CN202003386U - Film chip device - Google Patents

Abstract

The utility model relates to a film chip device. The device comprises a film substrate, at least one chip and release paper, wherein the film substrate is provided with a first contact interface and a second contact interface; the at least one chip is attached to one side of the film substrate; the release paper is attached to one side of the film substrate; the film substrate accords with a first specification size; and a cutting line which accords with a second specification size is marked on the other side of the release paper, which is opposite to the side attached to the film substrate, or is marked on the other side of the film substrate, which is opposite to the side attached with the release paper.

Description

The thin film chip device

Technical field

The utility model is about a kind of thin film chip device, and particularly, the utility model is the thin film chip device that has the smart card of the single process specification size and the different specification size of can arranging in pairs or groups about a kind of.

Background technology

According to prior art, a kind of SIM card of thin film chip device collocation one action communication device operates together.The positive and negative surface of this thin film chip device has one first contact interface and one second contact interface respectively, this first contact interface is used to be electrically connected the interior contact interface of draw-in groove of this action communication device, and this second contact interface is used to be electrically connected the contact interface of this SIM card.When this thin film chip device is pasted on a side of SIM card, the second contact interface that makes the thin film chip device is electrically connected the contact interface of this SIM card, and the SIM card of sticking film chip apparatus is when inserting in the draw-in groove of this action communication device in the lump, the first contact interface that makes the thin film chip device is electrically connected the contact interface in the draw-in groove of this action communication device.

Please refer to shown in Figure 1A and Figure 1B, because existing SIM card has two kinds of specifications of mini card and micro card, but the contact interface on two kinds of specifications is identical.So, the thin film chip device 1 of collocation SIM card (figure does not show), 2 also distinguish on the process specification size just like the mini size shown in Figure 1A and two kinds of specifications of micro size shown in Figure 1B and produce, and two kinds of thin film chip devices 1,2 the first contact interface 3 is identical, wherein the first contact interface 3 is distinguished into eight electrodes, and Figure 1A and Figure 1B are at the electrode institute contact position of six roundlets that electrode indicated draw-in groove inner contact interface that is mobile communication devices.Therefore, it is complicated to cause the management of product item number to go up for the manufacturer of thin film chip device, and must produce the thin film chip device of mini size and micro size with two cover processes.The SIM card that the utility model can provide a kind of thin film chip device with single process specification size can arrange in pairs or groups mini size and micro size will help to reduce the cost of manufacturer and be convenient to the management of product item number.

In addition, continue to consult shown in Figure 1A and Figure 1B, when the thin film chip device of same size size and SIM card are fitted each other, the contraposition easily owing to edge unanimity between both sizes is so each electrode of the first contact interface of thin film chip device can be distinguished each electrode of the contact interface of accurately aiming at this SIM card.Though the micro size is less than mini size and both thin film chip devices 1,2 contact interface 3 is identical, so the thin film chip device 2 of less micro size can be pasted on the SIM card (figure does not show) of big mini size, but since around the contact interface 3 of micro size the substrate edges distance less than substrate edges distance around the contact interface of mini size, therefore when the thin film chip device 2 of less micro size being pasted on the SIM card of big mini size, the substrate edges distance is inconsistent between both sizes will cause the contraposition problem.

The reason that causes the contraposition problem is that the thin film chip device 2 of micro size is when affixing to the SIM card of mini size, the micro size of thin film chip device 2 can cover the contact interface of SIM card fully, and is difficult for each electrode of the first contact interface 3 is accurately aimed at respectively each electrode of the contact interface of this SIM card.When the thin film chip device 2 of contraposition deviation is pasted on the SIM card of mini size and inserts in the draw-in groove of this action communication device, the electrode that each electrode of this draw-in groove inner contact interface can't accurately be connected to the first contact interface 3 among Figure 1B indicates the roundlet position, and have position deviation may cause the electric pole short circuit of the contact interface of SIM card slightly, even make the electrode of the first contact interface correspond to the electrode of wrong SIM card or the electrode in the draw-in groove.Therefore, the SIM card that the thin film chip device of the size of micro shown in Figure 1B is directly applied for the mini size will cause the difficulty on the paste operation.

The utility model content

The purpose of this utility model is to provide a kind of thin film chip device with single process specification size, the smart card of the different specification size of can arranging in pairs or groups.

Another purpose of the present utility model is to provide a kind of thin film chip device of the micro of having specification, accurately is pasted on to contraposition the smart card with mini specification.

Reach the thin film chip device of one of the utility model purpose, comprising: a film substrate has one first contact interface and one second contact interface; And at least one chip, being attached to a side of this film substrate, this film substrate has and meets one first specification, and the cutting line that meets one second specification is shown in a side of this film substrate.

Reach the thin film chip device of one of the utility model purpose, comprising: a film substrate has one first contact interface and one second contact interface; And at least one chip, be attached to a side of this film substrate, this thin film chip device comprises a strippable paper, be attached to a side of this film substrate, this film substrate has and meets one first specification, and the cutting line that meets one second specification is shown in this strippable paper with respect to the another side of adhering to this film substrate.

Reach the thin film chip device of one of the utility model purpose, comprising: a film substrate has one first contact interface and one second contact interface; And at least one chip, be attached to a side of this film substrate, this film substrate has and meets one first specification, and this thin film chip device is offered the slit with a profile, and this profile has to meet and comprises this first contact interface and this second contact interface in one second specification and this profile.

Reach the thin film chip device of one of the utility model purpose, comprising: a film substrate has one first contact interface and one second contact interface; And at least one chip, be attached to a side of this film substrate, this film substrate has and meets one second specification, and the second contact interface of this film substrate is used to be electrically connected to a contact interface of a card, this card meets one first specification, the edge of the first contact interface of this film substrate is provided with an aligning structure, and this aligning structure makes the second contact interface of this film substrate aim at the contact interface of this card.

