CN102386310A - Light-emitting diode (LED) chip bracket - Google Patents
Light-emitting diode (LED) chip bracket Download PDFInfo
- Publication number
- CN102386310A CN102386310A CN2011103458573A CN201110345857A CN102386310A CN 102386310 A CN102386310 A CN 102386310A CN 2011103458573 A CN2011103458573 A CN 2011103458573A CN 201110345857 A CN201110345857 A CN 201110345857A CN 102386310 A CN102386310 A CN 102386310A
- Authority
- CN
- China
- Prior art keywords
- led chip
- heating panel
- matrix
- loam cake
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000843 powder Substances 0.000 claims abstract description 13
- 239000012212 insulator Substances 0.000 claims abstract description 12
- 238000010438 heat treatment Methods 0.000 claims description 29
- 239000011159 matrix material Substances 0.000 claims description 24
- 235000012970 cakes Nutrition 0.000 claims description 15
- 238000009434 installation Methods 0.000 claims description 14
- OAICVXFJPJFONN-UHFFFAOYSA-N phosphorus Chemical compound 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[P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 8
- 230000000295 complement Effects 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 abstract description 6
- 230000032683 aging Effects 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 abstract 4
- 241001465382 Physalis alkekengi Species 0.000 abstract 1
- 239000000463 material Substances 0.000 description 8
- 239000000741 silica gel Substances 0.000 description 6
- 229910002027 silica gel Inorganic materials 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicium dioxide Chemical compound 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O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000000875 corresponding Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
Abstract
The invention discloses a light-emitting diode (LED) chip bracket, which comprises a heat sink, electrodes, an insulator and a fluorescent powder layer, wherein the insulator consists of a substrate and an upper cover; the substrate is fixedly connected to the heat sink; the upper cover is fixed on the substrate; mounting holes are formed on the substrate and the upper cover; and the fluorescent powder layer is movably arranged in the mounting holes. In the LED chip bracket provided by the invention, the fluorescent powder layer is independently arranged and separated from the encapsulation of an LED chip, so the ageing of fluorescent powder is greatly slowed down, and the fluorescent powder layer can be independently replaced so that requirements of different lamps and lanterns on different color temperatures can be met.
Description
Technical field
The present invention relates to a kind of led chip support.
Background technology
LED (light-emitting diode) has advantages such as cold light source, energy-saving and environmental protection, safety; Adopt the light fixture of led light source that long service life, advantage such as not fragile are arranged; And led light source do not have conventional light source to the luminous shortcoming in four sides, and the characteristics of luminescence of its high directivity can promote the light extraction efficiency of light fixture.
The encapsulation of current led light source mainly contains single and integrated two kinds of forms.The primary structure of integrated packaging LED chips support is that insulating barrier parcel electrode slice is fixed on the heating panel; The led chip of the Lights section is installed in the top of insulating barrier heating panel; Be connected with the electrode slice circuit, the silica gel that is doped with fluorescent material directly be coated in the chip top encapsulate.The led light source processed of encapsulation because the chip heating unavoidably can bring the temperature of fluorescent material to raise, has aggravated the aging of fluorescent material when work like this.
Summary of the invention
The purpose of this invention is to provide a kind of led chip support, directly be coated in the deficiency that the fluorescent material that brings the chip top is prone to aging to solve current led chip support fluorescent material.
Led chip support of the present invention comprises heating panel, electrode, insulator and phosphor powder layer; On heating panel, be provided with a led chip installation region; Pair of electrodes is embedded in the heating panel; The one of which end is exposed to the periphery of led chip installation region on the heating panel, and the other end is exposed to arbitrary edge of heating panel.Said insulator is made up of matrix and loam cake; Said matrix is fixedly connected on the one side that heating panel is provided with the led chip installation region; Loam cake is fixed on the matrix, matrix and loam cake with respect to heating panel on place, led chip installation region be provided with installing hole, phosphor powder layer is movably arranged in the installing hole.
Wherein, Loam cake with a kind of mode that is fixedly connected of matrix is: on described matrix, be provided with at least one draw-in groove; On the contact-making surface of said loam cake and matrix, be provided with the jump ring complementary with said draw-in groove, said jump ring snaps in the draw-in groove, and loam cake and matrix are connected as a single entity.
The installing hole inwall is configured to concaveconvex structure near a side of heating panel on the matrix, and when above led chip, encapsulating silica gel in the future, this concaveconvex structure can fully combine with encapsulation silica gel, has avoided the caducous deficiency of traditional led chip support packaged light source silica gel.
Led chip support of the present invention also comprises a socket, and this socket is arranged on a side of insulator, is connected with the telegraph circuit that is exposed to the heating panel edge.
Led chip support provided by the present invention is than traditional led chip support; Adopted the phosphor powder layer of independent installation; The encapsulation of fluorescent material part with led chip is separated; Not only slowed down the aging of fluorescent material greatly, and can realize the independent replacing of phosphor powder layer, to adapt to the requirement of different lamps different-colour.
The design of socket in the led chip support of the present invention has changed the technology that traditional led chip support uses welding method connection light source line, has simplified the fitting operation of led chip.
Description of drawings
Fig. 1 is the overall structure sketch map of embodiment of the invention led chip support.
