CN101773367B - Semiconductor water dispenser - Google Patents
Semiconductor water dispenser Download PDFInfo
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- CN101773367B CN101773367B CN201010300530XA CN201010300530A CN101773367B CN 101773367 B CN101773367 B CN 101773367B CN 201010300530X A CN201010300530X A CN 201010300530XA CN 201010300530 A CN201010300530 A CN 201010300530A CN 101773367 B CN101773367 B CN 101773367B
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Abstract
The invention relates to the technical field of household electrical appliances, relating to a semiconductor water dispenser, comprises a water bucket, a refrigeration device, a heating device and a room temperature device, wherein the water bucket is respectively connected with the refrigeration device, the heating device and the room temperature device; the refrigeration device comprises a cold water tank, a cold water tap, a refrigeration piece, a radiator and a heat pipe; the cold water tank is connected with the water bucket; the cold water tap is connected with the cold water tank; the refrigeration piece is respectively connected with the cold water tank and the radiator; and the top end of the heat pipe is connected with the water bucket, the tail end is connected with the radiator, and the top end is immersed in water. The invention can provide cold water, room temperature water and heat water at will, the semiconductor refrigeration piece with high power is utilized in the refrigeration device so that the refrigeration capability is greatly enhanced, the radiator integrated with the heat pipe is utilized at the same time so that the radiating capability is greatly enhanced. The semiconductor water dispenser has the advantages of simple whole structure, reliable performance, low cost, energy saving and and the environmental friendly.
Description
Technical field
What the present invention relates to is the device of a kind of family electro-technical field, in particular a kind of semiconductor water dispenser.
Background technology
Water dispenser is risen the nineties in last century, is the water source with pure water or through the running water after filtering, and sanitation and hygiene are easy to use.Modal on the market is the cold and hot type water dispenser.The heating method of water dispenser is basic identical, but that its refrigerating method just has is a variety of, such as using semiconductor refrigerating or cold-producing medium refrigeration etc.Use the water dispenser power consumption of semiconductor chilling plate little, but refrigeration will be lower than the water dispenser that uses cold-producing medium, key is because the power of the semiconductor chilling plate that water dispenser uses is low, if with the high semiconductor chilling plate of power, the high-power radiator that will change the outfit mates it, but high more its volume of radiator power is just big more, so just can't be installed on the less water dispenser, and increased cost, these are difficult problems to manufacturer, so it is limited that the semiconductor water dispenser refrigeration promotes always, can't better be people's service.
Find through literature search prior art, Chinese patent literature number: CN2588903Y, this technology discloses a kind of cold-instantly type semiconductor water dispenser, this technology comprises: semiconductor is device for cooling, EGR, feed pump, heat jar and power supply, semiconductor is that device for cooling comprises main switch, secondary interchanger and semiconductor subassembly, and the main switch upper and lower faces respectively is provided with a secondary interchanger.Put between major and minor interchanger semiconductor subassembly is arranged.EGR comprises condenser and circulating pump, and condenser one end is connected with circulating pump by tube connector, and the other end is communicated with secondary interchanger, and the secondary interchanger other end is connected with circulating pump.Feed pump is communicated with the main switch water inlet, and the main switch water outlet is connected with tap.This technology has been used the large-power semiconductor cooling piece, be equipped with powerful radiator, and devices such as EGR, feed pump and power supply have been designed in the whole water dispenser more, complex structure, power consumption is big, has consumed many materials, and it is more that cost increases, so just be unfavorable for promoting, can't come into huge numbers of families.
Summary of the invention
The objective of the invention is to overcome the deficiencies in the prior art, a kind of semiconductor water dispenser is provided, in refrigerating plant, has used the high semiconductor chilling plate of power, make its refrigerating capacity improve greatly, use the radiator of integrated heat pipe simultaneously, made its heat-sinking capability be greatly improved.
