CN202200167U - Grinding pad - Google Patents
Grinding pad Download PDFInfo
- Publication number
- CN202200167U CN202200167U CN2011202333519U CN201120233351U CN202200167U CN 202200167 U CN202200167 U CN 202200167U CN 2011202333519 U CN2011202333519 U CN 2011202333519U CN 201120233351 U CN201120233351 U CN 201120233351U CN 202200167 U CN202200167 U CN 202200167U
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- China
- Prior art keywords
- grinding pad
- backing paper
- grinding
- end point
- optical end
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
The utility model relates to a grinding pad for chemical mechanical polishing, wherein the grinding pad comprises a grinding pad base material comprising an optical end point detecting window, an adhesive layer on the back of the grinding pad base material and a backing paper on the adhesive layer; the backing paper comprises a first part backing paper and a second part backing paper. When changing the grinding pad, the grinding pad is placed on a grinding machine, and the optical end point detection window aims at the signal window on the grinding machine, and the first part of backing paper on the grinding pad is torn off to adhere the grinding pad on the grinding machine fixedly, and the second part of backing paper on the grinding pad is torn off to adhere the grinding pad. The utility model has a simple structure and low production cost, and is easy to replace. The optical end point detection window aims at the signal window on the chemical mechanical grinding machine. The utility model is characterized by good replacement effect and no shift.
Description
Technical field
The utility model relates to semi-conductive making, particularly a kind of grinding pad that is used for cmp processing procedure grinding semiconductor chip.
Background technology
Cmp (CMP) technology was introduced the integrated circuit process industry by IBM in 1984, and at first was used in the planarization of the intermetallic dielectric (IMD) of postchannel process.Cmp (CMP) for grow up the soonest in the IC processing procedure in recent years, the most valued technology.Its main cause be owing to super large-scale integration along with continuous tinyization of live width produces the tight demand to planarization.
Because the fast development of IC industry adds further dwindling of live width, make the height fluctuating of wafer surface have a strong impact on the reliability of process technique.Because the height of superficial layer rises and falls, so our every deposition thin film can make the fluctuating on surface become bigger; This situation accumulates up always, during to surface metal-layer, on the processing procedure two big problems can take place: during at the metal plated film; The part that depression is gone down is in uneven thickness with other place; Can cause not only that here resistance value increases, cause line broken circuit because of electron transfer easily simultaneously, cause element to have very poor reliability.On the other hand,, when photoresistance develops, can cause the light that is used for developing when focusing on, can't obtain good resolution because the photoresistance degree of depth differs if on this scraggly surface, apply photoresistance.
Convention is when carrying out cmp to semiconductor wafer; Wafer is placed in the position of polishing semiconductor wafer head; Make grinding head catch the back of semiconductor wafer, the front of semiconductor wafer then is pressed on the grinding table that is covered with grinding pad, when carrying out the cmp processing procedure; Grinding table counterclockwise is rotated; The polishing semiconductor wafer head is rotation and move along a horizontal direction in the direction of the clock then, makes semiconductor wafer obtain good grinding effect, and grinding effect is accomplished polishing semiconductor wafer endpoint detecting (End-point-detection) through the reflectivity of laser detecting semiconductor wafer surface.After accomplishing the cmp processing procedure, semiconductor wafer obtains a smooth surface.
The grinding pad of grinding semiconductor chip that is used for the cmp processing procedure is generally by comprising the grinding pad base material 11 that has optical end point detection window 111, the adhered layer 12 of grinding pad substrate backside and whole backing paper 13 on the adhered layer, in changing grinding pad 1 process, need throw off whole backing paper 13 and aim at and paste on the work-table of chemicomechanical grinding mill 2; Grinding pad in the cmp processing procedure is easily-consumed products; Life cycle is to changing; The weak point of existing grinding pad is; Need be in changing the grinding pad process with the signal window on the work-table of chemicomechanical grinding mill of the aligning of the optical end point detection window on grinding pad grinding pad; Replacing needs the personnel of skilled operation to carry out; When the optical end point detection window was very little, the signal window on the work-table of chemicomechanical grinding mill that paste more easily partially, force that operating personnel's repeated adhering is prone to cause that grinding pad damages that utilization rate is low, the optical end point detection window on the grinding pad departs from grinding pad was prone to cause wafer grinding endpoint detecting (End-point-detection) inaccurate, and the wafer property after the grinding does not reach requirement.
The content of utility model
The purpose of the utility model is in order to overcome the deficiency of prior art, to provide a kind of easy completion replacing and optical end point detection window accurately to aim at the grinding pad of the signal window on the work-table of chemicomechanical grinding mill.
The technical scheme of the utility model is following: grinding pad comprises the grinding pad base material that has the optical end point detection window, the adhered layer of grinding pad substrate backside and the backing paper on the adhered layer; Its special character is that said backing paper comprises first's backing paper and second portion backing paper.
As preferably: said first backing paper is less than the second portion backing paper.
As preferably; Described first backing paper and second portion backing paper joint are overlapping; Overlapping, first's backing paper is pressed close to adhered layer, and the second portion backing paper is away from adhered layer.
