CN104754877B - A kind of EMMC verification method - Google Patents
A kind of EMMC verification method Download PDFInfo
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- CN104754877B CN104754877B CN201510121328.3A CN201510121328A CN104754877B CN 104754877 B CN104754877 B CN 104754877B CN 201510121328 A CN201510121328 A CN 201510121328A CN 104754877 B CN104754877 B CN 104754877B
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- emmc
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- tin
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Abstract
The present invention relates to encapsulation technology field, there is provided a kind of EMMC verification method, comprises the following steps：Take piece step；Processing step；Verification step；When taking in piece step, after EMMC is removed, when solder joint is bad on mainboard, in addition to tin step is planted：New EMMC is welded on mainboard, then removed this new EMMC, and new EMMC tin ball is retained on mainboard；In above-mentioned verification step, the EMMC after processing is welded and fixed and verified using the tin ball being retained on mainboard.In the present invention, by in being welded on mainboard and remove new EMMC, the EMMC welding after processing is verified using new EMMC tin ball, in this way, plants tin efficiency high, greatly facilitate the welding of the EMMC after processing, it is time saving and energy saving, and the new EMMC being removed can be repaired slowly again in free time, may continue to use, both it will not cause to waste, save the time again.
Description
Technical field
The present invention relates to encapsulation technology field, is to be related to a kind of EMMC verification method more specifically.
Background technology
In R ＆ D of complex, when development department peopleware judges that EMMC is problematic, hardware technology personnel coordinate will
EMMC is removed, and EMMC is read out and handled using the read-write software of EMMC manufacturers, EMMC then is welded in into electricity again
Verify whether there is a problem on the plate of road.Hardware technology personnel are removed EMMC using air pressure gun, and using flatiron by circuit board
The solder joint cleaning left is clean；When welding again, the EMMC alignment steel meshes after processing are put on fixture, tin cream is coated, utilizes
Air pressure gun blows weldering, and EMMC is taken out after cooling in welding mainboard checking.When carrying out above-mentioned checking, the step for coating tin cream is pair
EMMC carries out plant tin, because original tin is cleaned out when removing EMMC, therefore needs to plant tin again.But this coat
The plant tin method of tin cream, difficulty is big, and technical requirements are high, and company of easily causing welds, and success rate is not high, and spot size differ, it is necessary to
Time is grown, and so, hardware operation efficiency is low, does not catch up with the job schedule of peopleware, is affected to production.
The content of the invention
It is an object of the invention to provide a kind of EMMC verification method, it is intended to which solution is tested EMMC in the prior art
The problem of tin is difficult, and efficiency is low is planted during card.
In order to solve the above technical problems, the technical scheme is that：A kind of EMMC verification method is provided, including it is following
Step：
Take piece step：Will likely EMMC of problems removed from mainboard；
Processing step：The EMMC processing that will be removed；
Verification step：EMMC after processing is welded on mainboard again and verified；
When taking in piece step, after EMMC is removed, when solder joint is bad on mainboard, in addition to
Plant tin step：New EMMC is welded on mainboard, then removed this new EMMC, and by new EMMC tin
Ball is retained on mainboard；
In above-mentioned verification step, the EMMC after processing is welded and fixed and tested using the tin ball being retained on mainboard
Card.
Specifically, if taking the mainboard in piece step to have been subjected to gluing processing, in tin step is planted, new EMMC is welded
In on another new mainboard of non-gluing, new mainboard and former mainboard are same model, the EMMC after being handled in verification step
It is welded on the new mainboard of this non-gluing.
Specifically, if taking the mainboard in piece step to have been subjected to gluing processing, when taking EMMC, air pressure gun is adjusted to 150 DEG C
~180 DEG C, wind-force I levels alignment EMMC around be blowed, while using instrument by around EMMC glue remove.
Specifically, if taking the mainboard in piece step to be handled without gluing, when taking EMMC, air pressure gun is adjusted to 260 DEG C
~280 DEG C, wind-force I levels remove EMMC to being blowed around EMMC.
Specifically, before the processing step, the EMMC removed solder joint is tied, and the behaviour that cleaned and removed photoresist to it
Make.
Specifically, in the processing step, the EMMC removed is handled by EMMC Reading and writing instruments.
Specifically, in tin step is planted, when new EMMC is welded, the former solder joint on mainboard is tied, and cleaned, coating pine
Balm is positioned, and carries out using air pressure gun blowing weldering.
Specifically, in tin step is planted, when new EMMC is removed, rosin cream is coated on pad.
