CN202013867U - Film chip device - Google Patents
Film chip device Download PDFInfo
- Publication number
- CN202013867U CN202013867U CN2011200811817U CN201120081181U CN202013867U CN 202013867 U CN202013867 U CN 202013867U CN 2011200811817 U CN2011200811817 U CN 2011200811817U CN 201120081181 U CN201120081181 U CN 201120081181U CN 202013867 U CN202013867 U CN 202013867U
- Authority
- CN
- China
- Prior art keywords
- contact interface
- thin film
- chip device
- film substrate
- card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
The utility model discloses a film chip device, comprising a film substrate and at least one chip, wherein the film substrate is prepared by transparent material and is provided with a first contact interface and a second contact interface, and the chip is attached to a side of the film substrate.
Description
Technical field
The utility model is about a kind of thin film chip device, and particularly, the utility model is a kind of thin film chip device with smart card of the single process specification size and the different specification size of can arranging in pairs or groups.
Background technology
According to prior art, the arrange in pairs or groups SIM card of a device for mobile communication of a kind of thin film chip device operates together.Shown in Figure 1A, the positive and negative surface of thin film chip device 1 has one first contact interface 3 and one second contact interface 4 respectively, and has a chip 5, this first contact interface 3 is used to be electrically connected the interior contact interface of draw-in groove of this device for mobile communication, and this second contact interface 4 is used to be electrically connected the contact interface of this SIM card.When thin film chip device 1 is pasted on a side of SIM card, the second contact interface 4 that makes thin film chip device 1 is electrically connected the contact interface of this SIM card, and the SIM card of sticking film chip apparatus 1 is when inserting in the draw-in groove of this device for mobile communication in the lump, the first contact interface 3 that makes thin film chip device 1 is electrically connected the contact interface in the draw-in groove of these device for mobile communication.
Because existing SIM card has two kinds of specifications of mini card and micro card, but the contact interface on two kinds of specifications is identical.So, the thin film chip device 1 of collocation SIM card (figure does not show), 2 also distinguish on the process specification size just like the mini size shown in Figure 1A and two kinds of specifications of micro size shown in Figure 1B and produce, and two kinds of thin film chip devices 1,2 the first contact interface 3 is identical, wherein the first contact interface 3 is distinguished into eight electrodes, and Figure 1A and Figure 1B are at the electrode institute contact position of six roundlets that electrode indicated draw-in groove inner contact interface that is device for mobile communication.Therefore, it is complicated to cause the management of product item number to go up for the manufacturer of thin film chip device, and must produce the thin film chip device of mini size and micro size with two cover processes.The SIM card that the utility model can provide a kind of thin film chip device with single process specification size can arrange in pairs or groups mini size and micro size will help to reduce the cost of manufacturer and be convenient to the management of product item number.
In addition, continue to consult shown in Figure 1A and Figure 1B, when the thin film chip device of same size size and SIM card are fitted each other, the contraposition easily owing to edge unanimity between both sizes is so each electrode of the first contact interface of thin film chip device can be distinguished each electrode of the contact interface of accurately aiming at this SIM card.Though the micro size is less than mini size and both thin film chip devices 1,2 contact interface 3 is identical, so the thin film chip device 2 of less micro size can be pasted on the SIM card (figure does not show) of big mini size, but since around the contact interface 3 of micro size the substrate edges distance less than substrate edges distance around the contact interface of mini size, therefore when the thin film chip device 2 of less micro size being pasted on the SIM card of big mini size, the substrate edges distance is inconsistent between both sizes will cause the contraposition problem.
