CN202134572U - LED heat dissipation substrate used for combining backlight module - Google Patents
LED heat dissipation substrate used for combining backlight module Download PDFInfo
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- CN202134572U CN202134572U CN201120207996U CN201120207996U CN202134572U CN 202134572 U CN202134572 U CN 202134572U CN 201120207996 U CN201120207996 U CN 201120207996U CN 201120207996 U CN201120207996 U CN 201120207996U CN 202134572 U CN202134572 U CN 202134572U
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- radiating substrate
- led
- block
- light source
- led heat
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Abstract
The utility model provides an LED (Light Emitting Diode) heat dissipation substrate used for combining a backlight module, in order to combine an LED light source module and the backlight module. The LED heat dissipation substrate comprises a metal basic layer, an insulating layer and a line layer, wherein the metal basic layer comprises a first block used for bearing the LED light source module and a second block used for bearing the backlight module, the insulating layer is coated on the first block, the line layer is pressed on a surface of the insulating layer, and the line layer is electrically connected to the LED light source module. Therefore, a combined way of the LED heat dissipation substrate, and the LED light source module as well as the backlight module can be simplified therethrough, and the effect of reducing man-hour, manpower and material cost can be achieved.
Description
Technical field
The utility model is relevant with the LED heat-radiating substrate, is particularly to a kind of LED structure of heat dissipation substrate that is used to combine module backlight.
Background technology
Light-emittingdiode (LED) element is used on the various lightings, like the indicator light of electrical home appliances, the application such as backlight, advertisement display screen and automobile lamp of display because power consumption is few, volume is little and long service life at present widely.On the other hand, along with the development of high-capacity LED and the heat dissipation problem of being followed, LED substrate now is heat-radiating substrate mostly, to reach the radiating requirements in the use.
Traditionally, LED is during as the display backlight source, and it is a plurality of LED elements are assembled on the heat-radiating substrate and form a led light source module, and this light source module makes up a module backlight again, so as to accomplishing this display backlight source.
Only, when existing display backlight source group is established, need earlier this led light source module to be combined in a loading plate, then module group backlight to be located on this loading plate again, with reception and reflect the light that this led light source module is sent.Because it is not only loaded down with trivial details consuming time that this group is established mode, and need to be equipped with in addition loading plate, so cause man-hour, manpower, reach the increase on the cost such as material.
The utility model content
In view of this, the utility model is for improving and solving above-mentioned disappearance, is that the spy concentrates on studies and cooperates the scientific principle utilization, proposes a kind of reasonable in design and effectively improve the utility model of above-mentioned disappearance finally.
One purpose of the utility model is to provide a kind of LED heat-radiating substrate that is used to combine module backlight, establishes mode with the group of simplifying LED heat-radiating substrate and led light source module and mould backlight, reaches the effect that reduces man-hour, manpower and material cost.
In order to reach above-mentioned purpose; The utility model is a kind of LED heat-radiating substrate that is used to combine module backlight, and to combine led light source module and module backlight, the LED heat-radiating substrate comprises a metal-based layer, an insulating barrier, reaches a line layer; Metal-based layer comprises in order to first block that carries the led light source module and in order to carry second block of module backlight; Coated is on first block, and line layer is pressed together on surface of insulating layer, and line layer electrically connects the led light source module.
Preferably, this metal-based layer is an aluminium base or an aluminium alloy base plate.
Preferably, this metal-based layer is a copper base.
Preferably, this metal-based layer includes a plurality of first blocks and a plurality of second block, and those first blocks and those second blocks are for being crisscross arranged.
Preferably, the area of this second block is greater than the area of this first block.
Preferably, leave a gap between this first block and this second block.
Preferably, this insulating barrier is made up of heat-conducting insulation material.
Preferably, this line layer is a copper foil layer.
Preferably, this line layer is formed on second block of this insulating barrier and this metal-based layer.
Compared to prior art; When the LED heat-radiating substrate of the utility model combines led light source module and module backlight; Because the metal-based layer of LED heat-radiating substrate comprises first block that carries the led light source module and second block that carries module backlight, so can save the loading plate element of the required setting of prior art; Moreover; The LED heat-radiating substrate of the utility model is directly in order to combine led light source module and module backlight; Must led light source module and module backlight be organized the group that is located at loading plate respectively compared to prior art and establish mode; The LED heat-radiating substrate of the utility model can be simplified the LED heat-radiating substrate and combine the group of led light source module and module backlight to establish, and reaches the effect that reduces man-hour, manpower and material cost.
