CN202406375U - Circuit board processing structure - Google Patents

Abstract

The utility model relates to a circuit board processing structure, comprising a first laminate, a bonding sheet, a second laminate, an isolating film, a high temperature silicon sheet and fillers which are successively superposed; the surface of the second laminate is provided with a plurality of holes; the first laminate and the second laminate are cooperated to form a groove structure. The isolating film is laid on the surface of the second laminate and the inner wall of the groove structure; the fillers are accommodated in the groove structure; the high temperature silicon sheet is laid on the surface of the fillers. The utility model possesses the advantages that the circuit board processing structure utilizes the isolating film to separate the fillers and high temperature silicon gel from the holes of the second laminate, which can prevent the bonding sheet or high temperature silicon gel from penetrating into the holes in a hot pressing process and ensures the integrity of hole functions; and the high temperature silicon gel is recoverable, which can save production costs.

Description

Circuit board processing structure

Technical field

The utility model relates to a kind ofly to be realized between the circuit board surface electronic devices and components being electrically connected and the function element of signal processing, relates in particular to a kind of processing structure of circuit board.

Background technology

Printed circuit board (PCB) (Printed Circuit Board; PCB) almost be the basis of any electronic product, appear at almost in each electronic equipment, generally speaking; If in some equipment, electronic devices and components are arranged, they also all are to be installed on the PCB of different sizes so.

Except fixing various components and parts, the main effect of PCB provides the connecting circuit between each item components and parts.Along with electronic equipment becomes increasingly complex, the components and parts that need are more and more, and the circuit and the components and parts on PCB surface are arranged also more and more intensive.

The sheet material of printed circuit board (PCB) itself be heat insulation by insulation, and can't crooked material be made, the tiny line material that can see on the surface is a Copper Foil.Before processed, Copper Foil is to cover whole printed circuit board surface, disposes and in manufacture process, partly be etched, and the part that stays just becomes netted tiny line pattern.Cause is in this processing process; Mostly be to form through mode of printing to supply etched line pattern; So just obtain the name of printed circuit board (PCB), these circuits are known as lead (conductor pattern) or claim wiring, and are used to provide the circuit connection that PCB goes up components and parts.

In order components and parts to be fixed on the PCB surface, need their pin directly to be welded in the wiring.On the most basic PCB (single sided board), components and parts all concentrate on a wherein side surface, and lead then all concentrates on another opposite flank.Just need design through hole in such event, reach the opposite side surface, realize being electrically connected each other, so the pin of components and parts is welded in another opposite flank with lead so that be positioned at the through hole that the pin of a side surface can run through circuit board surface at circuit board surface.Based on this, the positive and negative of PCB is called as components and parts face (Component Side) and solder side (Solder Side) respectively.

In the circuit board course of processing; In multi-layer sheet crimping, etched process; Need position circuit board, and general mode is through through hole or half through hole are set in the non-wiring region of circuit board, runs through through hole with screw or reference column again or half through hole positions.

In addition, as stated, mostly circuit board is multi-layer sheet, and some through hole or half through hole hereinafter to be referred as hole, are arranged at top plate, and between top plate and lower plywood in the process of hot pressing, and these holes are prone to polluted and lost efficacy by other adminiclies.

Please consult Fig. 1 and Fig. 2 simultaneously, wherein shown in Figure 1 is a kind of circuit board hot pressing decomposing schematic representation relevant with the utility model, and Fig. 2 is a circuit board hot pressing process assembling sketch map shown in Figure 1.In general, this method mainly comprises the steps: at first, and first laminate 81 is provided; Then, provide an adhesive sheet 86 to be layed in said first laminate 81 surfaces; Moreover, second laminate 82 that provides a surface to be provided with a plurality of holes 820, and be stacked at said first laminate 81 surfaces, said adhesive sheet 86 is located between said first laminate 81 and second laminate 82; Then, the opposite side surface that provides a silica gel sheet 84 to be layed in said second laminate 82 makes said second laminate 82 be located between said silica gel sheet 84 and the said adhesive sheet 86; At last, utilize the heating electrode 851,852 of hot pressing equipment 85, from said first laminate 81 of two opposite side pressings and second laminate 82, and through said adhesive sheet 86 affixed said first laminate 81 and second laminates 82.