The reason that causes the contraposition problem is that the thin film chip device 2 of micro size is when affixing to the SIM card of mini size, the micro size of thin film chip device 2 can cover the contact interface of SIM card fully, and is difficult for each electrode of the first contact interface 3 is accurately aimed at respectively each electrode of the contact interface of this SIM card.When the thin film chip device 2 of contraposition deviation is pasted on the SIM card of mini size and inserts in the draw-in groove of this device for mobile communication, the electrode that each electrode of this draw-in groove inner contact interface can't accurately be connected to the first contact interface 3 among Figure 1B indicates the roundlet position, and have position deviation may cause the electric pole short circuit of the contact interface of SIM card slightly, even make the electrode of the first contact interface correspond to the electrode of wrong SIM card or the electrode in the draw-in groove.Therefore, the SIM card that the thin film chip device of the size of micro shown in Figure 1B is directly applied for the mini size will cause the difficulty on the paste operation.
The utility model content
The purpose of this utility model is to provide a kind of thin film chip device with single process specification size, the smart card of the different specification size of can arranging in pairs or groups.
Another purpose of the present utility model is to provide a kind of thin film chip device of the micro of having specification, accurately is pasted on to contraposition the smart card with mini specification.
For reaching above-mentioned purpose, the utility model provides a kind of thin film chip device, comprising: a film substrate has one first contact interface and one second contact interface; And at least one chip, being attached to a side of this film substrate, this film substrate is made by transparent material.
For reaching above-mentioned purpose, the utility model provides a kind of thin film chip device, comprising: a film substrate has one first contact interface and one second contact interface; And at least one chip, be attached to a side of this film substrate, this film substrate roughly has and meets one second specification, and this film substrate has an extension, this extension is suitable for when this film substrate is pasted on the card with a contact interface, this extension edge aligns with this card-edge, makes the second contact interface of this film substrate aim at the contact interface of this card.
For reaching above-mentioned purpose, the utility model provides a kind of thin film chip device, comprising: a film substrate has one first contact interface and one second contact interface; And at least one chip, be attached to a side of this film substrate, this film substrate has and meets one second specification, this film substrate affixes to a card with a contact interface by a mould, make the second contact interface of this film substrate be electrically connected to the contact interface of this card, wherein this mould and this jig have and meet one first specification, and this mould has the opening that meets this second specification, and this opening is positioned at the position of this mould with respect to the contact interface of this card.
According to the thin film chip device that the utility model is implemented, can produce the smart card that is applicable to different specification size by single process specification size, for example: the SIM card of mini size and micro size.In addition, when the utility model also solved the thin film chip device with less specification and is pasted on the smart card with big specification, the contact electrode of thin film chip device can be distinguished the contact electrode of accurately aiming at this smart card.After consulting following detailed execution mode and relevant accompanying drawing and claim, the person of readding will more can understand the utility model other purpose, feature, reach advantage.
Description of drawings
Consult follow-up accompanying drawing and can more understand system and method for the present utility model with description.Not detailed row and non-restrictive example then please refer to the description of this subsequent drawings in the literary composition.Element in the accompanying drawing might not meet ratio, but depicts principle of the present utility model in the mode of emphasizing.In the accompanying drawings, components identical is the part that marks identical correspondence in different accompanying drawings.
Figure 1A is existing two sides figure with thin film chip device of mini size.
Figure 1B is existing two sides figure with thin film chip device of micro size.
Fig. 2 A is the stereogram of a kind of embodiment thin film chip device of the present utility model and smart card.
Fig. 2 B is pasted on a side view of smart card for Fig. 2 A thin film chip device.
Fig. 3 A is the stereogram of another kind of embodiment thin film chip device of the present utility model and smart card.
Fig. 3 B is pasted on a side view of smart card for Fig. 3 A thin film chip device.
Fig. 4 A is the stereogram of another kind of embodiment thin film chip device of the present utility model and smart card.
Fig. 4 B is pasted on a side view of smart card for Fig. 4 A thin film chip device.
Fig. 5 A is the stereogram of another kind of embodiment thin film chip device of the present utility model and smart card.
Fig. 5 B is pasted on a side view of smart card for Fig. 5 A thin film chip device.
Fig. 6 A is the stereogram of another kind of embodiment thin film chip device of the present utility model and smart card.
Fig. 6 B is pasted on a side view of smart card for Fig. 6 A thin film chip device.
