TWM467064U - Circuit test quick adapter module - Google Patents
Circuit test quick adapter module Download PDFInfo
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- TWM467064U TWM467064U TW102212048U TW102212048U TWM467064U TW M467064 U TWM467064 U TW M467064U TW 102212048 U TW102212048 U TW 102212048U TW 102212048 U TW102212048 U TW 102212048U TW M467064 U TWM467064 U TW M467064U
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Description
本創作係與半導體電路檢測技術有關，旨在提供一種可以透過套接方式，快速構成電路測試板與訊號檢知系統電氣連接的電路測試快速轉接模組。This creation is related to the semiconductor circuit detection technology, and aims to provide a circuit test quick transfer module that can quickly form a electrical connection between the circuit test board and the signal detection system through a socket.
按，目前所製造量產的晶圓或半導體元件，為確保其品質上的製造良率，均會利用到電路測試板對於內部積體電路是否異常進行檢測，其主要透過電路測試板之量測點接觸到受測之晶圓或半導體元件(以下統稱受測元件)，使量測點接觸受測元件內部積體電路之相對應的輸入點與輸出點，然後經由電路測試板傳輸測試信號至訊號檢知系統，以精確測試出量測點失效位置，藉以測試受測元件之積體電路是否異常。According to the current production of wafers or semiconductor components, in order to ensure the quality of the manufacturing yield, the circuit test board is used to detect the abnormality of the internal integrated circuit, which is mainly measured by the circuit test board. Point-contacting the tested wafer or semiconductor component (hereinafter collectively referred to as the device under test), causing the measuring point to contact the corresponding input point and output point of the integrated circuit of the device under test, and then transmitting the test signal to the circuit test board via the circuit test board to The signal detection system accurately tests the failure position of the measurement point to test whether the integrated circuit of the device under test is abnormal.
近年來，半導體元件的封裝形式更具多樣化，相對的電路測試板亦必須對應於不同規格的受測元件的輸入點與輸出點配置而個別地製造各種形態，但基本上係設有與受測元件之輸入輸出點數量相同的針腳，且其全數的針腳多係以預定間距呈矩陣排列，且於各針腳處焊接有連接至訊號檢知系統的導線，透過導線構成受測元件與訊號檢知系統之間的訊傳遞。In recent years, the packaging form of semiconductor components has become more diverse, and the relative circuit test boards must also be individually manufactured in various forms corresponding to the input and output point configurations of different types of measured components, but basically The number of input and output points of the measuring component is the same, and the total number of stitches are arranged in a matrix at a predetermined interval, and the wires connected to the signal detecting system are soldered to the respective pins, and the tested components and the signal are detected through the wires. Know the communication between the systems.
然而，隨著半導體元件的小型化及高密度化，電路測試板之針腳(即量測點)腳位極細，單位面積內之分布密度極高， 相對會增加導線焊接難度，而必須耗費較高的焊接加工成本；尤其，電路測試板係對應於不同規格的受測元件的輸入點與輸出點配置，而配設與受測元件之輸入輸出點數量相同的針腳，因此當受測元件之規格有所變更，而需要重新製作電路測試板時，不但必須再耗費一次焊接成本，更會因此降低電路測試產能。However, with the miniaturization and high density of semiconductor components, the pins of the circuit test board (ie, the measuring points) are extremely thin, and the distribution density per unit area is extremely high. Relatively increasing the difficulty of wire welding, and it must consume high welding processing costs; in particular, the circuit test board corresponds to the input point and output point configuration of the tested components of different specifications, and the input and output points of the device under test are arranged. The same number of pins, so when the specifications of the device under test are changed, and the circuit test board needs to be re-created, not only must the welding cost be reduced, but the circuit test capacity can be reduced.
有鑒於此，本創作即在提供一種可以透過套接方式，快速構成電路測試板與訊號檢知系統電氣連接的電路測試快速轉接模組，為其主要目的者。In view of this, the present invention provides a circuit test quick transfer module which can quickly form an electrical connection between a circuit test board and a signal detection system through a socket, and is its main purpose.