Wherein, before with said second laminate 82 and said first laminate, 81 hot pressings, utilize filling gel 83 to fill described holes 820, said filling gel 83 is filled to concordant with said second laminate 82 surfaces.This hot-press equipment 85 has a pair of heating electrode 851 and heating electrode 852, and this heating electrode 851 is sticked on the surface of silica gel sheet 84, and this heating electrode 852 closes on the 81 side settings of said first laminate.After this is to heating electrode 851,852 energisings, said silica gel sheet 84 is heated, and then first laminate 81 and second laminate, 82 thermocompression bonded are connected together.

Yet in heating process, said hot-press equipment 85 need apply squeezing action power downwards; So that said laminate 81, between 82 pressing more compact; The hot melt of said silica gel sheet 84 and said adhesive sheet 86 flows, and makes to be pressed into the melt flow stream of overflowing said adhesive sheet 86 molten masses or said silica gel sheet 84 in the described hole 820 in the slit between said filling gel 83 and the described hole 820; Cause hole 820 is polluted, influence circuit board usefulness.Simultaneously, said silica gel sheet 84 is difficult for reclaiming utilization once more, causes the wasting of resources, promotes production cost.

The utility model then provides a kind of processing structure of new circuit board in order to improve or to solve the above problems.

The utility model content

The technical problem that the utility model will solve provides a kind of circuit board processing structure that does not influence circuit board hole performance.

A kind of circuit board processing structure; It comprises first laminate, adhesive sheet, second laminate, barrier film, high temperature silicon film and the filler of superimposed setting successively; The said second laminate surface is provided with a plurality of holes, and it cooperates said first laminate to form groove structure, and said barrier film is laid said second laminate surface and said groove structure inwall; Said filler is contained in the said groove structure, and said high temperature silicon film is laid on said filler surface.

Further improvement as above-mentioned processing structure also comprises adhesive sheet, and said adhesive sheet is laid on said first laminate surface, and is located between said first laminate and second laminate.

As the further improvement of above-mentioned processing structure, said adhesive sheet comprises engraved structure, corresponding described hole region, said hollow out zone, the surface of corresponding said first laminate of the diapire of said groove structure, the inwall of the corresponding described hole of its sidewall.

As the further improvement of above-mentioned processing structure, the extension of said adhesive sheet and said first laminate and the second laminate outer ledge.

As the further improvement of above-mentioned processing structure, the edge of said engraved structure is consistent with the profile phase of said groove structure.

As the further improvement of above-mentioned processing structure, said filler is any one in glass-epoxy material, the plastic material.

As the further improvement of above-mentioned processing structure, described hole runs through said second laminate, the surperficial flush of the surface of said filler and said barrier film.

Compared with prior art; The utlity model has following advantage: in the circuit board processing structure of the utility model; Utilize barrier film that the hole of filler and the high-temperature silica gel and second laminate is kept apart, can prevent adhesive sheet material or high-temperature silica gel material infiltration hole in the hot pressing, guarantee hole function integrity; And the recyclable repeated use of high-temperature silica gel saves production cost.In addition, this filler can be according to the specific requirement of product, and directly cutting is made arbitrarily, fills, and satisfies the shape demand, and is convenient.

Description of drawings

Fig. 1 is the decomposing schematic representation that a kind of circuit board processing relevant with the utility model is constructed.

Fig. 2 is the assembling sketch map of the element in the circuit board processing method shown in Figure 1.

Fig. 3 is the processing structure decomposing schematic representation in the utility model circuit board processing method.

Fig. 4 is the processing structure assembling sketch map in the circuit board processing method shown in Figure 3.

Fig. 5 is the schematic flow sheet of circuit board processing method shown in Figure 3.

