CN202332864U - 一种整流半导体器件 - Google Patents

一种整流半导体器件 Download PDF

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Publication number
CN202332864U
CN202332864U CN2011204542720U CN201120454272U CN202332864U CN 202332864 U CN202332864 U CN 202332864U CN 2011204542720 U CN2011204542720 U CN 2011204542720U CN 201120454272 U CN201120454272 U CN 201120454272U CN 202332864 U CN202332864 U CN 202332864U
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China
Prior art keywords
semiconductor device
oxygen
chip
rectified semiconductor
epoxy molding
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Expired - Fee Related
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CN2011204542720U
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English (en)
Inventor
孙孝兵
毕士轩
杨利
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LIANYUNGANG FENGDA ELECTRONICS CO Ltd
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LIANYUNGANG FENGDA ELECTRONICS CO Ltd
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Priority to CN2011204542720U priority Critical patent/CN202332864U/zh
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

本实用新型是一种整流半导体器件,其特征在于:它包括玻璃钝化芯片,在玻璃钝化芯片的两端各固定连接设有一根无氧铜导线,所述的玻璃钝化芯片和无氧铜导线封装设于一个柱状的环氧模塑料块中,无氧铜导线的连接端伸出环氧模塑料块外。本实用新型结构更为合理,加工使用方便,有效避免了酸洗的清洗不净或烘干不彻底现象,有效地提高了产品的电性良率。

Description

一种整流半导体器件
技术领域
本实用新型涉及一种半导体器件,特别是一种半导体整流半导体器件。
背景技术
现有技术中的二极管由二极管芯片和引脚组成,并将其塑封于圆柱状的环氧膜塑料中制成。其缺陷在于:由于其结构设置不合理,加工不方便,由于生产过程需要对该芯片进行酸洗、上白胶和烘干工序,因此生产时流程长,生产效率低,焊接温度高达370℃-385℃,导致产品的电性良率低。
发明内容
本实用新型所要解决的技术问题是针对现有技术的不足,提供一种结构更为合理、加工容易、生产效率高的整流半导体器件。
本实用新型所要解决的技术问题是通过以下的技术方案来实现的。本实用新型是一种整流半导体器件,其特点是:它包括玻璃钝化芯片,在玻璃钝化芯片的两端各固定连接设有一根无氧铜导线,所述的玻璃钝化芯片和无氧铜导线封装设于一个柱状的环氧模塑料块中,无氧铜导线的连接端伸出环氧模塑料块外。
本实用新型采用的芯片为玻璃钝化芯片,由于采用玻璃钝化芯片生产过程中不需要酸洗、上白胶和烘干工序,因此有效地缩短了生产流程;焊接温度只需要360℃-370℃,极大地提高生产效率。
与现有技术相比,本实用新型结构更为合理,加工使用方便,有效避免了酸洗的清洗不净或烘干不彻底现象,有效地提高了产品的电性良率。
附图说明
图1为本实用新型的一种结构示意图。
具体实施方式
以下参照附图,进一步描述本实用新型的具体技术方案,以便于本领域的技术人员进一步地理解本发明,而不构成对其权利的限制。
实施例1,一种整流半导体器件,它包括玻璃钝化芯片1,在玻璃钝化芯片1的两端各固定连接设有一根无氧铜导线3,所述的玻璃钝化芯片1和无氧铜导线3封装设于一个柱状的环氧模塑料块2中,无氧铜导线3的连接端伸出环氧模塑料块2外。

Claims (1)

1.一种整流半导体器件,其特征在于:它包括玻璃钝化芯片,在玻璃钝化芯片的两端各固定连接设有一根无氧铜导线,所述的玻璃钝化芯片和无氧铜导线封装设于一个柱状的环氧模塑料块中,无氧铜导线的连接端伸出环氧模塑料块外。
CN2011204542720U 2011-11-16 2011-11-16 一种整流半导体器件 Expired - Fee Related CN202332864U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011204542720U CN202332864U (zh) 2011-11-16 2011-11-16 一种整流半导体器件

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Application Number Priority Date Filing Date Title
CN2011204542720U CN202332864U (zh) 2011-11-16 2011-11-16 一种整流半导体器件

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CN202332864U true CN202332864U (zh) 2012-07-11

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105932071A (zh) * 2016-06-20 2016-09-07 滨州德润电子有限公司 一种高温下不易损坏的大功率二极管

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105932071A (zh) * 2016-06-20 2016-09-07 滨州德润电子有限公司 一种高温下不易损坏的大功率二极管

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Granted publication date: 20120711

Termination date: 20201116