CN202361687U - Semiconductor refrigeration component with temperature protection and efficient radiator - Google Patents
Semiconductor refrigeration component with temperature protection and efficient radiator Download PDFInfo
- Publication number
- CN202361687U CN202361687U CN2011204761060U CN201120476106U CN202361687U CN 202361687 U CN202361687 U CN 202361687U CN 2011204761060 U CN2011204761060 U CN 2011204761060U CN 201120476106 U CN201120476106 U CN 201120476106U CN 202361687 U CN202361687 U CN 202361687U
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- China
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- radiator
- potsherd
- temperature protection
- cold
- hot side
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Abstract
The utility model relates to a semiconductor refrigeration component, in particular to a semiconductor refrigeration component with temperature protection and an efficient radiator, consisting of a cold face copper radiator, a cold face ceramic wafer, a semiconductor refrigeration NP element, a hot face ceramic wafer and a hot face copper radiator, wherein the cold face ceramic wafer is arranged on the upper part of the semiconductor refrigeration NP element, the hot face ceramic wafer is arranged on the lower part of the semiconductor refrigeration NP element, the cold face copper radiator is arranged on the upper part of the cold face ceramic wafer, and the hot face copper radiator is arranged on the lower part of the hot face ceramic wafer. According to the semiconductor refrigeration component, metallized coatings are additionally arranged among the cold face ceramic wafer, the hot face ceramic wafer and the corresponding copper radiators, and the metallized coatings are tinned to be welded with the copper radiators with high heat conductivity, so that the cold and heat conducting efficiency is greatly improved. A temperature protection element is arranged on the hot face ceramic wafer and is used for protecting the hot face temperature of the semiconductor device from exceeding the upper limit. The semiconductor refrigeration component is small in volume, convenient in mounting, high in cold and heat conducting efficiency and has temperature protection while operating.
Description
Technical field
The utility model relates to a kind of semiconductor refrigerating assembly, especially relates to a kind of semiconductor refrigerating assembly with temperature protection and high-efficiency radiator.
Background technology
General semiconductor cooling piece assembly is made up of huyashi-chuuka (cold chinese-style noodles) potsherd, flow deflector, semiconductor refrigerating NP element, hot side potsherd, positive and negative lead wires; The cold and hot surface of device is a ceramic plane; The surface needs several times of aluminium alloy heat radiators of about size own during work, the fan heat radiation could be worked; And the radiator fan volume is very big, can not be applicable on the very little product in installation site.Add the temperature protection switch more in addition, protection refrigeration device hot-face temperature can not surpass 80 ℃ of the upper limits, otherwise the inner solder joint of refrigeration device can melt because temperature is too high, formation short circuit or open circuit.After common cooling assembly was installed, big, the cold and hot conduction efficiency of volume was low, do not have protective device.
The utility model content
In order to solve the problems of the technologies described above, the utility model provides a kind of efficient that increases cold and hot conduction greatly, and the little conduction efficiency easy for installation, cold and hot of volume is high, and the semiconductor refrigerating assembly of temperature protection is arranged during work.
The band temperature protection of the utility model and the semiconductor refrigerating assembly of high-efficiency radiator; It is made up of the copper radiator of huyashi-chuuka (cold chinese-style noodles), huyashi-chuuka (cold chinese-style noodles) potsherd, semiconductor refrigerating NP element, hot side potsherd and the copper radiator of hot side; The top of said semiconductor refrigerating NP element is provided with the huyashi-chuuka (cold chinese-style noodles) potsherd; The bottom of said semiconductor refrigerating NP element is provided with the hot side potsherd, and the top of huyashi-chuuka (cold chinese-style noodles) potsherd is provided with the copper radiator of huyashi-chuuka (cold chinese-style noodles), and the bottom of hot side potsherd is provided with the copper radiator of hot side.
The band temperature protection of the utility model and the semiconductor refrigerating assembly of high-efficiency radiator, the hot side potsherd is provided with positive and negative lead wires.
The band temperature protection of the utility model and the semiconductor refrigerating assembly of high-efficiency radiator, the hot side potsherd is provided with temperature protection component.
The band temperature protection of the utility model and the semiconductor refrigerating assembly of high-efficiency radiator are provided with metalized coated between the copper radiator of huyashi-chuuka (cold chinese-style noodles) potsherd and huyashi-chuuka (cold chinese-style noodles).
The band temperature protection of the utility model and the semiconductor refrigerating assembly of high-efficiency radiator are provided with metalized coated between the copper radiator of hot side potsherd and hot side.
The band temperature protection of the utility model and the semiconductor refrigerating assembly of high-efficiency radiator, said metalized coated be tin coating.
The band temperature protection of the utility model and the semiconductor refrigerating assembly of high-efficiency radiator, said hot and cold potsherd and copper radiator weld together.
Compared with prior art; The beneficial effect of the utility model is: the utility model is by the copper radiator of huyashi-chuuka (cold chinese-style noodles); Huyashi-chuuka (cold chinese-style noodles) potsherd semiconductor refrigerating NP element, hot side potsherd, the copper radiator of hot side, temperature protection component, positive and negative lead wires are formed; This kind of semiconductor chilling plate has increased metalized coated between huyashi-chuuka (cold chinese-style noodles) potsherd, hot side potsherd and corresponding copper radiator, plates after the tin and the copper radiator of high-termal conductivity welds together, and has increased the efficient of cold and hot conduction greatly.The hot side potsherd is provided with temperature protection component, is used to protect the semiconductor devices hot-face temperature to be no more than the upper limit.The little conduction efficiency easy for installation, cold and hot of this kind of refrigeration device volume is high, and temperature protection is arranged during work.