Fig. 7 A is the stereogram of another kind of embodiment thin film chip device of the present utility model, mould and smart card.
Fig. 7 B is pasted on a side view of smart card by mould for Fig. 7 A thin film chip device.
Drawing reference numeral
1 thin film chip device
2 thin film chip devices
3 first contact interfaces
4 second contact interfaces 4
5 chips
20 thin film chip devices
21 film substrates
22 first contact interfaces
221 edges
30 thin film chip devices
31 film substrates
32 first contact interfaces
321 edges
40 thin film chip devices
41 film substrates
42 first contact interfaces
43 extensions
431 edges
50 thin film chip devices
51 film substrates
52 first contact interfaces
53 extensions
531 edges
60 thin film chip devices
61 film substrates
62 first contact interfaces
63 extensions
631 edges
70 film substrates
72 first contact interfaces
73 moulds
74 openings
The 8SIM card
81 edges
82 edges
83 edges
84 edges
85 edges
9 contact interfaces
91 edges
92 edges
Embodiment
Below will carry out the explanation of the utility model specific embodiment.Must notice that the embodiment that is disclosed only is to enumerate explanation.Category of the present utility model is not limited in it and discloses in the specific embodiment that comprises special characteristic, structure or character, but is defined by claim appended behind the literary composition.In addition, the accompanying drawing of institute's reference is not specifically depicted the unnecessary feature of all the utility model in the specification, and the element of being depicted may with simplify, the mode of signal express, all kinds of size of component may just being exaggerated or not met actual ratio for explanation in the accompanying drawing.Though above-mentioned simply why, or whether correlated characteristic has by detailed description, its all the description person of expectation institute be arranged in the knowledge category that association area those skilled in the art can implement together with other other specific embodiments relevant with these features, structure or character according to this.
Please refer to Fig. 2 A, is the stereogram that shows a kind of embodiment thin film chip device of the present utility model and smart card.Thin film chip device 20 comprises that a film substrate 21 and at least one chip (not accompanying drawing) are attached to a side of film substrate 21, wherein film substrate 21 has one first contact interface 22 and one second contact interface (not accompanying drawing), and film substrate 21 is made by transparent material.The first contact interface 22 has same size with this second contact interface, this first contact interface 22 is used to be electrically connected to the interior a plurality of electrodes of draw-in groove of a device for mobile communication, and this second contact interface is used to be electrically connected to a contact interface 9 of smart card 8 (for example, SIM card).
In the utility model one embodiment, film substrate 21 has and meets one second specification, for example meets the micro size of SIM card, and SIM card 8 has and meet one first specification, for example meets the mini size of SIM card.The first contact interface 22 meets ISO7816 with the contact interface 9 of smart card 8, and the contact interface 9 of the first contact interface 22 and smart card 8 corresponds to each other and distinguish 8 contact electrodes respectively, and the left bank electrode from top to bottom is C1, C2, C3, C4, right row's electrode from top to bottom is C5, C6, C7 and C8.This second contact interface (not accompanying drawing) comprises at least six electrodes, and these six electrodes are the contact electrode C1 of the corresponding first contact interface 22 respectively, C2, C3, C5, C6, C7.In another kind of embodiment of the present utility model, this first contact interface 22 meets ISO7816 and this first contact interface 22 is distinguished 6 contact electrodes, and the left bank electrode from top to bottom is C1, C2, and C3, right row's electrode from top to bottom is C5, C6, C7.
Simultaneously with reference to figure 2A and Fig. 2 B, because the first contact interface 22 of film substrate 21 is identical specifications with the contact interface 9 of smart card 8, and film substrate 21 is made by transparent material, therefore, when user's desire affixes to smart card 8 with thin film chip device 20, the user can be convenient to adjust the position of film substrate 21 and the edge 221 (that is edge of the second contact interface) of the first contact interface 22 be aimed at the contact interface 9 pairing edges 91 of smart card 8, to guarantee that so the electrode of the second contact interface is positioned at the counter electrode of contact interface 9, and the electrode of the second contact interface also will be positioned at the abutment position that the draw-in groove electrode is resisted against the first contact interface 22 exactly.