Embodiment

Specify the embodiment of the utility model below in conjunction with accompanying drawing.

Circuit board can be divided into single sided board, double sided board and multi-layer sheet according to its wiring level.Single sided board is to have only one side that the circuit board of conductive pattern is arranged.The general paper phenol matrix copper-clad laminate that adopts is made, and also often adopts epoxy paper substrate or epoxy glass fabric copper-clad plate.

The printing figures of single sided board is fairly simple, generally adopts the method transition diagram of silk screen process, etches circuit board then, also has to adopt photochemical method to produce.

Double-sided PCB is the circuit board that all there is conductive pattern on the two sides.Obviously, the area of double sided board is bigger one times than single sided board, is suitable for than single sided board complicated circuitry more.Double-sided PCB adopts the manufacturing of epoxy glass fabric copper coated foil plate usually.It is mainly used in the higher communication electronic equipment of performance requirement, high grade instrument and meter and electronic computer etc.The production technology of double sided board generally is divided into several kinds of bus bar method, plug-hole method, masking method and graphic plating etching methods etc.

Multilayer circuit board is that the circuit board that conductive pattern and insulation material layer are pressed into more than three layers or three layers is arranged.It is actually uses several pieces double sided boards, and pressing is bonding after putting a layer insulating between every laminate forms.Its number of plies all is an even number usually, and comprises outermost two-layer.From the angle of technology, can accomplish nearly 100 layers pcb board, but the motherboard of present computer all is 4～8 layers a structure.

Multilayer circuit board generally adopts the epoxy glass fabric copper clad laminate.In order to improve the reliability of plated-through hole, should select for use as far as possible resistant to elevated temperatures, the substrate size good stability, particularly the thickness direction thermal coefficient of expansion is less, and the new material that matees basically with the copper coating thermal coefficient of expansion.Make multilayer circuit board; Earlier make the inner conductor figure, then according to designing requirement, several inner conductor graphics overlays with the Copper Foil etching method; Be placed in the special-purpose multi-daylight press platform; Through hot pressing, bonding process, just processed the multilayer circuit board that covers Copper Foil with internal layer conductive pattern, the manufacturing process of later manufacturing procedure and two-sided hole metallization circuit board is basic identical.

Fig. 3 to Fig. 5 discloses a kind of preferred embodiments of the utility model circuit board processing structure and processing method thereof.

Please consult Fig. 3 and Fig. 4 simultaneously, wherein Fig. 3 is the decomposing schematic representation of the utility model hot-press equipment to circuit board processing structure, and Fig. 4 is the assembling sketch map of hot-press equipment shown in Figure 3 to circuit board processing structure.This multilayer circuit board (not indicating) is to carry out pressing processing through hot-press equipment (figure does not show), and its surface is provided with a plurality of grooves.The circuit board of this tool groove is a multilayer circuit board, and it comprises first laminate 11, adhesive sheet 13 and second laminate 15 of superimposed setting.When processing during this circuit board, the structure in its course of processing comprises first laminate 11, adhesive sheet 13, second laminate 15, barrier film 16 and the high temperature silicon film 19 of superimposed setting, has filler 17 to be filled in the groove of said circuit board simultaneously.

Said first laminate 11 is the rectangular flats that are processed into by the epoxy glass fabric copper clad laminate with said second laminate 15, and it has good thermal insulation and high insulation property.Certainly, that other and Copper Foil thermal coefficient of expansion mate basically is high temperature resistant, dimensional stability good, particularly the less new material of thickness direction thermal coefficient of expansion all is the material that the utility model requires.

Said adhesive sheet 13 is attached at said first laminate 11 surfaces.Said adhesive sheet 13 is a kind of hot melt colloids.