Description of drawings
Fig. 1 is the front view of the semiconductor refrigerating assembly of the utility model band temperature protection and high-efficiency radiator;
Fig. 2 is the left view of the semiconductor refrigerating assembly of the utility model band temperature protection and high-efficiency radiator;
Fig. 3 is the vertical view of the semiconductor refrigerating assembly of the utility model band temperature protection and high-efficiency radiator.
The specific embodiment
Below in conjunction with accompanying drawing and embodiment, the specific embodiment of the utility model is described in further detail.Following examples are used to explain the utility model, but are not used for limiting the scope of the utility model.
Like Fig. 1, Fig. 2 and shown in Figure 3; The band temperature protection of present embodiment and the semiconductor refrigerating assembly of high-efficiency radiator; It is made up of the copper radiator of huyashi-chuuka (cold chinese-style noodles) 1, huyashi-chuuka (cold chinese-style noodles) potsherd 2, semiconductor refrigerating NP element 3, hot side potsherd 4 and the copper radiator 5 of hot side; The top of semiconductor refrigerating NP element 3 is provided with huyashi-chuuka (cold chinese-style noodles) potsherd 2, and the bottom of semiconductor refrigerating NP element 3 is provided with hot side potsherd 4, and the top of huyashi-chuuka (cold chinese-style noodles) potsherd 2 is provided with the copper radiator 1 of huyashi-chuuka (cold chinese-style noodles); The bottom of hot side potsherd 4 is provided with the copper radiator 5 of hot side, and hot side potsherd 4 is provided with positive and negative lead wires 6 and temperature protection component 7.
Be provided with metalized coatedly between the copper radiator 1 of huyashi-chuuka (cold chinese-style noodles) potsherd 2 and huyashi-chuuka (cold chinese-style noodles), be provided with metalized coatedly between the copper radiator 5 of hot side potsherd 4 and hot side, metalized coated is tin coating.
This kind of semiconductor chilling plate has increased metalized coated between huyashi-chuuka (cold chinese-style noodles) potsherd, hot side potsherd and corresponding copper radiator, plates after the tin and the copper radiator of high-termal conductivity welds together, and has increased the efficient of cold and hot conduction greatly.The hot side potsherd is provided with temperature protection component, is used to protect the semiconductor devices hot-face temperature to be no more than the upper limit.The little conduction efficiency easy for installation, cold and hot of this kind of refrigeration device volume is high, and temperature protection is arranged during work.
The above only is the preferred implementation of the utility model; Should be understood that; For those skilled in the art; Under the prerequisite that does not break away from the utility model know-why, can also make some improvement and modification, these improvement and modification also should be regarded as the protection domain of the utility model.
Claims (7)
1. semiconductor refrigerating assembly with temperature protection and high-efficiency radiator; It is characterized in that: it is made up of the copper radiator of huyashi-chuuka (cold chinese-style noodles), huyashi-chuuka (cold chinese-style noodles) potsherd, semiconductor refrigerating NP element, hot side potsherd and the copper radiator of hot side; The top of said semiconductor refrigerating NP element is provided with the huyashi-chuuka (cold chinese-style noodles) potsherd; The bottom of said semiconductor refrigerating NP element is provided with the hot side potsherd, and the top of huyashi-chuuka (cold chinese-style noodles) potsherd is provided with the copper radiator of huyashi-chuuka (cold chinese-style noodles), and the bottom of hot side potsherd is provided with the copper radiator of hot side.
2. the semiconductor refrigerating assembly of band temperature protection according to claim 1 and high-efficiency radiator is characterized in that: the hot side potsherd is provided with positive and negative lead wires.
3. the semiconductor refrigerating assembly of band temperature protection according to claim 1 and high-efficiency radiator is characterized in that: the hot side potsherd is provided with temperature protection component.
4. the semiconductor refrigerating assembly of band temperature protection according to claim 1 and high-efficiency radiator is characterized in that: be provided with metalized coated between the copper radiator of huyashi-chuuka (cold chinese-style noodles) potsherd and huyashi-chuuka (cold chinese-style noodles).
5. the semiconductor refrigerating assembly of band temperature protection according to claim 1 and high-efficiency radiator is characterized in that: be provided with metalized coated between the copper radiator of hot side potsherd and hot side.
6. the semiconductor refrigerating assembly of band temperature protection according to claim 1 and high-efficiency radiator is characterized in that: the said metalized coated tin coating that is.
7. the semiconductor refrigerating assembly of band temperature protection according to claim 1 and high-efficiency radiator is characterized in that: said huyashi-chuuka (cold chinese-style noodles) potsherd, hot side potsherd and copper radiator weld together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204761060U CN202361687U (en) | 2011-11-25 | 2011-11-25 | Semiconductor refrigeration component with temperature protection and efficient radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204761060U CN202361687U (en) | 2011-11-25 | 2011-11-25 | Semiconductor refrigeration component with temperature protection and efficient radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202361687U true CN202361687U (en) | 2012-08-01 |
Family
ID=46572869
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204761060U Expired - Fee Related CN202361687U (en) | 2011-11-25 | 2011-11-25 | Semiconductor refrigeration component with temperature protection and efficient radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202361687U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107732359A (en) * | 2017-09-05 | 2018-02-23 | 北京普莱德新能源电池科技有限公司 | Electric automobile power battery heat management device based on semiconductor refrigerating technology |
-
2011
- 2011-11-25 CN CN2011204761060U patent/CN202361687U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107732359A (en) * | 2017-09-05 | 2018-02-23 | 北京普莱德新能源电池科技有限公司 | Electric automobile power battery heat management device based on semiconductor refrigerating technology |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120801 Termination date: 20201125 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |