CN202394854U - Gripping arm-and-hand system for semiconductor packaging device - Google Patents
Gripping arm-and-hand system for semiconductor packaging device Download PDFInfo
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- CN202394854U CN202394854U CN2012200209795U CN201220020979U CN202394854U CN 202394854 U CN202394854 U CN 202394854U CN 2012200209795 U CN2012200209795 U CN 2012200209795U CN 201220020979 U CN201220020979 U CN 201220020979U CN 202394854 U CN202394854 U CN 202394854U
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Abstract
The utility model relates to a gripping arm-and-hand system for a semiconductor packaging device, comprising a mechanical gripper device, a gripping cylinder device and a platen cushioning device. The mechanical gripper device comprises a leader fixed block, a claw, a leader, a first spring and a gripper fixed block; the gripping cylinder device comprises a claw, a slide rail fixed block and a slide rail; and the platen cushioning device comprises a substrate, a guiding shaft, a third spring, a guiding shaft fixed block, a locking plate, a linear bearing, a platen and a platen fixed block. Compared with the prior arts, the gripping arm-and-hand system for a semiconductor packaging device provided by the utility model has the advantages of being simple in structure, not occupying space, being able to adapt to the semiconductor produce with width and thickness in certain range, having no requirements for any change and adjustment during the process for processing different types of products, being stable in running the device, being low in cost, and significantly improving the production efficiency and device-utilization efficiency.
Description
Technical field
The utility model relates to semiconductor technology, relates in particular to semiconductor packaging device product grabbing device.
Background technology
In the semiconductor packaging process process, product all will pass through the process of material loading, operation, blanking in each procedure.
Present full-automatic loading and unloading equipment mostly adopts the mode of suction disc loading and unloading, product is drawn from material basket or track come out to deliver to the appointed place.Because semiconductor product is of a great variety, frame size differs, and need change different suction discs during the equipment replacement kind, causes spare part to increase, and the variety renovation action is loaded down with trivial details.Suction nozzle is an attrition component, needs often to change, and use cost is higher, and suction disc absorption product is very high to the product space requirement, and the position has deviation will cause the absorption failure slightly.Along with semi-conductive development, product is done littler and littler, causes product to draw difficulty more, and the fault that product is drawn failure frequently takes place, and stable equipment operation property and efficient are significantly reduced.
The utility model content
The technical problem that the utility model solves is: semiconductor product mechanical gripping arm device how to realize a kind of simple in structure, cost economy, stability and high efficiency.
For solving the problems of the technologies described above, the utility model provides semiconductor packaging device catching robot system, comprises the mechanical gripping arm device, grasps air cylinder device and pressing plate buffer unit; Said mechanical gripping arm device comprises guide rod fixed block, claw, guide rod, first spring and handgrip fixed block; Said extracting air cylinder device comprises gas pawl, slide rail fixed block and slide rail, and said pressing plate buffer unit comprises substrate, the axis of guide, the 3rd spring, axis of guide fixed head, locking plate, linear bearing, pressing plate and pressing plate fixed block; Said mechanical gripping arm device is the both sides that symmetrical structure is positioned at pressing plate; The two ends of the guide rod fixed block of the every side of mechanical gripping arm device are embedded with claw; Said guide rod fixed block is provided with perforation, is with first spring on the said guide rod and sees through said perforation to be fixed on the handgrip fixed block; The gas pawl of said extracting air cylinder device is that horizontal opening-closing structure places the below of substrate and across on the handgrip fixed block that is fixed in the pressing plate both sides; Said slide rail is also across on the handgrip fixed block that is fixed in the pressing plate both sides and be positioned at the both sides of said gas pawl; The substrate below is fixed at the top of said slide rail fixed block, and the bottom of slide rail fixed block places on the slide rail; The pressing plate of said pressing plate buffer unit is fixed in the below of substrate through the pressing plate fixed block; Be with the 3rd spring on the said axis of guide; One end of the axis of guide is fixed on the substrate; The other end of the axis of guide passes said axis of guide fixed head and is placed in part and is embedded in the linear bearing of axis of guide fixed head, is embedded with said locking plate between said linear bearing and axis of guide fixed head.
Alternatively, said mechanical gripping arm device also comprises second spring and spring block, and two of said second spring is separately fixed on the back side and said spring block of said claw, and spring block is fixed on the said handgrip fixed block.
Alternatively, the position that hooks up of said claw is a stepped construction.
Alternatively, said pressing plate buffer unit also comprises cover plate, and said cover plate is overlying on the said linear bearing.