Said second laminate 15 is stacked at said first laminate 11 surfaces, and realizes bonding through adhesive sheet 13.Said second laminate 15 comprises a plurality of holes 150.Described hole 150 is distributed in said second laminate 15 surfaces, and runs through said second laminate, 15 2 opposite sides surface.Described hole 150 mainly perhaps conducts in order to the location, and after said first laminate 11 and said second laminate, 15 superimposed settings, the surface of said first laminate 11 of an end butt of described hole 150 so forms groove (indicating).Said adhesive sheet 13 surfaces, corresponding said groove region, said adhesive sheet 13 is hollow outs, that is to say the surface of corresponding said first laminate 11 of the diapire of said groove, the inwall of the corresponding described hole of sidewall.Be projected to the zone of first laminate in the described hole correspondence, said adhesive sheet 13 is engraved structure.

Said barrier film 16 is attached at said second laminate 15 surfaces, and corresponding described hole 150 inner wall surface that cover.

Affiliated filler 17 correspondences are contained in described hole 150, and are coated by said barrier film 16.Said filler 17 is to adopt ink material to substitute silica gel material of the prior art.Said ink material is full of whole hole 150,, is full of ink material in the said groove that is, the upper surface flush of its upper surface and said barrier film 16.Certainly, in the actual course of processing, this filler 17 allows to a certain degree a little higher than or is lower than the surface of said barrier film 16 slightly.Said filler is any one in glass-epoxy material, the plastic material, and size is more smaller than the packing space profile of former hole 150 as the one of which, probably gets final product to 100 microns.

Said high temperature silicon film 19 is attached at said barrier film 16 surfaces, and lid covers the surface that said filler 17 is not coated by said barrier film 16 simultaneously.This high temperature silicon film 19 can effectively all be pressed, and makes pressure even, guarantees the integral thickness uniformity and between gas producing formation, produces good bonding force, improves production reliability.

In the structure of this circuit board course of processing, said hot-press equipment comprises two hot-press base plate 20 and two heating electrodes 201,202 that relative spacing is provided with.Said heating electrode 201 is located at said heated substrates 20 ends, and said hot-press base plate 20 provides heat energy to said heating electrode 201,202, carries out hot pressing technique to treat the hot pressing circuit board.

Hot-press equipment is as shown in Figure 4 to the package assembly that circuit board carries out in the course of processing when adopting.Said second laminate 15 places a said laminate 11 upper surfaces, and is fixed together through adhesive sheet 13.Said barrier film 16 is sticked on the opposite side surface of said second laminate 15, and pastes on the inwall of hole 150, and said filler 17 is packed in the hole 150, that is said filler 17 is filled in the groove.Certainly; Because the existence of said barrier film 16; In fact; Said filler 17 is to be filled in the space of said barrier film 16 corresponding to described hole 150 formation, and said filler 117 is filled to concordant with said second laminate, 15 upper surfaces, and said high temperature silicon film 10 is laid on the upper surface of barrier film 16.Certainly because said filler 14 is concordant with the upper surface of said second laminate 12, in fact, said high temperature silicon film 19 be laid on said second laminate 15 upper surface and said filler 17 with the concordant surface of second laminate, 15 upper surfaces.The heating electrode 201,202 of said hot-press base plate 20 is sticked respectively at the outer surface of high temperature silicon film 19 and said first laminate 11.

Please combine with reference to figure 5, be the schematic flow sheet of the utility model circuit board processing method shown in Figure 3 again, and when adding man-hour, it specifically comprises the steps:

Step S1 provides first laminate 11;

Step S2 provides adhesive sheet 13, and is stacked at said first laminate 11 surfaces;

Step S3 provides second laminate 15, and its surface is provided with a plurality of holes 150, and with said second laminate 15 and the 11 superimposed settings of said first laminate, is adhesively fixed through adhesive sheet 13, forms groove structure;

Step S4 lays barrier film 16 at said second laminate, 12 upper surfaces and hole 150 inwalls;

