CN202051528U - Semiconductor water dispenser adopting heat pipe type radiator - Google Patents
Semiconductor water dispenser adopting heat pipe type radiator Download PDFInfo
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- CN202051528U CN202051528U CN2011200743345U CN201120074334U CN202051528U CN 202051528 U CN202051528 U CN 202051528U CN 2011200743345 U CN2011200743345 U CN 2011200743345U CN 201120074334 U CN201120074334 U CN 201120074334U CN 202051528 U CN202051528 U CN 202051528U
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- pipe type
- type radiator
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- water dispenser
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Abstract
The utility model provides a semiconductor water dispenser adopting a heat pipe type radiator, which comprises a shell body, wherein at least a refrigerating device and a heating device are arranged in the shell body; the refrigerating device comprises a cold water tank communicated with a water channel, a refrigerating sheet and a hot-end radiator; the refrigerating sheet is particularly a semiconductor refrigerating sheet, the hot-end radiator adopts the heat pipe type radiator, and the refrigerating sheet which is arranged between the cold water tank and the heat pipe type radiator clings to the cold water tank and the heat pipe type radiator. Compared with the prior art, the semiconductor water dispenser has the following advantages that as the hot-end radiator of the refrigerating device adopts the heat pipe type radiator to carry out radiation, heat can be effectively radiated; meanwhile, the volume of the heat pipe type radiator is smaller; therefore, the installation is facilitated and the structure is simplified.
Description
Technical field
The utility model relates to a kind of water dispenser, particularly a kind of semiconductor water dispenser that adopts heat-pipe type radiator.
Background technology
Water dispenser is risen the nineties in last century, is the water source with pure water or through the running water after filtering, sanitation and hygiene, and easy to use, modal in the market is the cold and hot type water dispenser.The heating method of existing water dispenser is basic identical, but that its refrigerating method just has is a variety of, such as using semiconductor refrigerating or cold-producing medium refrigeration etc.Can produce the material that causes environmental pollution in the process of using cold-producing medium to freeze; Use the water dispenser power consumption of semiconductor chilling plate smaller, and can not produce the material that causes environmental pollution, promptly energy-conservation environmental protection again.But, make semi-conductive Energy Efficiency Ratio lower, thereby reduced the speed of chilled water and improved power consumption because the heat-sinking capability of semiconductor hot junction radiator is lower.
Also there is the high semiconductor chilling plate of the power of employing to improve refrigerating speed, increase refrigerating capacity, but use the high semiconductor chilling plate of power, the high-power radiator that will change the outfit mates it, and high more its volume of radiator power is just big more, so just can't be installed on the less water dispenser, and increased the cost of water dispenser, these are difficult problems to manufacturer, so the refrigeration of semiconductor water dispenser can't promote effectively always, can't better be people's service.
As the Chinese patent publication number is that the patent document of CN2588903 discloses a kind of cold-instantly type semiconductor water dispenser, refrigerating plant has used the large-power semiconductor cooling piece in this technology, be equipped with powerful radiator, and designed devices such as EGR, suction pump and power supply more in the whole water dispenser, though refrigeration has increased much, but complex structure, power consumption is big, has consumed many materials, and it is more that cost increases, so just be unfavorable for promoting, can't come into huge numbers of families.
Because the above-mentioned defective that existing water dispenser exists needs a kind of semiconductor water dispenser to remedy the existing existing defective of water dispenser especially.
The utility model content
The purpose of this utility model is to provide a kind of semiconductor water dispenser that adopts heat-pipe type radiator, overcome above-mentioned shortcoming of the prior art, can not only make that water temperature reduces fast in the cold water storage cistern, also improved simultaneously the refrigerating efficiency of semiconductor chilling plate, overall structure is simple, dependable performance, low, the energy-conserving and environment-protective of cost.