With reference to figure 3A, be the stereogram that shows a kind of embodiment thin film chip device of the present utility model and smart card.Thin film chip device 30 comprises that a film substrate 31 and at least one chip (not accompanying drawing) are attached to a side of film substrate 31, wherein film substrate 31 has one first contact interface 32 and one second contact interface (not accompanying drawing), and film substrate 31 is made by transparent material.The first contact interface 32 has same size with this second contact interface, this first contact interface 32 is used to be electrically connected to the interior a plurality of electrodes of draw-in groove of a device for mobile communication, and this second contact interface is used to be electrically connected to a contact interface 9 of smart card 8 (for example, SIM card).In the utility model one embodiment, film substrate 31 has and meets one second specification, for example meets the micro size of SIM card, and SIM card 8 has and meet one first specification, for example meets the mini size of SIM card.The first contact interface 32 meets ISO7816 with the contact interface 9 of smart card 8, and the contact interface 9 of the first contact interface 32 and smart card 8 corresponds to each other and distinguish 8 contact electrodes respectively, and the left bank electrode from top to bottom is C1, C2, C3, C4, right row's electrode from top to bottom is C5, C6, C7 and C8.This second contact interface (not accompanying drawing) comprises at least six electrodes, and these six electrodes are the contact electrode C1 of the corresponding first contact interface 32 respectively, C2, C3, C5, C6, C7.In another kind of embodiment of the present utility model, this first contact interface 32 meets ISO7816 and this first contact interface 32 is distinguished 6 contact electrodes, and the left bank electrode from top to bottom is C1, C2, and C3, right row's electrode from top to bottom is C5, C6, C7.
Simultaneously with reference to figure 3A and Fig. 3 B, the size of the first contact interface 32 of film substrate 31 is less than the size of the contact interface 9 of smart card 8, and film substrate 31 is made by transparent material, therefore, when user's desire affixes to smart card 8 with thin film chip device 30, the user can be convenient to adjust the position of film substrate 31 and the edge 321 (that is edge of the second contact interface) of the first contact interface 32 be aimed at the contact interface 9 pairing edges 92 of smart card 8, to guarantee that so the electrode of the second contact interface is positioned at the counter electrode of contact interface 9, and the electrode of the second contact interface also will be positioned at the abutment position that the draw-in groove electrode is resisted against the first contact interface 32 exactly.
Should be able to recognize, the described SIM card 8 of the utility model second figure and the 3rd figure is not limited to meet this first specification and can meets this second specification, and is convenient to the contact interface 9 that the user aims at the second contact interface SIM card 8 by the transparent material of film substrate 21,31.
Please refer to Fig. 4 A, is the stereogram that shows another kind of embodiment thin film chip device of the present utility model and smart card.Thin film chip device 40 comprises that a film substrate 41 and at least one chip (not accompanying drawing) are attached to a side of film substrate 41, and wherein film substrate 41 has one first contact interface 42 and one second contact interface (not accompanying drawing).Film substrate 41 comprises an extension 43, and the part of film substrate 41 except that extension 43 meet one second specification, for example meets the micro size of SIM card, and therefore, film substrate 41 roughly meets this second specification.The first contact interface 42 of film substrate 41 has same size with this second contact interface, this first contact interface 42 is used to be electrically connected to the interior a plurality of electrodes of draw-in groove of a device for mobile communication, and this second contact interface is used to be electrically connected to a contact interface 9 of smart card 8 (for example, SIM card).
In the utility model one embodiment, the first contact interface 42 meets ISO7816 with the contact interface 9 of smart card 8, and the contact interface 9 of the first contact interface 42 and smart card 8 corresponds to each other and distinguishes 8 contact electrodes respectively, the left bank electrode from top to bottom is C1, C2, C3, C4, right row's electrode from top to bottom is C5, C6, C7 and C8.This second contact interface (not accompanying drawing) comprises at least six electrodes, and these six electrodes are the contact electrode C1 of the corresponding first contact interface 42 respectively, C2, C3, C5, C6, C7.In another kind of embodiment of the present utility model, this first contact interface 42 meets ISO7816 and this first contact interface 42 is distinguished 6 contact electrodes, and the left bank electrode from top to bottom is C1, C2, and C3, right row's electrode from top to bottom is C5, C6, C7.