In the present invention, by welding a new EMMC on mainboard, then new EMMC being removed again, using new
EMMC tin ball is verified the EMMC welding after processing, in this way, tin efficiency high is planted, after greatly facilitating processing
EMMC welding, it is time saving and energy saving, and the new EMMC being removed can be repaired slowly again in free time, may continue to make
With so, will not both causing to waste, and saved the time, hardware handles in R＆D process and software processing can be made more preferable
Cooperation.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, with reference to embodiments to the present invention
It is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, it is not used to
Limit the present invention.
It should be noted that when element is referred to as " being fixed on " or " being arranged at " another element, it can be directly another
On one element or it may be simultaneously present centering elements.When an element is referred to as " being connected to " another element, it can be with
It is directly to another element or may be simultaneously present centering elements.
It should also be noted that, the orientation term such as left and right, upper and lower in the present embodiment, be only each other relative concept or
Using the normal operating condition of product as reference, and should not be regarded as restrictive.
The embodiments of the invention provide a kind of EMMC verification method, asked mainly for there may be in R ＆ D of complex
The EMMC of topic is verified, to find the problem of EMMC exists in use, so as to contribute to manufacturer to EMMC energy
Preferably improve.
This EMMC provided in an embodiment of the present invention verification method, comprises the following steps：
Take piece step：Will likely EMMC of problems removed from mainboard；
Processing step：The EMMC processing that will be removed；
Verification step：EMMC after processing is welded on mainboard again and verified；
Also include planting tin step：New EMMC is welded on mainboard, then removed this new EMMC, and will be new
EMMC tin ball is retained on mainboard；
In above-mentioned verification step, the EMMC after processing is welded and fixed and tested using the tin ball being retained on mainboard
Card.
In the present embodiment, in piece step is taken, after removing EMMC, generally the pad on mainboard can be destroyed, and be deposited
Pad in the situation of even weldering, mainboard can not reuse, as such, it is desirable to which the pad on mainboard is cleaned out, then enter again
The above-mentioned plant tin step of row., can also be it should be noted that above-mentioned plant tin step, can be carried out with processing step simultaneously
Before processing step, or after the treatment step, as long as ensuring to plant tin step before verification step after taking piece step i.e.
Can.
In the embodiment of the present invention, by welding a new EMMC on mainboard, then again removing new EMMC, utilize
New EMMC tin ball is verified the EMMC welding after processing, in this way, is planted tin efficiency high, is greatly facilitated place
The welding of EMMC after reason, it is time saving and energy saving, and the new EMMC being removed can be repaired slowly again in free time, still can be after
It is continuous to use, so, it will not both cause to waste, and the time has been saved, hardware handles and software processing in R＆D process can be made
Preferably coordinate.
Specifically, if the mainboard in piece step is taken has been subjected to gluing processing, in tin step is planted, new EMMC is welded
It is connected on another new mainboard of non-gluing, new mainboard must be same model with the former mainboard of gluing, in verification step
EMMC after middle processing is welded on the new mainboard of this non-gluing.Because mainboard is handled once passing through gluing, to air pressure gun
Under the influence of temperature the result can be impacted, if therefore former mainboard by gluing handle, checking when need to using without
The new mainboard of gluing is verified.
Specifically, if taking the mainboard in piece step to have been subjected to gluing processing, when taking problematic EMMC, air pressure gun is adjusted
It is blowed around to 150 DEG C~180 DEG C, wind-force I levels alignment EMMC, while is removed the glue around EMMC using instrument.Tool
Body, instrument is tweezers.If in this step, mainboard is handled without gluing, then when taking EMMC, by air pressure gun be adjusted to 260 DEG C~
280 DEG C, wind-force I levels directly remove to being blowed around EMMC, while by EMMC.
Specifically, before processing step is carried out, the EMMC removed solder joint is tied, and the behaviour that cleaned and removed photoresist to it
Make.Only by the clean processing for being just easy to postorder of the EMMC removed processing.
In processing step, specific processing operation is that the EMMC removed is read and write again using EMMC Reading and writing instruments
With processing.Because EMMC is processed clean before this, so, it can be made fully to be contacted with EMMC Reading and writing instruments in processing step,
So that it is guaranteed that read-write is accurate with handling.
In above-mentioned plant tin step, new EMMC welding is with removing using normal flow.Specifically, in welding, by master
Former solder joint on plate is tied, and is cleaned, and coating rosin cream is positioned, and carries out using air pressure gun blowing weldering.Removing new EMMC
When, rosin cream need to be also coated on pad.If it should be noted that during welding, using new mainboard, then butt welding is not needed
Point is tied, and is directly coated rosin cream and is positioned new EMMC, and carries out using air pressure gun blowing weldering.
