CN202252991U - Led灯泡 - Google Patents
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
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- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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Abstract
本实用新型涉及照明灯具领域。LED灯泡,包括灯头、灯壳、灯罩和LED光源,灯壳安装在灯头上,灯罩安装在灯壳上,还包括用于支撑LED光源的导线,导线连接灯头,LED光源处于灯罩的内腔内;所述LED光源包括芯片、荧光粉和柔性PCB板,荧光粉涂在芯片上,芯片固定在柔性PCB板上,导线焊接在柔性PCB板上。该LED灯泡的优点是结构新颖,光的利用率高,生产成本低。
Description
技术领域
本实用新型涉及照明灯具领域,尤其涉及一种LED作为光源的灯泡。
背景技术
能源短缺是当今世界的热门话题,在照明行业中,LED灯泡因为它的高效、节能、环保、长寿命等多种优点,是取代能耗高,寿命短的传统白炽灯(钨丝灯)的首选。白炽灯(钨丝灯)包括灯丝,支架,透明灯罩,填充气体和灯头构成,支架支撑灯丝,透明泡壳内充入惰性气体,并要求密封,靠灯丝发热产生光,其效率低,工艺复杂,其好处是360度发光。目前市场上类似于白炽灯接近360度发光的LED灯泡也有,其结构包括灯头、灯壳和LED光源,灯壳上设置圆柱形或方形的支架,多个LED光源环绕安装在支架的外侧壁上,即除了靠近灯体一侧外其它五面均安装LED光源实现LED灯的360度发光,支架一般是采用铝基板,其存在的不足是光的利用率低,结构单一并且生产成本高。
发明内容
本实用新型的目的是为了克服现有LED灯泡存在的光的利用率低、生产成本高的问题,提供一种结构新颖,光的利用率高,生产成本低的LED灯泡。
为了实现上述发明目的,本实用新型采用了以下的技术方案:
LED灯泡,包括灯头、灯壳、灯罩和LED光源,灯壳安装在灯头上,灯罩安装在灯壳上,还包括用于支撑LED光源的导线,导线连接灯头,LED光源处于灯罩的内腔内;所述LED光源包括芯片、荧光粉和柔性PCB板,荧光粉涂在芯片上,芯片固定在柔性PCB板上,导线焊接在柔性PCB板上。
作为优选,所述柔性PCB板是印刷有电路的聚酰亚胺或聚酯薄膜板,生产 成本低,并且耐温效果好,尤其是长时间使用后也不会发黑变色影响发光的效率。
作为优选,所述柔性PCB板呈透明或半透明状,芯片360度发光都会穿过柔性PCB板,光可以任意透射而不会被挡住,光的利用率提高了一倍以上。
作为优选,所述导线通过锡焊接在柔性PCB板的电路上并在焊接处覆盖粘接剂固定;所述芯片通过绝缘胶、银胶或锡膏中的一种粘接在柔性PCB板上,芯片通过金线连接柔性PCB板。导线除了连通电源之外还起支撑LED光源的作用,因此上述固定方式可以将LED光源牢固的固定,延长使用寿命。
作为优选,所述LED光源直径在1.5mm之内,便于LED光源折弯或通过导线连成各种形状,直径太粗难以实现并且直径大重量就重不利于导线支撑。
作为优选,所述柔性PCB板折弯呈弧形且不能折角,折弯呈弧形便于制成各种形状,提高发光效率,折角后柔性PCB及其上的芯片以及连接芯片与PCB的金线就容易断裂损坏,不能使用。
作为优选,所述芯片的上下面或四周分别涂有荧光粉,荧光粉调节芯片发出的光的颜色,实现芯片全部发光即360度发光。
作为优选,所述柔性PCB板呈一字形,其上设置多块芯片;所述LED光源是多个,每个LED光源功率不超过1W,由于采用了柔性PCB板,因此不再使用铝基板支架等散热部件,因此工作功率不能太高,否则散热存在问题。
作为优选,所述LED光源是处于灯罩内腔的中心处,明显区别于目前一些LED光源安装在灯壳底面不处于灯罩的内腔内的结构,提高了发光效率。