Wherein, this aligning structure is at least one perforation that is positioned at the edge of the first contact interface, or for being positioned at least one breach of edge of this first contact interface, when making this film substrate be pasted on a side of this card, the edge that can expose the contact interface of this card in interior or this breach of this perforation.

According to the thin film chip device that the utility model is implemented, can produce the smart card that is applicable to different specification size by single process specification size, for example: the SIM card of mini size and micro size.In addition, when the utility model also solved the thin film chip device with less specification and is pasted on the smart card with big specification, the contact electrode of thin film chip device can be distinguished the contact electrode of accurately aiming at this smart card.

Description of drawings

Figure 1A is an existing outboard profile with thin film chip device of mini size.

Figure 1B is an existing outboard profile with thin film chip device of micro size.

Fig. 2 A is about a kind of embodiment of the present utility model, an outboard profile of thin film chip device.

Fig. 2 B is about a kind of embodiment of the present utility model, the another side figure of thin film chip device.

Fig. 3 A is about another kind of embodiment of the present utility model, an outboard profile of thin film chip device.

Fig. 3 B is about another kind of embodiment of the present utility model, the another side figure of thin film chip device.

Fig. 4 A is about a kind of embodiment of the present utility model, has an outboard profile of the thin film chip device of aligning structure.

Fig. 4 B is about a kind of embodiment of the present utility model, has the another side figure of the thin film chip device of aligning structure.

Fig. 5 A is Fig. 4 A and Fig. 4 B illustrated embodiment, the stereographic map of the utility model thin film chip device and smart card.

Fig. 5 B is Fig. 4 A and Fig. 4 B illustrated embodiment, and the utility model thin film chip device is pasted on an outboard profile of smart card.

Fig. 6 A is about another kind of embodiment of the present utility model, has an outboard profile of the thin film chip device of aligning structure.

Fig. 6 B is about another kind of embodiment of the present utility model, has the another side figure of the thin film chip device of aligning structure.

Fig. 6 C is about another embodiment of the present utility model, has an outboard profile of the thin film wafers device of aligning structure.

Fig. 7 A is Fig. 6 A and Fig. 6 B illustrated embodiment, the stereographic map of the utility model thin film chip device and smart card.

Fig. 7 B is Fig. 6 A and Fig. 6 B illustrated embodiment, and the utility model thin film chip device is pasted on an outboard profile of smart card.

Fig. 8 A is about another embodiment of the present utility model, has an outboard profile of the thin film chip device of antenna.

Fig. 8 B is about another embodiment of the present utility model, has the another side figure of the thin film chip device of antenna.

Fig. 9 is the outboard profile of thin film wafers device shown in Fig. 3 A further combined with the aligning structure shown in Fig. 4 A.

Figure 10 A is the outboard profile of thin film wafers device shown in Fig. 3 A further combined with the aligning structure shown in Fig. 4 A and Fig. 6 C.

Figure 10 B figure is the outboard profile that thin film wafers device shown in Figure 10 A is pasted on a smart card.

Drawing reference numeral

Thin film chip device 1,2

The first contact interface 3

Smart card 4

Contact interface 5

Thin film chip device 10,20,30

Film substrate 11,21,31

The first contact interface 111,211,311

The second contact interface 112,212,312

Strippable paper 12,22,32

Antenna substrate 33

Breach 121,221

Chip 13,23

Cutting line 14

Slit 15

Perforation 24

Breach 25,251,252

Embodiment

Please refer to Fig. 2 A and Fig. 2 B, show the both sides figure of a kind of embodiment thin film chip device 10 of the present utility model respectively.In a kind of embodiment of the present utility model, a kind of thin film chip device 10 comprises a film substrate 11, a strippable paper 12 and at least one chip 13, wherein this film substrate 11 has one first contact interface 111 and one second contact interface 112, wherein with reference to shown in the figure 2A, this first contact interface 111 is used to be electrically connected the interior contact interface (figure does not show) of draw-in groove of an action communication device, and with reference to shown in the figure 2B, this second contact interface 112 is used to be electrically connected the contact interface of a smart card.In addition, thin film chip device 10 further comprises a strippable paper 12, this strippable paper 12 can be dialled a liftoff side and this side that adheres to this film substrate 11 and be had adhered layer by the zone that strippable paper 12 covers, this chip 13 then setting is attached to the same side of this film substrate, shown in Fig. 2 B, this strippable paper 12 has a breach 121, and this breach 121 exposes the position that this chip 13 adheres to, and an adhered layer is not had on this chip 13 surface of exposing.But in another kind of embodiment of the present utility model, this strippable paper 12 and chip 13 are respectively in the opposite flank of this film substrate.The side that this film substrate has the second contact interface is to dial this strippable paper 12 of liftoff adhesion.

In a kind of embodiment of the present utility model, this film substrate 11 has and meets one first specification, for example the mini size of SIM card.This first contact interface 111 meets ISO7816 with the contact interface of the smart card of for example SIM card, and the contact interface of this first contact interface 111 and this card corresponds to each other and distinguishes 8 contact electrodes respectively, shown in Fig. 2 A, the left bank electrode from top to bottom is C1, C2, C3, C4, right row's electrode from top to bottom is C5, C6, C7 and C8.This second contact interface 112 comprises at least six electrodes, and these six electrodes are the contact electrode C1 of the corresponding first contact interface 111 respectively, C2, C3, C5, C6, C7.In another kind of embodiment of the present utility model, this first contact interface 111 meets ISO7816 and this first contact interface 111 is distinguished 6 contact electrodes, and the left bank electrode from top to bottom is C1, C2, and C3, right row's electrode from top to bottom is C5, C6, C7.