To achieve these goals, the technical solution of the utility model is as follows:
A kind of semiconductor water dispenser that adopts heat-pipe type radiator, comprise housing, it is characterized in that, in described housing, be provided with refrigerating plant and heating combined equipment at least, described housing top is provided with the tank that links to each other with bucket, described tank is connected with heating combined equipment with described refrigerating plant respectively, be respectively arranged with cooling water outlet and hot water outlet on the described housing, described cooling water outlet is connected with heating combined equipment with described refrigerating plant by pipeline respectively with hot water outlet, described refrigerating plant comprises the cold water storage cistern that is connected with described tank, and cooling piece and hot-side heat dissipation device, described cooling piece is a semiconductor chilling plate, described hot-side heat dissipation device adopts heat-pipe type radiator, and described cooling piece is arranged between cold water storage cistern and the heat-pipe type radiator and is close to cold water storage cistern and heat-pipe type radiator.
In an embodiment of the present utility model, also comprise the normal temperature device, be connected by pipeline between described normal temperature device and the tank.Further, described normal temperature device is normal-temperature water outlet.
In an embodiment of the present utility model, described cooling piece comprises chill surface and radiating surface, and described chill surface and radiating surface are oppositely arranged on the described cooling piece, and described chill surface links to each other with cold water storage cistern, and described radiating surface links to each other with heat-pipe type radiator.
In an embodiment of the present utility model, described heating combined equipment comprises boiler and heater circuit, described heater circuit is arranged in the described boiler, links to each other by pipeline between described boiler and the tank, links to each other by pipeline between described boiler and the described hot water outlet.
Semiconductor water dispenser of the present utility model has following advantage compared to existing technology:
1, can provide cold water, normal-temperature water and hot water at any time;
2, the hot-side heat dissipation device of refrigerating plant adopts heat-pipe type radiator to dispel the heat, and can effectively heat be shed, and the volume of heat-pipe type radiator is less simultaneously, is convenient to install, and is simple in structure.
3, simple, the dependable performance of overall structure, low, the energy-conserving and environment-protective of cost.
Description of drawings
Describe the utility model in detail below in conjunction with the drawings and specific embodiments:
Fig. 1 is a structural representation of the present utility model;
Fig. 2 is a front view of the present utility model.
The specific embodiment
For technological means, creation characteristic that the utility model is realized, reach purpose and effect is easy to understand, below in conjunction with concrete diagram, further set forth the utility model.
As Fig. 1, shown in Figure 2, semiconductor water dispenser of the present utility model, comprise housing 100, in housing 100, be respectively arranged with refrigerating plant 200, heating combined equipment 300 and normal temperature device 400, housing 100 upper ends are provided with the tank 110 that links to each other with bucket 500, tank 110 respectively with refrigerating plant 200, heating combined equipment 300 is connected with normal temperature device 400, be respectively arranged with cooling water outlet 210 and hot water outlet 310 on the housing 100, cooling water outlet 210 is connected with heating combined equipment 300 with refrigerating plant 200 by pipeline respectively with hot water outlet 310, and the cooling piece 220 of refrigerating plant 200 is a semiconductor chilling plate.
Refrigerating plant 200 comprises cold water storage cistern 230, cooling piece 220 and heat-pipe type radiator 240 (can buy) on market, link to each other by pipeline between cold water storage cistern 230 and the tank 110, link to each other by pipeline between cold water storage cistern 230 and the cooling water outlet 210, cooling piece 220 links to each other with heat-pipe type radiator 240 with cold water storage cistern 230 respectively.Whole refrigerating plant 200 integrated being bundled together.
Cooling piece 220 comprises chill surface and radiating surface, the chill surface 221 and the radiating surface 222 of cooling piece 220 are oppositely arranged on the cooling piece 220, the chill surface 221 of cooling piece 220 links to each other with cold water storage cistern 230, and the radiating surface 222 of cooling piece 220 links to each other with heat-pipe type radiator 240.
Heating combined equipment 300 comprises boiler 320 and heater circuit 330, and heater circuit 330 is arranged in the boiler 320, links to each other by pipeline between boiler 320 and the tank 110, links to each other by pipeline between boiler 320 and the hot water outlet 310.
After water dispenser connects power supply, open the normal-temperature water outlet and can obtain normal-temperature water; Open hot-water switch and start heating combined equipment 300, water in the heater circuit 330 heat hot water tanks 320 stops heating automatically behind design temperature, heating automatically again when the water in the boiler 320 drops to the setting low temperature, behind design temperature, stop automatically, water temperature remains on to be set between the high and low temperature, opens hot water outlet 310 and just can obtain hot water.
