CN202134517U

CN202134517U - Electronic testing apparatus

Info

Publication number: CN202134517U
Application number: CN 201120192147
Authority: CN
Inventors: 王宏杰; 黄雅如
Original assignee: Premtek International Inc
Current assignee: Premtek International Inc
Priority date: 2011-06-09
Filing date: 2011-06-09
Publication date: 2012-02-01
Anticipated expiration: 2021-06-09

Abstract

The utility model provides an electronic testing apparatus, including a printed circuit board, an upper fixing device, a plurality of space transition substrates and a plurality of probe substrates. The upper fixing device is arranged on the printed circuit board; the space transition substrates are arranged on the upper fixing device and are electrically connected with the printed circuit board; the probe substrates possess microprobes corresponding to the test pads of test bear crystals, and are connected with the space transition substrates in a lead wire combination mode; and through the probe substrates of large areas and electronic testing apparatus with a high needle number and a high parallel test assembled by the probe substrates of small areas and the space transition substrates, the problem is overcome that a ceramic substrate of a large area is hard to prepare, the cost is effectively reduced, the production yield rate, the process flexibility and the industry application are raised, and the maintenance cost is reduced.

Description

Electronic test equipment

Technical field

The utility model relates to a kind of electronic test equipment, relates in particular to the upright electronic test equipment of a plurality of space conversion substrates and probe substrate group.

Background technology

Integrated circuit before the encapsulation, is done function test to naked crystalline substance (bare chip) with probe (probe) with electronic test equipment (or claim probe) as yet, filters out defective products, the encapsulation engineering after carrying out again.Therefore, be in the integrated circuit manufacturing manufacturing cost to be influenced sizable critical processes; The yield that this electronic test equipment can make finished product is promoted to the semiconductor factory that 90%, 20% yield contribution degree is all haggled over every penny 1% yield difference by original 70%, influences very huge.In brief; This electronic test equipment is the interface between a tester table and wafer; Each IC needs the corresponding probe of a slice at least, and the purpose of test is to make wafer cutting back, make non-defective unit get into next encapsulation procedure and avoid defective products continuation processing to cause waste.

Yet present advanced electronic test equipment assembling mainly comprises printed circuit board (PCB), contains the probe substrate of a plurality of microprobes; And electrical connection arrangement; Wherein corresponding with the testing cushion (testing pad) on the chip to be measured in the locus of the microprobe on the probe substrate; The about 30um-150um of testing cushion spacing (pitch) on other its chip to be measured, but the about 1.0mm of minimum spacing of the electronics contact mat of printed circuit board (PCB) (electric pad), so probe substrate must possess the function of the conversion of having living space; Just; With this probe basal plane to the spacing of the electronic contact of the one side of chip to be measured through the probe substrate internal conversion, make its spacing be amplified to 1.0mm, with the electronics contact mat of corresponding printed circuit board (PCB).The probe substrate of this type is mostly with the ceramic substrate of LTCC (LTCC) or HTCC (HTCC) mode made; Be subject to present manufacturing technology; Maximum substrate size only reaches 100mm-150mm (4 inches-6 inches); And size is bigger, the more difficult control of electronics connecting point position precision on it.And semiconductor technology evolves trend is to develop 300mm (12 inches) process technique and dwindle live width to make every wafer (wafer) can hold more multicore sheet (chip) at present, so can effectively reduce manufacturing cost, boost productivity.

Therefore, the electronic test equipment technical need of large tracts of land, high pin count, high parallel testing is quite urgent.

The utility model content

The utility model provides a kind of electronic test equipment of founding into large tracts of land probe substrate, high pin count, high parallel testing with small size, undersized probe substrate and space conversion substrate in batch to the drawback of prior art.

The main purpose of the utility model provides a kind of electronic test equipment, and this device comprises printed circuit board (PCB), goes up fixture, a plurality of space conversion substrate and a plurality of probe substrate, and last fixture is arranged at the upper surface of printed circuit board (PCB); Comprise holddown groove, locking device and firm banking, firm banking is arranged in the holddown groove, arranges with specific distance; A plurality of space conversion substrates are installed in the holddown groove, arrange each other with another specific distance, are electrically connected with this printed circuit board (PCB); Said probe substrate is to process with silicon substrate, glass substrate or ceramic substrate, has a plurality of microprobes, and said microprobe is corresponding to the testing cushion of naked crystalline substance to be tested; Said probe substrate is arranged on the firm banking respectively; Wherein firm banking adopts and the approaching rigid material of silicon thermal coefficient of expansion, is generally kovar (Kovar), and firm banking and probe substrate are fixed with this locking device in addition; And it is adjacent with a plurality of space conversion substrates; And be electrically connected with said space conversion substrate, wherein this space conversion substrate and this probe substrate are positioned at different level, utilize the mode with wire-bonded (wire bonding) to connect.

