CN202332961U - LED (light-emitting diode) packaging device capable of realizing lensless packaging by utilizing surface modification - Google Patents
LED (light-emitting diode) packaging device capable of realizing lensless packaging by utilizing surface modification Download PDFInfo
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- CN202332961U CN202332961U CN2011204972057U CN201120497205U CN202332961U CN 202332961 U CN202332961 U CN 202332961U CN 2011204972057 U CN2011204972057 U CN 2011204972057U CN 201120497205 U CN201120497205 U CN 201120497205U CN 202332961 U CN202332961 U CN 202332961U
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Abstract
The utility model discloses an LED (light-emitting diode) packaging device capable of realizing lensless packaging by utilizing surface modification. The packaging device comprises a packaging matrix, an LED chip arranged on the packaging matrix, a surface modification layer which is arranged on the packaging matrix and forms an annular encircling region taking the LED chip as the center, and a fluorescent powder adhesive layer and a silica gel layer, which are respectively spot-coated in the annular encircling region and used for wrapping and packaging the LED chip, wherein the surface modification layer is used for changing the wetting angle between the fluorescent powder adhesive layer and the silica gel layer, and the surface of the packaging matrix. The packaging device disclosed by the utility model has the advantages that, by changing the wetting angle between fluorescent powder adhesive and silica gel on the surface of the packaging matrix, affecting the flow of the silica gel and the fluorescent powder adhesive by utilizing the surface modification layer and combining with the surface tension of the silica gel and the fluorescent powder adhesive, the fluorescent powder layer and the silica gel layer meeting the design requirements are formed, and the lensless packaging is realized. The method disclosed by the utility model has the advantages of low cost, simplicity in operation and easiness in implementation.
Description
Technical field
The utility model relates to the LED packaging, controls the packaging of phosphor powder layer and the no lens packages of silica gel layer geometry realization thereby relate in particular to through encapsulation matrix being carried out surface modification.
Background technology
LED (Light Emitting Diode) is a kind of light emitting semiconductor device of processing based on P-N junction electroluminescence principle; Have advantages such as electro-optical efficiency height, long service life, environmental protection and energy saving, volume be little; Be described as the 21 century green illumination light source; If can be applied to the traditional lighting field and will obtain very obvious energy-saving effect, this is significant now what be becoming tight global energy day.Along with the breakthrough that with the nitride is the third generation semi-conducting material technology of representative; Semiconductor lighting industry based on high-power and high-luminance light-emitting diode (LED) is risen rapidly in the whole world; Just becoming semi-conductor photoelectronic industry new growth engines, and causing a revolution in the traditional lighting field.LED has begun to be used widely in a lot of fields because its unique advantages, is thought the main developing direction of following lighting technology to have huge market potential by industry.
The LED encapsulation is as the middle reaches link of LED industry, and is significant to the quick popularization that realizes the LED illumination.Improve luminous efficiency, the luminous mass of LED, reliability meanwhile reduces the cost of LED, is the main purpose of LED encapsulation.
In the high-brightness white-light LED field, preparation LED package module method for packing commonly used is after chip surface spot printing phosphor gel, pours silica gel in the space of mode between chip and covering lens or mould through encapsulating at present.In this method, lens or mould need preparation in advance, and lens also need the mould manufacturing, in production cost, add die cost inevitably.In addition, mould is that the conveniently stripped release agent that adds or other chemicals can be introduced impurity in silica gel, and these impurity can be introduced the factor like acceleration component failures such as moistures in embedding and use.Thereby it is significant in the LED encapsulation, to look for no lens packaging method a kind of simple to operate, with low cost.
The utility model content
The purpose of the utility model is phosphor gel, silica gel and encapsulation matrix wetting of surfaces angle to be changed, thereby a kind of white light LEDs packaging that does not have lensization is provided through increasing surface reforming layer on LED encapsulation matrix surface.