為達上揭目的，本創作之電路測試快速轉接模組，係供連接於至少一電路測試板與一訊號檢知系統之間，用以構成該至少一電路測試板所安裝的受測元件與該訊號檢知系統之間的訊號傳遞，該電路測試快速轉接模組，基本上包括有：至少一絕緣基板，該至少一絕緣基板上設有複數供與電路測試板之針腳對應接合的耦接元件，全數耦接元件且依預定間距呈矩陣排列；複數排線組，各排線組係具有數條依序與該至少一絕緣基板上的耦接元件電氣連接的導線，且於各排線組之尾端設有一與所屬排線組全數導線電氣連接的電連接器。In order to achieve the above, the circuit test fast switching module of the present invention is connected between at least one circuit test board and a signal detecting system for forming the tested component mounted on the at least one circuit test board. And the signal transmission between the signal detection system, the circuit testing the quick switching module, basically comprising: at least one insulating substrate, wherein the at least one insulating substrate is provided with a plurality of pins for correspondingly engaging with the pins of the circuit test board a coupling component, all of which are coupled to each other and arranged in a matrix at a predetermined pitch; a plurality of cable sets, each of the wire sets having a plurality of wires electrically connected to the coupling components on the at least one insulating substrate, respectively The end of the cable set is provided with an electrical connector electrically connected to all the wires of the associated cable set.
利用上述結構特徵，本創作之電路測試快速轉接模組，於使用時，不同規格的電路測試板係可依照其針腳數選定套置於絕緣基板其中一區塊處，且將全數針腳分別與耦接元件對應接合，再將電路測試板所相連接的排線組透過電連接器與訊號檢知系統電氣連接。俾可快速構成電路測試板所安裝的受測元件與訊號檢知系統之間的訊號傳遞，有效降低電路測試板繁雜的導線焊接加工成本，以及具有較佳的適用性及操作便利性。Using the above structural features, the circuit test fast switching module of the present invention, when used, different circuit test boards can be placed in one of the insulating substrates according to the number of stitches, and all the pins are respectively The coupling components are correspondingly engaged, and the cable group connected to the circuit test board is electrically connected to the signal detection system through the electrical connector.俾 can quickly form the signal transmission between the tested component and the signal detection system installed on the circuit test board, effectively reducing the complicated wire welding processing cost of the circuit test board, and having better applicability and convenient operation.
依據上述結構特徵，所述各耦接元件係由一具預定管徑且伸出絕緣基板板面預定長度的導電桿體所構成。According to the above structural feature, each of the coupling elements is formed by a conductive rod body having a predetermined diameter and extending a predetermined length of the surface of the insulating substrate.
依據上述結構特徵，所述各耦接元件係由一具預定管徑且伸出絕緣基板板面預定長度的中空導電管體所構成。According to the above structural feature, each of the coupling elements is formed by a hollow conductive tube body having a predetermined diameter and extending a predetermined length of the surface of the insulating substrate.
依據上述結構特徵，所述各耦接元件係由一具預定管徑且伸出絕緣基板板面預定長度的中空導電管體所構成，且於各中空導電管體內裝設有與排線組電氣連接的彈性導電元件。According to the above structural feature, each of the coupling elements is formed by a hollow conductive tube body having a predetermined diameter and extending a predetermined length of the surface of the insulating substrate, and is electrically connected to the cable group in each hollow conductive tube body. Connected elastic conductive elements.
上述彈性導電元件係為一金屬彈簧。The elastic conductive element is a metal spring.
所述電路測試快速轉接模組，係進一步包括一供固定該至少一絕緣基板的載板。The circuit test fast switching module further includes a carrier for fixing the at least one insulating substrate.
上述載板係設有至少一供容置該至少一絕緣基板的凹槽。The carrier board is provided with at least one recess for receiving the at least one insulating substrate.
上述載板係設有至少一供與夾具接觸的裝配槽。The carrier plate is provided with at least one mounting groove for contacting the jig.
上述載板係設有至少一供容置該至少一絕緣基板的凹槽，以及設有至少一供與夾具接觸的裝配槽。The carrier board is provided with at least one recess for receiving the at least one insulating substrate, and at least one mounting groove for contacting the clamp.
具體而言，本創作所揭露之電路測試快速轉接模組，係可以產生下列功效：Specifically, the circuit test quick transfer module disclosed in the present invention can produce the following effects:
1.可透過套接方式，快速構成電路測試板與訊號檢知系統電氣連接，省去電路測試板之焊接加工成本。1. The socket test mode can be used to quickly form the electrical connection between the circuit test board and the signal detection system, eliminating the welding processing cost of the circuit test board.
2.可透過簡單插拔方式，快速更換不同規格的電路測試板與訊號檢知系統電氣連接，相對較具適用性。2. It is relatively easy to change the electrical connection between the circuit test board of different specifications and the signal detection system through simple plugging and unplugging.