As preferably: said grinding pad is the soft grinding pad of circular port for the optical end point detection window.
Compared with prior art, the utility model has the advantages that simple in structure, cost is low, be prone to change, the optical end point detection window of grinding pad is accurately aimed at the signal window on the work-table of chemicomechanical grinding mill, changes effectively, does not produce skew.
Description of drawings
Fig. 1 is the vertical view of prior art grinding pad.
Fig. 2 is the front view of prior art grinding pad.
Fig. 3 is the vertical view of the utility model grinding pad.
Fig. 4 is the front view of the utility model grinding pad.
Fig. 5 a-5c is the replacing sketch map of the utility model grinding pad.
The specific embodiment
Below in conjunction with accompanying drawing the utility model is done further elaboration:
As depicted in figs. 1 and 2; Existing grinding pad 1 comprises the grinding pad base material 11 that has optical end point detection window 111, the adhered layer 12 of grinding pad substrate backside and whole backing paper 13 on the adhered layer; In changing grinding pad 1 process, need throw off whole backing paper 13 alignings and paste on the work-table of chemicomechanical grinding mill 2, the personnel of this process need skilled operation could accomplish; Like Fig. 3 and shown in Figure 4; The grinding pad 1 of the utility model comprises the grinding pad base material 11 that has optical end point detection window 111, the adhered layer 12 of grinding pad substrate backside and the backing paper 13 on the adhered layer 12; Said backing paper 13 comprises first's backing paper 131 and second portion backing paper 132; Said first backing paper 131 is less than second portion backing paper 132, and described first backing paper 131 is overlapping with second portion backing paper 132 joints; Overlapping; First's backing paper 131 is pressed close to adhered layer 12; Second portion backing paper 132 is away from adhered layer 12, and said backing paper 13 structures have easy to operate, and when first's backing paper 131 is thrown off; Second portion backing paper 132 is also uncovered a part, the operation of more convenient second portion backing paper 132.Optical end point detection window 111 on the said grinding pad 1 can be circular port or square opening.Said grinding pad 1 is preferably optical end point detection window 111 and is the soft grinding pad of circular port, and circular port can be enough little.Said grinding pad 1 is applicable on the work-table of chemicomechanical grinding mill 2 of 200mm or 300mm or 450mm specification.
Shown in Fig. 5 a-5c, the step of changing grinding pad 1 is following, shown in Fig. 5 a; Be placed on whole grinding pad 1 on the work-table of chemicomechanical grinding mill 2 earlier and the optical end point detection window 111 accurate signal windows of aiming on the work-table of chemicomechanical grinding mill 21, shown in Fig. 5 b, lift grinding pad 1 one ends that have first's backing paper 131 again; Take first's backing paper 131 off, push grinding pad 1, make grinding pad 1 firm pasting on work-table of chemicomechanical grinding mill 2; Shown in Fig. 5 c, lift the other end of the grinding pad 1 of second portion backing paper 132 then, take second portion backing paper 132 off; Push grinding pad 1, make grinding pad 1 firm pasting on work-table of chemicomechanical grinding mill 2.The replacing method of said grinding pad 1 is aimed at earlier, and an end is fixed again, changes easily, can not produce skew, and alignment effect is good, and described grinding pad 1 is simple in structure.
The above is merely the preferred embodiment of the utility model, and all equalizations of being done according to the utility model claim scope change and modify, and all should belong to the covering scope of the utility model claim.
Claims (4)
1. grinding pad that is used for cmp; Comprise the grinding pad base material that has the optical end point detection window, the adhered layer of grinding pad substrate backside and the backing paper on the adhered layer, it is characterized in that: said backing paper comprises first's backing paper and second portion backing paper.
2. grinding pad according to claim 1 is characterized in that: said first backing paper is less than the second portion backing paper.
3. grinding pad according to claim 2 is characterized in that: described first backing paper and second portion backing paper joint are overlapping; Overlapping, first's backing paper is pressed close to adhered layer, and the second portion backing paper is away from adhered layer.
4. grinding pad according to claim 1 is characterized in that: said grinding pad is the soft grinding pad of circular port for the optical end point detection window.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202333519U CN202200167U (en) | 2011-07-04 | 2011-07-04 | Grinding pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202333519U CN202200167U (en) | 2011-07-04 | 2011-07-04 | Grinding pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202200167U true CN202200167U (en) | 2012-04-25 |
Family
ID=45964304
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011202333519U Expired - Fee Related CN202200167U (en) | 2011-07-04 | 2011-07-04 | Grinding pad |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202200167U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103419123A (en) * | 2012-05-14 | 2013-12-04 | 株式会社荏原制作所 | Polishing pad and chemical mechanical polishing apparatus for polishing a workpiece, and method of polishing a workpiece using the chemical mechanical polishing apparatus |
-
2011
- 2011-07-04 CN CN2011202333519U patent/CN202200167U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103419123A (en) * | 2012-05-14 | 2013-12-04 | 株式会社荏原制作所 | Polishing pad and chemical mechanical polishing apparatus for polishing a workpiece, and method of polishing a workpiece using the chemical mechanical polishing apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130419 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20130419 Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120425 Termination date: 20180704 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |