CN104754877A - Method for verifying EMMC (embedded multi media card) - Google Patents
Method for verifying EMMC (embedded multi media card) Download PDFInfo
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- CN104754877A CN104754877A CN201510121328.3A CN201510121328A CN104754877A CN 104754877 A CN104754877 A CN 104754877A CN 201510121328 A CN201510121328 A CN 201510121328A CN 104754877 A CN104754877 A CN 104754877A
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- emmc
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- tin
- welded
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Abstract
The invention refers to the technical field of packaging, and provides a method for verifying EMMC (embedded multi media card). The method comprises the following steps: a slice taking step; a processing step; a verifying step; when EMMC is taken off and a welding point on a main board is bad in the slice taking step, the method further comprises a tin planting step: welding a new EMMC on the main board, and then taking off the new EMMC, and remaining a tin ball of the new EMMC on the main board; in the verifying step, the EMMC after processing is welded and fixed by the tin ball remained on the main board so as to perform verification. According to the method for verifying the EMMC, the processed EMMC is welded by the tin ball of the new EMMC to verify through welding and taking off the new EMMC on the main board; by adopting the method, the tin plating efficiency high, and the processed EMMC can be greatly convenient to weld, and saves time and labor; moreover, the taken-off new EMMC can be slowly repaired in spare time, and still can be used again, thus the method cannot cause waste and also can save time.
Description
Technical field
The present invention relates to encapsulation technology field, more particularly, relate to the verification method of a kind of EMMC.
Background technology
In R & D of complex, when development department peopleware judges that EMMC has a problem, EMMC takes off by hardware technology personnel cooperation, utilizes the read-write software of EMMC manufacturer carry out reading to EMMC and process, and then EMMC is welded on circuit board to verify whether also have problems.Hardware technology personnel utilize air pressure gun to be taken off by EMMC, and utilize flatiron by clean clean for the solder joint that circuit board is left over; When again welding, the EMMC after process being aimed at steel mesh and puts on fixture, coating tin cream, utilize air pressure gun to blow weldering, take out EMMC after cooling in the checking of welding mainboard.When carrying out above-mentioned checking, namely coat this step of tin cream is plant tin to EMMC, because original tin has been cleaned out when taking off EMMC, therefore needs again to plant tin.But this coat tin cream plant tin method, difficulty is large, and technical requirement is high, and easily companys of causing welds, success rate is not high, and spot size differs, and needs the time long, like this, hardware operation efficiency is low, does not catch up with the job schedule of peopleware, affects to production.
Summary of the invention
The object of the present invention is to provide the verification method of a kind of EMMC, be intended to solve when verifying EMMC in prior art and plant tin difficulty, inefficient problem.
For solving the problems of the technologies described above, technical scheme of the present invention is: the verification method providing a kind of EMMC, comprises the following steps:
Get sheet step: may take off from mainboard by in-problem EMMC;
Treatment step: by the EMMC process of taking off;
Verification step: the EMMC after process is welded on mainboard again and verifies;
When getting in sheet step, after EMMC takes off, when on mainboard, solder joint is not good, also comprise
Plant tin step: be welded on mainboard by new EMMC, then this new EMMC is taken off, and the tin ball of new EMMC is retained on mainboard;
In above-mentioned verification step, utilize the tin ball be retained on mainboard that the EMMC after process is welded and fixed and is verified.
Particularly, if the mainboard got in sheet step through playing glue process, is then being planted in tin step, is being welded in by new EMMC and does not beat on another new mainboard of glue, new mainboard and former mainboard are same model, and the EMMC in verification step after process is welded in this and does not beat on the new mainboard of glue.
Particularly, if get mainboard in sheet step through playing glue process, then when getting EMMC, air pressure gun being adjusted to 150 DEG C ~ 180 DEG C, wind-force I level aims at around EMMC and blow, using instrument to be removed by the glue around EMMC simultaneously.
Particularly, if the mainboard got in sheet step is without playing glue process, then when getting EMMC, air pressure gun being adjusted to 260 DEG C ~ 280 DEG C, wind-force I level blows around EMMC, EMMC being taken off simultaneously.
Particularly, before described treatment step, the solder joint of the EMMC taken off is tied, and clean and operation of removing photoresist are carried out to it.
Particularly, in described treatment step, the EMMC taken off is processed by EMMC Reading and writing instrument.
Particularly, planting in tin step, when new EMMC welds, the former solder joint on mainboard is being tied, and clean, and coating rosin cream positions, and utilizes air pressure gun to carry out blowing weldering.
Particularly, planting in tin step, when new EMMC takes off, pad is applying rosin cream.