3.可透過簡單插拔方式，快速更換不同規格的電路測試板與訊號檢知系統電氣連接，相對較具操作便利性。3. It is easy to replace the electrical connection between the circuit test board of different specifications and the signal detection system through simple plugging and unplugging mode, which is relatively convenient to operate.
4.整體電路測試快速轉接模組，尚可在載板上裝設兩個或兩個以上的絕緣基板，使得以適用更多不同規格的電路測試板。4. The whole circuit test fast transfer module can still install two or more insulating substrates on the carrier board, so that more circuit test boards with different specifications can be applied.
10‧‧‧電路測試板10‧‧‧Circuit Test Board
11‧‧‧針腳11‧‧‧ stitches
20‧‧‧受測元件20‧‧‧Measured components
30‧‧‧電路測試快速轉接模組30‧‧‧Circuit Test Fast Transfer Module
31‧‧‧絕緣基板31‧‧‧Insert substrate
311‧‧‧耦接元件311‧‧‧ coupling components
32‧‧‧排線組32‧‧‧ cable group
321‧‧‧導線321‧‧‧ wire
322‧‧‧電連接器322‧‧‧Electrical connector
33‧‧‧載板33‧‧‧ Carrier Board
40‧‧‧操作平台40‧‧‧Operation platform
第一圖係為本創作第一實施例之電路測試快速轉接模組外觀立體圖。The first figure is a perspective view of the appearance of the circuit test quick transfer module of the first embodiment of the present invention.
第二圖係為本創作第一實施例之電路測試快速轉接模組與電路測試板之接合狀態示意圖。The second figure is a schematic diagram of the joint state of the circuit test quick transfer module and the circuit test board of the first embodiment of the present invention.
第三圖係為本創作第二實施例之電路測試快速轉接模組外觀立體圖。The third figure is an external perspective view of the circuit test quick transfer module of the second embodiment of the present invention.
第四圖係為本創作第二實施例之電路測試快速轉接模組於使用時之安裝示意圖。The fourth figure is a schematic diagram of the installation of the circuit test quick transfer module of the second embodiment of the present invention.
本創作之電路測試快速轉接模組30，係供連接於至少一電路測試板10與一訊號檢知系統(圖略)之間，用以構成該至少一電路測試板10所安裝的受測元件20與該訊號檢知系統之間的訊號傳遞，如第一圖本創作第一實施例之電路測試快速轉接模組外觀立體圖、第二圖本創作第一實施例之電路測試快速轉接模組與電路測試板之接合狀態示意圖所示，本創作之電路測試快速轉接模組30，基本上包括有：The circuit test fast transfer module 30 of the present invention is connected between at least one circuit test board 10 and a signal detection system (not shown) to form a test device on which the at least one circuit test board 10 is installed. The signal transmission between the component 20 and the signal detection system, as shown in the first figure, the circuit test fast transfer module of the first embodiment is a perspective view, and the second figure is a circuit test quick transfer of the first embodiment. As shown in the schematic diagram of the interface state of the module and the circuit test board, the circuit test fast transfer module 30 of the present invention basically includes:
至少一絕緣基板31，該至少一絕緣基板31上設有複數供與電路測試板10之針腳11對應接合的耦接元件311，全數耦接元件311且依預定間距呈矩陣排列。The at least one insulating substrate 31 is provided with a plurality of coupling elements 311 for correspondingly engaging with the pins 11 of the circuit test board 10, and all of the coupling elements 311 are arranged in a matrix at a predetermined pitch.
複數排線組32，各排線組32係具有數條依序與該至少一絕緣基板31上的耦接元件311電氣連接的導線321，且於各排線組32之尾端設有一與所屬排線組32全數導線321電氣連接的電連接器322。本創作主要提供一種可以透過套接方式，快速構成 電路測試板與訊號檢知系統電氣連接的電路測試快速轉接模組。a plurality of cable sets 32, each of which has a plurality of wires 321 electrically connected to the coupling elements 311 of the at least one insulating substrate 31, and is provided at the end of each of the wire groups 32. The cable set 32 is an electrical connector 322 that is electrically connected to all of the wires 321 . This creation mainly provides a form that can be quickly constructed through a socket. The circuit test board and the signal detection system are electrically connected to the circuit test fast transfer module.