Please refer to shown in Fig. 2 B, it is a salient point that the electrode of the second contact interface 112 indicates the stain place, the roundlet of the contact electrode of the corresponding back side of this salient point first contact interface 111, and this roundlet is the draw-in groove inner contact electrode institute contact position of this action communication device.Therefore, according to embodiment of the present utility model, these film substrate 11 accurate contrapositions are pasted on the side of the smart card of SIM card for example and when inserting in this draw-in groove, draw-in groove inner contact electrode will accurately be connected to the roundlet of the contact electrode of the first contact interface 111, make acting force from draw-in groove inner contact electrode butt act on salient point on the electrode of the second contact interface 112 exactly, guarantee being electrically connected between the contact interface of the second contact interface 112 and smart card.If accurate contraposition between the contact interface of the first contact interface 111 and smart card, then both stickups are inserted in this draw-in groove, and draw-in groove inner contact electrode can't act on salient point on the electrode of the second contact interface 112 exactly.

Continue with reference to figure 2A and Fig. 2 B, this film substrate 11 has and meets one first specification, for example mini size.So film substrate shown in Fig. 2 A 11 is suitable for and is pasted on the smart card that meets this first specification, for example meets the SIM card of mini size.Be pasted on the smart card that meets one second specification for the ease of film substrate shown in Fig. 2 A 11 is suitable for, for example meet the SIM card of micro size, and second specification be less than first specification.Shown in Fig. 2 A a side of film substrate 11 or shown in Fig. 2 B a side of strippable paper 12 sign is had the cutting line 14 that meets this second specification, so Fig. 2 A processes promptly smart card applicable to different specification size with thin film chip device shown in Fig. 2 B 10 as long as cut material simply slightly, and is convenient to produce the arrange in pairs or groups smart card of different specification sizes of thin film chip device 10 with single process specification size.Chip 13 be corresponding be provided with to be attached to meet within this cutting line 14, and this chip 13 preferably is arranged at the centre of at least six electrodes of the second contact interface 112, wherein the side of these film substrate 11 sign cutting lines 14 is the sides with first contact interface 111, shown in Fig. 2 A, perhaps the side of these strippable paper 12 sign cutting lines 14 is the another sides that adhere to this film substrate 11, shown in Fig. 2 B.Therefore, in a kind of embodiment of the present utility model, when film substrate 11 desires that meet the mini size shown in Fig. 2 A are suitable for when being pasted on the SIM card that meets the micro size, the user can indicate the cutting line 14 that meets the micro size according to a side of side of this film substrate 11 or strippable paper 12 and cut out, then this film substrate 11 promptly meets the micro size, so, tear off this strippable paper 12 from the film substrate 11 of micro size after, this film substrate 11 just can adhere to the SIM card of micro size.

Please refer to Fig. 3 A and Fig. 3 B, show the two sides figure of a kind of embodiment thin film chip device 10 of the present utility model respectively.In a kind of embodiment of the present utility model, a kind of thin film chip device 10 comprises a film substrate 11 and at least one chip 13, wherein this film substrate 11 has one first contact interface 111 and one second contact interface 112, wherein with reference to shown in the figure 3A, this first contact interface 111 is used to be electrically connected the interior contact interface (figure does not show) of draw-in groove of an action communication device, and with reference to shown in the figure 3B, this second contact interface 112 is used to be electrically connected the contact interface of a smart card.

In a kind of embodiment of the present utility model, thin film chip device 10 further comprises a strippable paper 12, this strippable paper 12 can be dialled a liftoff side and this side that adheres to this film substrate 11 and be had adhered layer by the zone that strippable paper 12 covers, this chip 13 then setting is attached to the same side of this film substrate, shown in Fig. 3 B, this strippable paper 12 has a breach 121, and this breach 121 exposes the position that this chip 13 adheres to, and an adhered layer is not had on this chip 13 surface of exposing.But in another kind of embodiment of the present utility model, this strippable paper 12 and chip 13 are respectively in the opposite flank of this film substrate.And the side that this film substrate has the second contact interface is to dial this strippable paper 12 of liftoff adhesion.

In a kind of embodiment of the present utility model, this film substrate 11 has and meets one first specification, for example the mini size of SIM card.This first contact interface 111 meets ISO7816 with the contact interface of the smart card of for example SIM card, and the contact interface of this first contact interface 111 and this card corresponds to each other and distinguishes 8 contact electrodes respectively, as shown in Figure 3A, the left bank electrode from top to bottom is C1, C2, C3, C4, right row's electrode from top to bottom is C5, C6, C7 and C8.This second contact interface 112 comprises at least six electrodes, and these six electrodes are the contact electrode C1 of the corresponding first contact interface 111 respectively, C2, C3, C5, C6, C7.In another kind of embodiment of the present utility model, this first contact interface 111 meets ISO7816 and this first contact interface 111 is distinguished 6 contact electrodes, and the left bank electrode from top to bottom is C1, C2, and C3, right row's electrode from top to bottom is C5, C6, C7.

Please refer to shown in Fig. 3 B, it is a salient point that the electrode of the second contact interface 112 indicates the stain place, the roundlet of the contact electrode of the corresponding back side of this salient point first contact interface 111, and this roundlet is the draw-in groove inner contact electrode institute contact position of this action communication device.Therefore, according to embodiment of the present utility model, these film substrate 11 accurate contrapositions are pasted on the side of the smart card of SIM card for example and when inserting in this draw-in groove, draw-in groove inner contact electrode will accurately be connected to the roundlet of the contact electrode of the first contact interface 111, make acting force from draw-in groove inner contact electrode butt act on salient point on the electrode of the second contact interface 112 exactly, guarantee being electrically connected between the contact interface of the second contact interface 112 and smart card.If accurate contraposition between the contact interface of the first contact interface 111 and smart card, then both stickups are inserted in this draw-in groove, and draw-in groove inner contact electrode can't act on salient point on the electrode of the second contact interface 112 exactly.