Simultaneously with reference to figure 4A and Fig. 4 B, SIM card 8 meets one first specification, the mini size that for example meets SIM card, and the extension 43 of film substrate 41 is to be designed to when the horizontal edge 81 of the horizontal edge 431 of extension 43 and vertical edge 432 and smart card 8 and vertical edge 82 align, and then the second contact interface of film substrate 41 is aimed at the contact interface 9 of SIM card 8.Therefore, when user's desire affixes to smart card 8 with thin film chip device 40, the user can be convenient to adjust the position of film substrate 41 and the horizontal edge 431 and the vertical edge 432 of extension 43 alignd with the horizontal edge 81 and the vertical edge 82 of smart card 8, to guarantee that so the electrode of the second contact interface is positioned at the counter electrode of contact interface 9, and the electrode of the second contact interface also will be positioned at the abutment position that the draw-in groove electrode is resisted against the first contact interface 42 exactly.
Please refer to Fig. 5 A, is the stereogram that shows another kind of embodiment thin film chip device of the present utility model and smart card.Thin film chip device 50 comprises that a film substrate 51 and at least one chip (not accompanying drawing) are attached to a side of film substrate 51, and wherein film substrate 51 has one first contact interface 52 and one second contact interface (not accompanying drawing).Film substrate 51 comprises an extension 53, and the part of film substrate 51 except that extension 53 meet one second specification, for example meets the micro size of SIM card, and therefore, film substrate 51 roughly meets this second specification.The first contact interface 52 of film substrate 51 has same size with this second contact interface, this first contact interface 52 is used to be electrically connected to the interior a plurality of electrodes of draw-in groove of a device for mobile communication, and this second contact interface is used to be electrically connected to a contact interface 9 of smart card 8 (for example, SIM card).
In the utility model one embodiment, the first contact interface 52 meets ISO7816 with the contact interface 9 of smart card 8, and the contact interface 9 of the first contact interface 52 and smart card 8 corresponds to each other and distinguishes 8 contact electrodes respectively, the left bank electrode from top to bottom is C1, C2, C3, C4, right row's electrode from top to bottom is C5, C6, C7 and C8.This second contact interface (not accompanying drawing) comprises at least six electrodes, and these six electrodes are the contact electrode C1 of the corresponding first contact interface 52 respectively, C2, C3, C5, C6, C7.In another kind of embodiment of the present utility model, this first contact interface 52 meets ISO7816 and this first contact interface 52 is distinguished 6 contact electrodes, and the left bank electrode from top to bottom is C1, C2, and C3, right row's electrode from top to bottom is C5, C6, C7.
Simultaneously with reference to figure 5A and Fig. 5 B, SIM card 8 meets one first specification, the mini size that for example meets SIM card, and the extension 53 of film substrate 51 is to be designed to when the edge (containing lead angle) 531,532 of extension 53 aligns with the edge (containing lead angle) 83,84 of smart card 8, and then the second contact interface of film substrate 51 is aimed at the contact interface 9 of SIM card 8.Therefore, when user's desire affixes to smart card 8 with thin film chip device 50, the user can be convenient to adjust film substrate 51 the position and with the edge (containing lead angle) 531,532 of extension 53 and the edge (containing lead angle) 83,84 of smart card 8, to guarantee that so the electrode of the second contact interface is positioned at the counter electrode of contact interface 9, and the electrode of the second contact interface also will be positioned at the abutment position that the draw-in groove electrode is resisted against the first contact interface 52 exactly.