Step S5; At the inner fillers 17 of filling of described hole 150, in fact, said filler 17 is to be filled in the space that barrier film 16 forms corresponding to described hole 150; Flow in the hole 150 after avoiding adhesive sheet 13 to condense, influence the outward appearance and the welding performance of product.In the actual course of processing, said filler is any one in glass-epoxy material, the plastic material, and size is more smaller than the packing space profile of former hole 150 as the one of which, probably gets final product to 100 microns;

Step S6; Lay high temperature silicon film 19 at said second laminate, 15 upper surfaces; In fact, high temperature silicon film 19 is to be laid on the surface concordant with second laminate, 15 upper surfaces of upper surface and said filler 17 of said second laminate 15, and the outer ledge of said high temperature silicon film 19 is recessed in the outer ledge of said second laminate 15; In the actual course of processing, said high temperature silicon film 19 can also be a little higher than or be lower than said second laminate, 15 upper surfaces;

Step S7 provides hot-press equipment, and the hot-press base plate 20 of said hot-press equipment and heating electrode 201,202 ride over said high temperature silicon film 19 and said first substrate, 11 outer surfaces heat.In hot pressing, the sustainable element that is positioned under it that compresses of said hot-press equipment finishes until hot pressing;

Step S8 removes hot-press base plate 20, removes high temperature silicon film 19 and removes filler 17, forms the multi-layer sheet of tool groove.

The circuit board processing method of the utility model; Utilize said barrier film 16 that said filler 17 and the said high temperature silicon film 19 and the hole 150 of said second laminate 15 are kept apart; Can prevent that adhesive sheet described in the hot pressing 13 and said high temperature silicon film 19 from infiltrating hole; Guarantee described hole 150 function integrity, and the 19 recyclable repeated uses of high temperature silicon film, save production cost.

In the processing technology of the utility model, can not be spilled over to the circuit board outside for guaranteeing said adhesive sheet 13 because of hot pressing function, the outline edge that said adhesive sheet 13 is set usually is recessed in the outer ledge of said first laminate 11 and second laminate 15.So, when in hot pressing, though said adhesive sheet 13 melted by heating, it can not go out by earial drainage because of squeezing action, improves the quality of products.

In the actual course of processing; According to actual needs, said hot-press equipment can only provide single heating substrate and heating electrode, and it only is arranged on first substrate, 11 outsides; Perhaps only be arranged on high temperature silicon film 19 outsides, to reach hot pressing demand for heat standard be prerequisite to satisfy.

The above is merely the preferred embodiments of the utility model; The protection range of the utility model does not exceed with above-mentioned execution mode; As long as the equivalence that those of ordinary skills do according to the utility model institute disclosure is modified or changed, all should include in the protection range of putting down in writing in claims.

Claims (7)

1. a circuit board processing is constructed, and first laminate, adhesive sheet, second laminate, barrier film and high temperature silicon film that it comprises superimposed setting successively is characterized in that; Also comprise filler; The said second laminate surface is provided with a plurality of holes, and it cooperates said first laminate to form groove structure, and said barrier film is laid said second laminate surface and said groove structure inwall; Said filler is contained in the said groove structure, and said high temperature silicon film is laid on said filler surface.

2. circuit board processing structure according to claim 1 is characterized in that, also comprises adhesive sheet, and said adhesive sheet is laid on said first laminate surface, and is located between said first laminate and second laminate.

3. circuit board processing structure according to claim 2; It is characterized in that said adhesive sheet comprises engraved structure, corresponding described hole region, said hollow out zone; The surface of corresponding said first laminate of the diapire of said groove structure, the inwall of the corresponding described hole of its sidewall.

4. circuit board processing structure according to claim 3 is characterized in that the extension of said adhesive sheet and said first laminate and the second laminate outer ledge.

5. circuit board processing structure according to claim 3 is characterized in that the edge of said engraved structure is consistent with the profile phase of said groove structure.

6. circuit board processing structure according to claim 1 is characterized in that said filler is any one in glass-epoxy material, the plastic material.

7. circuit board processing structure according to claim 1 is characterized in that described hole runs through said second laminate, the surperficial flush of the surface of said filler and said barrier film.

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