According to an aspect of the utility model, the LED packaging of the utility model comprises:
Encapsulation matrix,
Be arranged on the led chip on the encapsulation matrix,
Be arranged on the encapsulation matrix with led chip the surface reforming layer that is formed centrally annular enclosing region in being, and
Be coated in said annular enclosing region is interior, be used for led chip is carried out wrapping and encapsulating fluorescent material glue-line and silica gel layer respectively, said surface reforming layer is used to change the angle of wetting between fluorescent material glue-line and silica gel layer and the encapsulation matrix surface.
As further preferably, the shape that said surface reforming layer constituted for example is square, circular, regular or irregular polygon.Said surface reforming layer can seal or not seal, or is connected to form confining bed by different not confining beds.
As further preferably, said surface reforming layer is positioned on same plane or the Different Plane.
As further preferably, the material of said surface reforming layer is surface energy and encapsulation matrix surface energy different metallic material, nano material or close silica gel or thin silica gel material, for example fluorine polymeric silicon material, graphite flake, nano titanium oxide etc.
As further preferably, the quantity that is arranged on the led chip on the encapsulation matrix is more than 1 or 2, and wherein the distribution of chip can be array or other regular distribution forms under the situation of a plurality of chips.
As further preferably, be positioned at outermost said fluorescent material glue-line of packaging or silica gel layer and form lens shape.
As further preferably, said encapsulation matrix is flat structure or reflector type structure.
As further preferably, said silica gel layer is a multilayer, and wherein one or more layers is positioned at said fluorescent material glue-line, and other layer all is positioned at outside the fluorescent material glue-line.
According to the utility model on the other hand, the LED packaging of the utility model comprises:
Encapsulation matrix,
Be arranged on the led chip more than 2 on the encapsulation matrix,
Being arranged on the encapsulation matrix with each led chip is the surface reforming layer that the center forms annular enclosing region respectively,
Put the fluorescent material glue-line that is coated in the most inboard said annular enclosing region, is used for each led chip is carried out wrapping and encapsulating, and
Spot printing in the said annular enclosing region in the outside, be used for adjacent LED chip and corresponding fluorescent material glue-line are carried out together the silica gel layer of wrapping and encapsulating, said surface reforming layer is used to change the angle of wetting between fluorescent material glue-line and silica gel layer and the encapsulation matrix surface.
Through LED packaging and method thereof that the utility model provides, because the modifying function of surface reforming layer, making encapsulation body outermost layer is fluorescent material glue-line or silica gel layer, and its surface configuration possesses designing requirement.The LED packaging that the utility model provides utilizes the modifying function of surface reforming layer, realizes no lens packages.
Description of drawings
Come further to specifically describe a plurality of embodiment below in conjunction with accompanying drawing according to the utility model.
Fig. 1 is the sketch map according to first embodiment of the utility model, and wherein Fig. 1 (a) is arranged on interior and silica gel layer with the fluorescent material glue-line to be arranged on outer situation, and Fig. 1 (b) is arranged on the outer and silica gel layer situation in being arranged on the fluorescent material glue-line;
Fig. 2 is the sketch map according to second embodiment of the utility model;
Fig. 3 is the sketch map according to the 3rd embodiment of the utility model;
Fig. 4 is the sketch map according to the 4th embodiment of the utility model;
Fig. 5 is the sketch map according to the 5th embodiment of the utility model;
Fig. 6 is the sketch map according to the 6th embodiment of the utility model;
Symbol description among the figure
1 plate encapsulation matrix 2LED chip 3 fluorescent material glue-lines 4 silica gel layer 5 surface reforming layers (dredging silica gel), 6 surface reforming layers (close silica gel), 7 reflector type encapsulation matrix
Embodiment
Embodiment one
Come further to specify the embodiment of the utility model below in conjunction with accompanying drawing.Fig. 1 is the sketch map according to first embodiment of the utility model, and wherein Fig. 1 (a) is arranged on interior and silica gel layer with the fluorescent material glue-line to be arranged on outer situation, and Fig. 1 (b) is arranged on the outer and silica gel layer situation in being arranged on the fluorescent material glue-line.Referring to Fig. 1, the structure of LED device is by encapsulation matrix 1, led chip 2, and fluorescent material glue-line 3, silica gel layer 4, surface reforming layer 5 is formed.Led chip is mounted in the encapsulation matrix 1.Encapsulation matrix 1 is flat structure or reflector type structure or other structures, is flat structure in the present embodiment.One or more surface reforming layers 5 are arranged on the encapsulation matrix 1, comprise 2 surface reforming layers in the present embodiment.Surface reforming layer 5 forms around the annular of surrounding led chip, and the shape of ring can be square or circular, or rule or irregular polygon or other shapes, and ring can be confining bed sealing or that do not seal or be connected to form by different not confining beds.Each surface reforming layer can be positioned on the same plane or on Different Plane, and in the present embodiment, each modified layer is positioned on the same plane.The width of each modified layer is identical or inequality, and each layer width is identical in the present embodiment.The material of surface reforming layer 5 is surface energy and former encapsulation matrix surface ability different metallic material, nano material or close silica gel or thin silica gel material, like materials such as fluorine polymeric silicon material, graphite flake, nano titanium oxides.These materials can be connected on the encapsulation matrix 1 through spraying, bonding, printing or other method.The material of encapsulation matrix 1 can be metal, pottery, monocrystalline silicon or other material.