Please refer to Fig. 6 A, is the stereogram that shows another kind of embodiment thin film chip device of the present utility model and smart card.Thin film chip device 60 comprises that a film substrate 61 and at least one chip (not accompanying drawing) are attached to a side of film substrate 61, and wherein film substrate 61 has one first contact interface 62 and one second contact interface (not accompanying drawing).Film substrate 61 comprises an extension 63, and the part of film substrate 61 except that extension 63 meet one second specification, for example meets the micro size of SIM card, and therefore, film substrate 61 roughly meets this second specification.The first contact interface 62 of film substrate 61 has same size with this second contact interface, this first contact interface 62 is used to be electrically connected to the interior a plurality of electrodes of draw-in groove of a device for mobile communication, and this second contact interface is used to be electrically connected to a contact interface 9 of smart card 8 (for example, SIM card).
In the utility model one embodiment, the first contact interface 62 meets ISO7816 with the contact interface 9 of smart card 8, and the contact interface 9 of the first contact interface 62 and smart card 8 corresponds to each other and distinguishes 8 contact electrodes respectively, the left bank electrode from top to bottom is C1, C2, C3, C4, right row's electrode from top to bottom is C5, C6, C7 and C8.This second contact interface (not accompanying drawing) comprises at least six electrodes, and these six electrodes are the contact electrode C1 of the corresponding first contact interface 62 respectively, C2, C3, C5, C6, C7.In another kind of embodiment of the present utility model, this first contact interface 62 meets ISO7816 and this first contact interface 62 is distinguished 6 contact electrodes, and the left bank electrode from top to bottom is C1, C2, and C3, right row's electrode from top to bottom is C5, C6, C7.
Simultaneously with reference to figure 6A and Fig. 6 B, SIM card 8 has a fool proof angle and meets one first specification, the mini size that for example meets SIM card, and the extension 63 of film substrate 61 is to be designed to when the edge 631 of extension 63 aligns with the fool proof corner edge 85 of smart card 8, and then the second contact interface of film substrate 61 is aimed at the contact interface 9 of SIM card 8.Therefore, when user's desire affixes to smart card 8 with thin film chip device 60, the user can be convenient to adjust the position of film substrate 61 and the edge 631 of extension 63 is alignd with the fool proof corner edge 85 of smart card 8, to guarantee that so the electrode of the second contact interface is positioned at the counter electrode of contact interface 9, and the electrode of the second contact interface also will be positioned at the abutment position that the draw-in groove electrode is resisted against the first contact interface 62 exactly.
Please refer to Fig. 7 A, is the stereogram that shows a kind of embodiment thin film chip device of the present utility model and smart card.Thin film chip device 70 comprises that a film substrate 71 and at least one chip (not accompanying drawing) are attached to a side of film substrate 71, and wherein film substrate 71 has one first contact interface 72 and one second contact interface (not accompanying drawing).The first contact interface 72 has same size with this second contact interface, this first contact interface 72 is used to be electrically connected to the interior a plurality of electrodes of draw-in groove of a device for mobile communication, and this second contact interface is used to be electrically connected to a contact interface 9 of smart card 8 (for example, SIM card).
In the utility model one embodiment, film substrate 71 has and meets one second specification, for example meets the micro size of SIM card, and SIM card 8 has and meet one first specification, for example meets the mini size of SIM card.The first contact interface 72 meets ISO7816 with the contact interface 9 of smart card 8, and the contact interface 9 of the first contact interface 72 and smart card 8 corresponds to each other and distinguish 8 contact electrodes respectively, and the left bank electrode from top to bottom is C1, C2, C3, C4, right row's electrode from top to bottom is C5, C6, C7 and C8.This second contact interface (not accompanying drawing) comprises at least six electrodes, and these six electrodes are the contact electrode C1 of the corresponding first contact interface 72 respectively, C2, C3, C5, C6, C7.In another kind of embodiment of the present utility model, this first contact interface 72 meets ISO7816 and this first contact interface 72 is distinguished 6 contact electrodes, and the left bank electrode from top to bottom is C1, C2, and C3, right row's electrode from top to bottom is C5, C6, C7.