Open cold water switch and start refrigerating plant 200, cooling piece 220 work, chill surface 221 refrigeration that connect cold water storage cistern 230, water for cooling in the cold water storage cistern 230, radiating surface 222 is passed to heat-pipe type radiator 240 with chill surface 221 from the heat that cold water storage cistern 230 absorbs, and heat-pipe type radiator 240 is dispersed into the part heat in the air.The heat-sinking capability of heat-pipe type radiator 240 is strong, can be effectively the heat of the radiating surface 222 of cooling piece 220 be dispersed in the air, thereby can give full play to the refrigerating capacity of cooling piece 220, improve the Energy Efficiency Ratio of cooling piece 220, it is faster that the coolant-temperature gage that making needs refrigeration falls.Simultaneously,, install easily, make the simple in structure of device because the volume of heat-pipe type radiator 240 is little.
More than show and described basic principle of the present utility model, principal character and advantage of the present utility model.The technical staff of the industry should understand; the utility model is not restricted to the described embodiments; what describe in the foregoing description and the specification is principle of the present utility model; the utility model also has various changes and modifications under the prerequisite that does not break away from the utility model spirit and scope, and these changes and improvements all fall in the claimed scope of the present utility model.The protection domain that the utility model requires is defined by appending claims and equivalent thereof.
Claims (5)
1. semiconductor water dispenser that adopts heat-pipe type radiator, comprise housing, it is characterized in that, in described housing, be provided with refrigerating plant and heating combined equipment at least, described housing top is provided with the tank that links to each other with bucket, described tank is connected with heating combined equipment with described refrigerating plant respectively, be respectively arranged with cooling water outlet and hot water outlet on the described housing, described cooling water outlet is connected with heating combined equipment with described refrigerating plant by pipeline respectively with hot water outlet, described refrigerating plant comprises the cold water storage cistern that is connected with described tank, and cooling piece and hot-side heat dissipation device, described cooling piece is a semiconductor chilling plate, described hot-side heat dissipation device adopts heat-pipe type radiator, and described cooling piece is arranged between cold water storage cistern and the heat-pipe type radiator and is close to cold water storage cistern and heat-pipe type radiator.
2. the semiconductor water dispenser of employing heat-pipe type radiator according to claim 1 is characterized in that, also comprises the normal temperature device, is connected by pipeline between described normal temperature device and the tank.
3. the semiconductor water dispenser of employing heat-pipe type radiator according to claim 2 is characterized in that, described normal temperature device is normal-temperature water outlet.
4. the semiconductor water dispenser of employing heat-pipe type radiator according to claim 1, it is characterized in that, described cooling piece comprises chill surface and radiating surface, described chill surface and radiating surface are oppositely arranged on the described cooling piece, described chill surface links to each other with cold water storage cistern, and described radiating surface links to each other with heat-pipe type radiator.
5. the semiconductor water dispenser of employing heat-pipe type radiator according to claim 1, it is characterized in that, described heating combined equipment comprises boiler and heater circuit, described heater circuit is arranged in the described boiler, link to each other by pipeline between described boiler and the tank, link to each other by pipeline between described boiler and the described hot water outlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200743345U CN202051528U (en) | 2011-03-21 | 2011-03-21 | Semiconductor water dispenser adopting heat pipe type radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200743345U CN202051528U (en) | 2011-03-21 | 2011-03-21 | Semiconductor water dispenser adopting heat pipe type radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202051528U true CN202051528U (en) | 2011-11-30 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200743345U Expired - Lifetime CN202051528U (en) | 2011-03-21 | 2011-03-21 | Semiconductor water dispenser adopting heat pipe type radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202051528U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102563955A (en) * | 2012-03-14 | 2012-07-11 | 浙江大学 | Solar energy driven semiconductor quick refrigerating device and water dispenser containing same |
-
2011
- 2011-03-21 CN CN2011200743345U patent/CN202051528U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102563955A (en) * | 2012-03-14 | 2012-07-11 | 浙江大学 | Solar energy driven semiconductor quick refrigerating device and water dispenser containing same |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20111130 |
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| CX01 | Expiry of patent term |