually beyond the pad, the innovation of the utility model is: on the film base material, also be shaped on a plurality of and the via-hole of circuit board 6 black chopping point 4 of contraposition mutually.
For fear of the position deviation of resistance weldering film during with circuit board contraposition exposure, the pad leakage copper that the external diameter of black chopping point causes to avoid the contraposition deviation smaller or equal to the internal diameter of via.
In the utility model, on the resistance weldering film except make with circuit board on remove the circuit figure of contraposition mutually the pad, also be shaped on and the via-hole of circuit board black chopping point of contraposition mutually; The external diameter of these chopping points is smaller or equal to the internal diameter of via, and when irradiate light, the resistance solder paste China ink 5 in the via scope receives blocking of black chopping point; Photopolymerization reaction does not take place in resistance solder paste China ink, and when follow-up development, resistance solder paste China ink uncured in the via scope is washed off; When surface treatment is subsequently handled; Owing to there is not the resistance solder paste China ink of curing on the via, in opening 8, gas is discharged behind printing ink 9 expanded by heating in the via, can not produce the phenomenon of blast hole; Guarantee the quality of product thus, improved rate of finished products.
Claims (2)
1. film is welded in a high density interconnected circuit plate explosionproof hole resistance; Comprise the film base material; Make on the film base material with circuit board on remove the circuit figure of contraposition mutually beyond the pad, it is characterized in that: on the film base material, also be shaped on a plurality of and the via-hole of circuit board black chopping point of contraposition mutually.
2. high density interconnected circuit plate explosionproof hole resistance weldering film according to claim 1, it is characterized in that: the external diameter of said black chopping point is smaller or equal to the internal diameter of via.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120469895 CN202455643U (en) | 2011-11-23 | 2011-11-23 | High density interconnected circuit board explosion-proof hole soldering-resistant film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120469895 CN202455643U (en) | 2011-11-23 | 2011-11-23 | High density interconnected circuit board explosion-proof hole soldering-resistant film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202455643U true CN202455643U (en) | 2012-09-26 |
Family
ID=46871461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120469895 Expired - Fee Related CN202455643U (en) | 2011-11-23 | 2011-11-23 | High density interconnected circuit board explosion-proof hole soldering-resistant film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202455643U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107750090A (en) * | 2017-09-30 | 2018-03-02 | 生益电子股份有限公司 | A kind of PCB preparation method |
| CN111212524A (en) * | 2020-01-16 | 2020-05-29 | 江苏本川智能电路科技股份有限公司 | Circuit heat dissipation plate for preventing solder resist ink from bleeding and manufacturing method thereof |
| CN111586991A (en) * | 2020-05-27 | 2020-08-25 | 生益电子股份有限公司 | Circuit board developing processing system and method |
-
2011
- 2011-11-23 CN CN 201120469895 patent/CN202455643U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107750090A (en) * | 2017-09-30 | 2018-03-02 | 生益电子股份有限公司 | A kind of PCB preparation method |
| CN107750090B (en) * | 2017-09-30 | 2019-11-05 | 生益电子股份有限公司 | A kind of production method of PCB |
| CN111212524A (en) * | 2020-01-16 | 2020-05-29 | 江苏本川智能电路科技股份有限公司 | Circuit heat dissipation plate for preventing solder resist ink from bleeding and manufacturing method thereof |
| CN111212524B (en) * | 2020-01-16 | 2022-09-20 | 江苏本川智能电路科技股份有限公司 | Circuit heat dissipation plate for preventing solder resist ink from bleeding and manufacturing method thereof |
| CN111586991A (en) * | 2020-05-27 | 2020-08-25 | 生益电子股份有限公司 | Circuit board developing processing system and method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120926 Termination date: 20141123 |
|
| EXPY | Termination of patent right or utility model |