In the present invention, by the EMMC that welding one on mainboard is new, and then new EMMC is taken off, the tin ball of new EMMC is utilized the EMMC welding after process to be verified, adopt in this way, plant tin efficiency high, greatly facilitate the welding of the EMMC after process, time saving and energy saving, and the new EMMC be removed can slowly repair at free time again, still can continue to use, like this, both can not cause waste, and save the time, the hardware handles in R&D process can be made better to coordinate with software process.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with embodiment, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
It should be noted that, when element is called as " being fixed on " or " being arranged at " another element, it can directly on another element or may there is centering elements simultaneously.When an element is called as " being connected to " another element, it can be directly connected to another element or may there is centering elements simultaneously.
Also it should be noted that, the orientation term such as left and right, upper and lower in the present embodiment, is only relative concept or be reference with the normal operating condition of product each other, and should not be regarded as have restrictive.
Embodiments provide the verification method of a kind of EMMC, may verify by in-problem EMMC mainly in R & D of complex, to find EMMC in use Problems existing, thus contribute to manufacturer and can better improve EMMC.
The verification method of this EMMC that the embodiment of the present invention provides, comprises the following steps:
Get sheet step: may take off from mainboard by in-problem EMMC;
Treatment step: by the EMMC process of taking off;
Verification step: the EMMC after process is welded on mainboard again and verifies;
Also comprise and plant tin step: new EMMC is welded on mainboard, then this new EMMC is taken off, and the tin ball of new EMMC is retained on mainboard;
In above-mentioned verification step, utilize the tin ball be retained on mainboard that the EMMC after process is welded and fixed and is verified.
In the present embodiment, getting in sheet step, after taking off EMMC, pad generally on mainboard can be destroyed, and there is the situation connecting weldering, the pad on mainboard can not re-use, like this, need the pad on mainboard to clean out, and then carry out above-mentioned planting tin step.It should be noted that, above-mentioned plants tin step, can carry out with treatment step simultaneously, also can before treatment step, or after the treatment step, as long as guarantee to plant tin step after getting sheet step before verification step.
In the embodiment of the present invention, by the EMMC that welding one on mainboard is new, and then new EMMC is taken off, the tin ball of new EMMC is utilized the EMMC welding after process to be verified, adopt in this way, plant tin efficiency high, greatly facilitate the welding of the EMMC after process, time saving and energy saving, and the new EMMC be removed can slowly repair at free time again, still can continue to use, like this, both can not cause waste, and save the time, the hardware handles in R&D process can be made better to coordinate with software process.
Particularly, if getting the mainboard in sheet step through playing glue process, then planting in tin step, being welded in by new EMMC does not beat on another new mainboard of glue, new mainboard must be same model with the former mainboard playing glue, and the EMMC in verification step after process is welded in this and does not beat on the new mainboard of glue.This is because mainboard, once through playing glue process, can impact the result the impact of air pressure gun temperature is lower, if therefore former mainboard process plays glue process, then the new mainboard without playing glue need be adopted to verify when verifying.
Particularly, if get mainboard in sheet step through playing glue process, then when getting problematic EMMC, air pressure gun being adjusted to 150 DEG C ~ 180 DEG C, wind-force I level aims at around EMMC and blow, using instrument to be removed by the glue around EMMC simultaneously.Particularly, instrument is tweezers.If in this step, air pressure gun without playing glue process, then, when getting EMMC, being adjusted to 260 DEG C ~ 280 DEG C, wind-force I level blows around EMMC, directly being taken off by EMMC simultaneously by mainboard.
Particularly, before carrying out treatment step, the solder joint of the EMMC taken off is tied, and clean and operation of removing photoresist are carried out to it.Only has the process EMMC process of taking off totally just being convenient to postorder.
In treatment step, concrete process operation utilizes EMMC Reading and writing instrument again read and write the EMMC taken off and process.Because EMMC is totally processed before this, like this, it can be made fully to contact with EMMC Reading and writing instrument in treatment step, thus guarantee that read-write is accurate with process.
Above-mentionedly plant in tin step, the welding of new EMMC with take off employing normal flow.Particularly, when welding, the former solder joint on mainboard is tied, and clean, and coating rosin cream positions, and utilizes air pressure gun to carry out blowing weldering.When taking off new EMMC, also rosin cream need be applied on pad.It should be noted that, if during welding, employing be new mainboard, then do not need butt welding point to tie, directly new EMMC positions by coating rosin cream, and utilizes air pressure gun to carry out blowing welding.