Electronic test equipment more comprises the lower fixed seat that is used to support with fixing this printed circuit board (PCB) below this printed circuit board (PCB); And a plurality of differential screw group that is arranged at lower fixed seat; Each differential screw group is in order to the same flatness between indivedual adjustment probe substrates, and with respect to the opposite planar degree of the chip to be measured on the tester table.The bottom of space conversion substrate has an electrical connection arrangement, in order to be electrically connected space conversion substrate and printed circuit board (PCB).

The characteristics of the utility model are to stand into small size, undersized probe substrate and space conversion substrate in batch the electronic test equipment of large tracts of land probe substrate, high pin count, high parallel testing, so can overcome the large tracts of land ceramic substrate and make difficult problem, effectively reduce cost; Because of modularized design, can improve the probe production yield again, and when in the electronic test equipment use local damage taking place, only need change the unit of affiliated area, need not put in order to organize to eliminate and change, processing procedure elasticity and industrial applicability that essence improves, and reduced maintenance cost.

Description of drawings

Fig. 1 is the three-dimensional top view of electronic test equipment first embodiment of the utility model;

Fig. 2 is the enlarged drawing of the a-quadrant of Fig. 1;

Fig. 3 is a view under the solid of electronic test equipment first embodiment of the utility model;

Fig. 4 is the three-dimensional top view of electronic test equipment second embodiment of the utility model;

Fig. 5 is along the transversal profile of the B-B ' of Fig. 4; And

Fig. 6 A to Fig. 6 D is the sketch map of the various structures of the utility model electrical connection arrangement.

Embodiment

Those skilled in the art below cooperate Figure of description that the execution mode of the utility model is done more detailed explanation, so that can implement after studying this specification carefully according to this.

With reference to figure 1, Fig. 1 is the three-dimensional top view of electronic test equipment first embodiment of the utility model.As shown in Figure 1, the electronic test equipment 1 of the utility model comprises printed circuit board (PCB) 10, goes up fixture 20, a plurality of space conversion substrate 30 and a plurality of probe substrate 40, and last fixture 20 is arranged at the upper surface of printed circuit board (PCB) 10; Comprise holddown groove 21, locking device 23 and firm banking 25, firm banking 25 is arranged in the holddown groove 21, arranges with specific distance; A plurality of space conversion substrates 30 are installed in the holddown groove 21; Arrange each other with another specific distance, be electrically connected with this printed circuit board (PCB) 10, said probe substrate 40 is made with the approaching rigid material substrate of smooth, the non-conductive thermal coefficient of expansions of tool such as silicon substrate, glass substrate or ceramic substrate and silicon; Have a plurality of microprobe (not shown)s; And said microprobe is corresponding to the testing cushion of naked crystalline substance to be tested, and said probe substrate 40 is arranged at respectively on the firm banking 25, and fixing with this locking device 23; And it is adjacent with a plurality of space conversion substrate 30; And be electrically connected with said space conversion substrate 30, wherein firm banking 25 is the rigid material approaching with the silicon thermal coefficient of expansion, is generally kovar (Kovar).

With reference to figure 2, Fig. 2 is the enlarged drawing of the a-quadrant of Fig. 1, and wherein this space conversion substrate 30 is positioned at different level with this probe substrate 40, utilizes a plurality of lead-in wires 50, is electrically connected with the mode of wire-bonded (wire bonding).

With reference to figure 3, Fig. 3 is a view under the solid of electronic test equipment first embodiment of the utility model.As shown in Figure 3; The electronic test equipment 1 of the utility model more comprises the lower fixed seat 22 that is used to support with fixing this printed circuit board (PCB) 10 below this printed circuit board (PCB) 10; And a plurality of differential screw group 27 that is arranged at lower fixed seat 22; Each differential screw group 27 is in order to the same flatness between indivedual adjustment probe substrates 40, and with respect to the opposite planar degree of the chip to be measured on the tester table.

With reference to figure 4, Fig. 4 is the three-dimensional top view of electronic test equipment 1 second embodiment of the utility model.As shown in Figure 4; The assembly of first embodiment and second embodiment is roughly the same; It is different with first embodiment with the arrangement mode of probe substrate 40 to have space conversion substrate 30 only, and space conversion substrate 30 areas of second embodiment are bigger, and with probe substrate 40 be to be arranged side by side.Implement simple the change because the arrangement of naked crystalline substance to be tested, the quantity of probe substrate 40, space conversion substrate 30 and arrangement mode also can change first embodiment and second according to needing, the utility model is only explained the only example of arrangement mode, is not limited to this.

With reference to figure 5, Fig. 5 is along the transversal profile of the B-B ' of Fig. 4.As shown in Figure 5, space conversion substrate 30 and probe substrate are to be connected with the wire-bonded mode by lead-in wire 50, and the bottom of space conversion substrate 30 has an electrical connection arrangement 60, in order to be electrically connected space conversion substrate 30 and printed circuit board (PCB) 10.