Simultaneously with reference to figure 7A and Fig. 7 B, film substrate 71 is to affix to SIM card 8 by a mould 73, and wherein this mould 73 has and meets first specification, for example meet the mini size of SIM card, and this mould 73 has the opening 74 that meets first specification.This opening 74 is positioned at the position of this mould 73 with respect to the contact interface 9 of SIM card 8, and when this mould 73 placed the side of this card, this opening 74 exposed the contact interface 9 of SIM card 8.Therefore, when user's desire affixes to smart card 8 with thin film chip device 70, the user can insert film substrate 71 in this opening 74, to guarantee that so the electrode of the second contact interface is positioned at the counter electrode of contact interface 9, and the electrode of the second contact interface also will be positioned at the abutment position that the draw-in groove electrode is resisted against the first contact interface 72 exactly.
Category of the present utility model and spirit are not limited to aforesaid embodiment.In addition, accompanying drawing shown in the specification only is used to be tool but not draws in proportion.Some part in the accompanying drawing may be exaggerated to be emphasized, and other parts may be by simple.In view of the above, exposure of the present utility model and accompanying drawing reason is considered as describing and non-limiting matter, and will by claim limit.
Claims (17)
1. a thin film chip device is characterized in that, described thin film chip device comprises: a film substrate has one first contact interface and one second contact interface; And at least one chip, be attached to a side of described film substrate, wherein:
Described film substrate is made by transparent material.
2. thin film chip device as claimed in claim 1, it is characterized in that, described first contact interface and the described second contact interface have same size, the described first contact interface is used to be electrically connected to the interior a plurality of electrodes of draw-in groove of a device for mobile communication, and the described second contact interface is used to be electrically connected to a contact interface of a card.
3. thin film chip device as claimed in claim 2 is characterized in that, described film substrate and described jig have and meet one second specification, and are convenient to the contact interface that the described second contact interface is aimed at described card by the transparent material of described film substrate.
4. thin film chip device as claimed in claim 3 is characterized in that, the size of the described second contact interface is not more than the size of the contact interface of described card, makes the edge of the described second contact interface aim at the edge of the contact interface of described card.
5. thin film chip device as claimed in claim 2, it is characterized in that, described film substrate has and meets one second specification, and described jig has and meet one first specification, and is convenient to the contact interface that the described second contact interface is aimed at described card by the transparent material of described film substrate.
6. thin film chip device as claimed in claim 5 is characterized in that, the size of the described second contact interface is not more than the size of the contact interface of described card, makes the edge of the described second contact interface aim at the edge of the contact interface of described card.
7. a thin film chip device is characterized in that, described thin film chip device comprises: a film substrate has one first contact interface and one second contact interface; And at least one chip, be attached to a side of described film substrate, wherein:
Described film substrate roughly has and meets one second specification, and described film substrate has an extension, described extension is suitable for when described film substrate is pasted on the card with a contact interface, described extension edge aligns with described card-edge, makes the second contact interface of described film substrate aim at the contact interface of described card.
8. thin film chip device as claimed in claim 7 is characterized in that, described jig has and meets one first specification, and described first specification is greater than described second specification.
9. thin film chip device as claimed in claim 7, it is characterized in that, described first contact interface and the described second contact interface have same size, the described first contact interface is used to be electrically connected to the interior a plurality of electrodes of draw-in groove of a device for mobile communication, and the described second contact interface is used to be electrically connected to the contact interface of described card.
10. thin film chip device as claimed in claim 7 is characterized in that, described extension edge aligns with the vertical edge or the horizontal edge of described card.
11. thin film chip device as claimed in claim 7 is characterized in that, described extension edge aligns simultaneously with the vertical edge and the horizontal edge of described card.
12. thin film chip device as claimed in claim 7, it is characterized in that, described jig has a fool proof angle and meets one first specification, and described extension edge aligns with the fool proof corner edge of described card, makes the second contact interface of described film substrate aim at the contact interface of described card.