作为优选,LED灯泡还包括支撑LED光源的支架,支架固定在灯壳上,当LED光源数量较多,尤其是出现多个LED光源共用导线的时候通过支架另外支撑LED光源稳定性更好。
按上述技术方案设计的LED灯泡,其优点是使用柔性PCB板结构新颖,不需要使用传统的铝基板或支架等散热结构,生产成本大大降低。综上所述,该LED灯泡的优点是结构新颖,光的利用率高,生产成本低。
附图说明
图1:本实用新型实施例1的结构示意图。
图2:本实用新型实施例2的结构示意图。
图3:本实用新型LED光源的结构示意图。
图4:图3的侧面局部放大结构示意图。
具体实施方式
下面结合附图1、图2、图3和图4本实用新型做进一步描述。
实施例1
如图1、图3和图4所示的LED灯泡,包括灯头8、灯壳9、至少2根导线2、灯罩11和多个LED光源10,灯壳9安装在灯头8上,灯罩11安装在灯壳9上,导线2连接灯头8,导线2即用于LED光源10和灯头8的连接同时起支撑LED光源10的作用。2根导线2之间的LED光源10处于灯罩11的内腔内,LED光源10最佳的位置是处于灯罩11内腔的中心处,发光效率高。
LED光源由芯片4、绝缘胶3、荧光粉7、金线6、导线2、粘接剂5和柔性PCB板1构成。荧光粉7涂在芯片4上,具体是芯片4的上下面或者其四周分别涂布荧光粉4,荧光粉4调节芯片4发出的光的颜色,实现芯片4全部发光即360度发光。芯片4固定在柔性PCB板1上并通过绝缘胶3粘接封装,绝缘胶3是环氧树脂胶。芯片4的电极通过金线6连接柔性PCB板1上的电路。柔性PCB板1呈透明或半透明状,柔性PCB板1是在聚酰亚胺或聚酯薄膜基板上印刷电路制作而成,生产成本低,并且耐温效果好,尤其是长时间使用后柔性 PCB板1也不会发黑变色影响发光的效率。柔性PCB板1的耐温范围在-45℃-300℃之间,配合芯片4的工作温度区间,达不到上述耐温效果的柔性PCB板1不适合使用。每个LED光源功率不超过1W,由于采用了柔性PCB板1,因此不再使用铝基板支架等散热部件,因此工作功率不能太高,否则散热存在问题。每块柔性PCB板1上规则设置多块芯片4,发光效率更高。2根导线2通过锡焊接在柔性PCB板的电路上并在焊接处覆盖粘接剂5固定。LED光源10直径在1.5mm之内,便于LED光源10折弯或通过导线2连成各种形状,直径太粗难以实现并且直径大重量就重不利于导线2支撑。
柔性PCB板1呈一字形即LED光源10呈一字形,便于2根导线2稳固的支撑,柔性PCB板1上设置多块芯片4,有助于提高发光效率。相邻两个LED光源10通过导线2连接构成V形,与传统的白炽灯的外观形状相同。芯片4的工作电压是在1.5V-240V之间,最为普及方便使用。
实施例2
如图2、图3和图4所示的LED灯泡,除柔性PCB板1形状和LED光源10排列形状外,LED光源10的数量可以是单个或多个,其它结构与实施例1相同。
柔性PCB板1折弯呈弧形,即LED光源10折弯呈弧形,便于制成各种形状,提高发光效率,相对于实施例1相邻两个LED光源10排成V形的结构LED光源10使用数量可以降低,柔性PCB板1可以折弯呈弧形但是不能折角使用,折角后柔性PCB上1的芯片4就容易翘起引起金线6断裂同时柔性PCB板1也容易断裂。
上述2个实施例仅为本专利的较佳实施方式,例如柔性PCB板1可以是透明或半透明状,也可以是不透明的,采用不透明的柔性PCB板1发光效率低于 采用透明或半透明状柔性PCB板1的LED灯泡,当使用不透明的柔性PCB板1时芯片4只需在上面涂荧光粉4即可,无需上下面或者其四周分别涂布荧光粉4,以节约材料降低生产成本;LED灯泡还可以包括支撑LED光源10的支架12,支架12固定在灯壳9上,当LED光源10数量较多,尤其是出现多个LED光源10共用导线2的时候通过支架12另外支撑LED光源10稳定性更好;芯片4可以是一排也可以是纵向排列的多排;芯片4也可以通过银胶或锡中的一种粘接在柔性PCB板1上,绝缘胶3也可以采用硅胶;柔性PCB板1的透明材料可以是有机或无机材料。
Claims (10)