Continue with reference to figure 3A and Fig. 3 B, this film substrate 11 has and meets one first specification, for example mini size.So film substrate shown in Fig. 3 A 11 is suitable for and is pasted on the smart card that meets this first specification, for example meets the SIM card of mini size.Be pasted on the smart card that meets one second specification for the ease of film substrate shown in Fig. 3 A 11 is suitable for, for example meet the SIM card of micro size, and second specification be less than first specification.The slit 15 that thin film chip device 10 will utilize Sheet Metal Forming Technology to offer to have a profile shown in Fig. 3 A and Fig. 3 B, this profile has and meets one second specification, the micro size that for example meets SIM card, and comprise this first contact interface 111 and this second contact interface 112 in this profile.So, thin film chip device shown in Fig. 3 A and Fig. 3 B 10 is as long as does slightly to dial from promptly applicable to the smart card of different specification size along slit 15 simply, and is convenient to produce the arrange in pairs or groups smart card of different specification sizes of thin film chip device 10 with single process specification size.Chip 13 is that corresponding the setting is attached in the slit 15 that meets this this profile, and this chip 13 preferably is arranged at the centre of at least six electrodes of the second contact interface 112.Therefore, in a kind of embodiment of the present utility model, when film substrate 11 desires that meet the mini size shown in Fig. 3 A are suitable for when being pasted on the SIM card that meets the micro size, the user can do to dial from going out this film substrate 11 along slit 15 simply slightly, then this film substrate 11 promptly meets the micro size, so, tear off this strippable paper 12 from the film substrate 11 of micro size after, this film substrate 11 just can adhere to the SIM card of micro size.

Please refer to Fig. 4 A and Fig. 4 B, show that respectively a kind of embodiment of the present utility model has the two sides figure of the thin film chip device 20 of aligning structure.In a kind of embodiment of the present utility model, a kind of thin film chip device 20 comprises a film substrate 21 and at least one chip 23, wherein this film substrate 21 has one first contact interface 211 and one second contact interface 212, wherein with reference to shown in the figure 4A, this first contact interface 211 is used to be electrically connected the interior contact interface (figure does not show) of draw-in groove of an action communication device, and with reference to shown in the figure 4B, this second contact interface 212 is used to be electrically connected the contact interface of a smart card.

In a kind of embodiment of the present utility model, thin film chip device 20 further comprises a strippable paper 22, this strippable paper 22 can be dialled a liftoff side and this side that adheres to this film substrate 21 and be had adhered layer by the zone that strippable paper 22 covers, this chip 23 then setting is attached to the same side of this film substrate, shown in Fig. 4 B, this strippable paper 22 has a breach 221, and this breach 221 exposes the position that this chip 23 adheres to, and an adhered layer is not had on this chip 23 surface of exposing.But in another kind of embodiment of the present utility model, this strippable paper 22 and chip 23 are respectively in the opposite flank of this film substrate.The side that this film substrate 21 has the second contact interface is to dial this strippable paper 22 of liftoff adhesion.

In a kind of embodiment of the present utility model, this film substrate 21 has and meets one second specification, for example the micro size of SIM card.This first contact interface 211 meets ISO7816 with the contact interface of the smart card of for example SIM card, and the contact interface of this first contact interface 211 and this card corresponds to each other and distinguishes 8 contact electrodes respectively, shown in Fig. 4 A, the left bank electrode from top to bottom is C1, C2, C3, C4, right row's electrode from top to bottom is C5, C6, C7 and C8.This second contact interface 212 comprises at least six electrodes, and these six electrodes are the contact electrode C1 of the corresponding first contact interface 211 respectively, C2, C3, C5, C6, C7.In another kind of embodiment of the present utility model, this first contact interface 211 meets ISO7816 and this first contact interface 211 is distinguished 6 contact electrodes, and the left bank electrode from top to bottom is C1, C2, and C3, right row's electrode from top to bottom is C5, C6, C7.

Please refer to shown in Fig. 4 B, it is a salient point that the electrode of the second contact interface 212 indicates the stain place, the roundlet of the contact electrode of the corresponding back side of this salient point first contact interface 211, and this roundlet is the draw-in groove inner contact electrode institute contact position of this action communication device.Therefore, according to embodiment of the present utility model, these film substrate 21 accurate contrapositions are pasted on the side of the smart card of SIM card for example and when inserting in this draw-in groove, draw-in groove inner contact electrode will accurately be connected to the roundlet of the contact electrode of the first contact interface 211, make acting force from draw-in groove inner contact electrode butt act on salient point on the electrode of the second contact interface 212 exactly, guarantee being electrically connected between the contact interface of the second contact interface 212 and smart card.If accurate contraposition between the contact interface of the first contact interface 211 and smart card, then both stickups are inserted in this draw-in groove, and draw-in groove inner contact electrode can't act on salient point on the electrode of the second contact interface 212 exactly.

Continue with reference to figure 4A and Fig. 4 B, this film substrate 21 has and meets one second specification, for example micro size.So film substrate shown in Fig. 4 A 21 is suitable for and is pasted on the smart card that meets this second specification, for example meets the SIM card of micro size.In addition, film substrate 21 shown in Fig. 4 A also can be considered from the thin film chip device 10 that has the mini size shown in Fig. 2 A or Fig. 3 A through cut out or along 15 groups of slits from after, can obtain to have shown in Fig. 4 A the film substrate 21 of micro size.In a kind of embodiment of the present utility model, second specification is less than first specification, and film substrate 21 shown in Fig. 4 A desires to be pasted on the smart card that meets first specification, when for example meeting the SIM card of mini size, this film substrate 21 will produce the contraposition problem and must solve on paste operation.In another kind of embodiment of the present utility model, after the film substrate 11 that obtains to have the micro size from thin film chip device 10 shown in Fig. 2 A or Fig. 3 A uses, when this film substrate 11 is wanted again to paste back the SIM card of mini size, this film substrate 11 will produce the contraposition problem equally and must solve on paste operation.