13., it is characterized in that the described first contact interface and the second contact interface meet ISO7816 as claim 1 or 7 described thin film chip devices.
14. a thin film chip device is characterized in that, described thin film chip device comprises: a film substrate has one first contact interface and one second contact interface; And at least one chip, be attached to a side of described film substrate, wherein:
Described film substrate has and meets one second specification, described film substrate affixes to a card with a contact interface by a mould, make the second contact interface of described film substrate be electrically connected to the contact interface of described card, wherein said mould and described jig have and meet one first specification, and described mould has the opening that meets described second specification, and described opening is positioned at the position of described mould with respect to the contact interface of described card.
15. thin film chip device as claimed in claim 14 is characterized in that, described first contact interface and the described second contact interface have same size, and the described first contact interface is used to be electrically connected to the interior a plurality of electrodes of draw-in groove of a device for mobile communication.
16. thin film chip device as claimed in claim 14 is characterized in that, the described first contact interface and the second contact interface meet ISO7816.
17. thin film chip device as claimed in claim 14, it is characterized in that, when described mould placed the side of described card, described opening exposed described contact interface, affixed to described card and made the described second contact interface be electrically connected the contact interface of described card and be convenient to described film substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200811817U CN202013867U (en) | 2011-03-24 | 2011-03-24 | Film chip device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200811817U CN202013867U (en) | 2011-03-24 | 2011-03-24 | Film chip device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202013867U true CN202013867U (en) | 2011-10-19 |
Family
ID=44784482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200811817U Expired - Fee Related CN202013867U (en) | 2011-03-24 | 2011-03-24 | Film chip device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202013867U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105654165A (en) * | 2014-12-04 | 2016-06-08 | 茂邦电子有限公司 | Chip card, bearing support plate of chip card and molding method of support plate |
-
2011
- 2011-03-24 CN CN2011200811817U patent/CN202013867U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105654165A (en) * | 2014-12-04 | 2016-06-08 | 茂邦电子有限公司 | Chip card, bearing support plate of chip card and molding method of support plate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204595373U (en) | FPC bends positioning fixture | |
| CN105404424B (en) | A kind of touch-control display module with fingerprint identification function | |
| CN203747183U (en) | Signal connector with improved type positioning sheets | |
| CN204547272U (en) | A kind of pyroelectricity ultra-thin chip film adhering jig | |
| CN207262354U (en) | A kind of shell structure of backlight source module, backlight source module and display device | |
| CN105868740A (en) | Fingerprint identification module and terminal | |
| CN203339442U (en) | Card tray structure | |
| CN105117053B (en) | The Improvement type joint tool of touch liquid crystal module | |
| CN202013867U (en) | Film chip device | |
| CN103935548B (en) | Screen protection layer erecting device and method | |
| CN105137631A (en) | Liquid crystal panel assembly and liquid crystal panel package assembly | |
| CN205313390U (en) | Sheet breaking -off device | |
| CN202443994U (en) | Solar energy back contact type battery pack packaging fixture | |
| CN103886356B (en) | The automatic production method of dual frequency active label card | |
| CN203301599U (en) | Lens seat glue-spilling-preventing structure | |
| CN202352954U (en) | Central processing unit (CPU) socket based structure for achieving detachability of field programmable gata array (FPGA) | |
| CN102789589B (en) | Intelligent dual-interface card and welding packaging process for intelligent dual-interface card | |
| CN106488694B (en) | Pasting method in a kind of electronic product groove | |
| CN204731795U (en) | A kind of fingerprint recognition module, fingerprint acquisition apparatus and electronic equipment | |
| CN202641013U (en) | A marking device | |
| CN202511773U (en) | Detecting device for IC (integrated circuit) card | |
| CN202003386U (en) | Film chip device | |
| CN207616023U (en) | A kind of CCD automatic identifications assembling device | |
| CN205705650U (en) | The automatic adhering device of cell rear cover diaphragm | |
| CN208367729U (en) | Smart card |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111019 Termination date: 20190324 |