本創作之電路測試快速轉接模組30，於實施時，所述各耦接元件311係可由一具預定管徑且伸出絕緣基板31板面預定長度的導電桿體所構成，或是由一具預定管徑且伸出絕緣基板31板面預定長度的中空導電管體所構成。以及，所述各耦接元件311係由一具預定管徑且伸出絕緣基板31板面預定長度的中空導電管體所構成之結構形態下，各耦接元件311係可進一步於各中空導電管體內裝設有與排線組電氣連接的彈性導電元件(該彈性導電元件係可以為一金屬彈簧)，可透過彈性導電元件之伸縮作用確保電路測試板10之全數針腳11皆可確實與耦接元件311電氣連接。The circuit test fast transfer module 30 of the present invention, in the implementation, each of the coupling elements 311 can be formed by a conductive rod body having a predetermined diameter and extending a predetermined length of the surface of the insulating substrate 31, or by A hollow conductive tube body having a predetermined diameter and extending a predetermined length of the surface of the insulating substrate 31 is formed. And each of the coupling elements 311 is formed by a hollow conductive tube body having a predetermined diameter and extending a predetermined length of the surface of the insulating substrate 31, and each of the coupling elements 311 is further transparent to each of the hollow conductive tubes. The tube body is provided with an elastic conductive element electrically connected to the cable group (the elastic conductive element can be a metal spring), and the expansion and contraction of the elastic conductive element ensures that all the pins 11 of the circuit test board 10 can be reliably coupled. The connecting member 311 is electrically connected.
原則上，本創作之電路測試快速轉接模組30，於使用時，不同規格的電路測試板10係可依照其針腳11數選定套置於絕緣基板31其中一區塊處，且將全數針腳11分別與耦接元件311對應接合，再將與電路測試板10相連接的排線組32透過電連接器322與訊號檢知系統電氣連接。據以，可透過套接方式，快速構成電路測試板10所安裝的受測元件20與訊號檢知系統之間的訊號傳遞，有效降低電路測試板10繁雜的導線焊接加工成本，且具有較佳的適用性；必要時，可透過簡單插拔方式，快速更換不同規格的電路測試板與訊號檢知系統電氣連接，相對較具適用性。In principle, the circuit test fast switching module 30 of the present invention, when in use, the circuit test board 10 of different specifications can be selectively placed in one of the blocks of the insulating substrate 31 according to the number of pins 11 thereof, and all the pins are 11 is respectively coupled to the coupling element 311, and then the cable group 32 connected to the circuit test board 10 is electrically connected to the signal detecting system through the electrical connector 322. Therefore, the signal transmission between the device under test 20 and the signal detection system installed in the circuit test board 10 can be quickly formed by the socket method, thereby effectively reducing the complicated wire bonding processing cost of the circuit test board 10, and is better. Applicability; if necessary, it is relatively easy to change the electrical connection between the circuit test board of different specifications and the signal detection system through simple plugging and unplugging.
請同時配合參照第三圖及第四圖所示，本創作之電路測試快速轉接模組30，係可進一步包括一供固定該至少一絕緣基板31的載板33，可透過該載板33將電路測試快速轉接模組30穩固的安裝在一操作平台40上；以及，在第三圖及第四圖所示之實施例中，整體電路測試快速轉接模組30，係在載板33上裝設兩 個絕緣基板31，使得以適用更多不同規格的電路測試板10安裝使用。With reference to the third and fourth figures, the circuit test fast transfer module 30 of the present invention may further include a carrier 33 for fixing the at least one insulating substrate 31, through which the carrier 33 can be passed. The circuit test quick transfer module 30 is stably mounted on an operating platform 40; and, in the embodiments shown in the third and fourth figures, the integral circuit test fast transfer module 30 is attached to the carrier 33 on the two The insulating substrate 31 is mounted for use in a circuit test board 10 that is applied to more different specifications.
值得一提的是，本創作之電路測試快速轉接模組30，不論係在載板33上裝設一個或多個絕緣基板31，於實施時，係可進一步於載板33上設有至少一供容置該至少一絕緣基板的凹槽，或是設有至少一供與夾具接觸的裝配槽；當然，該載板33係以設有至少一供容置該至少一絕緣基板的凹槽，以及設有至少一供與夾具接觸的裝配槽為佳，使得以增加對絕緣基板31之固定效果，以及快速將電路測試快速轉接模組30安裝至定位。It is worth mentioning that the circuit test fast transfer module 30 of the present invention, whether or not the one or more insulating substrates 31 are mounted on the carrier 33, may be further provided on the carrier 33 at least when implemented. a recess for receiving the at least one insulating substrate, or at least one mounting groove for contacting the clamp; of course, the carrier 33 is provided with at least one recess for receiving the at least one insulating substrate Preferably, and at least one mounting groove for contacting the jig is provided to increase the fixing effect on the insulating substrate 31 and to quickly mount the circuit test quick transfer module 30 to the positioning.