For the ease of being suitable for, the film substrate of the second less specification is pasted on the smart card that meets the first bigger specification, for example the film substrate of micro size is pasted on the SIM card of mini size, a kind of embodiment of the present utility model provides a kind of thin film chip device 20 of tool aligning structure.

Further specify, in a kind of embodiment of the present utility model, film substrate has and meets first or second specification, for example: mini size or micro size, represent that this film substrate has profile and the area near mini size or micro size, be not to refer on all four contour shape and area size,, and make film substrate in fact be considered as being not more than this mini size or micro size because the profile of film substrate or area can be subjected to the influence of aligning structure.

Thin film chip device 20 will utilize Sheet Metal Forming Technology to offer at least one perforation 24 at the ad-hoc location of film substrate 21 shown in Fig. 4 A and Fig. 4 B, and this perforation 24 will be as aligning structure.In a kind of embodiment of the present utility model, the size of this perforation 24 should be fit to penetrating by user's visual inspection perforation 24, but 24 the size of boring a hole should avoid influencing the electrode that electrode in the draw-in groove of mobile communication device contacts the first contact interface 211, and 24 the diameter of preferably boring a hole is no more than 2mm.In a kind of embodiment of the present utility model, ad-hoc location the best of perforation 24 is the edge that is positioned at the first contact interface 211, and 24 the bests of boring a hole are to contain the part of one or two electrode of this first contact interface 211 and the part of film substrate 21, and the position of perforation 24 all is fit to shown in Fig. 4 A.

In a kind of embodiment of the present utility model, the aligning structure of thin film chip device 20 is to comprise at least two perforation 24, and these two perforation 24 lay respectively at relative angle edge or place, opposite side edge or the level and the place, vertical side edge of the first contact interface 211.In a kind of embodiment of the present utility model, this first contact interface 211 meets ISO7816, and this first contact interface 211 is distinguished 8 contact electrodes, the left bank electrode from top to bottom is C1, C2, C3, C4, right row's electrode from top to bottom is C5, C6, C7 and C8, and the perforation 24 of aligning structure can be positioned at the corner edge place of electrode C1 or C4 or C5 or C8, or the edge between electrode C1 and C2, or the edge between electrode C2 and C3, or the edge between electrode C3 and C4, or the edge of 6 of electrode C5 and C, or the edge between electrode C6 and C7, or the edge between electrode C7 and C8.In another kind of embodiment of the present utility model, this first contact interface 211 meets ISO7816, and this first contact interface 211 is distinguished at least 6 contact electrode C1, C2, C3, C5, C6 and C7, and the perforation 24 of aligning structure can be positioned at the corner edge place of electrode C1 or C5, or the edge between electrode C1 and C2, or the edge between electrode C2 and C3, or the corner edge place of electrode C3, or the edge between electrode C5 and C6, or the edge between electrode C6 and C7, or the corner edge place of electrode C7.

Please refer to Fig. 5 A, displayed map 4A and Fig. 4 B illustrated embodiment, the stereographic map of the utility model thin film chip device and smart card.After thin film chip device 20 is torn strippable paper 22, the side that this film substrate 21 has adhered layer is the side that has contact interface 5 in the face of a smart card 4, make the contact interface 5 of the second contact interface, 212 these smart cards 4 of electrical connection of pasting rear film substrate 21, shown in Fig. 5 B.Please refer to Fig. 5 B, when the user carries out paste operation, perforation 24 on the film substrate 21 will be aimed at the contact interface 5 pairing edges of smart card 4, the user can penetrate these perforation 24 observations by naked eyes and see contact interface 5 pairing edges, because the first contact interface 211 of film substrate 21 is identical specifications with the contact interface 5 of smart card 4, therefore, the position that the user can be convenient to adjust film substrate 21 makes the edge of the first contact interface 211 aim at the edge of these 24 inner contact interfaces 5 of boring a hole, and make both edges connect being aligned, to guarantee that so the electrode of the second contact interface 212 is positioned at the counter electrode of contact interface 5, and the electrode of the second contact interface 212 also will be positioned at the abutment position that the draw-in groove electrode is resisted against the first contact interface 211 exactly.

Please refer to Fig. 6 A and Fig. 6 B, show that respectively another kind of embodiment of the present utility model has the two sides figure of the thin film chip device 20 of aligning structure.In a kind of embodiment of the present utility model, a kind of thin film chip device 20 comprises a film substrate 21 and at least one chip 23, wherein this film substrate 21 has one first contact interface 211 and one second contact interface 212, wherein with reference to shown in the figure 6A, this first contact interface 211 is used to be electrically connected the interior contact interface (figure does not show) of draw-in groove of an action communication device, and with reference to shown in the figure 6B, this second contact interface 212 is used to be electrically connected the contact interface of a smart card.

In a kind of embodiment of the present utility model, thin film chip device 20 further comprises a strippable paper 22, this strippable paper 22 can be dialled a liftoff side and this side that adheres to this film substrate 21 and be had adhered layer by the zone that strippable paper 22 covers, this chip 23 then setting is attached to the same side of this film substrate, shown in Fig. 6 B, this strippable paper 22 has a breach 221, and this breach 221 exposes the position that this chip 23 adheres to, and an adhered layer is not had on this chip 23 surface of exposing.But in another kind of embodiment of the present utility model, this strippable paper 22 and chip 23 are respectively in the opposite flank of this film substrate.The side that this film substrate 21 has the second contact interface is to dial this strippable paper 22 of liftoff adhesion.