With reference to figure 6A to Fig. 6 D, Fig. 6 A to Fig. 6 D is the sketch map of the various structures of the utility model electrical connection arrangement 60.Shown in Fig. 6 A; The electrical connection arrangement 60 of the electronic test equipment of the utility model comprises a plurality of probe bases 62; The gap 64 that has perforation between the said probe base 62, to insert T type elastic probe 66a, this T type elastic probe 66a is fixed between two probe bases 62 with the upper end of its T type; And length is a little more than probe base 62, so that space conversion substrate 30 and printed circuit board (PCB) 10 are electrically connected.Shown in Fig. 6 B, can the T type elastic probe 66a among Fig. 6 A be substituted by L type elastic probe 66b, shown in Fig. 6 C, can the T type elastic probe 66a among Fig. 6 A be substituted by S type elastic probe 66c.

Shown in Fig. 6 D, Fig. 6 D is the sketch map of the another kind of execution mode of the utility model electrical connection arrangement 60.In Fig. 6 D, electrical connection arrangement 60 comprises a substrate 70, and corresponding to the position of probe substrate a plurality of projections 72 is set at this substrate 70, and this projection 72 is arranged at the upper and lower surfaces of substrate, and corresponds to each other.This substrate 70 has pliability, and is for example made with silastic material, can compensate printed circuit board (PCB) 10 because of the gap difference that micro-warpage caused, and contains a plurality of conducting particless 74 in the position that substrate 70 is provided with a plurality of projections 72 in addition, to form electrical communication.

The above is merely in order to explain the preferred embodiment of the utility model; Be not that attempt is done any pro forma restriction to the utility model according to this; Therefore; All have in following any modification or change of making relevant the utility model of identical creation spirit, all must be included in the category of the utility model intention protection.

Claims

1. an electronic test equipment is characterized in that, comprises:

One printed circuit board (PCB);

Fixture on one is arranged at a upper surface of this printed circuit board (PCB), comprises a holddown groove and a plurality of firm banking, and said firm banking is arranged in this holddown groove, and arranges with a specific distance;

A plurality of space conversion substrates are installed in this holddown groove, arrange each other with another specific distance, and are electrically connected with this printed circuit board (PCB); And

A plurality of probe substrates; Made with a rigid material substrate; Have a plurality of microprobes, and said microprobe is corresponding to the testing cushion of naked crystalline substance to be tested, said probe substrate is arranged at respectively on the said firm banking; And adjacent, and be electrically connected with said space conversion substrate with said space conversion substrate.

2. device as claimed in claim 1; It is characterized in that; Below this printed circuit board (PCB), further comprise: be used to support a lower fixed seat with fixing this printed circuit board (PCB); And a plurality of differential screw group that is arranged at this lower fixed seat, each differential screw group is in order to the same flatness between the said probe substrate of indivedual adjustment, and with respect to the opposite planar degree of the chip to be measured on the tester table.

3. device as claimed in claim 1 is characterized in that, said space conversion substrate utilizes a plurality of lead-in wires to be connected with the mode of wire-bonded with each of said probe substrate.

4. device as claimed in claim 3 is characterized in that, said space conversion substrate and said probe substrate are positioned at different level.

5. device as claimed in claim 1 is characterized in that, further comprises a plurality of locking devices with fixing said probe substrate.

6. device as claimed in claim 1 is characterized in that, this rigid material substrate is silicon substrate, glass substrate or ceramic substrate, and this rigid material substrate is non-conductive and the thermal coefficient of expansion of this rigid material substrate near the thermal coefficient of expansion of silicon.

7. device as claimed in claim 1 is characterized in that, this firm banking is a rigid material, and this rigid material comprises kovar at least.

8. device as claimed in claim 1 is characterized in that the bottom of each space conversion substrate has an electrical connection arrangement, in order to be electrically connected space conversion substrate and printed circuit board (PCB).

9. device as claimed in claim 8 is characterized in that this electrical connection arrangement comprises a plurality of probe bases, has the gap of perforation between the said probe base, and respectively in this gap an elastic probe is being set, and the length of this elastic probe is a little more than probe base.

10. device as claimed in claim 9 is characterized in that, this elastic probe is a T type elastic probe.

11. device as claimed in claim 9 is characterized in that, this elastic probe is a L type elastic probe.

12. device as claimed in claim 9 is characterized in that, this elastic probe is a S type elastic probe.

13. device as claimed in claim 9; It is characterized in that this electrical connection arrangement comprises a substrate, and corresponding to the position of probe substrate a plurality of projections are set at this substrate; Said projection is arranged at the upper and lower surfaces of this substrate; And correspond to each other, and contain a plurality of conducting particless, to form electrical communication in the position that this substrate is provided with said projection.