CN202285249U - Light emitting diode (LED) chip bracket - Google Patents

Light emitting diode (LED) chip bracket Download PDF

Info

Publication number
CN202285249U
CN202285249U CN2011204338907U CN201120433890U CN202285249U CN 202285249 U CN202285249 U CN 202285249U CN 2011204338907 U CN2011204338907 U CN 2011204338907U CN 201120433890 U CN201120433890 U CN 201120433890U CN 202285249 U CN202285249 U CN 202285249U
Authority
CN
China
Prior art keywords
matrix
led chip
heating panel
loam cake
fluorescent powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2011204338907U
Other languages
Chinese (zh)
Inventor
霍文旭
栗敏
吴景海
成长青
亢锐英
许敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanxi Guangyu Semiconductor Lighting Co., Ltd.
Original Assignee
Shanxi Guangyu LED Lighting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanxi Guangyu LED Lighting Co Ltd filed Critical Shanxi Guangyu LED Lighting Co Ltd
Priority to CN2011204338907U priority Critical patent/CN202285249U/en
Application granted granted Critical
Publication of CN202285249U publication Critical patent/CN202285249U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a light emitting diode (LED) chip bracket comprising a heat-radiation plate, an electrode, an insulator and fluorescent powder layers, wherein the insulator comprises a matrix and an upper cover, the matrix is fixedly connected to the heat-radiation plate, the upper cover is fixed on the matrix, installing holes are arranged on the matrix and the upper cover, and the fluorescent powder layers are movably arranged in the installing holes. According to the LED chip bracket disclosed by the utility model, the fluorescent powder layers with independent installation are adopted, and the packaging of fluorescent powder parts and an LED chip is separated. The senescence of fluorescent powder is greatly relieved; and moreover, the independent replacement of the fluorescent powder layers can be realized so as to adapt to the requirements of different lamps to different color temperatures.

Description

A kind of led chip support
Technical field
The utility model relates to a kind of led chip support.
Background technology
LED (light-emitting diode) has advantages such as cold light source, energy-saving and environmental protection, safety; Adopt the light fixture of led light source that long service life, advantage such as not fragile are arranged; And led light source do not have conventional light source to the luminous shortcoming in four sides, and the characteristics of luminescence of its high directivity can promote the light extraction efficiency of light fixture.
The encapsulation of current led light source mainly contains single and integrated two kinds of forms.The primary structure of integrated packaging LED chips support is that insulating barrier parcel electrode slice is fixed on the heating panel; The led chip of the Lights section is installed in the top of insulating barrier heating panel; Be connected with the electrode slice circuit, the silica gel that is doped with fluorescent material directly be coated in the chip top encapsulate.The led light source processed of encapsulation because the chip heating unavoidably can bring the temperature of fluorescent material to raise, has aggravated the aging of fluorescent material when work like this.
Summary of the invention
The purpose of the utility model provides a kind of led chip support, directly is coated in the deficiency that the fluorescent material that brings the chip top is prone to aging to solve current led chip support fluorescent material.
The led chip support of the utility model comprises heating panel, electrode, insulator and phosphor powder layer; On heating panel, be provided with a led chip installation region; Pair of electrodes is embedded in the heating panel; The one of which end is exposed to the periphery of led chip installation region on the heating panel, and the other end is exposed to arbitrary edge of heating panel.Said insulator is made up of matrix and loam cake; Said matrix is fixedly connected on the one side that heating panel is provided with the led chip installation region; Loam cake is fixed on the matrix, matrix and loam cake with respect to heating panel on place, led chip installation region be provided with installing hole, phosphor powder layer is movably arranged in the installing hole.
Wherein, Loam cake with a kind of mode that is fixedly connected of matrix is: on described matrix, be provided with at least one draw-in groove; On the contact-making surface of said loam cake and matrix, be provided with the jump ring complementary with said draw-in groove, said jump ring snaps in the draw-in groove, and loam cake and matrix are connected as a single entity.
The installing hole inwall is configured to concaveconvex structure near a side of heating panel on the matrix, and when above led chip, encapsulating silica gel in the future, this concaveconvex structure can fully combine with encapsulation silica gel, has avoided the caducous deficiency of traditional led chip support packaged light source silica gel.
The led chip support of the utility model also comprises a socket, and this socket is arranged on a side of insulator, is connected with the telegraph circuit that is exposed to the heating panel edge.
The led chip support that the utility model provided is than traditional led chip support; Adopted the phosphor powder layer of independent installation; The encapsulation of fluorescent material part with led chip is separated; Not only slowed down the aging of fluorescent material greatly, and can realize the independent replacing of phosphor powder layer, to adapt to the requirement of different lamps different-colour.
The design of socket in the utility model led chip support has changed the technology that traditional led chip support uses welding method connection light source line, has simplified the fitting operation of led chip.
Description of drawings
Fig. 1 is the overall structure sketch map of the utility model embodiment led chip support.
Fig. 2 is the STRUCTURE DECOMPOSITION sketch map of the utility model embodiment led chip support.
Fig. 3 is the STRUCTURE DECOMPOSITION figure of the utility model embodiment led chip support insulator part.
Fig. 4 is the arrangement of electrodes sketch map of the utility model embodiment led chip support.
Embodiment
Below in conjunction with accompanying drawing and specific embodiment the utility model is further specified.
The structure of led chip support such as Fig. 1, shown in Figure 2 comprise heating panel 1, electrode 2, insulator 3, phosphor powder layer 4 and socket 5.
The shape of heating panel 1 such as Fig. 2 are provided with a foursquare led chip installation region 11 in the central authorities of heating panel 1.Pair of electrodes 2 is like Fig. 4 arrangements; And be embedded within the heating panel 1; The one of which end is centered around the periphery of led chip installation region 11, and around led chip installation region 11, exposes a part, is used for being connected with the led chip circuit in the future; The other end of electrode 2 is positioned at one side of heating panel 1, is used for being connected with socket 5 circuit in the future.
The structure of insulator 3 such as Fig. 3 are made up of matrix 31 and loam cake 32, are respectively equipped with an installing hole 33 in the central authorities of matrix 31 and loam cake 32, and this installing hole 33 is big or small consistent with led chip installation region 11, and the position is identical.Matrix 31 is fixedly connected on the one side that heating panel 1 is provided with led chip installation region 11 through the injection moulding mode, respectively is provided with 2 draw-in grooves 34 on the both sides of matrix 31.Both sides respectively are provided with 2 jump rings 35 on the contact-making surface of loam cake 32 and matrix 31, and this jump ring 35 and draw-in groove 34 corresponding complementary snap in jump ring 35 in the draw-in groove 34, can loam cake 32 be fixed on the matrix 31, are connected as a single entity.
Phosphor powder layer 4 is to adopt fluorescent material independently to make, and it is big or small consistent with installing hole 33, can be movably arranged in the installing hole 33, in support, be placed on behind the packaging LED chips future led chip above.
Be provided with an open slot on one side of insulator 3, socket 5 is installed in the open slot.This socket 5 is connected with the terminal circuit that electrode 2 is positioned at heating panel 1 edge, is the technology of light source energising to improve tradition employing welding manner, simplifies the electrical connection operation of light source.
Can in the installing hole 33 of matrix 31, concaveconvex structure 36 be set, this concaveconvex structure 36 is set on installing hole 33 inwalls side near heating panel 1.This concaveconvex structure 36 can fully combine with the led chip encapsulation silica gel of filling in the future, prevents coming off of silica gel.