In the present embodiment, led chip 2 can be at first by fluorescent material glue-line 3 parcels, again by silica gel layer 4 parcels; Also can be coated by fluorescent material glue-line 3 at first by silica gel layer 4 parcels.Be positioned at outermost silica gel layer 4 or fluorescent material glue-line 3 and be lens shape.Led chip 2 in the present embodiment is the positive cartridge chip of horizontal electrode or positive cartridge chip of vertical electrode or flip-chip.The bottom of positive cartridge chip of plane electrode or vertical chip adopts the mode of high heat conduction scolder or eutectic weldering or laser welding to be mounted on the encapsulation matrix, and flip-chip adopts solder-ball flip on encapsulation matrix.Described led chip comprises blue light emitting chip and ultra-violet light-emitting chip, and described fluorescent material adopts dissimilar fluorescent material according to chip type.
Concrete method for packing can comprise following steps:
The surface reforming layer of annular spread is set on the surface of encapsulation matrix, and this surface reforming layer is used to change the angle of wetting between phosphor gel and these encapsulating materials of silica gel and the encapsulation matrix surface; For example square, circular, the regular or irregular polygon of the shape of ring.Ring is sealing or open structure; Distance between each modified layer is by the thickness decision of required phosphor gel or silica gel;
Led chip is mounted on the surface of encapsulation matrix, and takes suitable electrical interconnection according to chip type;
In the different annular regions of on the surface of encapsulation matrix, surrounding, respectively phosphor gel and the even point of silica gel are coated on the encapsulation matrix, are formed for the fluorescent material glue-line and the silica gel layer of wrapping and encapsulating led chip through spot gluing equipment by said surface reforming layer; Wherein can make phosphor gel or silica gel when reaching stable state, possess the surface configuration that adheres to specification, be formed lens shape in the present embodiment through the speed and the glue amount of control point glue;
The control temperature makes whole packaging full solidification to accomplish encapsulation.
Method for packing increases surface reforming layer 5 based on the physicochemical properties of phosphor gel and silica gel through the upper surface in LED encapsulation matrix 1, and fluorescent material glue-line 3, silica gel layer 4 are changed with the angle of wetting of encapsulation matrix 1 upper surface.Behind the pasting chip; Progressively spot printing phosphor gel and silica gel form fluorescent material glue-line and silica gel layer respectively; Fluorescent material glue-line 3 or silica gel layer 4 receive the control of surface reforming layer 5 in encapsulation matrix 1 lip-deep shape, and other part forms stable shaped under the acting in conjunction of surface tension and gravity.Amount through control phosphor gel or silica gel finally forms the packaging body that comprises phosphor powder layer, silica gel layer etc. that surface configuration possesses designing requirement.Its detailed process is: when phosphor gel or silica gel flow to the medial surface of modified layer, owing to receive the influence that angle of wetting changes, phosphor gel or silica gel can stop to flow or further flowing, and its shape on matrix surface is limited by surface reforming layer.Modified layer can be close silica gel layer or thin silica gel layer, and in the present embodiment is to dredge silica gel layer.When continuing to increase some glue amount, phosphor gel or silica gel can change under the acting in conjunction of surface tension and gravity, thereby can generate the surface configuration that meets the demands through control point glue amount.