Alternatively, said pressing plate fixed block comprises vertical fixed block and crosswise fixed piece, and said vertical fixed block connects said substrate and said pressing plate, and said crosswise fixed piece is stuck between vertical fixed block and is fixed on the pressing plate.
Compared with prior art; The semiconductor packaging device catching robot system that the utility model is asked for protection; Semiconductor product simple in structure, as not take up space, can adapt to certain limit width and thickness; Need not do any replacing and adjustment when processing the product of different cultivars, stable equipment operation, with low cost has improved production efficiency and equipment efficiency of usage greatly.
Description of drawings
Fig. 1 is the structural representation of the utility model semiconductor packaging device catching robot system.
Fig. 2 disassembles sketch map for the structure of semiconductor packaging device catching robot system among the utility model embodiment;
Fig. 3 is the structural representation of mechanical gripping arm device among the utility model embodiment;
Fig. 4 is the partial schematic diagram of mechanical gripping arm device among the utility model embodiment;
Fig. 5 is the structural representation of cylinder grabbing device among the utility model embodiment;
Fig. 6 is the structural representation of the utility model embodiment center platen buffer unit;
Fig. 7 is a sketch map of waiting to grasp framework.
Embodiment
A lot of details have been set forth in the following description so that make much of the utility model.But the utility model can be implemented much to be different from alternate manner described here, and those skilled in the art can do similar popularization under the situation of the utility model intension, so the utility model does not receive the restriction of following disclosed practical implementation.
Secondly, the utility model utilizes sketch map to be described in detail, and when the utility model embodiment was detailed, for ease of explanation, said sketch map was an instance, and it should not limit the scope of the utility model protection at this.
Below in conjunction with accompanying drawing the embodiment of the utility model is done detailed explanation.
Like Fig. 1, shown in Figure 2, the semiconductor packaging device catching robot system that the utility model provides comprises the mechanical gripping arm device, grasps air cylinder device and pressing plate buffer unit.Said mechanical gripping arm device comprises guide rod fixed block 8, claw 9, guide rod 6, first spring 7, handgrip fixed block 5, second spring 20 and spring block 19; Said extracting air cylinder device comprises gas pawl 4, slide rail fixed block 2 and slide rail 3; Said pressing plate buffer unit comprises substrate 1, the axis of guide 13, the 3rd spring 17, axis of guide fixed head 15, locking plate 16, linear bearing 14, cover plate 18, pressing plate 12 and pressing plate fixed block, and said pressing plate fixed block comprises vertical fixed block 10 and crosswise fixed piece 11.
Said mechanical gripping arm device is the both sides that symmetrical structure is positioned at pressing plate 12; The two ends of the guide rod fixed block 8 of the every side of mechanical gripping arm device are embedded with the claw 9 that staged hooks up; Said guide rod fixed block 8 is provided with perforation, is with first spring 7 on the said guide rod 6 and inserts in the perforation, and is as shown in Figure 4; Guide rod 6 sees through said perforation and is fixed on the handgrip fixed block 5, and two of said second spring 20 is separately fixed on the back side and said spring block 20 of said claw 9, and spring block 20 is fixed on the said handgrip fixed block 5, and is as shown in Figure 3.
The gas pawl 4 of said extracting air cylinder device places the below of substrate 1 for horizontal opening-closing structure and across on the handgrip fixed block 5 that is fixed in pressing plate 12 both sides; Said slide rail 3 is also across on the handgrip fixed block 5 that is fixed in pressing plate 12 both sides and be positioned at the both sides of said gas pawl 4; Substrate 1 below is fixed at the top of said slide rail fixed block 3; The bottom of slide rail fixed block 3 places on the slide rail 3, and is as shown in Figure 5.
The pressing plate 12 of said pressing plate buffer unit is fixed in the below of substrate 1 through vertical fixed block 10; Said crosswise fixed piece 11 is stuck in 10 of vertical fixed blocks and is fixed on the pressing plate 12; Be with the 3rd spring 17 on the said axis of guide 13; One end of the axis of guide 13 is fixed on the substrate 1, and the other end of the axis of guide 13 passes said axis of guide fixed head 15 and is placed in part and is embedded in the linear bearing 14 of axis of guide fixed head 15, and 15 of said linear bearing 14 and axis of guide fixed heads are embedded with said locking plate 16; Be covered with cover plate 18 on the linear bearing 14, as shown in Figure 6.
As shown in Figure 7, encapsulating products is arranged on the framework 21.
In the production process, framework 21 is stacked in to be waited to get in the device;
Said semiconductor packaging device catching robot system moves in waiting to get the device top;
Then, the pressing plate 12 of pressing plate buffer unit begins to press down along linear bearing 14 directions, and the stable buffering through the axis of guide 13 upper springs 17 be pressed on the framework 21 that piles up;
Then; The mechanical gripping arm device along continuous straight runs under the drive of grasping air cylinder device that is positioned at pressing plate 12 both sides is closed; The gap of 21 product thicknesses of framework is piled up in dependence; Add that the staged that claw 9 hooks up the position dodges design, make the claw 9 of pressing plate 12 both sides can from pile up framework 21, separate a framework 21 that grasps the top easily;
Then, pressing plate 12 floats to dodge the collision in follow-up transmission framework 21 processes along linear bearing 14 directions;
Then, the said semiconductor packaging device catching robot system framework 21 that will grasp moves to this operation delivery track top to be processed;
Then; Acting in conjunction through the guide rod 6 and first spring 7; Claw 9 moves along guide rod 6 horizontal directions framework 21 is accurately sent into delivery track top to be processed; At this moment, make for fear of the deadweight because of framework 21 that claw 9 is sliding outside when moving horizontally to be caused grasping not steady, second spring 19 at claw 9 back sides can play good equalizing and buffering effect;
Then, mechanical gripping arm device along continuous straight runs under the drive of grasping air cylinder device is opened, and makes crawled wall scroll framework 21 fall into delivery track;
So far, said semiconductor packaging device catching robot system promptly accomplish the whole series extracting, place action, so repeatedly.
Need to prove that the folding of grasping gas pawl 4 in the air cylinder device drives handgrip fixed block 5 and steadily moves along slide rail 3 directions, gas pawl 4, can steadily be grasped to guarantee grasping power by pressure maintaining valve control, unlikely again product framework 21 distortion.
Though the utility model discloses as above with preferred embodiment, the utility model is not to be defined in this.Any those skilled in the art in spirit that does not break away from the utility model and scope, all can do various changes and modification, so the protection range of the utility model should be as the criterion with claim institute restricted portion.
Claims (5)
1. a semiconductor packaging device catching robot system is characterized in that: comprise the mechanical gripping arm device, grasp air cylinder device and pressing plate buffer unit;
Said mechanical gripping arm device comprises guide rod fixed block, claw, guide rod, first spring and handgrip fixed block; Said extracting air cylinder device comprises gas pawl, slide rail fixed block and slide rail, and said pressing plate buffer unit comprises substrate, the axis of guide, the 3rd spring, axis of guide fixed head, locking plate, linear bearing, pressing plate and pressing plate fixed block;
Said mechanical gripping arm device is the both sides that symmetrical structure is positioned at pressing plate; The two ends of the guide rod fixed block of the every side of mechanical gripping arm device are embedded with claw; Said guide rod fixed block is provided with perforation, is with first spring on the said guide rod and sees through said perforation to be fixed on the handgrip fixed block;
The gas pawl of said extracting air cylinder device is that horizontal opening-closing structure places the below of substrate and across on the handgrip fixed block that is fixed in the pressing plate both sides; Said slide rail is also across on the handgrip fixed block that is fixed in the pressing plate both sides and be positioned at the both sides of said gas pawl; The substrate below is fixed at the top of said slide rail fixed block, and the bottom of slide rail fixed block places on the slide rail;
The pressing plate of said pressing plate buffer unit is fixed in the below of substrate through the pressing plate fixed block; Be with the 3rd spring on the said axis of guide; One end of the axis of guide is fixed on the substrate; The other end of the axis of guide passes said axis of guide fixed head and is placed in part and is embedded in the linear bearing of axis of guide fixed head, is embedded with said locking plate between said linear bearing and axis of guide fixed head.
2. a kind of semiconductor packaging device catching robot according to claim 1 system; It is characterized in that; Said mechanical gripping arm device also comprises second spring and spring block; Two of said second spring is separately fixed on the back side and said spring block of said claw, and spring block is fixed on the said handgrip fixed block.
3. a kind of semiconductor packaging device catching robot according to claim 1 and 2 system is characterized in that the position that hooks up of said claw is a stepped construction.
4. a kind of semiconductor packaging device catching robot according to claim 1 system is characterized in that said pressing plate buffer unit also comprises cover plate, and said cover plate is overlying on the said linear bearing.
5. a kind of semiconductor packaging device catching robot according to claim 1 system; It is characterized in that; Said pressing plate fixed block comprises vertical fixed block and crosswise fixed piece; Said vertical fixed block connects said substrate and said pressing plate, and said crosswise fixed piece is stuck between vertical fixed block and is fixed on the pressing plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200209795U CN202394854U (en) | 2012-01-17 | 2012-01-17 | Gripping arm-and-hand system for semiconductor packaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200209795U CN202394854U (en) | 2012-01-17 | 2012-01-17 | Gripping arm-and-hand system for semiconductor packaging device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202394854U true CN202394854U (en) | 2012-08-22 |
Family
ID=46669760
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200209795U Withdrawn - After Issue CN202394854U (en) | 2012-01-17 | 2012-01-17 | Gripping arm-and-hand system for semiconductor packaging device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202394854U (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569148A (en) * | 2012-01-17 | 2012-07-11 | 南通富士通微电子股份有限公司 | Grabbing manipulator system for semiconductor packaging equipment |
| CN103213122A (en) * | 2013-04-23 | 2013-07-24 | 上海大学 | Mechanical grabbing hand based on synchronous double-connecting-rod centering moving mechanism |
| CN105552012A (en) * | 2016-01-20 | 2016-05-04 | 苏州光越微纳科技有限公司 | Mechanical type material-taking mechanism |
| CN107089509A (en) * | 2017-06-14 | 2017-08-25 | 镇江成泰自动化技术有限公司 | One kind rotation material catching apparatus |
| CN108858161A (en) * | 2018-08-22 | 2018-11-23 | 中民筑友科技投资有限公司 | A kind of manipulator and set mould truss robot |
| CN112061654A (en) * | 2020-08-12 | 2020-12-11 | 久恒理树 | Sorting robot, sorting device, sorting system and sorting method |
| CN112323120A (en) * | 2020-10-30 | 2021-02-05 | 昆山首佳智能科技有限公司 | Semiconductor lead frame piece formula clamp plate electroplating device |
| CN113375869A (en) * | 2021-07-02 | 2021-09-10 | 苏州富强科技有限公司 | Feeding and discharging integrated air tightness detection method |
| CN113375867A (en) * | 2021-07-02 | 2021-09-10 | 苏州富强科技有限公司 | Go up unloading integral type gas tightness detection device |
-
2012
- 2012-01-17 CN CN2012200209795U patent/CN202394854U/en not_active Withdrawn - After Issue
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569148B (en) * | 2012-01-17 | 2014-08-27 | 南通富士通微电子股份有限公司 | Grabbing manipulator system for semiconductor packaging equipment |
| CN102569148A (en) * | 2012-01-17 | 2012-07-11 | 南通富士通微电子股份有限公司 | Grabbing manipulator system for semiconductor packaging equipment |
| CN103213122A (en) * | 2013-04-23 | 2013-07-24 | 上海大学 | Mechanical grabbing hand based on synchronous double-connecting-rod centering moving mechanism |
| CN103213122B (en) * | 2013-04-23 | 2015-07-01 | 上海大学 | Mechanical grabbing hand based on synchronous double-connecting-rod centering moving mechanism |
| CN105552012B (en) * | 2016-01-20 | 2019-02-12 | 苏州光越微纳科技有限公司 | Mechanical material fetching mechanism |
| CN105552012A (en) * | 2016-01-20 | 2016-05-04 | 苏州光越微纳科技有限公司 | Mechanical type material-taking mechanism |
| CN107089509A (en) * | 2017-06-14 | 2017-08-25 | 镇江成泰自动化技术有限公司 | One kind rotation material catching apparatus |
| CN108858161A (en) * | 2018-08-22 | 2018-11-23 | 中民筑友科技投资有限公司 | A kind of manipulator and set mould truss robot |
| CN112061654A (en) * | 2020-08-12 | 2020-12-11 | 久恒理树 | Sorting robot, sorting device, sorting system and sorting method |
| CN112061654B (en) * | 2020-08-12 | 2022-04-01 | 久恒理树 | Sorting robot, sorting device, sorting system and sorting method |
| CN112323120A (en) * | 2020-10-30 | 2021-02-05 | 昆山首佳智能科技有限公司 | Semiconductor lead frame piece formula clamp plate electroplating device |
| CN113375869A (en) * | 2021-07-02 | 2021-09-10 | 苏州富强科技有限公司 | Feeding and discharging integrated air tightness detection method |
| CN113375867A (en) * | 2021-07-02 | 2021-09-10 | 苏州富强科技有限公司 | Go up unloading integral type gas tightness detection device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20120822 Effective date of abandoning: 20140827 |
|
| RGAV | Abandon patent right to avoid regrant |