Claims (4)

1. led chip support; Comprise heating panel (1), electrode (2), insulator (3) and phosphor powder layer (4); On heating panel (1), be provided with a led chip installation region (11); Pair of electrodes (2) is embedded in the heating panel (1); The one of which end is exposed to the periphery that heating panel (1) is gone up led chip installation region (11), and the other end is exposed to arbitrary edge of heating panel (1), it is characterized in that described insulator (3) is made up of matrix (31) and loam cake (32); Said matrix (31) is fixedly connected on the one side that heating panel (1) is provided with led chip installation region (11); Loam cake (32) is fixed on the matrix (31), locates to be provided with installing hole (33) at matrix (31) and loam cake (32) with respect to the last led chip installation region (11) of heating panel (1), and phosphor powder layer (4) is movably arranged in the installing hole (33).
2. led chip support according to claim 1; It is characterized in that on described matrix (31), being provided with at least one draw-in groove (34); On the contact-making surface of said loam cake (32) and matrix (31), be provided with the jump ring (35) complementary with said draw-in groove (34); Said jump ring (35) snaps in the draw-in groove (34), and loam cake (32) and matrix (31) are connected as a single entity.
3. led chip support according to claim 1 and 2 is characterized in that going up installing hole (33) inwall at said matrix (31) is arranged to concaveconvex structure (36) near a side of heating panel (1).
4. led chip support according to claim 1 and 2 is characterized in that being provided with socket (5) in a side of said insulator (3), and said socket (5) is connected with electrode (2) circuit that is exposed to heating panel (1) edge.
CN2011204338907U 2011-11-07 2011-11-07 Light emitting diode (LED) chip bracket Expired - Fee Related CN202285249U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011204338907U CN202285249U (en) 2011-11-07 2011-11-07 Light emitting diode (LED) chip bracket

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011204338907U CN202285249U (en) 2011-11-07 2011-11-07 Light emitting diode (LED) chip bracket

Publications (1)

Publication Number Publication Date
CN202285249U true CN202285249U (en) 2012-06-27

Family

ID=46296761

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011204338907U Expired - Fee Related CN202285249U (en) 2011-11-07 2011-11-07 Light emitting diode (LED) chip bracket

Country Status (1)

Country Link
CN (1) CN202285249U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103692774A (en) * 2013-12-23 2014-04-02 珠海天威飞马打印耗材有限公司 Chip connecting seat and powder box

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103692774A (en) * 2013-12-23 2014-04-02 珠海天威飞马打印耗材有限公司 Chip connecting seat and powder box
CN103692774B (en) * 2013-12-23 2015-07-15 珠海天威飞马打印耗材有限公司 Chip connecting seat and powder box

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee

Owner name: SHANXI GUANGYU SEMICONDUCTOR LIGHTING CO., LTD.

Free format text: FORMER NAME: SHANXI GUANGYU LED LIGHTING CO. LTD.

CP01 Change in the name or title of a patent holder

Address after: 041000 Shanxi Province, Linfen city yaomiao Guangyu Industrial Park (Linfen art school in South West 800 meters)

Patentee after: Shanxi Guangyu Semiconductor Lighting Co., Ltd.

Address before: 041000 Shanxi Province, Linfen city yaomiao Guangyu Industrial Park (Linfen art school in South West 800 meters)

Patentee before: Shanxi Guangyu LED Lighting Co., Ltd.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120627

Termination date: 20181107

CF01 Termination of patent right due to non-payment of annual fee