1.LED灯泡,包括灯头、灯壳、灯罩和LED光源,灯壳安装在灯头上,灯罩安装在灯壳上,其特征在于还包括用于支撑LED光源的导线,导线连接灯头,LED光源处于灯罩的内腔内;所述LED光源包括芯片、荧光粉和柔性PCB板,荧光粉涂在芯片上,芯片固定在柔性PCB板上,导线焊接在柔性PCB板上。
2.根据权利要求1所述的LED灯泡,其特征在于所述柔性PCB板是印刷有电路的聚酰亚胺或聚酯薄膜板。
3.根据权利要求2所述的LED灯泡,其特征在于所述柔性PCB板呈透明或半透明状。
4.根据权利要求2或3所述的LED灯泡,其特征在于所述导线通过锡焊接在柔性PCB板的电路上并在焊接处覆盖粘接剂固定;所述芯片通过绝缘胶、银胶或锡膏中的一种粘接在柔性PCB板上,芯片通过金线连接柔性PCB板。
5.根据权利要求1或2或3所述的LED灯泡,其特征在于所述LED光源直径在1.5mm之内。
6.根据权利要求1或2或3所述的LED灯泡,其特征在于所述柔性PCB板折弯呈弧形且不能折角。
7.根据权利要求3所述的LED灯泡,其特征在于所述芯片的上下面或四周分别涂有荧光粉。
8.根据权利要求1或2或3所述的LED灯泡,其特征在于所述柔性PCB板呈一字形,其上设置多块芯片;所述LED光源是多个,每个LED光源功率不超过1W。
9.根据权利要求1所述的LED灯泡,其特征在于所述LED光源是处于灯罩内腔的中心处。
10.根据权利要求1所述的LED灯泡,其特征在于还包括支撑LED光源的支架,支架固定在灯壳上。
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Cited By (36)
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CN103939758A (zh) * | 2013-01-22 | 2014-07-23 | 浙江中宙照明科技有限公司 | 一种led照明装置 |
EP3065174A1 (en) * | 2013-12-02 | 2016-09-07 | Tiehan Ge | Spiral led filament and light bulb using spiral led filament |
CN106015973A (zh) * | 2016-07-19 | 2016-10-12 | 上海顿格电子贸易有限公司 | 一种led灯丝 |
WO2016197901A1 (en) * | 2015-06-10 | 2016-12-15 | Jiaxing Super Lighting Electric Appliance Co., Ltd | Led filament, led filament assembly and led bulb |
WO2018014442A1 (zh) * | 2016-07-19 | 2018-01-25 | 上海顿格电子贸易有限公司 | 一种led灯丝 |
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Effective date of registration: 20131203 Address after: 322200, No. 88, Bi Bi Avenue, Pujiang Economic Development Zone, Jinhua, Zhejiang Patentee after: ZHEJIANG SINGBEE LIGHTING TECHNOLOGY CO., LTD. Address before: 322200, No. 88, Bi Bi Avenue, Pujiang Economic Development Zone, Jinhua, Zhejiang Patentee before: Wang Yuancheng |
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