In a kind of embodiment of the present utility model, this film substrate 21 has and meets one second specification, for example the micro size of SIM card.This first contact interface 211 meets ISO7816 with the contact interface of the smart card of for example SIM card, and the contact interface of this first contact interface 211 and this card corresponds to each other and distinguishes 8 contact electrodes respectively, the left bank electrode from top to bottom is C1, C2, C3, C4, right row's electrode from top to bottom is C5, C6, C7 and C8.This second contact interface 212 comprises at least six electrodes, and these six electrodes are the contact electrode C1 of the corresponding first contact interface 211 respectively, C2, C3, C5, C6, C7.In another kind of embodiment of the present utility model, this first contact interface 211 meets ISO7816 and this first contact interface 211 is distinguished 6 contact electrodes, and the left bank electrode from top to bottom is C1, C2, and C3, right row's electrode from top to bottom is C5, C6, C7.

Please refer to shown in Fig. 6 B, it is a salient point that the electrode of the second contact interface 212 indicates the stain place, the roundlet of the contact electrode of the corresponding back side of this salient point first contact interface 211, and this roundlet is the draw-in groove inner contact electrode institute contact position of this action communication device.Therefore, according to embodiment of the present utility model, these film substrate 21 accurate contrapositions are pasted on the side of the smart card of SIM card for example and when inserting in this draw-in groove, draw-in groove inner contact electrode will accurately be connected to the roundlet of the contact electrode of the first contact interface 211, make acting force from draw-in groove inner contact electrode butt act on salient point on the electrode of the second contact interface 212 exactly, guarantee being electrically connected between the contact interface of the second contact interface 212 and smart card.If accurate contraposition between the contact interface of the first contact interface 211 and smart card, then both stickups are inserted in this draw-in groove, and draw-in groove inner contact electrode can't act on salient point on the electrode of the second contact interface 212 exactly.

Continue with reference to figure 6A and Fig. 6 B, this film substrate 21 has and meets one second specification, for example micro size.So film substrate shown in Fig. 6 A 21 is suitable for and is pasted on the smart card that meets this second specification, for example meets the SIM card of micro size.In addition, film substrate 21 shown in Fig. 6 A also can be considered from the thin film chip device 10 that has the mini size shown in Fig. 2 A or Fig. 3 A through cut out or along 15 groups of slits from after, can obtain to have shown in Fig. 6 A the film substrate 21 of micro size.In a kind of embodiment of the present utility model, second specification is less than first specification, and film substrate 21 shown in Fig. 6 A desires to be pasted on the smart card that meets first specification, when for example meeting the SIM card of mini size, this film substrate 21 will produce the contraposition problem and must solve on paste operation.In another kind of embodiment of the present utility model, after the film substrate 11 that obtains to have the micro size from thin film chip device 10 shown in Fig. 2 A or Fig. 3 A uses, when this film substrate 11 is wanted again to paste back the SIM card of mini size, this film substrate 11 will produce the contraposition problem equally and must solve on paste operation.

Thin film chip device 20 will utilize Sheet Metal Forming Technology to offer at least one breach 25 at the ad-hoc location of film substrate 21 shown in Fig. 6 A and Fig. 6 B, this breach 25 will be as aligning structure, therefore, owing to can be considered this film substrate 21, this breach 25 is not more than this second specification.In a kind of embodiment of the present utility model, the size of this breach 25 should be fit to penetrating by user's visual inspection breach 25, but the size of breach 25 should avoid influencing the electrode that electrode in the draw-in groove of mobile communication device contacts the first contact interface 211, and the breach profile is then unrestricted.In a kind of embodiment of the present utility model, ad-hoc location the best of breach 25 is the edge that is positioned at the first contact interface 211, and breach 25 the bests are to contain the part of an electrode of this first contact interface 211 and the part of film substrate 21, or as breach 251,252 the bests are to contain the part of two electrodes of this first contact interface 211 and the part of film substrate 21, breach 25,251,252 all are fit to.

In a kind of embodiment of the present utility model, the aligning structure of thin film chip device 20 is to comprise at least two breach 251,252, and these two breach 251,252 lay respectively at corner edge place or the level and the place, vertical side edge of the first contact interface 211.In a kind of embodiment of the present utility model, this first contact interface 211 meets ISO7816, and this first contact interface 211 is distinguished 8 contact electrodes, as shown in Figure 6A, the left bank electrode from top to bottom is C1, C2, C3, C4, right row's electrode from top to bottom is C5, C6, C7 and C8, and the breach 25,251 of aligning structure, 252 can be positioned at the corner edge place of electrode C1 or C4, or are positioned at the vertical edge and the horizontal edge of this first contact interface.In another kind of embodiment of the present utility model, this first contact interface 211 meets ISO7816 and this first contact interface 211 is distinguished 6 contact electrodes, and the left bank electrode from top to bottom is C1, C2, C3, right row's electrode from top to bottom is C5, C6, C7, and the breach 25 of aligning structure, 251,252 can be positioned at the corner edge place of electrode C1 or C3, or are positioned at the vertical edge and the horizontal edge of this first contact interface.

In embodiment of the present utility model, the aligning structure of thin film chip device 20 can be by the variation of breach derived structure, for example: breach 25 can be derived and is changed to vertical side cut as shown in Figure 6A, and a side vertical edge that makes the first contact interface 211 becomes the vertical edge of this film substrate 21, shown in Fig. 6 C.Therefore, be not more than this second specification owing to this vertical trimming can be considered this film substrate 21, and the side cut of the left vertical of this film substrate 21 also can be considered aligning structure.Because when the user carries out paste operation, the left vertical edge of contact interface that can be by exposing smart card is aimed at the left vertical of the first contact interface 211 of this film substrate 21 and is cut edge, and obtains accurately location.