The present invention is achieved through the following technical solutions, and the present invention includes: bucket, refrigerating plant, heating combined equipment and normal temperature device, wherein: bucket links to each other with refrigerating plant, heating combined equipment and normal temperature device respectively.
Described refrigerating plant comprises: cold water storage cistern, cold water faucet, cooling piece, radiator and heat pipe, wherein: cold water storage cistern links to each other with bucket, and cold water faucet links to each other with cold water storage cistern, and cooling piece links to each other with radiator with cold water storage cistern respectively, the top of heat pipe links to each other with bucket, and end links to each other with radiator.
Described cooling piece is to be made by semi-conducting material.
Described cooling piece comprises: chill surface and radiating surface, and wherein: chill surface and radiating surface are relatively arranged on the cooling piece, and chill surface is connected with cold water storage cistern, and radiating surface links to each other with radiator.
Described heat pipe is sealing and the inner metal tube that is provided with refrigeration working medium.
In the water of the top-submerged of described heat pipe in bucket.
Described heating combined equipment comprises: boiler, heater circuit and hot water tap, and wherein: heater circuit is arranged in the boiler, and boiler links to each other with bucket, and the hot water tap links to each other with boiler.
Described normal temperature device is the normal-temperature water tap, and the normal-temperature water tap directly links to each other with bucket.
The present invention has following advantage compared to existing technology: the present invention can provide cold water, normal-temperature water and hot water at any time, in refrigerating plant, used the high semiconductor chilling plate of power, make refrigerating capacity improve greatly, use the radiator of integrated heat pipe simultaneously, made its heat-sinking capability be greatly improved.Overall structure is simple, dependable performance, low, the energy-conserving and environment-protective of cost.
Description of drawings
Fig. 1 is a side view of the present invention;
Fig. 2 is a front view of the present invention.
The specific embodiment
Below in conjunction with accompanying drawing embodiments of the invention are elaborated: present embodiment is to implement under the prerequisite in technical solution of the present invention.Provided detailed embodiment and concrete operating process, but protection scope of the present invention is not limited to following embodiment.
As shown in Figure 1, present embodiment comprises: bucket 1, tank 2, refrigerating plant 3, heating combined equipment 4 and normal temperature device 5, and wherein: the outlet of bucket 1 is provided with tank 2, and tank 2 links to each other with refrigerating plant 3, heating combined equipment 4 and normal temperature device 5 respectively.
Refrigerating plant 3 comprises: cold water storage cistern 6, cold water faucet 7, cooling piece 8, radiator 9 and heat pipe 10, wherein: cold water storage cistern 6 links to each other with tank 2, cold water faucet 7 links to each other with cold water storage cistern 6, cooling piece 8 links to each other with radiator 9 with cold water storage cistern 6 respectively, the top of heat pipe 10 links to each other with tank 2, end links to each other with radiator 9, and the top of heat pipe 10 is not had by the water logging in the tank 2 fully.
Cooling piece 8 is made by semi-conducting material, comprises chill surface and radiating surface, and chill surface and radiating surface are oppositely arranged on the cooling piece, and chill surface is connected with cold water storage cistern 6, and radiating surface links to each other with radiator 9.
Heating combined equipment 4 comprises: boiler 11, heater circuit 12 and hot water tap 13, and wherein: heater circuit 12 is arranged in the boiler 11, and boiler 11 links to each other with tank 2, and hot water tap 13 links to each other with boiler 11.
This water dispenser is opened the normal-temperature water tap and can be obtained normal-temperature water after connecting power supply.Open hot-water switch and start heating combined equipment 4, water in the heater circuit 12 heat hot water tanks 11 stops heating automatically after setting high-temperature, heating automatically again when the water in the boiler 11 drops to the setting low temperature, behind design temperature, stop automatically, water temperature remains on to be set between the high and low temperature, opens hot water tap 13 and just can obtain hot water.