與傳統習用結構相較，本創作所揭露之電路測試快速轉接模組，係可以產生下列功效：Compared with the conventional structure, the circuit test quick transfer module disclosed in the present invention can produce the following effects:
1.可透過套接方式，快速構成電路測試板與訊號檢知系統電氣連接，省去電路測試板之焊接加工成本。1. The socket test mode can be used to quickly form the electrical connection between the circuit test board and the signal detection system, eliminating the welding processing cost of the circuit test board.
2.可透過簡單插拔方式，快速更換不同規格的電路測試板與訊號檢知系統電氣連接，相對較具適用性。2. It is relatively easy to change the electrical connection between the circuit test board of different specifications and the signal detection system through simple plugging and unplugging.
3.可透過簡單插拔方式，快速更換不同規格的電路測試板與訊號檢知系統電氣連接，相對較具操作便利性。3. It is easy to replace the electrical connection between the circuit test board of different specifications and the signal detection system through simple plugging and unplugging mode, which is relatively convenient to operate.
4.整體電路測試快速轉接模組，尚可在載板上裝設兩個或兩個以上的絕緣基板，使得以適用更多不同規格的電路測試板。4. The whole circuit test fast transfer module can still install two or more insulating substrates on the carrier board, so that more circuit test boards with different specifications can be applied.
綜上所述，本創作提供一較佳可行之電路測試快速轉接模組，爰依法提呈新型專利之申請；本創作之技術內容及技術特點已揭示如上，然而熟悉本項技術之人士仍可能基於本創作之揭示而作各種不背離本案創作精神之替換及修飾。因此，本創作之保護範圍應不限於實施例所揭示者，而應包括各種不背離本創作之替換及修飾，並為以下之申請專利範圍所涵蓋。In summary, the present invention provides a better and feasible circuit test quick transfer module, and submits a new patent application according to law; the technical content and technical features of the present invention have been disclosed above, but those skilled in the art still It is possible to make various substitutions and modifications based on the disclosure of this creation without departing from the spirit of the creation of the case. Therefore, the scope of the present invention is not limited to the embodiments disclosed, but includes various alternatives and modifications that do not depart from the present invention and are covered by the following claims.
10‧‧‧電路測試板10‧‧‧Circuit Test Board
11‧‧‧針腳11‧‧‧ stitches
20‧‧‧受測元件20‧‧‧Measured components
30‧‧‧電路測試快速轉接模組30‧‧‧Circuit Test Fast Transfer Module
31‧‧‧絕緣基板31‧‧‧Insert substrate
311‧‧‧耦接元件311‧‧‧ coupling components
32‧‧‧排線組32‧‧‧ cable group
321‧‧‧導線321‧‧‧ wire
322‧‧‧電連接器322‧‧‧Electrical connector
33‧‧‧載板33‧‧‧ Carrier Board
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102212048U TWM467064U (en) | 2013-06-27 | 2013-06-27 | Circuit test quick adapter module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102212048U TWM467064U (en) | 2013-06-27 | 2013-06-27 | Circuit test quick adapter module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM467064U true TWM467064U (en) | 2013-12-01 |
Family
ID=50154751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102212048U TWM467064U (en) | 2013-06-27 | 2013-06-27 | Circuit test quick adapter module |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM467064U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI507699B (en) * | 2014-06-09 | 2015-11-11 | ||
| CN113358902A (en) * | 2021-06-08 | 2021-09-07 | 广东利扬芯片测试股份有限公司 | Signal adapter plate, chip testing device and testing method |
-
2013
- 2013-06-27 TW TW102212048U patent/TWM467064U/en not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI507699B (en) * | 2014-06-09 | 2015-11-11 | ||
| CN113358902A (en) * | 2021-06-08 | 2021-09-07 | 广东利扬芯片测试股份有限公司 | Signal adapter plate, chip testing device and testing method |
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| MM4K | Annulment or lapse of a utility model due to non-payment of fees |