CN201974255U - 压力传感器用微晶玻璃密封基座 - Google Patents
压力传感器用微晶玻璃密封基座 Download PDFInfo
- Publication number
- CN201974255U CN201974255U CN2011200397380U CN201120039738U CN201974255U CN 201974255 U CN201974255 U CN 201974255U CN 2011200397380 U CN2011200397380 U CN 2011200397380U CN 201120039738 U CN201120039738 U CN 201120039738U CN 201974255 U CN201974255 U CN 201974255U
- Authority
- CN
- China
- Prior art keywords
- glassceramic
- shell
- pressure sensor
- sintering
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Measuring Fluid Pressure (AREA)
Abstract
Description
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011200397380U CN201974255U (zh) | 2011-02-16 | 2011-02-16 | 压力传感器用微晶玻璃密封基座 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011200397380U CN201974255U (zh) | 2011-02-16 | 2011-02-16 | 压力传感器用微晶玻璃密封基座 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201974255U true CN201974255U (zh) | 2011-09-14 |
Family
ID=44579356
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2011200397380U Expired - Fee Related CN201974255U (zh) | 2011-02-16 | 2011-02-16 | 压力传感器用微晶玻璃密封基座 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201974255U (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106168513A (zh) * | 2015-05-19 | 2016-11-30 | 罗斯蒙特航天公司 | 具有应力隔离特征的压力传感器封装件 |
CN113816329A (zh) * | 2021-08-25 | 2021-12-21 | 中国电子科技集团公司第四十九研究所 | 一种真空封装结构的谐振压力敏感芯片探头及其封装方法 |
-
2011
- 2011-02-16 CN CN2011200397380U patent/CN201974255U/zh not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106168513A (zh) * | 2015-05-19 | 2016-11-30 | 罗斯蒙特航天公司 | 具有应力隔离特征的压力传感器封装件 |
CN106168513B (zh) * | 2015-05-19 | 2019-12-20 | 罗斯蒙特航天公司 | 具有应力隔离特征的压力传感器封装件 |
CN113816329A (zh) * | 2021-08-25 | 2021-12-21 | 中国电子科技集团公司第四十九研究所 | 一种真空封装结构的谐振压力敏感芯片探头及其封装方法 |
CN113816329B (zh) * | 2021-08-25 | 2023-08-11 | 中国电子科技集团公司第四十九研究所 | 一种真空封装结构的谐振压力敏感芯片探头及其封装方法 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN213148194U (zh) | 一种多芯片压力传感器 | |
CN201974255U (zh) | 压力传感器用微晶玻璃密封基座 | |
CN201996301U (zh) | 一种玻璃电水壶 | |
CN206179845U (zh) | 一种复合薄膜引线式金属杜瓦 | |
CN101546801B (zh) | 大功率led封装方法 | |
CN205789919U (zh) | 一种混合集成电路用铝碳化硅一体封装管壳 | |
CN201993196U (zh) | 压力传感器用整体玻璃密封基座 | |
CN201892544U (zh) | 一种传感器封装结构 | |
CN202614454U (zh) | So8塑料封装传感器 | |
CN202712172U (zh) | 一种多芯片双基岛的sop封装结构 | |
CN209389025U (zh) | 一种用于大功率模块产品的端子结构 | |
CN201562689U (zh) | 陶瓷底座环氧封装红外发射光敏接收光电器件 | |
CN105628092B (zh) | 温度压力传感器模块及其制备方法 | |
CN201199188Y (zh) | 不锈钢膜片隔离充油封装的高温高压传感器 | |
CN204118116U (zh) | 一种led封装结构 | |
CN102509941A (zh) | 一种高频接触件安装密封结构 | |
CN204054661U (zh) | 一种可提高生产效率的圆环粘贴模具 | |
CN201697746U (zh) | 压力传感器用玻璃密封网纹型基座 | |
CN202678409U (zh) | 一种led灯珠封装结构 | |
CN101800144B (zh) | 一种集成的气体放电管 | |
CN201689916U (zh) | Led封装结构 | |
CN202373589U (zh) | 一种防止应力作用在芯片上的二极管 | |
CN203083763U (zh) | 平膜压力传感器 | |
CN203895432U (zh) | 能耐高工作压力的高精度多参量硅感应芯片的基座结构 | |
CN104979296B (zh) | 能耐高工作压力的高精度多参量硅感应芯片的基座结构 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: ANHUI YIDA ELECTRONIC CO., LTD. Free format text: FORMER OWNER: BENGBU LIQUN ELECTRONIC CO., LTD. Effective date: 20121012 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20121012 Address after: 233010 No. 68 Liugong Road, hi tech Zone, Anhui, Bengbu Patentee after: Anhui Yida Electronic Co., Ltd. Address before: 233010 Friendship Road 1, hi tech Zone, Anhui, Bengbu Patentee before: Bengbu Liqun Electronics Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110914 Termination date: 20150216 |
|
EXPY | Termination of patent right or utility model |