Open cold water switch and start refrigerating plant 3, cooling piece 8 work, the chill surface refrigeration that connects cold water storage cistern 6, water for cooling in the cold water storage cistern 6, radiating surface is passed to radiator 9 with chill surface from the heat that cold water storage cistern 6 absorbs, radiator 9 is dispersed into the part heat in the air, part heat transferred heat pipe 10, the heat of vaporization that the water of heat pipe 10 inside absorbs radiator 9 transmission is that steam rises to heat pipe 10 tops, the top is not had by the water logging in the tank 2 fully, steam is passed to water in the tank 2 by tube wall with heat, dissipated heat is condensed into water and runs down into end again from radiator 9 heat absorption evaporations along heat pipe 10 inwalls, and the water in the tank 2 both can have been lowered the temperature naturally by air, also can enter the water hybrid cooling of tank 2 with bucket 1, the continuous cooling of the water in the cold water storage cistern 6 is opened cold water faucet 7 and just can be obtained cold water.
Claims (1)
1. semiconductor water dispenser comprises: bucket, refrigerating plant, heating combined equipment and normal temperature device, and wherein: bucket links to each other with refrigerating plant, heating combined equipment and normal temperature device respectively, it is characterized in that, also comprises: heat pipe;
Described refrigerating plant comprises: cold water storage cistern, cold water faucet, radiator and cooling piece, and wherein: cold water storage cistern links to each other with bucket, and cold water faucet links to each other with cold water storage cistern, and cooling piece links to each other with radiator with cold water storage cistern respectively;
Described heating combined equipment comprises: boiler, heater circuit and hot water tap, and wherein: heater circuit is arranged in the boiler, and boiler links to each other with bucket, and the hot water tap links to each other with boiler;
Described normal temperature device is the normal-temperature water tap, and the normal-temperature water tap directly links to each other with bucket;
The top of described heat pipe links to each other with bucket, and end links to each other with radiator;
Described cooling piece comprises: chill surface and radiating surface, and wherein: chill surface and radiating surface are relatively arranged on the cooling piece, and chill surface is connected with cold water storage cistern, and radiating surface links to each other with radiator;
Described heat pipe is sealing and the inner metal tube that is provided with refrigeration working medium;
Described cooling piece is made by semi-conducting material;
In the water of the top-submerged of described heat pipe in bucket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010300530XA CN101773367B (en) | 2010-01-21 | 2010-01-21 | Semiconductor water dispenser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010300530XA CN101773367B (en) | 2010-01-21 | 2010-01-21 | Semiconductor water dispenser |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101773367A CN101773367A (en) | 2010-07-14 |
| CN101773367B true CN101773367B (en) | 2011-06-01 |
Family
ID=42510053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010300530XA Expired - Fee Related CN101773367B (en) | 2010-01-21 | 2010-01-21 | Semiconductor water dispenser |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101773367B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102818394B (en) * | 2012-08-14 | 2015-12-09 | 苏州华爱电子有限公司 | Indirect-cooling semiconductor cooling device |
| CN109163443A (en) * | 2018-08-23 | 2019-01-08 | 民勤县威瑞环保有限责任公司 | It is a kind of can self-purging water source energy-saving heating type travelling scuttlebutt |
| CN109578683B (en) * | 2018-12-25 | 2019-11-22 | 华中科技大学 | Tap associated mode fast-refrigerating device and combinations thereof part |
| CN112034900B (en) * | 2020-09-10 | 2021-06-22 | 焦作大学 | Automatic temperature regulating and controlling device for computer host and control method thereof |
| CN113100632A (en) * | 2021-05-07 | 2021-07-13 | 江苏全给净化科技有限公司 | Circulation heat preservation water dispenser |
-
2010
- 2010-01-21 CN CN201010300530XA patent/CN101773367B/en not_active Expired - Fee Related
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| Publication number | Publication date |
|---|---|
| CN101773367A (en) | 2010-07-14 |
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| C06 | Publication | ||
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| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110601 Termination date: 20140121 |