Description of drawings
Fig. 1 is the three-dimensional appearance sketch map that the LED heat-radiating substrate of the utility model combines with the led light source module;
Fig. 2 is the end view that the LED heat-radiating substrate of the utility model combines module backlight;
Fig. 3 is the three-dimensional appearance sketch map of the LED heat-radiating substrate of the utility model;
Fig. 4 is the cutaway view of the LED heat-radiating substrate of the utility model;
Fig. 5 is the cutting sketch map of the LED heat-radiating substrate of the utility model;
Fig. 6 is the three-dimensional appearance sketch map of another embodiment of LED heat-radiating substrate of the utility model;
Fig. 7 is the cutaway view of another embodiment of LED heat-radiating substrate of the utility model.
[description of reference numerals]
1,1 ' LED heat-radiating substrate
2LED light source module 2a LED
3 modules backlight
10 metal-based layers, 100 gaps
11 first blocks, 12 second blocks
20 insulating barriers, 30 line layers
1a heat-radiating substrate 10a metal-based layer
1a ' heat-radiating substrate 10a ' metal-based layer
Embodiment
Below in conjunction with accompanying drawing and specific embodiment the utility model is described further so that those skilled in the art can better understand the utility model and implementing, but the embodiment that lifts not conduct to the qualification of the utility model.
Please with reference to Fig. 1 and Fig. 2, be respectively three-dimensional appearance sketch map that the LED heat-radiating substrate of the utility model combines with the led light source module and the end view that combines module backlight thereof; The LED heat-radiating substrate 1 of the utility model is in order to combining a led light source module 2 and a module 3 backlight, and this LED heat-radiating substrate 1 comprises a metal-based layer 10, an insulating barrier 20, an and line layer 30.This led light source module 2 comprises most LED2a, and those LED 2a are welded on respectively on this line layer 30.This 3 of module backlight is arranged on a side of this led light source module 2, in order to receive and to reflect the light that this led light source module 2 is sent; In present embodiment, this LED heat-radiating substrate 1 bends, and is vertical setting to make this led light source module 2 and this module 3 backlight.
Please continue with reference to Fig. 3 to Fig. 5, be respectively three-dimensional appearance sketch map, cutaway view and the cutting sketch map of the LED heat-radiating substrate of the utility model; In the present embodiment, heat-radiating substrate 1a includes plurality of LED heat-radiating substrate 1, and respectively this LED heat-radiating substrate 1 comprises a metal-based layer 10, an insulating barrier 20, an and line layer 30.
This metal-based layer 10 is a metal substrate; This metal-based layer 10 can be an aluminium base (aluminium alloy base plate) or a copper base, and one first block 11 that this metal-based layer 10 comprises in order to carry this led light source module 2 reaches in order to carry one second block 12 of this module 3 backlight.In addition, because the volume of this module 3 backlight is greater than the volume of this led light source module 2, so the area of this second block 12 is greater than the area of this first block 11.
This insulating barrier 20 is made up of heat-conducting insulation material, and it is coated on this first block 11.Moreover this line layer 30 is pressed together on this insulating barrier 20 surfaces, and this line layer 30 is in order to settle this led light source module.This line layer 30 is a copper foil layer, and this copper foil layer etching is manufactured with circuit, to electrically connect this led light source module 2.
In present embodiment, the metal-based layer 10a of heat-radiating substrate 1a includes a plurality of first blocks 11 and a plurality of second block 12, and those first blocks 11 and those second blocks 12 are for being crisscross arranged.After this heat-radiating substrate 1a carried out cutting operation, can leave a gap 100 between this first block 11 and this second block 12, so that this heat-radiating substrate 1a is divided into several pieces LED heat-radiating substrates 1.
Please be respectively three-dimensional appearance sketch map and the cutaway view of another embodiment of LED heat-radiating substrate of the utility model in addition with reference to Fig. 6 and Fig. 7; In the present embodiment, heat-radiating substrate 1a ' includes plurality of LED heat-radiating substrate 1 ', and respectively this LED heat-radiating substrate 1 ' comprises a metal-based layer 10, an insulating barrier 20, an and line layer 30.In addition, led light source module 2 comprises most LED 2a, and those LED 2a are welded on respectively on this line layer 30.Likewise, the metal-based layer 10a ' of heat-radiating substrate 1a ' includes a plurality of first blocks 11 and a plurality of second block 12, this heat-radiating substrate 1a ' is carried out cutting operation after, can this heat-radiating substrate 1a ' be divided into several pieces LED heat-radiating substrates 1 '.
