CN202189793U - Rectifier diode - Google Patents
Rectifier diode Download PDFInfo
- Publication number
- CN202189793U CN202189793U CN2011202780620U CN201120278062U CN202189793U CN 202189793 U CN202189793 U CN 202189793U CN 2011202780620 U CN2011202780620 U CN 2011202780620U CN 201120278062 U CN201120278062 U CN 201120278062U CN 202189793 U CN202189793 U CN 202189793U
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- China
- Prior art keywords
- upper electrode
- chip
- weld layer
- rectifier diode
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses a rectifier diode and belongs to the technical field of semiconductor devices. The rectifier diode is composed of an upper electrode, a first soldering layer, a chip, a second soldering layer, a lower electrode and a protection bond layer. The chip is disposed between the upper electrode and the lower electrode. And the upper electrode connects with an upper surface of the chip through the first soldering layer. The upper electrode connects with a lower surface of the chip through the second soldering layer. The upper electrode, the first soldering layer, the chip, the second soldering layer and the lower electrode are all packaged in the protection bond layer. An upper surface of the upper electrode is provided with a lead. And the lead and the upper electrode are formed integrally. Since the above structure is adopted in the utility model, compared with the prior art, the rectifier diode in the utility model has advantages of simple structure, convenient usage, high reliability and low cost.
Description
Technical field
The utility model relates to technical field of semiconductor device, particularly relates to a kind of diode.
Background technology
Existing diode normally with the method for welding with wire bonds on diode, production process is increased, and owing to increased weld layer during welding; Diode heat resistance is increased; When under big electric current hot environment, using, might cause rectifier diode to lose efficacy, and lead-in wire all is a fine copper; Along with the rise of copper valency in recent years, cost is improved greatly.
The utility model content
The purpose of the utility model is the deficiency that overcomes prior art, provide a kind of simple in structure, easy to use, reliability is high, the rectifier diode that reduces cost.
The utility model is made up of upper electrode, first weld layer, chip, second weld layer, lower electrode and protection glue-line; Said chip is between upper electrode and lower electrode; And upper electrode is connected through first weld layer with the upper surface of chip; Lower electrode is connected through second weld layer with the lower surface of chip; The periphery of said upper electrode, first weld layer, chip, second weld layer and lower electrode all is encapsulated in the protection glue-line, and the upper surface of said upper electrode is leaded, and lead-in wire and upper electrode are integrative-structures.
Said lead-in wire is cylindrical and is positioned at the center of upper electrode upper surface; Said lead-in wire comprises steel heart yearn and copper skin, and copper skin is wrapped in the outside of steel heart yearn.
Preferred carbon-free steel of said steel heart yearn or low-carbon steel material are processed; Said copper outer field thickness is greater than more than 18% of radius of lead-in wire.
The utility model compared with prior art has owing to adopt above structure: simple in structure, easy to use, reliability is high, the advantage that reduces cost.
Description of drawings
Fig. 1 is the structural representation of a kind of rectifier diode of the utility model;
Fig. 2 is the perspective view of a kind of rectifier diode lead-in wire shown in Figure 1.
Embodiment
Below in conjunction with accompanying drawing the utility model is elaborated:
Among the figure: 1, upper electrode, 2, first weld layer, 3, chip, 4, second weld layer, 5, lower electrode, 6, the protection glue-line, 7, lead-in wire, 8, the steel heart yearn, 9, copper skin.
Like Fig. 1, shown in Figure 2; Form by upper electrode, first weld layer, chip, second weld layer, lower electrode and protection glue-line; Said chip is between upper electrode and lower electrode; And upper electrode is connected through first weld layer with the upper surface of chip, and lower electrode is connected through second weld layer with the lower surface of chip, and the periphery of said upper electrode, first weld layer, chip, second weld layer and lower electrode all is encapsulated in the protection glue-line; The upper surface of said upper electrode is leaded, and lead-in wire and upper electrode are integral structures.
Said lead-in wire is cylindrical, and is positioned at the center of upper electrode upper surface; Said lead-in wire comprises steel heart yearn and copper skin, and copper skin is wrapped in the outside of steel heart yearn; Said steel heart yearn is to process with carbon-free steel; Said copper outer field thickness is greater than 20% of the lead-in wire radius.
Above-described embodiment is more preferably one of embodiment of the utility model, and common variation that those skilled in the art carries out in the utility model technical scheme scope and replacement all should be included within the protection range of the utility model.
Claims (5)
1. rectifier diode; Form by upper electrode, first weld layer, chip, second weld layer, lower electrode and protection glue-line; Said chip is between upper electrode and lower electrode; And upper electrode is connected through first weld layer with the upper surface of chip, and lower electrode is connected through second weld layer with the lower surface of chip, and the periphery of said upper electrode, first weld layer, chip, second weld layer and lower electrode all is encapsulated in the protection glue-line; It is characterized in that: the upper surface of said upper electrode is leaded, and lead-in wire and upper electrode are integral structures.
2. rectifier diode according to claim 1 is characterized in that: said lead-in wire is cylindrical, and is positioned at the center of upper electrode upper surface.
3. rectifier diode according to claim 1 is characterized in that: said lead-in wire comprises steel heart yearn and copper skin, and copper skin is wrapped in the outside of steel heart yearn.
4. rectifier diode according to claim 3 is characterized in that: said steel heart yearn is to process with carbon-free steel or low-carbon steel material.
5. want 3 described rectifier diodes according to right, it is characterized in that: said copper outer field thickness is greater than more than 18% of radius of lead-in wire.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011202780620U CN202189793U (en) | 2011-08-02 | 2011-08-02 | Rectifier diode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011202780620U CN202189793U (en) | 2011-08-02 | 2011-08-02 | Rectifier diode |
Publications (1)
Publication Number | Publication Date |
---|---|
CN202189793U true CN202189793U (en) | 2012-04-11 |
Family
ID=45921228
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2011202780620U Expired - Fee Related CN202189793U (en) | 2011-08-02 | 2011-08-02 | Rectifier diode |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN202189793U (en) |
-
2011
- 2011-08-02 CN CN2011202780620U patent/CN202189793U/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120411 Termination date: 20130802 |