These are only presently preferred embodiments of the present invention, be not intended to limit the invention, it is all the present invention spirit and
All any modification, equivalent and improvement made within principle etc., should be included in the scope of the protection.
Claims (7)
1. a kind of EMMC verification method, comprises the following steps：
Take piece step：Will likely EMMC of problems removed from mainboard；
Processing step：The EMMC processing that will be removed；
Verification step：EMMC after processing is welded on mainboard again and verified；
Taken characterized in that, working as in piece step, after EMMC is removed, when solder joint is bad on mainboard, in addition to
Plant tin step：New EMMC is welded on mainboard, then removed this new EMMC, and new EMMC tin ball is protected
Stay on mainboard；
If taking the mainboard in piece step to have been subjected to gluing processing, in tin step is planted, new EMMC is welded in non-gluing
On another new mainboard, new mainboard and former mainboard are same model, and the EMMC after being handled in verification step is welded in this not
On the new mainboard of gluing；
In above-mentioned verification step, the EMMC after processing is welded and fixed and verified using the tin ball being retained on mainboard.
2. EMMC as claimed in claim 1 verification method, it is characterised in that if taking the mainboard in piece step to have been subjected to gluing
Processing, then when taking EMMC, by air pressure gun be adjusted to 150 DEG C~180 DEG C, wind-force I levels alignment EMMC around be blowed, use simultaneously
Instrument removes the glue around EMMC.
3. EMMC as claimed in claim 1 verification method, it is characterised in that if taking the mainboard in piece step without gluing
Processing, then when taking EMMC, by air pressure gun be adjusted to 260 DEG C~280 DEG C, wind-force I levels to being blowed around EMMC, while by EMMC
Remove.
4. EMMC as claimed in claim 1 verification method, it is characterised in that before the processing step, by what is removed
EMMC solder joint is tied, and operation of being cleaned and removed photoresist to it.
5. EMMC as claimed in claim 1 verification method, it is characterised in that in the processing step, the EMMC removed leads to
EMMC Reading and writing instruments are crossed to be handled.
6. EMMC as claimed in claim 1 verification method, it is characterised in that in tin step is planted, when new EMMC is welded,
Former solder joint on mainboard is tied, and cleaned, coating rosin cream is positioned, and carries out using air pressure gun blowing weldering.
7. EMMC as claimed in claim 1 verification method, it is characterised in that in tin step is planted, when new EMMC is removed,
Rosin cream is coated on pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510121328.3A CN104754877B (en) | 2015-03-19 | 2015-03-19 | A kind of EMMC verification method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510121328.3A CN104754877B (en) | 2015-03-19 | 2015-03-19 | A kind of EMMC verification method |
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| Publication Number | Publication Date |
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| CN104754877A CN104754877A (en) | 2015-07-01 |
| CN104754877B true CN104754877B (en) | 2017-12-12 |
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| CN201510121328.3A Expired - Fee Related CN104754877B (en) | 2015-03-19 | 2015-03-19 | A kind of EMMC verification method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105390163B (en) * | 2015-12-15 | 2018-05-08 | 深圳佰维存储科技股份有限公司 | EMMC test devices |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202042477U (en) * | 2010-10-20 | 2011-11-16 | 无敌科技(西安)有限公司 | IC packaging device |
| CN102686044A (en) * | 2012-05-14 | 2012-09-19 | 江苏中科梦兰电子科技有限公司 | Method for removing residual solder tin from soldering-pan during repair and replacement of ball grid array (BGA) chip |
| CN104302100A (en) * | 2013-07-18 | 2015-01-21 | 群联电子股份有限公司 | Welding pad structure, printed circuit board employing welding pad structure, and memory storage device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202758381U (en) * | 2012-08-14 | 2013-02-27 | 无锡中科龙泽信息科技有限公司 | Secure digital card device |
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2015
- 2015-03-19 CN CN201510121328.3A patent/CN104754877B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202042477U (en) * | 2010-10-20 | 2011-11-16 | 无敌科技(西安)有限公司 | IC packaging device |
| CN102686044A (en) * | 2012-05-14 | 2012-09-19 | 江苏中科梦兰电子科技有限公司 | Method for removing residual solder tin from soldering-pan during repair and replacement of ball grid array (BGA) chip |
| CN104302100A (en) * | 2013-07-18 | 2015-01-21 | 群联电子股份有限公司 | Welding pad structure, printed circuit board employing welding pad structure, and memory storage device |
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| CN104754877A (en) | 2015-07-01 |
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Granted publication date: 20171212 |