Please refer to Fig. 7 A, displayed map 6A and Fig. 6 B illustrated embodiment, the stereographic map of the utility model thin film chip device and smart card.After thin film chip device 20 is torn strippable paper 22, the side that this film substrate 21 has adhered layer is the side that has contact interface 5 in the face of a smart card 4, make the contact interface 5 of the second contact interface, 212 these smart cards 4 of electrical connection of pasting rear film substrate 11, shown in Fig. 7 B.Please refer to Fig. 7 B, when the user carries out paste operation, breach 25 on the film substrate 21 will be aimed at the contact interface 5 pairing corner edge places of smart card 4, the user can penetrate these breach 25 observations by naked eyes and see contact interface 5 pairing corner edge places, because the first contact interface 211 of film substrate 21 is identical specifications with the contact interface 5 of smart card 4, therefore, the position that the user can be convenient to adjust film substrate 21 makes the edge of the first contact interface 211 aim at the corner edge place of these breach 25 inner contact interfaces 5, and make both edges connect being aligned, to guarantee that so the electrode of the second contact interface 212 is positioned at the counter electrode of contact interface 5, and the electrode of the second contact interface 212 also will be positioned at the abutment position that the draw-in groove electrode is resisted against the first contact interface 211 exactly.

Please refer to Fig. 8 A and Fig. 8 B, show that respectively another embodiment of the present utility model has the two sides figure of the thin film chip device 30 of antenna.In a kind of embodiment of the present utility model, a kind of thin film chip device 30 comprises a film substrate 31 and at least one chip (figure does not show), and wherein this film substrate 31 extends integrally formed antenna substrate 33.In a kind of embodiment of the present utility model, thin film chip device 30 further comprises a strippable paper 32, this strippable paper 32 can be dialled a liftoff side and this side that adheres to this film substrate 31 and be had adhered layer by the zone that strippable paper 32 covers, and this chip can be provided with arbitrary side of this antenna substrate 33.This strippable paper 32 has a breach, and this breach exposes the position of the second contact interface 312 and the connecting portion between this antenna substrate 33 and the film substrate 31.This film substrate 31 has one first contact interface 311 and one second contact interface 312, wherein with reference to shown in the figure 8A, this first contact interface 311 is used to be electrically connected the interior contact interface (figure does not show) of draw-in groove of an action communication device, and with reference to shown in the figure 8B, this second contact interface 312 is used to be electrically connected the contact interface of a smart card, and the side that this film substrate has second a contact interface 312 is to dial this strippable paper 32 of liftoff adhesion.

Continue with reference to figure 8A and Fig. 8 B, this film substrate 31 has and meets one first specification, for example mini size.So film substrate shown in Fig. 8 A 31 is suitable for and is pasted on the smart card that meets this first specification, for example meets the SIM card of mini size.For the ease of being suitable for, film substrate shown in Fig. 8 A 31 is pasted on the smart card that meets one second specification, the SIM card that for example meets the micro size, thin film chip device 30 will utilize Sheet Metal Forming Technology to offer the slit with a profile shown in Fig. 8 A and Fig. 8 B, as slit 15 shown in Fig. 3 A and Fig. 3 B, this profile has and meets one second specification, the micro size that for example meets SIM card, and comprise this first contact interface 111 and this second contact interface 112 in this profile.So, thin film chip device shown in Fig. 8 A and Fig. 8 B 30 is as long as do slightly to dial from promptly applicable to the smart card of different specification size along slit simply, and is convenient to produce with single process specification size the smart card of thin film chip device 30 collocation different specification sizes.Therefore, in a kind of embodiment of the present utility model, when film substrate 31 desires that meet the mini size shown in Fig. 8 A are suitable for when being pasted on the SIM card that meets the micro size, the user can do to dial from the film substrate 31 that goes out to have antenna along slit simply slightly, then this film substrate 31 with antenna promptly meets the micro size, so, tear off this strippable paper 32 from the film substrate 31 of micro size after, this film substrate 31 just can adhere to the SIM card of micro size.

In another kind of embodiment of the present utility model, slit with film substrate 31 of antenna also can be replaced by cutting line 14 shown in Fig. 2 A and Fig. 2 B, thin film chip device 30 is as long as cut out promptly smart card applicable to different specification size slightly along cutting line simply, and is convenient to produce with single process specification size the smart card of thin film chip device 30 collocation different specification sizes.

In addition, shown in Fig. 2 A or Fig. 3 A or Fig. 8 A thin film chip device 10,30 through suitably cut out or dial along slit from after, just can obtain to have the film substrate of micro size.In a kind of embodiment of the present utility model, when the film substrate with micro size desired to be pasted on the SIM card that meets the mini specification, the contraposition problem that this film substrate is produced on paste operation also can be solved by the aligning structure of thin film chip device 20 shown in Fig. 4 A or Fig. 6 A or Fig. 6 C.For example: embodiment as shown in Figure 9, the utility model utilize the aligning structure shown in Fig. 4 A (perforation 24) can solve thin film chip device 10 shown in Fig. 3 A through suitably cut out or dial along slit from after, and the film substrate that obtains to have the micro size desires to be pasted on the contraposition problem that SIM card produced that meets the mini specification; The embodiment shown in Figure 10 A and for example, the utility model utilizes the perforation 24 shown in Fig. 4 A to implement aligning structure in conjunction with the vertical trimming of film substrate shown in Fig. 6 C, can solve thin film chip device 10 shown in Fig. 3 A through suitably cut out or dial along slit from after, and the film substrate that obtains to be not more than in fact the micro size desires to be pasted on the contraposition problem that SIM card produced that meets the mini specification, shown in Figure 10 B figure.

Though the utility model discloses as above with preferred embodiment; right its is not in order to limit the utility model; any those skilled in the art; in not breaking away from spirit and scope of the present utility model; when doing a little change and retouching, therefore protection domain of the present utility model is when being as the criterion with claim institute confining spectrum.

Claims (17)

1. a thin film chip device is characterized in that, described thin film chip device comprises: a film substrate has one first contact interface and one second contact interface; And at least one chip, be attached to a side of described film substrate, wherein:

Described film substrate has and meets one first specification, and described thin film chip device offers the slit with a profile, and described profile has to meet and comprises described first contact interface and the described second contact interface in one second specification and the described profile.

2. thin film chip device as claimed in claim 1 is characterized in that, through dialling behind the slit place of described thin film chip device, described film substrate has and meets second specification.

3. thin film chip device as claimed in claim 1, it is characterized in that, the edge of the first contact interface of described film substrate is provided with an aligning structure, and the described second contact interface is used to be electrically connected to a contact interface of a card, and described card meets one first specification, and described aligning structure makes the second contact interface of described film substrate aim at the contact interface of described card.

4. thin film chip device as claimed in claim 3 is characterized in that, described aligning structure is at least one perforation.

5. thin film chip device as claimed in claim 4 is characterized in that, the two-phase diagonal angle edge of the first contact interface of described film substrate, or two opposite sides edge, or vertical edge and horizontal edge are respectively equipped with perforation.

6. thin film chip device as claimed in claim 4, it is characterized in that, the described first contact interface meets ISO7816, and the described first contact interface is distinguished 8 contact electrode C1, C2, C3, C4, C5, C6, C7 and C8, described perforation is positioned at the corner edge place of electrode C1 or C4 or C5 or C8, or the edge between electrode C1 and C2, or the edge between electrode C2 and C3, or the edge between electrode C3 and C4, or the edge between electrode C5 and C6, or the edge between electrode C6 and C7, or the edge between electrode C7 and C8.

7. thin film chip device as claimed in claim 4 is characterized in that, the described first contact interface meets ISO7816, and the described first contact interface is distinguished at least 6 contact electrode C1, C2, C3, C5, C6 and C7, described perforation is positioned at the corner edge place of electrode C1 or C5, or the edge between electrode C1 and C2, or the edge between electrode C2 and C3, or the corner edge place of electrode C3, or the edge between electrode C5 and C6, or the edge between electrode C6 and C7, or the corner edge place of electrode C7.

8. thin film chip device as claimed in claim 3, it is characterized in that, described aligning structure is a breach that is positioned at the edge of the described first contact interface, and when described film substrate was pasted on a side of described card, described indentation, there was exposed the edge of the contact interface of described card.

9. thin film chip device as claimed in claim 1 is characterized in that, the profile of described cutting line or the profile of described slit are not more than the profile of described second specification.

10. a thin film chip device is characterized in that, described thin film chip device comprises: a film substrate has one first contact interface and one second contact interface; And at least one chip, be attached to a side of described film substrate, wherein:

Described film substrate has and meets one second specification, and the second contact interface of described film substrate is used to be electrically connected to a contact interface of a card, described card meets one first specification, the edge of the first contact interface of described film substrate is provided with an aligning structure, and described aligning structure makes the second contact interface of described film substrate aim at the contact interface of described card.

11. thin film chip device as claimed in claim 10 is characterized in that, described second specification is less than described first specification, and described aligning structure is at least one perforation.

12. thin film chip device as claimed in claim 11 is characterized in that, the two-phase diagonal angle edge of the first contact interface of described film substrate, or two opposite sides edge, or vertical edge and horizontal edge are respectively equipped with perforation.

13. thin film chip device as claimed in claim 10, it is characterized in that, the described first contact interface meets ISO7816, and the described first contact interface is distinguished 8 contact electrode C1, C2, C3, C4, C5, C6, C7 and C8, described perforation is positioned at the corner edge place of electrode C1 or C4 or C5 or C8, or the edge between electrode C1 and C2, or the edge between electrode C2 and C3, or the edge between electrode C3 and C4, or the edge between electrode C5 and C6, or the edge between electrode C6 and C7, or the edge between electrode C7 and C8.

14. thin film chip device as claimed in claim 10 is characterized in that, the described first contact interface meets ISO7816, and the described first contact interface is distinguished at least 6 contact electrode C1, C2, C3, C5, C6 and C7, described perforation is positioned at the corner edge place of electrode C1 or C5, or the edge between electrode C1 and C2, or the edge between electrode C2 and C3, or the corner edge place of electrode C3, or the edge between electrode C5 and C6, or the edge between electrode C6 and C7, or the corner edge place of electrode C7.

15. thin film chip device as claimed in claim 10, it is characterized in that, described aligning structure is at least one breach that is positioned at the edge of the described first contact interface, and when described film substrate was pasted on a side of described card, described indentation, there was exposed the edge of the contact interface of described card.

16. thin film chip device as claimed in claim 15, it is characterized in that, the described first contact interface meets ISO7816, and the described first contact interface is distinguished at least 6 contact electrode C1, C2, C3, C5, C6 and C7, described breach are positioned at the corner edge place of contact electrode C1 or C3, or are positioned at the vertical edge and the horizontal edge of the described first contact interface.

17. thin film chip device as claimed in claim 10 is characterized in that, described aligning structure is a side cut of described film substrate, and makes a lateral edges of the described first contact interface become the edge of described film substrate.

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