CN201965645U - High-density laminated RFID (Radio Frequency Identification Devices) electronic label - Google Patents
High-density laminated RFID (Radio Frequency Identification Devices) electronic label Download PDFInfo
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- CN201965645U CN201965645U CN2011200110304U CN201120011030U CN201965645U CN 201965645 U CN201965645 U CN 201965645U CN 2011200110304 U CN2011200110304 U CN 2011200110304U CN 201120011030 U CN201120011030 U CN 201120011030U CN 201965645 U CN201965645 U CN 201965645U
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Abstract
The utility model discloses a high-density laminated RFID (Radio Frequency Identification Devices) electronic label which comprises a composite surface layer, a composite bottom layer, a COB (Chip On Board) module and a label antenna, wherein both the composite surface layer and the composite bottom layer are made of RF-4 high-density epoxy glass fiber boards; the COB module and the label antenna are located between the composite surface layer and the composite bottom layer; and the composite surface layer and the composite bottom layer form a composite whole through lamination thermal composite die-casting technology. The insulation property of the RF-4 high-density epoxy glass fiber board is extremely excellent, the electric properties of the RF-4 high-density epoxy glass fiber board under dry and wet states are excellent and the mechanical strength of the RF-4 high-density epoxy glass fiber board is high, so that the RFID electronic label is quite ideal in damp proofing property, very strong in corrosion resistance, extremely good in high temperature resistance, high in flexibility, stable and reliable in performance, simple in process, convenient for use and capable of meeting the using requirements in various severe occasions.
Description
Technical field
The utility model relates to a kind of RFID electronic tag, particularly a kind of high-density layer die mould RFID electronic tag.
Background technology
The large-scale popularization of RFID electronic tag card series products, the scope of its application is also in continuous expansion.The packaging manufacturing process of the RFID electronic tag card class that causes is therefrom also being goed deep into synchronously, and constantly weeds out the old and bring forth the new.
The factor that is difficult to determine that has many unknowns in view of the application scenario of electronic tag card series products, the applied environment that adds electronic tag card class has various or even very harsh requirement to the package material and the packaging technology of electronic tag card series products, therefore, want to make electronic tag card series products to work in the abominable occasion of high-temperature, high humility, severe corrosive, the RFID electronic tag that just needs a kind of special base material and take special process to make.
The utility model content
Can't be in order to overcome common RFID electronic tag in the deficiency of steady operation under the rugged surroundings, the utility model provides a kind of moisture proof performance very good, corrosion resistance is very strong, high temperature resistant performance is good especially, highly sensitive, stable and reliable for performance, especially technology is simple, easy to use, be adapted at the high-density layer die mould RFID electronic tag that various rugged surroundings occasions are used.
The technical scheme that its technical matters that solves the utility model adopts is:
A kind of high-density layer die mould RFID electronic tag, comprise the composite cover of FR-4 high density epoxy glass fiber sheet material material, composite bottom layer, the COB module between described composite cover and composite bottom layer of FR-4 high density epoxy glass fiber sheet material material and the label antenna that is electrically connected with described COB module, described composite cover and composite bottom layer form a composite monolithic by laminated heat composite die casted technology.
Described composite cover is formed by the laminated heat composite die casted by three layers of FR-4 high density epoxy glass fiber plate.
Described composite bottom layer is formed by the laminated heat composite die casted by three layers of FR-4 high density epoxy glass fiber plate.
The beneficial effects of the utility model are: RFID electronic tag of the present utility model adopts FR-4 high density epoxy glass fiber plate as base material, dexterously COB module and label antenna are embedded between the composite cover of being made up of multilayer FR-4 high density epoxy glass fiber plate and composite bottom layer, because the insulating property of highdensity FR-4 epoxy glass fiber plate are splendid, and the electric property performance is excellent under dry state and the hygrometric state, the physical strength height, make that the moisture proof performance of this RFID electronic tag is very good, corrosion resistance is very strong, high temperature resistant performance is good especially, highly sensitive, stable and reliable for performance, especially technology is simple, easy to use, can satisfy the requirement that the RFID electronic tag uses in various abominable occasions.
Description of drawings
Below in conjunction with drawings and Examples the utility model is described further.
Fig. 1 is a semisectional view of the present utility model;
Fig. 2 is a sectional view of the present utility model.
Embodiment
With reference to accompanying drawing 1, Fig. 2, a kind of high-density layer die mould RFID electronic tag, comprise the composite cover 1 of FR-4 high density epoxy glass fiber sheet material material, composite bottom layer 2, the COB module 4 between described composite cover 1 and composite bottom layer 2 of FR-4 high density epoxy glass fiber sheet material material and the label antenna 3 that is electrically connected with described COB module 4, described composite cover 1 and composite bottom layer 2 form a composite monolithic by laminated heat composite die casted technology.