Fig. 2 is the STRUCTURE DECOMPOSITION sketch map of embodiment of the invention led chip support.
Fig. 3 is the STRUCTURE DECOMPOSITION figure of embodiment of the invention led chip support insulator part.
Fig. 4 is the arrangement of electrodes sketch map of embodiment of the invention led chip support.
Embodiment
Below in conjunction with accompanying drawing and specific embodiment the present invention is further specified.
The structure of led chip support such as Fig. 1, shown in Figure 2 comprise heating panel 1, electrode 2, insulator 3, phosphor powder layer 4 and socket 5.
The shape of heating panel 1 such as Fig. 2 are provided with a foursquare led chip installation region 11 in the central authorities of heating panel 1.Pair of electrodes 2 is like Fig. 4 arrangements; And be embedded within the heating panel 1; The one of which end is centered around the periphery of led chip installation region 11, and around led chip installation region 11, exposes a part, is used for being connected with the led chip circuit in the future; The other end of electrode 2 is positioned at one side of heating panel 1, is used for being connected with socket 5 circuit in the future.
The structure of insulator 3 such as Fig. 3 are made up of matrix 31 and loam cake 32, are respectively equipped with an installing hole 33 in the central authorities of matrix 31 and loam cake 32, and this installing hole 33 is big or small consistent with led chip installation region 11, and the position is identical.Matrix 31 is fixedly connected on the one side that heating panel 1 is provided with led chip installation region 11 through the injection moulding mode, respectively is provided with 2 draw-in grooves 34 on the both sides of matrix 31.Both sides respectively are provided with 2 jump rings 35 on the contact-making surface of loam cake 32 and matrix 31, and this jump ring 35 and draw-in groove 34 corresponding complementary snap in jump ring 35 in the draw-in groove 34, can loam cake 32 be fixed on the matrix 31, are connected as a single entity.
Phosphor powder layer 4 is to adopt fluorescent material independently to make, and it is big or small consistent with installing hole 33, can be movably arranged in the installing hole 33, in support, be placed on behind the packaging LED chips future led chip above.
Be provided with an open slot on one side of insulator 3, socket 5 is installed in the open slot.This socket 5 is connected with the terminal circuit that electrode 2 is positioned at heating panel 1 edge, is the technology of light source energising to improve tradition employing welding manner, simplifies the electrical connection operation of light source.
Can in the installing hole 33 of matrix 31, concaveconvex structure 36 be set, this concaveconvex structure 36 is set on installing hole 33 inwalls side near heating panel 1.This concaveconvex structure 36 can fully combine with the led chip encapsulation silica gel of filling in the future, prevents coming off of silica gel.
Claims (4)
1. led chip support; Comprise heating panel (1), electrode (2), insulator (3) and phosphor powder layer (4); On heating panel (1), be provided with a led chip installation region (11); Pair of electrodes (2) is embedded in the heating panel (1); The one of which end is exposed to the periphery that heating panel (1) is gone up led chip installation region (11), and the other end is exposed to arbitrary edge of heating panel (1), it is characterized in that described insulator (3) is made up of matrix (31) and loam cake (32); Said matrix (31) is fixedly connected on the one side that heating panel (1) is provided with led chip installation region (11); Loam cake (32) is fixed on the matrix (31), locates to be provided with installing hole (33) at matrix (31) and loam cake (32) with respect to the last led chip installation region (11) of heating panel (1), and phosphor powder layer (4) is movably arranged in the installing hole (33).
2. led chip support according to claim 1; It is characterized in that on described matrix (31), being provided with at least one draw-in groove (34); On the contact-making surface of said loam cake (32) and matrix (31), be provided with the jump ring (35) complementary with said draw-in groove (34); Said jump ring (35) snaps in the draw-in groove (34), and loam cake (32) and matrix (31) are connected as a single entity.
3. led chip support according to claim 1 and 2 is characterized in that going up installing hole (33) inwall at said matrix (31) is arranged to concaveconvex structure (36) near a side of heating panel (1).
4. led chip support according to claim 1 and 2 is characterized in that being provided with socket (5) in a side of said insulator (3), and said socket (5) is connected with electrode (2) circuit that is exposed to heating panel (1) edge.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103458573A CN102386310A (en) | 2011-11-07 | 2011-11-07 | Light-emitting diode (LED) chip bracket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103458573A CN102386310A (en) | 2011-11-07 | 2011-11-07 | Light-emitting diode (LED) chip bracket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102386310A true CN102386310A (en) | 2012-03-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103458573A Pending CN102386310A (en) | 2011-11-07 | 2011-11-07 | Light-emitting diode (LED) chip bracket |
Country Status (1)
| Country | Link |
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| CN (1) | CN102386310A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105222072A (en) * | 2014-10-24 | 2016-01-06 | 成都世纪光合作用科技有限公司 | Long-range high-power Dimmable lighting device |
| CN106402731A (en) * | 2016-08-31 | 2017-02-15 | 中山昂欣科技有限责任公司 | Using method and structural part for fixing alternating current light-emitting chip |
Citations (4)
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| CN106402731A (en) * | 2016-08-31 | 2017-02-15 | 中山昂欣科技有限责任公司 | Using method and structural part for fixing alternating current light-emitting chip |
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