CN201989054U - Vehicle suitable for sand blasting of multi-size wafers - Google Patents
Vehicle suitable for sand blasting of multi-size wafers Download PDFInfo
- Publication number
- CN201989054U CN201989054U CN 201020670860 CN201020670860U CN201989054U CN 201989054 U CN201989054 U CN 201989054U CN 201020670860 CN201020670860 CN 201020670860 CN 201020670860 U CN201020670860 U CN 201020670860U CN 201989054 U CN201989054 U CN 201989054U
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- vehicle
- wafer
- carrier
- size
- sandblast
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- Expired - Lifetime
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Abstract
The utility model aims at providing a vehicle suitable for sand blasting of multi-size wafers. When the vehicle is used for machining a product, a wafer is arranged on a bearing plane, and a vertical limit surface with a certain depth is arranged at the periphery of the wafer, so that the wafer is kept at a fixed position without deflecting from the working position of a manipulator used for grasping the wafer in normal operation. When the product size is replaced, the vehicle can be immediately shifted to process another wafer of a different size without adjusting the vehicle. The vehicle has the following advantages that the traditional vehicle which can only process wafers of the same size is recombined in vertical space so as to be suitable for the wafers of three different sizes. As the vehicle and a carrier plate of a conveyor belt are fixed together through a screw, no vehicle needs to be replaced when the product size is replaced so as to realize continuous processing and production, and the production efficiency is improved; and no vehicle needs to be replaced regularly, therefore, the wear of the vehicle is reduced, the tooling maintenance cost is reduced, and the risk of product loss due to the damage of the vehicle is reduced.
Description
Technical field
The utility model relates to a kind of sandblast carrier that is applicable to many sizes wafer, is specially adapted to the shot blasting procedure at 4,5,6 inches wafers.
Background technology
In wafer processing, crystals inevitably has the existence of metal and microdefect.Because metal and defective can influence the product quality of wafer when forming chip circuit, may influence the chip electrical parameter even can cause circuit malfunction.Semiconductor crystal has a specific character, and under certain condition, the metal of crystals and microdefect can directively move, and this mobile process is called as gettering.
Gettering can be divided into intrinsic gettering and outer gettering two big classes, sandblast is a kind of very common outer gettering mode, it has easy control of process conditions, and processing cost is low, do not change advantages such as wafer geometric parameter, so be widely used in the processing of 4,5,6 inches wafers.
Traditional blasting craft is that a lot of carrier is installed on conveyer belt, is used for carrying wafer by one group of group spray gun, sprays the mortar through pressurized with compressed air in the spray gun.Molecule in the mortar can form the microlesion of arts demand at crystal column surface.In actual mechanical process, in the wafer of processing different size, just need to change the carrier of corresponding size.Changing carrier each time needs for a long time, and often dismounting and change also can be quickened the carrier wearing and tearing, causes production efficiency to reduce, increase maintenance mans and dresses up this.
When plant machinery hand grasping silicon wafer, displacement or dislocation also may take place because carrier damages in wafer, cause product loss easily.
Summary of the invention
The purpose of this utility model provides a kind of sandblast carrier that is applicable to many sizes wafer, when using this carrier converted products, wafer is placed on the load plane, around wafer is the spacing facade that certain depth is arranged, allow wafer remain on the fixed position, can not deflect away from the operating position that the manipulator of grasping silicon wafer can normally move.When changing product size, do not need carrier is adjusted, can change the wafer of the another kind of size of processing immediately.By using the processing continuously of this carrier, improved production efficiency, owing to do not need often to change carrier, reduced the carrier wearing and tearing, lowered the frock maintenance cost, reduced the risk of the product loss that causes because carrier damages.
To achieve the above object of the invention, the utility model is by the following technical solutions:
A kind of many sizes wafer sandblast carrier that is applicable to, it comprises a plurality of step concentric circles, each step is used to carry the silicon chip of one piece of corresponding size, each step has the load plane of a carrying wafer, the height of the step slick and sly moving facade of combinations that exceeds, the concentric circles center of circle overlaps with manipulator sucker center; The carrier orlop has a mounting plane that is used to install and fix carrier, mounting plane be provided with locating hole and be used for conveyer belt on the installing hole that is connected and fixed of supporting plate.
Spacing facade on each load plane has certain height 0.3-5 millimeter.
It is two that mounting plane is provided with locating hole, and installing hole is 1.Carrier has three load planes, is used for support different size wafer, all posts slipmat on each load plane.