Embodiment two
Referring to Fig. 2, the structure of LED device is by led chip 2, fluorescent material glue-line 3, and silica gel layer 4, surface reforming layer 5 is formed.Led chip is mounted in the encapsulation matrix 1.Encapsulation matrix 1 is flat structure or reflector type structure, is flat structure in the present embodiment.One or more surface reforming layers 5 are arranged on the encapsulation matrix 1, comprise 4 surface reforming layers in the present embodiment.Surface reforming layer 5 forms the annular of surrounding led chip, and the shape of ring can be square or circular, rule or irregular polygon or other shape, and ring can be confining bed sealing or that do not seal or be connected to form by different not confining beds.Each surface reforming layer can be positioned on the same plane or on Different Plane, and each modified layer is positioned on the same plane in the present embodiment.The width of each modified layer is identical or inequality, and each layer width is identical in the present embodiment.The material of modified layer 5 is surface energy and former encapsulation matrix surface ability different metallic material, nano material or other close silica gel or thin silica gel material, like fluorine polymeric silicon material, graphite flake, nano titanium oxide etc.These materials can be connected on the encapsulation matrix 1 through spraying, bonding, printing or other method.The material of encapsulation matrix 1 can be metal, pottery, monocrystalline silicon or other material.
In the present embodiment, led chip 2 is at first coated by silica gel layer 4, is coated by fluorescent material glue-line 3 again, is coated by multilayer silica gel layer 4 again, and silica gel layer 4 outermost layers are shaped as lens shape.Led chip 2 in the present embodiment is the positive cartridge chip of horizontal electrode or positive cartridge chip of vertical electrode or flip-chip.The bottom of positive cartridge chip of plane electrode or vertical chip adopts the mode of high heat conduction scolder or eutectic weldering or laser welding to be mounted on the encapsulation matrix, and flip-chip adopts solder-ball flip on encapsulation matrix.Described led chip comprises blue light emitting chip and ultra-violet light-emitting chip, and described fluorescent material adopts dissimilar fluorescent material according to chip type.
Concrete method for packing can be similar with embodiment one, and the main difference part is extra several silica gel layer that increased.
Embodiment three
The encapsulation matrix of embodiment three and embodiment one different is embodiment three is a reflector type encapsulation matrix 7.On the reflector face of encapsulation matrix by surface reforming layer that has thin silica gel layer to constitute 5 and the surface reforming layer 6 that constitutes by close silica gel layer.In the present embodiment, dredge silica gel layer through increasing fluorescent material and encapsulation matrix wetting of surfaces angle, phosphor powder layer upper surface shape through changing the phosphor gel amount, can be controlled in the position of restriction phosphor gel, and phosphor powder layer is a convex in the present embodiment.Parent's silica gel layer reduces silica gel and encapsulation matrix wetting of surfaces angle, makes the silica gel upper surface form the shape (especially spill) that adheres to specification, and silica gel layer is a spill shape in the present embodiment.Specifically referring to accompanying drawing 3.
Embodiment four
Different is dredges the relative position of silica gel layer 5 and close silica gel layer 6 for embodiment four and embodiment three, and the phosphor powder layer upper surface is shaped as spill in the present embodiment, and the silica gel layer upper surface is shaped as convex, specifically referring to accompanying drawing 4.
Embodiment five
Different is to be multi-core encapsulation module among the embodiment four for embodiment five and embodiment one; A plurality of led chips are arranged on the encapsulation matrix 1; Each led chip 2 is coated by fluorescent material glue-line 3; Each fluorescent material glue-line 3 is coated by silica gel layer 4 and forms the surface configuration that adheres to specification, specifically referring to accompanying drawing 5.Certainly, also can be as such among Fig. 2, led chip 2 also can be coated by multilayer silica gel layer 4, and silica gel layer 4 outermost layers are shaped as lens shape.
Embodiment six
Different is that a plurality of led chips 2 are coated by same silica gel layer 4 with fluorescent material glue-line 3 among the embodiment six, specifically referring to accompanying drawing 6 for embodiment six and embodiment five.
Those of ordinary skill in the art understands easily, and the above is the preferred embodiment of the utility model, but the utility model should not be confined to the disclosed content of this embodiment and accompanying drawing.So everyly do not break away from the equivalence of accomplishing under the spirit disclosed in the utility model or revise, all fall into the scope of the utility model protection.
Claims (9)
1. LED packaging comprises:
Encapsulation matrix,
Be arranged on the led chip on the encapsulation matrix,
Be arranged on the encapsulation matrix with led chip the surface reforming layer that is formed centrally annular enclosing region in being, and
Be coated in said annular enclosing region is interior, be used for led chip is carried out wrapping and encapsulating fluorescent material glue-line and silica gel layer respectively, said surface reforming layer is used to change the angle of wetting between fluorescent material glue-line and silica gel layer and the encapsulation matrix surface.
2. LED packaging as claimed in claim 1 is characterized in that, said surface reforming layer is sealing or does not seal, or is connected to form confining bed by different not confining beds.
3. according to claim 1 or claim 2 LED packaging is characterized in that the material of said surface reforming layer is surface energy and encapsulation matrix surface energy different metallic material, nano material or close silica gel or thin silica gel material.
4. LED packaging as claimed in claim 3 is characterized in that, the material of said surface reforming layer is fluorine polymeric silicon material, graphite flake or nano titanium oxide.
5. LED packaging as claimed in claim 1 is characterized in that, the said quantity that is arranged on the led chip on the encapsulation matrix is more than 1 or 2.
6. LED packaging as claimed in claim 1 is characterized in that, is positioned at outermost said fluorescent material glue-line of packaging or silica gel layer and forms lens shape.
7. LED packaging as claimed in claim 1 is characterized in that, said encapsulation matrix is flat structure or reflector type structure.
8. LED packaging as claimed in claim 1 is characterized in that, said silica gel layer is a multilayer, and wherein one or more layers is positioned at said fluorescent material glue-line, and other layer all is positioned at outside the fluorescent material glue-line.
9. LED packaging comprises:
Encapsulation matrix,
Be arranged on the led chip more than 2 on the encapsulation matrix,
Being arranged on the encapsulation matrix with each led chip is the surface reforming layer that the center forms annular enclosing region respectively,
Put the fluorescent material glue-line that is coated in the most inboard said annular enclosing region, is used for each led chip is carried out wrapping and encapsulating, and
Spot printing in the said annular enclosing region in the outside, be used for adjacent LED chip and corresponding fluorescent material glue-line are carried out together the silica gel layer of wrapping and encapsulating, said surface reforming layer is used to change the angle of wetting between fluorescent material glue-line and silica gel layer and the encapsulation matrix surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204972057U CN202332961U (en) | 2011-12-02 | 2011-12-02 | LED (light-emitting diode) packaging device capable of realizing lensless packaging by utilizing surface modification |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204972057U CN202332961U (en) | 2011-12-02 | 2011-12-02 | LED (light-emitting diode) packaging device capable of realizing lensless packaging by utilizing surface modification |
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| CN202332961U true CN202332961U (en) | 2012-07-11 |
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| CN2011204972057U Expired - Fee Related CN202332961U (en) | 2011-12-02 | 2011-12-02 | LED (light-emitting diode) packaging device capable of realizing lensless packaging by utilizing surface modification |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102437273A (en) * | 2011-12-02 | 2012-05-02 | 华中科技大学 | LED packaging device capable of realizing lens-free packaging by utilizing surface modification and method thereof |
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2011
- 2011-12-02 CN CN2011204972057U patent/CN202332961U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102437273A (en) * | 2011-12-02 | 2012-05-02 | 华中科技大学 | LED packaging device capable of realizing lens-free packaging by utilizing surface modification and method thereof |
| CN102437273B (en) * | 2011-12-02 | 2014-08-27 | 华中科技大学 | LED packaging device capable of realizing lens-free packaging by utilizing surface modification and method thereof |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120711 Termination date: 20161202 |