CN202042477U - IC packaging device - Google Patents
IC packaging device Download PDFInfo
- Publication number
- CN202042477U CN202042477U CN2010205686880U CN201020568688U CN202042477U CN 202042477 U CN202042477 U CN 202042477U CN 2010205686880 U CN2010205686880 U CN 2010205686880U CN 201020568688 U CN201020568688 U CN 201020568688U CN 202042477 U CN202042477 U CN 202042477U
- Authority
- CN
- China
- Prior art keywords
- card body
- pin
- card
- utility
- packaging system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides an IC (integrated circuit) packaging device, which comprises a card body and pins arranged on the card body, wherein contacts on the pins extend from the card body to the end parts of the card body. The IC packaging device provided by the utility model enables the IC to be provided with not only common plugging function, but also an SMT (Surface Mounting Technology) welding function, so that the work efficiency during the production and the development is improved.
Description
Technical field
The utility model relates to a kind of IC packaging system, especially a kind of IC packaging system with SMT welding function.
Background technology
Along with the development of IC technology, increasing application processor support starts from SD/MMC, and the development that can avoid the Nandflash technology like this also makes system become more flexible constantly to the new requirement of processor ECC technology.This international organization has been formulated the eMMC/eSD standard.Make the IC of each manufacturer production can be general mutually, it be encapsulation BGA169,12 * 16mm that size is little, and big can arrive 16 * 20mm, and its solder pad space length only is 0.5mm, and it is to the production technology of PCB, and the smt specification requirement is very high.Exploitation, production and maintenance have all been brought certain difficulty; And general microSD card, it is encapsulated as the 8pin interface, size 15 * 11mm, and convenient plug, but reliability is relatively poor.
The utility model content
In order to solve existing technical problem in the background technology, the utility model proposes a kind of IC packaging system, contact on the pin extends to the end of card body on one's body from card, make IC not only have common plug function, can also have SMT welding function simultaneously, thereby in the process of producing and developing, increase work efficiency.
Technical solution of the present utility model is: a kind of IC packaging system, comprise card body and pin, and its special character is: described pin is arranged on one's body the card, and the contact on the described pin extends to the end of card body on one's body from card.
The other end setting of above-mentioned card body is free pin.
Above-mentioned empty pin is two.
IC packaging system of the present utility model extends to the contact on the pin outside the card, and keeps the part of card body side, and the part that it exposes in the side increases scolding tin adhesive force during for SMT.And, increase by 2 empty pins at card body afterbody, when SMT welds, can increase whole stability and reach convenient exploitation, produce, save purposes such as cost.Can make IC not only have common plug function, can also have SMT welding function simultaneously, thereby in the process of producing and developing, increase work efficiency.
Description of drawings
Fig. 1 (a) is existing IC packaging system structure chart;
Fig. 1 (b) is that the A of Fig. 1 (a) is to view;
Fig. 2 (a) is an IC packaging system structural representation of the present utility model;
Fig. 2 (b) is that the A of Fig. 2 (a) is to view;
Embodiment
Referring to Fig. 2 (a), Fig. 2 (b), IC packaging system of the present utility model, comprise card body 1, pin 2, feeler 3, empty pin 4, pin 2 is in the front portion of IC-card body 1, pin 2 extends to the end of card body 1 always, and encasing the part (similar existing QFN mode encapsulates) of card body 1 front end side, the part that it exposes in the side increases scolding tin adhesive force during for SMT.Increase the pin 4 of two skies simultaneously at card body 1 afterbody, when SMT welds, can increase whole stability.As can be seen SD card pin is only changed a little, can not had much impact, after modification, can improve reliability and utilization rate greatly on the contrary for the control of cost.
Claims (3)
1. an IC packaging system comprises card body and pin, it is characterized in that: described pin is arranged on one's body the card, and the contact on the described pin extends to the end of card body on one's body from card.
2. IC packaging system according to claim 1 is characterized in that: the other end setting of described card body is free pin.
3. IC packaging system according to claim 2 is characterized in that: described empty pin is two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205686880U CN202042477U (en) | 2010-10-20 | 2010-10-20 | IC packaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205686880U CN202042477U (en) | 2010-10-20 | 2010-10-20 | IC packaging device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202042477U true CN202042477U (en) | 2011-11-16 |
Family
ID=44969912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205686880U Expired - Fee Related CN202042477U (en) | 2010-10-20 | 2010-10-20 | IC packaging device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202042477U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104754877A (en) * | 2015-03-19 | 2015-07-01 | 广东小天才科技有限公司 | Method for verifying EMMC (embedded multi media card) |
-
2010
- 2010-10-20 CN CN2010205686880U patent/CN202042477U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104754877A (en) * | 2015-03-19 | 2015-07-01 | 广东小天才科技有限公司 | Method for verifying EMMC (embedded multi media card) |
| CN104754877B (en) * | 2015-03-19 | 2017-12-12 | 广东小天才科技有限公司 | A kind of EMMC verification method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111116 Termination date: 20121020 |