These are only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (8)
1. a verification method of EMMC, comprises the following steps:
Get sheet step: may take off from mainboard by in-problem EMMC;
Treatment step: by the EMMC process of taking off;
Verification step: the EMMC after process is welded on mainboard again and verifies;
It is characterized in that, when getting in sheet step, after EMMC takes off, when solder joint is not good on mainboard, also comprising
Plant tin step: be welded on mainboard by new EMMC, then this new EMMC is taken off, and the tin ball of new EMMC is retained on mainboard;
In above-mentioned verification step, utilize the tin ball be retained on mainboard that the EMMC after process is welded and fixed and is verified.
2. the verification method of EMMC as claimed in claim 1, it is characterized in that, if the mainboard got in sheet step is through playing glue process, then planting in tin step, being welded in by new EMMC does not beat on another new mainboard of glue, new mainboard and former mainboard are same model, and the EMMC in verification step after process is welded in this and does not beat on the new mainboard of glue.
3. the verification method of EMMC as claimed in claim 1, it is characterized in that, if the mainboard got in sheet step is through playing glue process, then when getting EMMC, air pressure gun is adjusted to 150 DEG C ~ 180 DEG C, wind-force I level aims at around EMMC and blow, use instrument by the glue removing around EMMC simultaneously.
4. the verification method of EMMC as claimed in claim 1, is characterized in that, if the mainboard got in sheet step is without playing glue process, then when getting EMMC, air pressure gun being adjusted to 260 DEG C ~ 280 DEG C, wind-force I level blows around EMMC, being taken off by EMMC simultaneously.
5. the verification method of EMMC as claimed in claim 1, is characterized in that, before described treatment step, tied by the solder joint of the EMMC taken off, and carries out clean and operation of removing photoresist to it.
6. the verification method of EMMC as claimed in claim 1, it is characterized in that, in described treatment step, the EMMC taken off is processed by EMMC Reading and writing instrument.
7. the verification method of EMMC as claimed in claim 1, is characterized in that, planting in tin step, when new EMMC welds, is tied by the former solder joint on mainboard, and clean, and coating rosin cream positions, and utilizes air pressure gun to carry out blowing weldering.
8. the verification method of EMMC as claimed in claim 1, is characterized in that, planting in tin step, when new EMMC takes off, pad is applying rosin cream.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510121328.3A CN104754877B (en) | 2015-03-19 | 2015-03-19 | A kind of EMMC verification method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510121328.3A CN104754877B (en) | 2015-03-19 | 2015-03-19 | A kind of EMMC verification method |
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| Publication Number | Publication Date |
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| CN104754877A true CN104754877A (en) | 2015-07-01 |
| CN104754877B CN104754877B (en) | 2017-12-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510121328.3A Expired - Fee Related CN104754877B (en) | 2015-03-19 | 2015-03-19 | A kind of EMMC verification method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105390163A (en) * | 2015-12-15 | 2016-03-09 | 深圳佰维存储科技有限公司 | Emmc testing device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202042477U (en) * | 2010-10-20 | 2011-11-16 | 无敌科技(西安)有限公司 | IC packaging device |
| CN102686044A (en) * | 2012-05-14 | 2012-09-19 | 江苏中科梦兰电子科技有限公司 | Method for removing residual solder tin from soldering-pan during repair and replacement of ball grid array (BGA) chip |
| WO2014026477A1 (en) * | 2012-08-14 | 2014-02-20 | 无锡中科龙泽信息科技有限公司 | Secure digital card device |
| CN104302100A (en) * | 2013-07-18 | 2015-01-21 | 群联电子股份有限公司 | Welding pad structure, printed circuit board employing welding pad structure, and memory storage device |
-
2015
- 2015-03-19 CN CN201510121328.3A patent/CN104754877B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202042477U (en) * | 2010-10-20 | 2011-11-16 | 无敌科技(西安)有限公司 | IC packaging device |
| CN102686044A (en) * | 2012-05-14 | 2012-09-19 | 江苏中科梦兰电子科技有限公司 | Method for removing residual solder tin from soldering-pan during repair and replacement of ball grid array (BGA) chip |
| WO2014026477A1 (en) * | 2012-08-14 | 2014-02-20 | 无锡中科龙泽信息科技有限公司 | Secure digital card device |
| CN104302100A (en) * | 2013-07-18 | 2015-01-21 | 群联电子股份有限公司 | Welding pad structure, printed circuit board employing welding pad structure, and memory storage device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105390163A (en) * | 2015-12-15 | 2016-03-09 | 深圳佰维存储科技有限公司 | Emmc testing device |
| CN105390163B (en) * | 2015-12-15 | 2018-05-08 | 深圳佰维存储科技股份有限公司 | EMMC test devices |
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| CN104754877B (en) | 2017-12-12 |
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Granted publication date: 20171212 |