Slipmat is used for increasing frictional force, reduces wafer and slides in the horizontal direction, reduces because of friction causes crystal column surface to scratch.Slipmat is a kind of flexible material, has been used for cushioning effect, can reduce excess impact and cause wafer cracked.
The utility model has the advantages that: the conventional carriers that can only process a kind of size wafer reconfigures on vertical space, can be suitable for the wafer with three different sizes.Carrier is fixed together by screw and conveyer belt supporting plate, when changing product size, do not need to change carrier, processing continuously, improved production efficiency, owing to do not need often to change carrier, reduce the carrier wearing and tearing, lowered the frock maintenance cost, reduced the risk of the product loss that causes because carrier damages.
Description of drawings
Fig. 1 is a structural representation of the present utility model
Among Fig. 1,4 is the concentric step of diameter minimum, its size and 4 cun wafer couplings, and 4 is its load plane, 1 is its spacing facade.5 for being positioned at 5 cun concentric steps of 4 cun silicon circle tops, and 5 is its load plane, and 2 is its spacing facade.6 for being positioned at 6 cun concentric steps of 5 cun silicon circle tops, and 6 is its load plane, and 3 is its spacing facade.The wafer placement location of new support is identical with the conventional carriers position, does not need equipment is additionally transformed and reset, and the carrier orlop has a mounting plane that is used to install and fix carrier among the figure.Two locating holes 8 and an installing hole 7 are arranged on the mounting plane, be used for conveyer belt on supporting plate be connected and fixed.
Two locating holes that are used to install location usefulness are arranged on the mounting plane, when carrier by locating hole when alignment pin on the conveyer belt mounting plate combines, carrier will be positioned on the operating point of manipulator sucker, its installation site is identical with conventional carriers.A fixedly screw hole of usefulness is arranged on the carrier mounting plane, use screw fixing after, carrier is just and firm the linking together of equipment conveyer belt supporting plate.
Claims (5)
1. one kind is applicable to many sizes wafer sandblast carrier, it is characterized in that: it comprises a plurality of step concentric circles, each step is used to carry the silicon chip of one piece of corresponding size, each step has the load plane of a carrying wafer, the height of the step slick and sly moving facade of combinations that exceeds, the concentric circles center of circle overlaps with manipulator sucker center; The carrier orlop has a mounting plane that is used to install and fix carrier, mounting plane be provided with locating hole and be used for conveyer belt on the installing hole that is connected and fixed of supporting plate.
2. according to a kind of many sizes wafer sandblast carrier that is applicable to described in claims 1, it is characterized in that: described concentric circles is three.
3. according to a kind of many sizes wafer sandblast carrier that is applicable to described in claims 1 or 2, it is characterized in that: all post slipmat on each load plane.
4. according to a kind of many sizes wafer sandblast carrier that is applicable to described in claims 1 or 2, it is characterized in that: the spacing facade on each load plane has certain height 0.3-5 millimeter.
5. according to a kind of many sizes wafer sandblast carrier that is applicable to described in claims 1 or 2, it is characterized in that: it is two that mounting plane is provided with locating hole, and installing hole is 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020670860 CN201989054U (en) | 2010-12-10 | 2010-12-10 | Vehicle suitable for sand blasting of multi-size wafers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020670860 CN201989054U (en) | 2010-12-10 | 2010-12-10 | Vehicle suitable for sand blasting of multi-size wafers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201989054U true CN201989054U (en) | 2011-09-28 |
Family
ID=44665556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201020670860 Expired - Lifetime CN201989054U (en) | 2010-12-10 | 2010-12-10 | Vehicle suitable for sand blasting of multi-size wafers |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201989054U (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103474371A (en) * | 2013-09-22 | 2013-12-25 | 瀚天天成电子科技（厦门）有限公司 | Semi-conductor chip compatibility test carrying platform and using method thereof |
| CN104096662A (en) * | 2014-07-23 | 2014-10-15 | 济南晶博电子有限公司 | Absorption type wafer coating rotating table |
| CN105609463A (en) * | 2016-01-25 | 2016-05-25 | 中国电子科技集团公司第二十四研究所 | Integrated cleaning fixture capable of automatically fixing silicon wafer during rotation |
| CN107303652A (en) * | 2016-04-22 | 2017-10-31 | 上银科技股份有限公司 | With the carrier for opening entire function |
| TWI632026B (en) * | 2016-04-15 | 2018-08-11 | 上銀科技股份有限公司 | Carrier with switch function |
| CN109624109A (en) * | 2019-02-20 | 2019-04-16 | 广州安特激光技术有限公司 | A kind of plummer of wafer cutter device |
| CN112824561A (en) * | 2019-11-20 | 2021-05-21 | 中国科学院微电子研究所 | Sample stage and method for atomic layer deposition |
| CN112824560A (en) * | 2019-11-20 | 2021-05-21 | 中国科学院微电子研究所 | Sample stage and method for preparing thin-film material |
| CN114843212A (en) * | 2022-04-29 | 2022-08-02 | 浙江晶睿电子科技有限公司 | Multifunctional semiconductor cavity type processing equipment |
-
2010
- 2010-12-10 CN CN 201020670860 patent/CN201989054U/en not_active Expired - Lifetime
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103474371A (en) * | 2013-09-22 | 2013-12-25 | 瀚天天成电子科技（厦门）有限公司 | Semi-conductor chip compatibility test carrying platform and using method thereof |
| CN103474371B (en) * | 2013-09-22 | 2016-06-29 | 瀚天天成电子科技（厦门）有限公司 | A kind of semiconductor wafer compatibility test microscope carrier and using method thereof |
| CN104096662A (en) * | 2014-07-23 | 2014-10-15 | 济南晶博电子有限公司 | Absorption type wafer coating rotating table |
| CN104096662B (en) * | 2014-07-23 | 2017-06-23 | 青岛海之源智能技术有限公司 | Absorption type silicon chip is coated with turntable |
| CN105609463A (en) * | 2016-01-25 | 2016-05-25 | 中国电子科技集团公司第二十四研究所 | Integrated cleaning fixture capable of automatically fixing silicon wafer during rotation |
| CN105609463B (en) * | 2016-01-25 | 2018-09-18 | 中国电子科技集团公司第二十四研究所 | The integrated cleaning jig of the automatic fixed silicon wafer of rotation |
| TWI632026B (en) * | 2016-04-15 | 2018-08-11 | 上銀科技股份有限公司 | Carrier with switch function |
| CN107303652A (en) * | 2016-04-22 | 2017-10-31 | 上银科技股份有限公司 | With the carrier for opening entire function |
| CN109624109A (en) * | 2019-02-20 | 2019-04-16 | 广州安特激光技术有限公司 | A kind of plummer of wafer cutter device |
| CN112824561A (en) * | 2019-11-20 | 2021-05-21 | 中国科学院微电子研究所 | Sample stage and method for atomic layer deposition |
| CN112824560A (en) * | 2019-11-20 | 2021-05-21 | 中国科学院微电子研究所 | Sample stage and method for preparing thin-film material |
| CN114843212A (en) * | 2022-04-29 | 2022-08-02 | 浙江晶睿电子科技有限公司 | Multifunctional semiconductor cavity type processing equipment |
| CN114843212B (en) * | 2022-04-29 | 2023-01-24 | 浙江晶睿电子科技有限公司 | Multifunctional semiconductor cavity type processing equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: GRINM SEMICONDUCTOR MATERIALS CO., LTD. Free format text: FORMER OWNER: GENERAL RESEARCH INSTITUTE FOR NONFERROUS METALS Effective date: 20120130 Free format text: FORMER OWNER: GRINM SEMICONDUCTOR MATERIALS CO., LTD. Effective date: 20120130 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20120130 Address after: 100088, 2, Xinjie street, Beijing Patentee after: GRINM Semiconductor Materials Co., Ltd. Address before: 100088, 2, Xinjie street, Beijing Co-patentee before: GRINM Semiconductor Materials Co., Ltd. Patentee before: General Research Institute for Nonferrous Metals |
|
| C56 | Change in the name or address of the patentee |
Owner name: GRINM ADVANCED MATERIALS CO., LTD. Free format text: FORMER NAME: GRINM SEMICONDUCTOR MATERIALS CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 100088, 2, Xinjie street, Beijing Patentee after: YOUYAN NEW MATERIAL CO., LTD. Address before: 100088, 2, Xinjie street, Beijing Patentee before: GRINM Semiconductor Materials Co., Ltd. |
|
| ASS | Succession or assignment of patent right |
Owner name: GRINM SEMICONDUCTOR MATERIALS CO., LTD. Free format text: FORMER OWNER: GRINM ADVANCED MATERIALS CO., LTD. Effective date: 20150610 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20150610 Address after: 101300 Beijing city Shunyi District Shuanghe Linhe Industrial Development Zone on the south side of the road Patentee after: You Yan Semi Materials Co., Ltd. Address before: 100088, 2, Xinjie street, Beijing Patentee before: YOUYAN NEW MATERIAL CO., LTD. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20110928 |
|
| CX01 | Expiry of patent term |