The present embodiment and the first embodiment difference are that this line layer 30 is formed on second block 12 of this insulating barrier 20 and this metal-based layer 10, that is this line layer 30 is pressed together on this metal-based layer 10 comprehensively.
The above embodiment is the preferred embodiment that proves absolutely that the utility model is lifted, and the protection range of the utility model is not limited thereto.Being equal to that the technical staff in present technique field is done on the utility model basis substitutes or conversion, all within the protection range of the utility model.The protection range of the utility model is as the criterion with claims.
Claims (9)
1. LED heat-radiating substrate that is used to combine module backlight, is characterized in that this LED heat-radiating substrate comprises to combine a led light source module and a module backlight:
One metal-based layer comprises in order to one first block that carries said led light source module and in order to carry one second block of said module backlight;
One insulating barrier is coated on this first block; And
One line layer is pressed together on this surface of insulating layer, and this line layer electrically connects said led light source module.
2. the LED heat-radiating substrate that is used to combine module backlight as claimed in claim 1 is characterized in that, this metal-based layer is an aluminium base or an aluminium alloy base plate.
3. the LED heat-radiating substrate that is used to combine module backlight as claimed in claim 1 is characterized in that this metal-based layer is a copper base.
4. like each described LED heat-radiating substrate that is used to combine module backlight of claim 1 to 3, it is characterized in that this metal-based layer includes a plurality of first blocks and a plurality of second block, those first blocks and those second blocks are for being crisscross arranged.
5. the LED heat-radiating substrate that is used to combine module backlight as claimed in claim 4 is characterized in that the area of this second block is greater than the area of this first block.
6. the LED heat-radiating substrate that is used to combine module backlight as claimed in claim 4 is characterized in that, leaves a gap between this first block and this second block.
7. like each described LED heat-radiating substrate that is used to combine module backlight of claim 1 to 3, it is characterized in that this insulating barrier is made up of heat-conducting insulation material.
8. like each described LED heat-radiating substrate that is used to combine module backlight of claim 1 to 3, it is characterized in that this line layer is a copper foil layer.
9. the LED heat-radiating substrate that is used to combine module backlight as claimed in claim 1 is characterized in that this line layer is formed on second block of this insulating barrier and this metal-based layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120207996U CN202134572U (en) | 2011-06-20 | 2011-06-20 | LED heat dissipation substrate used for combining backlight module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120207996U CN202134572U (en) | 2011-06-20 | 2011-06-20 | LED heat dissipation substrate used for combining backlight module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202134572U true CN202134572U (en) | 2012-02-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120207996U Expired - Fee Related CN202134572U (en) | 2011-06-20 | 2011-06-20 | LED heat dissipation substrate used for combining backlight module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202134572U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102916111A (en) * | 2012-10-19 | 2013-02-06 | 杨勇平 | LED (light-emitting diode) integrated light source substrate and producing method thereof |
| CN103792712A (en) * | 2014-01-20 | 2014-05-14 | 深圳市华星光电技术有限公司 | Cooling structure of liquid crystal display module |
| WO2014107891A1 (en) * | 2013-01-09 | 2014-07-17 | 深圳市华星光电技术有限公司 | Backlight module, printed circuit board and manufacturing method therefor |
-
2011
- 2011-06-20 CN CN201120207996U patent/CN202134572U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102916111A (en) * | 2012-10-19 | 2013-02-06 | 杨勇平 | LED (light-emitting diode) integrated light source substrate and producing method thereof |
| CN102916111B (en) * | 2012-10-19 | 2016-09-28 | 杨勇平 | LED integrated optical source substrate and preparation method thereof |
| WO2014107891A1 (en) * | 2013-01-09 | 2014-07-17 | 深圳市华星光电技术有限公司 | Backlight module, printed circuit board and manufacturing method therefor |
| CN103792712A (en) * | 2014-01-20 | 2014-05-14 | 深圳市华星光电技术有限公司 | Cooling structure of liquid crystal display module |
| WO2015106463A1 (en) * | 2014-01-20 | 2015-07-23 | 深圳市华星光电技术有限公司 | Heat dissipation structure of liquid crystal module |
| US9703136B2 (en) | 2014-01-20 | 2017-07-11 | Shenzhen China Star Optoelectronics Technology Co., Ltd | Heat radiation of the liquid crystal module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120201 Termination date: 20160620 |