CN202053191U - 一种抛光垫 - Google Patents
一种抛光垫 Download PDFInfo
- Publication number
- CN202053191U CN202053191U CN2010206835079U CN201020683507U CN202053191U CN 202053191 U CN202053191 U CN 202053191U CN 2010206835079 U CN2010206835079 U CN 2010206835079U CN 201020683507 U CN201020683507 U CN 201020683507U CN 202053191 U CN202053191 U CN 202053191U
- Authority
- CN
- China
- Prior art keywords
- polishing pad
- polishing
- microns
- material plate
- backing material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Polishing Bodies And Polishing Tools (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010206835079U CN202053191U (zh) | 2010-12-27 | 2010-12-27 | 一种抛光垫 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN2010206835079U CN202053191U (zh) | 2010-12-27 | 2010-12-27 | 一种抛光垫 |
Publications (1)
Publication Number | Publication Date |
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CN202053191U true CN202053191U (zh) | 2011-11-30 |
Family
ID=45013177
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2010206835079U Expired - Lifetime CN202053191U (zh) | 2010-12-27 | 2010-12-27 | 一种抛光垫 |
Country Status (1)
Country | Link |
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CN (1) | CN202053191U (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102642182A (zh) * | 2012-04-19 | 2012-08-22 | 浙江工业大学 | 有序固结研磨盘装置 |
-
2010
- 2010-12-27 CN CN2010206835079U patent/CN202053191U/zh not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102642182A (zh) * | 2012-04-19 | 2012-08-22 | 浙江工业大学 | 有序固结研磨盘装置 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130326 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
|
TR01 | Transfer of patent right |
Effective date of registration: 20130326 Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone, Beijing Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20111130 |