CN202145704U - 刚挠结合印制电路板 - Google Patents
刚挠结合印制电路板 Download PDFInfo
- Publication number
- CN202145704U CN202145704U CN201120196920U CN201120196920U CN202145704U CN 202145704 U CN202145704 U CN 202145704U CN 201120196920 U CN201120196920 U CN 201120196920U CN 201120196920 U CN201120196920 U CN 201120196920U CN 202145704 U CN202145704 U CN 202145704U
- Authority
- CN
- China
- Prior art keywords
- rigid
- printed
- flexible
- board
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
热板温度(℃) | 热板时间(Min) | 压力(Kg/c㎡) | 压力时间(Min) | |
Step1 | 120 | 5 | 0 | 4 |
Step2 | 160 | 10 | 7 | 1 |
Step3 | 190 | 10 | 25 | 5 |
Step4 | 190 | 65 | 25 | 90 |
Step5 | 120 | 20 | 18 | 10 |
Step6 | 120 | 20 | 18 | 10 |
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201120196920U CN202145704U (zh) | 2011-06-13 | 2011-06-13 | 刚挠结合印制电路板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201120196920U CN202145704U (zh) | 2011-06-13 | 2011-06-13 | 刚挠结合印制电路板 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN202145704U true CN202145704U (zh) | 2012-02-15 |
Family
ID=45581623
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201120196920U Expired - Fee Related CN202145704U (zh) | 2011-06-13 | 2011-06-13 | 刚挠结合印制电路板 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN202145704U (zh) |
-
2011
- 2011-06-13 CN CN201120196920U patent/CN202145704U/zh not_active Expired - Fee Related
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101420820B (zh) | 双面挠性覆铜板及其制作方法 | |
TWI346127B (en) | Halogen-free epoxy resin composition, coverlay film, bonding sheet, prepreg, and laminate for printed wiring board | |
WO2009041212A1 (ja) | 太陽電池、太陽電池の製造方法、太陽電池モジュールの製造方法および太陽電池モジュール | |
EP1985654A4 (en) | HEAT-CURABLE RESIN COMPOSITION CONTAINING A COMPLEX OF SEMI-IPN TYPE, AND CLEAR, PREPREG AND METALLUM COATED LAMINATE PLATE THEREWITH | |
TW200727744A (en) | Multilayer wiring board | |
TW200709739A (en) | Hinge board and method for producing the same | |
HK1134312A1 (en) | Resin composition, prepreg and laminate using the same | |
EP2141198A4 (en) | METHOD FOR PRODUCING A RESIN LACQUER WITH A HEAT-CURABLE SEMI-IPN COMPOSITE RESIN, RESIN LACQUER WITH THIS RESIN FOR ONE FITTED LADDER PLATE, AND PREPREG AND METAL-CASE LAMINATE | |
TW200746934A (en) | A method of making a fiber reinforced panel for printed circuit boards and a fiber reinforced panel made according to the method | |
TW200709751A (en) | Polyimide copper foil laminate and method of producing the same | |
WO2008134530A3 (en) | A capacitive microphone with integrated cavity | |
MY157604A (en) | Copper foil with carrier, and copper clad laminate, printed wiring board and printed circuit board using the same, and method for manufacturing printed wiring board | |
CN104507260A (zh) | 一种设有补强片的软硬结合板的制作方法 | |
ATE551884T1 (de) | Elektronisches gerät und verfahren zum untersuchen einer leiterplatte | |
CN202145704U (zh) | 刚挠结合印制电路板 | |
CN202005058U (zh) | 一种液晶显示面板的印刷电路板加贴胶层的结构 | |
CN102072904B (zh) | 挠性单面覆铜板的耐渗水性检验方法 | |
FI20085418L (fi) | Menetelmä ja järjestely käsittäen piirilevyn | |
CN204119657U (zh) | 一种使用于多层贴合的fpc板 | |
CN202282911U (zh) | 一种可弯曲防断裂的软硬结合板 | |
CN207340286U (zh) | 聚酰亚胺发泡基材多层板 | |
CN106686476B (zh) | 一种喇叭的防水结构及电子设备 | |
CN112105157A (zh) | 一种增加柔性电路板补强胶片结合力的处理方法 | |
CN204539608U (zh) | 一种新型柔性电路板 | |
CN205051970U (zh) | 具有镂空排气层及磨砂层的补强钢片 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Jiujiang HuaXiang Technology Co., Ltd. Assignor: Shenzhen Huaxiang Circuit Tech. Co., Ltd. Contract record no.: 2014440020070 Denomination of utility model: Method for manufacturing rigidity-flexibility combined printing circuit board Granted publication date: 20120215 License type: Exclusive License Record date: 20140310 |
|
LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120215 Termination date: 20160613 |