Described composite cover 13 is formed by the laminated heat composite die casted by three layers of FR-4 high density epoxy glass fiber plate 1a, 1b, 1c totally, and described composite bottom layer 2 is also formed by the laminated heat composite die casted by three layers of FR-4 high density epoxy glass fiber plate 2a, 2b, 2c.
The starting material of FR-4 high density epoxy glass fiber plate are made up of epoxy resin, hardening agent and promoter, inorganic filler, solvent, reinforcing material etc.In these starting material, epoxy resin has excellent electric property, bounding force, thermotolerance, moisture resistance, chemical proofing; Inorganic filler has stability, through hole reliability, moisture resistance and anti-machining property; Reinforcing material adopts electronic-grade glass fiber cloth to make the high-density glass fiberboard, and the glass plate can improve moisture resistance, high-fire resistance, high electric insulating quality through special surface treatment.
Technical characterstic of the present utility model:
1, framework is ingenious, and technology is simple, the science of drawing materials;
2, the volume dexterity is easy to use;
3, corrosion resistivity is strong, and the moisture proof performance is good;
4, high temperature resistant performance is good, but 150 degrees centigrade of operate as normal;
5, highly sensitive, stable and reliable for performance;
6, being fit to the rugged surroundings occasion uses.
For carry, easy to use, this RFID electronic tag is provided with fixed orifice 5, during use, with the utility model or extension or be or fixed form such as tie up or hang, being placed into needs the place or the corresponding stationkeeping of body surface of use good, can carry out contactless accessible identification to the utility model by all kinds of fetch equipments or identification terminal.
With embodiment the utility model has been carried out detailed as far as possible explanation above, but what need statement is that above embodiment is only in order to the explanation the technical solution of the utility model, and is not to be restriction to the utility model protection domain.Although the utility model has been done detailed as far as possible explanation with reference to above preferred embodiment, but those skilled in the art is to be understood that, the technical solution of the utility model is made amendment or is equal to replacement, still belong to the essence and the scope of technical solutions of the utility model.As long as to any improvement or the modification that the utility model is done, all should belong to the utility model claim and advocate within the scope of protection.
Claims (3)
1. high-density layer die mould RFID electronic tag, it is characterized in that: it comprises the composite cover (1) of FR-4 high density epoxy glass fiber sheet material material, the composite bottom layer (2) of FR-4 high density epoxy glass fiber sheet material material, the label antenna (3) that is positioned at the COB module (4) between described composite cover (1) and the composite bottom layer (2) and is electrically connected with described COB module (4), and described composite cover (1) and composite bottom layer (2) form a composite monolithic by laminated heat composite die casted technology.
2. a kind of high-density layer die mould RFID electronic tag according to claim 1 is characterized in that described composite cover (1) is formed by the laminated heat composite die casted by three layers of FR-4 high density epoxy glass fiber plate (1a, 1b, 1c).
3. a kind of high-density layer die mould RFID electronic tag according to claim 1 is characterized in that described composite bottom layer (2) is formed by the laminated heat composite die casted by three layers of FR-4 high density epoxy glass fiber plate (2a, 2b, 2c).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200110304U CN201965645U (en) | 2011-01-14 | 2011-01-14 | High-density laminated RFID (Radio Frequency Identification Devices) electronic label |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200110304U CN201965645U (en) | 2011-01-14 | 2011-01-14 | High-density laminated RFID (Radio Frequency Identification Devices) electronic label |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201965645U true CN201965645U (en) | 2011-09-07 |
Family
ID=44528192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200110304U Expired - Fee Related CN201965645U (en) | 2011-01-14 | 2011-01-14 | High-density laminated RFID (Radio Frequency Identification Devices) electronic label |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201965645U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106132725A (en) * | 2014-03-19 | 2016-11-16 | 许克莱茵有限公司 | Extrusion plate or endless belt including RFID transponder |
-
2011
- 2011-01-14 CN CN2011200110304U patent/CN201965645U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106132725A (en) * | 2014-03-19 | 2016-11-16 | 许克莱茵有限公司 | Extrusion plate or endless belt including RFID transponder |
| CN106132725B (en) * | 2014-03-19 | 2019-03-01 | 许克莱茵有限公司 | Extrusion plate or endless belt including RFID transponder |
| US10245880B2 (en) | 2014-03-19 | 2019-04-02 | Hueck Rheinische Gmbh | Press plate or endless belt with RFID transponder |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20171116 Address after: 101300, room 711, building 2, building 1, Golden Road, Beijing, Shunyi District (Tianzhu comprehensive bonded area, -031) Patentee after: Beijing culture science and technology finance leasing Limited by Share Ltd Address before: 528415 Guangdong Province, Zhongshan City Xiaolan Town Taifeng Industrial Zone water Yi Road No. 9 Patentee before: Tatwah Smarttech Co., Ltd. |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110907 Termination date: 20200114 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |